SG10201809403YA - Loudspeaker array with circuit board-integrated asic - Google Patents

Loudspeaker array with circuit board-integrated asic

Info

Publication number
SG10201809403YA
SG10201809403YA SG10201809403YA SG10201809403YA SG10201809403YA SG 10201809403Y A SG10201809403Y A SG 10201809403YA SG 10201809403Y A SG10201809403Y A SG 10201809403YA SG 10201809403Y A SG10201809403Y A SG 10201809403YA SG 10201809403Y A SG10201809403Y A SG 10201809403YA
Authority
SG
Singapore
Prior art keywords
circuit board
loudspeaker
mems
asic
mems loudspeaker
Prior art date
Application number
SG10201809403YA
Inventor
Clerici Beltrami Andrea Rusconi
Ferruccio Bottoni
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of SG10201809403YA publication Critical patent/SG10201809403YA/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

LOUDSPEAKER ARRAY WITH CIRCUIT BOARD-INTEGRATED ASIC Loud speaker arrangement with a circuit board, an MEMS loudspeaker for producing sound waves in the audible wavelength spectrum, said MEMS loud speaker having a membrane deflectable along a z-axis, a sound-conducting channel adjacent to the MEMS loudspeaker with an acoustic outlet opening and an ASIC electrically connected to the MEMS loudspeaker. The circuit board comprises a first circuit board cavity in which the ASIC is arranged so as to be fully integrated in the circuit board. The circuit board comprises a second circuit board cavity with an opening, said opening being closed by means of the MEMS loudspeaker so that the second circuit board cavity forms at least one part of a cavity of the MEMS loudspeaker. The sound-conducting channel extends obliquely to the z-axis of the MEMS loudspeaker. Moreover, the acoustic outlet opening is arranged on the lateral surface of the loudspeaker arrangement. Fig. 5
SG10201809403YA 2014-04-24 2015-04-24 Loudspeaker array with circuit board-integrated asic SG10201809403YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014105754.6A DE102014105754B4 (en) 2014-04-24 2014-04-24 Loudspeaker arrangement with circuit board integrated ASIC

Publications (1)

Publication Number Publication Date
SG10201809403YA true SG10201809403YA (en) 2018-11-29

Family

ID=53039401

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201809403YA SG10201809403YA (en) 2014-04-24 2015-04-24 Loudspeaker array with circuit board-integrated asic
SG11201608913YA SG11201608913YA (en) 2014-04-24 2015-04-24 Loud speaker arrangement with circuit-board-integrated asic

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201608913YA SG11201608913YA (en) 2014-04-24 2015-04-24 Loud speaker arrangement with circuit-board-integrated asic

Country Status (9)

Country Link
US (1) US10097927B2 (en)
EP (1) EP3135044B1 (en)
KR (1) KR20160146952A (en)
CN (1) CN107027341B (en)
AU (1) AU2015250799B2 (en)
CA (1) CA2946784A1 (en)
DE (1) DE102014105754B4 (en)
SG (2) SG10201809403YA (en)
WO (1) WO2015162248A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9301043B2 (en) * 2013-05-01 2016-03-29 Harman International Industries, Inc. Sealed speaker system having a pressure vent
DE102015107560A1 (en) * 2015-05-13 2016-11-17 USound GmbH Sound transducer arrangement with MEMS sound transducer
DE102019121258A1 (en) * 2019-08-06 2021-02-11 USound GmbH Mobile phone with an audio system having a rear secondary opening
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US11395073B2 (en) * 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
CN113114831B (en) * 2021-04-12 2023-05-26 维沃移动通信有限公司 Electronic equipment
CN113539850A (en) * 2021-07-16 2021-10-22 芯知微(上海)电子科技有限公司 System-level packaging method and packaging structure
CN113645556A (en) * 2021-08-27 2021-11-12 歌尔微电子股份有限公司 MEMS microphone packaging structure and packaging method
CN217116396U (en) * 2022-03-03 2022-08-02 瑞声开泰科技(武汉)有限公司 MEMS loudspeaker
DE102022209706A1 (en) 2022-09-15 2024-03-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein MEMS, method of manufacturing a MEMS and method of designing a MEMS
CN115767404A (en) * 2022-11-29 2023-03-07 瑞声开泰科技(武汉)有限公司 MEMS (micro-electromechanical systems) loudspeaker preparation process and MEMS loudspeaker

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69626747T2 (en) * 1995-11-16 2003-09-04 Matsushita Electric Industrial Co., Ltd. Printed circuit board and its arrangement
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
TWI267315B (en) * 2002-07-01 2006-11-21 Sony Ericsson Mobile Comm Ab Communication terminal
TWI348872B (en) * 2007-10-17 2011-09-11 Ind Tech Res Inst Electro-acoustic sensing device
US7869206B2 (en) * 2008-09-05 2011-01-11 Apple Inc. Handheld computing device
US8199953B2 (en) * 2008-10-30 2012-06-12 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-aperture acoustic horn
US7790492B1 (en) * 2009-06-13 2010-09-07 Mwm Acoustics, Llc Method for fabricating a transducer package with the transducer die unsupported by a substrate
JP2011114506A (en) * 2009-11-26 2011-06-09 Funai Electric Co Ltd Microphone unit
CN102763431B (en) * 2009-12-24 2015-08-19 诺基亚公司 A kind of equipment
CN101895798B (en) * 2010-07-29 2013-03-13 青岛海信移动通信技术股份有限公司 Sound cavity sealing structure of loudspeaker, and portable mobile terminal
US8618619B1 (en) * 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
US20130001550A1 (en) * 2011-06-29 2013-01-03 Invensense, Inc. Hermetically sealed mems device with a portion exposed to the environment with vertically integrated electronics
DE102011084393A1 (en) * 2011-10-13 2013-04-18 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
US9402137B2 (en) 2011-11-14 2016-07-26 Infineon Technologies Ag Sound transducer with interdigitated first and second sets of comb fingers
DE102011086722A1 (en) 2011-11-21 2013-05-23 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
CN202374407U (en) * 2011-11-24 2012-08-08 比亚迪股份有限公司 Resonant chamber device and electronic product utilizing same
US8995694B2 (en) * 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
US8866237B2 (en) * 2012-02-27 2014-10-21 Texas Instruments Incorporated Methods for embedding controlled-cavity MEMS package in integration board
DE102012205921A1 (en) 2012-04-12 2013-10-17 Robert Bosch Gmbh Membrane assembly for a micro-electro-mechanical transmitter and method of making a diaphragm assembly
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9216897B2 (en) * 2013-06-05 2015-12-22 Invensense, Inc. Capacitive sensing structure with embedded acoustic channels
DE102013212173B4 (en) * 2013-06-26 2016-06-02 Robert Bosch Gmbh MEMS device with a deflectable membrane and a fixed counter element and method for its preparation

Also Published As

Publication number Publication date
AU2015250799B2 (en) 2019-04-04
US20170048624A1 (en) 2017-02-16
US10097927B2 (en) 2018-10-09
KR20160146952A (en) 2016-12-21
AU2015250799A1 (en) 2016-11-17
EP3135044B1 (en) 2019-06-05
CN107027341B (en) 2020-03-13
WO2015162248A1 (en) 2015-10-29
CN107027341A (en) 2017-08-08
CA2946784A1 (en) 2015-10-29
DE102014105754A1 (en) 2015-10-29
EP3135044A1 (en) 2017-03-01
DE102014105754B4 (en) 2022-02-10
SG11201608913YA (en) 2016-11-29

Similar Documents

Publication Publication Date Title
SG10201809403YA (en) Loudspeaker array with circuit board-integrated asic
USD811362S1 (en) Headphone headset
USD814439S1 (en) Foldable headphone
USD830331S1 (en) Foldable headphone
USD830993S1 (en) Foldable headphone
USD740784S1 (en) Portable sound device
WO2016046810A3 (en) Wearable audio device
WO2015168487A3 (en) Pairing devices using acoustic signals
SG10201909786QA (en) Sound transducer assembly with a mems sound transducer
WO2014163794A3 (en) Sound induction ear speaker for eye glasses
GB2551916A (en) Microphone unit comprising integrated speech analysis
WO2015094590A3 (en) Adapting audio based upon detected environmental acoustics
HK1250192A1 (en) Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement
WO2014143723A3 (en) Acoustic transducers
GB201721127D0 (en) Dipole loudspeaker for producing sound at bass frequencies
WO2016069866A3 (en) Smart flexible interactive earplug
EP2770747A3 (en) Earphone microphone
TW201615036A (en) Ear pressure sensors integrated with speakers for smart sound level exposure
MX2015008545A (en) Speaker including a speaker apparatus and a lighting apparatus.
ATE554481T1 (en) TALKER LOCALIZATION
EP2770746A3 (en) Earphone microphone
PH12015501610B1 (en) Speaker and speaker housing
TWD192211S (en) Speaker
MY178847A (en) Circuit board module comprising a continuous cavity, associated sonic transducer assembly, and production method
EP3764659B8 (en) Sound producing device