WO2010024635A3 - 발광 소자 패키지 - Google Patents

발광 소자 패키지 Download PDF

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Publication number
WO2010024635A3
WO2010024635A3 PCT/KR2009/004869 KR2009004869W WO2010024635A3 WO 2010024635 A3 WO2010024635 A3 WO 2010024635A3 KR 2009004869 W KR2009004869 W KR 2009004869W WO 2010024635 A3 WO2010024635 A3 WO 2010024635A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitting device
device package
cavity
electrode layer
light emitting
Prior art date
Application number
PCT/KR2009/004869
Other languages
English (en)
French (fr)
Other versions
WO2010024635A2 (ko
Inventor
박형조
Original Assignee
엘지이노텍주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍주식회사 filed Critical 엘지이노텍주식회사
Priority to US12/812,915 priority Critical patent/US8487336B2/en
Priority to EP09810240.3A priority patent/EP2207212B1/en
Priority to CN200980101104.9A priority patent/CN101874311B/zh
Publication of WO2010024635A2 publication Critical patent/WO2010024635A2/ko
Publication of WO2010024635A3 publication Critical patent/WO2010024635A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

실시예에 따른 발광 소자 패키지는 제1 깊이를 갖고 측면이 바닥면에 대하여 경사진 제1 캐비티와, 상기 제1 캐비티의 바닥면으로부터 제2 깊이를 갖고 측면이 상기 제1 캐비티의 바닥면에 대하여 수직인 제2 캐비티를 포함하는 기판; 상기 기판 상에 제1 전극층 및 제2 전극층; 및 상기 제2 캐비티 내에 설치되고 상기 제1 전극층 및 제2 전극층과 전기적으로 연결되는 발광 다이오드를 포함한다.
PCT/KR2009/004869 2008-09-01 2009-08-31 발광 소자 패키지 WO2010024635A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/812,915 US8487336B2 (en) 2008-09-01 2009-08-31 Light emitting device package
EP09810240.3A EP2207212B1 (en) 2008-09-01 2009-08-31 Light emitting device package
CN200980101104.9A CN101874311B (zh) 2008-09-01 2009-08-31 发光器件封装

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0085884 2008-09-01
KR1020080085884A KR100999699B1 (ko) 2008-09-01 2008-09-01 발광 소자 패키지

Publications (2)

Publication Number Publication Date
WO2010024635A2 WO2010024635A2 (ko) 2010-03-04
WO2010024635A3 true WO2010024635A3 (ko) 2010-06-10

Family

ID=41722155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004869 WO2010024635A2 (ko) 2008-09-01 2009-08-31 발광 소자 패키지

Country Status (5)

Country Link
US (1) US8487336B2 (ko)
EP (1) EP2207212B1 (ko)
KR (1) KR100999699B1 (ko)
CN (1) CN101874311B (ko)
WO (1) WO2010024635A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244178A (zh) * 2010-05-14 2011-11-16 展晶科技(深圳)有限公司 发光二极管的封装结构
KR101789825B1 (ko) * 2011-04-20 2017-11-20 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지
JP2012238830A (ja) * 2011-05-09 2012-12-06 Lumirich Co Ltd 発光ダイオード素子
US20130069218A1 (en) * 2011-09-20 2013-03-21 Stmicroelectronics Asia Pacific Pte Ltd. High density package interconnect with copper heat spreader and method of making the same
KR20130102746A (ko) * 2012-03-08 2013-09-23 삼성전자주식회사 발광 장치의 제조 방법
DE102013100121A1 (de) 2013-01-08 2014-07-10 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
KR102045778B1 (ko) * 2013-08-30 2019-11-18 엘지디스플레이 주식회사 발광 다이오드 패키지
JP6606331B2 (ja) * 2015-02-16 2019-11-13 ローム株式会社 電子装置
CN113636265A (zh) * 2021-08-14 2021-11-12 浙江珵美科技有限公司 一种编码器46to贴片封装装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060729A (en) * 1997-11-26 2000-05-09 Rohm Co., Ltd. Light-emitting device
US20060138436A1 (en) * 2004-12-29 2006-06-29 Ming-Hung Chen Light emitting diode package and process of making the same
KR20080008767A (ko) * 2006-07-21 2008-01-24 (주) 아모센스 전자부품 패키지 및 이를 채용한 조명기구
KR100853412B1 (ko) * 2006-12-05 2008-08-21 (주) 아모센스 반도체 패키지

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183407A (ja) * 1998-12-16 2000-06-30 Rohm Co Ltd 光半導体装置
US8294172B2 (en) * 2002-04-09 2012-10-23 Lg Electronics Inc. Method of fabricating vertical devices using a metal support film
KR100567559B1 (ko) * 2002-07-25 2006-04-05 마츠시다 덴코 가부시키가이샤 광전소자부품
CN100352066C (zh) * 2002-07-25 2007-11-28 松下电工株式会社 光电元件部件
CN100459188C (zh) 2003-03-18 2009-02-04 住友电气工业株式会社 发光元件安装用构件以及使用该构件的半导体装置
KR100580765B1 (ko) * 2003-09-22 2006-05-15 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP3994287B2 (ja) * 2004-07-07 2007-10-17 サンケン電気株式会社 半導体発光素子
US7432119B2 (en) * 2005-01-11 2008-10-07 Semileds Corporation Light emitting diode with conducting metal substrate
DE102005017527A1 (de) * 2005-04-15 2006-11-02 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement
EP2109157B1 (en) * 2006-12-28 2018-11-28 Nichia Corporation Light emitting device and method for manufacturing the same
JP2008288248A (ja) 2007-05-15 2008-11-27 Hitachi Cable Ltd 半導体発光素子
KR101007087B1 (ko) * 2009-10-26 2011-01-10 엘지이노텍 주식회사 발광소자 및 그 제조방법
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060729A (en) * 1997-11-26 2000-05-09 Rohm Co., Ltd. Light-emitting device
US20060138436A1 (en) * 2004-12-29 2006-06-29 Ming-Hung Chen Light emitting diode package and process of making the same
KR20080008767A (ko) * 2006-07-21 2008-01-24 (주) 아모센스 전자부품 패키지 및 이를 채용한 조명기구
KR100853412B1 (ko) * 2006-12-05 2008-08-21 (주) 아모센스 반도체 패키지

Also Published As

Publication number Publication date
CN101874311A (zh) 2010-10-27
WO2010024635A2 (ko) 2010-03-04
EP2207212B1 (en) 2017-08-30
US8487336B2 (en) 2013-07-16
EP2207212A2 (en) 2010-07-14
US20110049553A1 (en) 2011-03-03
EP2207212A4 (en) 2015-11-11
KR100999699B1 (ko) 2010-12-08
KR20100026759A (ko) 2010-03-10
CN101874311B (zh) 2014-08-27

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