IN2012DN02644A - - Google Patents
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- Publication number
- IN2012DN02644A IN2012DN02644A IN2644DEN2012A IN2012DN02644A IN 2012DN02644 A IN2012DN02644 A IN 2012DN02644A IN 2644DEN2012 A IN2644DEN2012 A IN 2644DEN2012A IN 2012DN02644 A IN2012DN02644 A IN 2012DN02644A
- Authority
- IN
- India
- Prior art keywords
- recess
- side wall
- light emitting
- disposed
- base body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W74/00—
-
- H10W74/127—
-
- H10W90/756—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009248820 | 2009-10-29 | ||
| PCT/JP2010/069144 WO2011052672A1 (ja) | 2009-10-29 | 2010-10-28 | 発光装置及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN02644A true IN2012DN02644A (de) | 2015-09-11 |
Family
ID=43922094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2644DEN2012 IN2012DN02644A (de) | 2009-10-29 | 2010-10-28 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US8659106B2 (de) |
| EP (1) | EP2495775B1 (de) |
| JP (2) | JP5849702B2 (de) |
| KR (2) | KR101947304B1 (de) |
| CN (2) | CN106449937B (de) |
| BR (1) | BR112012003202B1 (de) |
| IN (1) | IN2012DN02644A (de) |
| RU (1) | RU2537091C2 (de) |
| TW (2) | TWI593142B (de) |
| WO (1) | WO2011052672A1 (de) |
| ZA (1) | ZA201201943B (de) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028743A (ja) * | 2010-06-22 | 2012-02-09 | Panasonic Corp | 半導体装置用パッケージおよびその製造方法ならびに半導体装置 |
| JP2012028744A (ja) * | 2010-06-22 | 2012-02-09 | Panasonic Corp | 半導体装置用パッケージおよびその製造方法ならびに半導体装置 |
| JP2012033884A (ja) * | 2010-06-29 | 2012-02-16 | Panasonic Corp | 半導体装置用パッケージおよびその製造方法ならびに半導体装置 |
| JP2012077235A (ja) * | 2010-10-05 | 2012-04-19 | Nitto Denko Corp | 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
| JP5682497B2 (ja) * | 2011-07-29 | 2015-03-11 | 信越化学工業株式会社 | 表面実装型発光装置の製造方法及びリフレクター基板 |
| US20130048192A1 (en) * | 2011-08-31 | 2013-02-28 | Jessie Lee | Method for sealing light engine module with flip-chip light emitting diode |
| EP3410498A1 (de) * | 2011-11-17 | 2018-12-05 | Lumens Co., Ltd. | Gehäuse für lichtemittierendes element |
| US9093621B2 (en) * | 2011-12-28 | 2015-07-28 | Nichia Corporation | Molded package for light emitting device |
| JP2013153004A (ja) * | 2012-01-24 | 2013-08-08 | Toshiba Corp | テレビジョン受像機、及び電子機器 |
| TW201415672A (zh) * | 2012-10-03 | 2014-04-16 | 隆達電子股份有限公司 | 發光元件封裝結構 |
| JP6054188B2 (ja) | 2013-01-30 | 2016-12-27 | 株式会社東芝 | 半導体パッケージおよびその製造方法 |
| CN103354257A (zh) * | 2013-06-25 | 2013-10-16 | 宁波协源光电科技有限公司 | 绿芯片加红荧光粉的条状高强度led封装结构和方法 |
| US9287472B2 (en) | 2013-06-27 | 2016-03-15 | Nichia Corporation | Light emitting device and method of manufacturing the same |
| TW201505135A (zh) * | 2013-07-25 | 2015-02-01 | 菱生精密工業股份有限公司 | 光學模組的封裝結構 |
| JP6252023B2 (ja) * | 2013-08-05 | 2017-12-27 | 日亜化学工業株式会社 | 発光装置 |
| CN104425680B (zh) * | 2013-09-09 | 2018-05-15 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| JP6210818B2 (ja) * | 2013-09-30 | 2017-10-11 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| KR102235258B1 (ko) * | 2014-02-04 | 2021-04-05 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛 |
| US20170082873A1 (en) * | 2014-03-25 | 2017-03-23 | Brown University | High frequency light emission device |
| JP2016004888A (ja) * | 2014-06-17 | 2016-01-12 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| ES2948674T3 (es) * | 2014-07-30 | 2023-09-15 | Breton Spa | Mejora del procedimiento de fabricación de losas de conglomerado |
| JP6195119B2 (ja) * | 2014-09-03 | 2017-09-13 | 東芝ライテック株式会社 | 移動体用照明装置、および車両用灯具 |
| KR20160038568A (ko) * | 2014-09-30 | 2016-04-07 | (주)포인트엔지니어링 | 복수의 곡면 캐비티를 포함하는 칩 기판 |
| DE102014114982B4 (de) * | 2014-10-15 | 2023-01-26 | Infineon Technologies Ag | Verfahren zum Bilden einer Chip-Baugruppe |
| CN105655466A (zh) * | 2014-11-10 | 2016-06-08 | 江苏欧密格光电科技股份有限公司 | 柔光贴片led灯 |
| US9859481B2 (en) | 2014-12-22 | 2018-01-02 | Nichia Corporation | Light emitting device |
| JP6701711B2 (ja) * | 2014-12-22 | 2020-05-27 | 日亜化学工業株式会社 | 発光装置 |
| US9590158B2 (en) * | 2014-12-22 | 2017-03-07 | Nichia Corporation | Light emitting device |
| WO2016139954A1 (en) * | 2015-03-05 | 2016-09-09 | Nichia Corporation | Light emitting device |
| JP6345342B2 (ja) * | 2015-04-15 | 2018-06-20 | 三菱電機株式会社 | 半導体装置 |
| EP3098861B1 (de) * | 2015-05-29 | 2020-05-06 | Nichia Corporation | Lichtemittierende vorrichtung und verfahren zur herstellung einer lichtemittierenden vorrichtung |
| JP6183486B2 (ja) * | 2015-05-29 | 2017-08-23 | 日亜化学工業株式会社 | 発光装置、被覆部材の製造方法及び発光装置の製造方法 |
| JP2017157593A (ja) * | 2016-02-29 | 2017-09-07 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法 |
| CN107978596B (zh) * | 2016-10-24 | 2020-05-12 | 光宝光电(常州)有限公司 | 光感测器模组及其穿戴装置 |
| JP6805081B2 (ja) * | 2017-05-26 | 2020-12-23 | 新光電気工業株式会社 | 発光装置用蓋体 |
| JP7057488B2 (ja) | 2017-09-27 | 2022-04-20 | 日亜化学工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR102472710B1 (ko) * | 2018-06-05 | 2022-11-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 |
| JP7277766B2 (ja) * | 2018-09-28 | 2023-05-19 | 日亜化学工業株式会社 | 発光装置 |
| JP7113390B2 (ja) * | 2018-12-21 | 2022-08-05 | 豊田合成株式会社 | 発光装置の製造方法 |
| JP7417031B2 (ja) * | 2019-03-27 | 2024-01-18 | 日亜化学工業株式会社 | 発光装置 |
| JP7334616B2 (ja) * | 2019-12-26 | 2023-08-29 | 住友大阪セメント株式会社 | 光導波路素子、光変調器、光変調モジュール、及び光送信装置 |
| EP3848981A1 (de) * | 2020-01-10 | 2021-07-14 | Lumileds Holding B.V. | Led-modul, form und verfahren zur herstellung davon |
| US11515347B2 (en) * | 2020-01-20 | 2022-11-29 | Omnivision Technologies, Inc. | Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same |
| RU197950U1 (ru) * | 2020-04-02 | 2020-06-08 | Общество с ограниченной ответственностью «ТВК» | Устройство для стабилизации работы амальгамных бактерицидных ламп |
| WO2022114086A1 (ja) * | 2020-11-27 | 2022-06-02 | 京セラ株式会社 | 発光装置及び照明装置 |
| WO2023034260A1 (en) * | 2021-08-30 | 2023-03-09 | Absolics, Inc. | Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method |
| TWI781781B (zh) * | 2021-10-04 | 2022-10-21 | 友達光電股份有限公司 | 顯示面板及其製備方法 |
| DE102021130173A1 (de) * | 2021-11-18 | 2023-05-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronische vorrichtung und verfahren zur herstellung einer elektronischen vorrichtung |
| TWI807529B (zh) | 2021-12-10 | 2023-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| JP2023090059A (ja) * | 2021-12-17 | 2023-06-29 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN114824040B (zh) * | 2022-07-01 | 2022-11-08 | 广东中科半导体微纳制造技术研究院 | 半导体封装器件 |
| CN117878164A (zh) * | 2023-12-27 | 2024-04-12 | 成都阜时科技有限公司 | 光感应芯片、光感测模组及激光雷达 |
| US20250287740A1 (en) * | 2024-03-06 | 2025-09-11 | Creeled, Inc. | Anchored encapsulation in led devices |
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| KR100643442B1 (ko) * | 1996-06-26 | 2006-11-10 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
| US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
| JPH10329461A (ja) * | 1997-05-29 | 1998-12-15 | Nec Yamagata Ltd | 半導体装置及びその製造方法 |
| JP3228321B2 (ja) * | 1997-08-29 | 2001-11-12 | 日亜化学工業株式会社 | チップタイプled |
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| DE60137972D1 (de) * | 2001-04-12 | 2009-04-23 | Matsushita Electric Works Ltd | Lichtquellenbauelement mit led und verfahren zu seiner herstellung |
| JP2003282955A (ja) * | 2001-07-19 | 2003-10-03 | Rohm Co Ltd | 反射ケース付半導体発光装置 |
| US6670648B2 (en) * | 2001-07-19 | 2003-12-30 | Rohm Co., Ltd. | Semiconductor light-emitting device having a reflective case |
| JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
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| JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| JP4307090B2 (ja) * | 2003-01-27 | 2009-08-05 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
| TWI237546B (en) | 2003-01-30 | 2005-08-01 | Osram Opto Semiconductors Gmbh | Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component |
| JP3910171B2 (ja) * | 2003-02-18 | 2007-04-25 | シャープ株式会社 | 半導体発光装置、その製造方法および電子撮像装置 |
| EP1603170B1 (de) * | 2003-03-10 | 2018-08-01 | Toyoda Gosei Co., Ltd. | Verfahren zur herstellung einer optischen festelementeinrichtung |
| JP2005079329A (ja) | 2003-08-29 | 2005-03-24 | Stanley Electric Co Ltd | 表面実装型発光ダイオード |
| JP2005310680A (ja) | 2004-04-23 | 2005-11-04 | Matsushita Electric Works Ltd | 発光ダイオード照明装置 |
| JP2005311153A (ja) | 2004-04-23 | 2005-11-04 | Harison Toshiba Lighting Corp | 発光素子の外囲器 |
| JP2006066657A (ja) * | 2004-08-27 | 2006-03-09 | Kyocera Corp | 発光装置および照明装置 |
| US20060034084A1 (en) * | 2004-06-28 | 2006-02-16 | Kyocera Corporation | Light-emitting apparatus and illuminating apparatus |
| JP2006093672A (ja) * | 2004-08-26 | 2006-04-06 | Toshiba Corp | 半導体発光装置 |
| JP5081370B2 (ja) * | 2004-08-31 | 2012-11-28 | 日亜化学工業株式会社 | 発光装置 |
| TWI245437B (en) * | 2004-11-16 | 2005-12-11 | Lighthouse Technology Co Ltd | Package structure of a surface mount device light emitting diode |
| JP4608294B2 (ja) * | 2004-11-30 | 2011-01-12 | 日亜化学工業株式会社 | 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 |
| JP4619834B2 (ja) * | 2005-03-09 | 2011-01-26 | 株式会社イノアックコーポレーション | 複合部材およびその製造方法 |
| EP2768031B1 (de) | 2005-08-04 | 2021-02-17 | Nichia Corporation | Licht emittierende anordnung |
| JP5046507B2 (ja) * | 2005-10-27 | 2012-10-10 | 京セラ株式会社 | 発光素子用配線基板および発光装置 |
| JP5119621B2 (ja) * | 2006-04-21 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
| JP2007305785A (ja) * | 2006-05-11 | 2007-11-22 | Nichia Chem Ind Ltd | 発光装置 |
| JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
| RU2321103C1 (ru) * | 2006-12-21 | 2008-03-27 | Закрытое акционерное общество "Светлана-Оптоэлектроника" | Светоизлучающий полупроводниковый модуль |
| KR101026914B1 (ko) * | 2006-12-28 | 2011-04-04 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치, 패키지, 발광 장치의 제조 방법, 패키지의 제조방법 및 패키지 제조용 금형 |
| US8093619B2 (en) * | 2006-12-28 | 2012-01-10 | Nichia Corporation | Light emitting device |
| JP2008198782A (ja) * | 2007-02-13 | 2008-08-28 | Toyoda Gosei Co Ltd | 発光装置 |
| JP4205135B2 (ja) * | 2007-03-13 | 2009-01-07 | シャープ株式会社 | 半導体発光装置、半導体発光装置用多連リードフレーム |
| US7807498B2 (en) * | 2007-07-31 | 2010-10-05 | Seiko Epson Corporation | Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication |
| US7652297B2 (en) * | 2007-09-11 | 2010-01-26 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device |
| JP2009070870A (ja) * | 2007-09-11 | 2009-04-02 | C I Kasei Co Ltd | 発光ダイオード用パッケージ、発光装置、および発光装置の作製方法 |
| KR101007131B1 (ko) * | 2008-11-25 | 2011-01-10 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| TWI389295B (zh) * | 2009-02-18 | 2013-03-11 | 奇力光電科技股份有限公司 | 發光二極體光源模組 |
| US8487328B2 (en) * | 2009-10-01 | 2013-07-16 | Nichia Corporation | Light emitting device |
| EP2506301A2 (de) * | 2011-03-31 | 2012-10-03 | Yamaichi Electronics Co., Ltd. | Flexible Beleuchtungskörperplatine und Beleuchtungsvorrichtung |
-
2010
- 2010-10-28 IN IN2644DEN2012 patent/IN2012DN02644A/en unknown
- 2010-10-28 WO PCT/JP2010/069144 patent/WO2011052672A1/ja not_active Ceased
- 2010-10-28 CN CN201610700656.3A patent/CN106449937B/zh active Active
- 2010-10-28 CN CN201080048796.8A patent/CN102598322B/zh active Active
- 2010-10-28 RU RU2011134678/28A patent/RU2537091C2/ru active
- 2010-10-28 JP JP2011538473A patent/JP5849702B2/ja active Active
- 2010-10-28 KR KR1020177031013A patent/KR101947304B1/ko active Active
- 2010-10-28 KR KR1020117018096A patent/KR101811885B1/ko active Active
- 2010-10-28 EP EP10826804.6A patent/EP2495775B1/de active Active
- 2010-10-28 BR BR112012003202-0A patent/BR112012003202B1/pt active IP Right Grant
- 2010-10-28 US US13/258,316 patent/US8659106B2/en active Active
- 2010-10-29 TW TW105103279A patent/TWI593142B/zh active
- 2010-10-29 TW TW099137246A patent/TWI532216B/zh active
-
2012
- 2012-03-15 ZA ZA2012/01943A patent/ZA201201943B/en unknown
-
2014
- 2014-01-10 US US14/152,712 patent/US8987853B2/en active Active
-
2015
- 2015-07-07 JP JP2015136183A patent/JP2015181202A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011052672A1 (ja) | 2011-05-05 |
| US8987853B2 (en) | 2015-03-24 |
| RU2011134678A (ru) | 2013-02-27 |
| EP2495775A1 (de) | 2012-09-05 |
| US8659106B2 (en) | 2014-02-25 |
| TWI593142B (zh) | 2017-07-21 |
| JP5849702B2 (ja) | 2016-02-03 |
| RU2537091C2 (ru) | 2014-12-27 |
| ZA201201943B (en) | 2013-06-26 |
| KR20170122856A (ko) | 2017-11-06 |
| JPWO2011052672A1 (ja) | 2013-03-21 |
| TWI532216B (zh) | 2016-05-01 |
| TW201620158A (zh) | 2016-06-01 |
| EP2495775B1 (de) | 2019-08-21 |
| CN102598322B (zh) | 2016-10-26 |
| US20120018772A1 (en) | 2012-01-26 |
| EP2495775A4 (de) | 2014-11-12 |
| KR101811885B1 (ko) | 2017-12-22 |
| CN102598322A (zh) | 2012-07-18 |
| TW201140887A (en) | 2011-11-16 |
| KR101947304B1 (ko) | 2019-02-12 |
| BR112012003202B1 (pt) | 2020-02-18 |
| US20140191278A1 (en) | 2014-07-10 |
| CN106449937B (zh) | 2020-11-03 |
| JP2015181202A (ja) | 2015-10-15 |
| CN106449937A (zh) | 2017-02-22 |
| KR20120084660A (ko) | 2012-07-30 |
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