EP2207212A4 - Light emitting device package - Google Patents

Light emitting device package

Info

Publication number
EP2207212A4
EP2207212A4 EP09810240.3A EP09810240A EP2207212A4 EP 2207212 A4 EP2207212 A4 EP 2207212A4 EP 09810240 A EP09810240 A EP 09810240A EP 2207212 A4 EP2207212 A4 EP 2207212A4
Authority
EP
European Patent Office
Prior art keywords
light emitting
emitting device
device package
package
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09810240.3A
Other languages
German (de)
French (fr)
Other versions
EP2207212A2 (en
EP2207212B1 (en
Inventor
Hyung Jo Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2207212A2 publication Critical patent/EP2207212A2/en
Publication of EP2207212A4 publication Critical patent/EP2207212A4/en
Application granted granted Critical
Publication of EP2207212B1 publication Critical patent/EP2207212B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
EP09810240.3A 2008-09-01 2009-08-31 Light emitting device package Active EP2207212B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080085884A KR100999699B1 (en) 2008-09-01 2008-09-01 Light emitting device package
PCT/KR2009/004869 WO2010024635A2 (en) 2008-09-01 2009-08-31 Light emitting device package

Publications (3)

Publication Number Publication Date
EP2207212A2 EP2207212A2 (en) 2010-07-14
EP2207212A4 true EP2207212A4 (en) 2015-11-11
EP2207212B1 EP2207212B1 (en) 2017-08-30

Family

ID=41722155

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09810240.3A Active EP2207212B1 (en) 2008-09-01 2009-08-31 Light emitting device package

Country Status (5)

Country Link
US (1) US8487336B2 (en)
EP (1) EP2207212B1 (en)
KR (1) KR100999699B1 (en)
CN (1) CN101874311B (en)
WO (1) WO2010024635A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244178A (en) * 2010-05-14 2011-11-16 展晶科技(深圳)有限公司 Encapsulation structure of LED (light emitting diode)
KR101789825B1 (en) * 2011-04-20 2017-11-20 엘지이노텍 주식회사 The light emitting device package having UV light emitting diode
JP2012238830A (en) * 2011-05-09 2012-12-06 Lumirich Co Ltd Light emitting diode element
US20130069218A1 (en) * 2011-09-20 2013-03-21 Stmicroelectronics Asia Pacific Pte Ltd. High density package interconnect with copper heat spreader and method of making the same
KR20130102746A (en) * 2012-03-08 2013-09-23 삼성전자주식회사 Method for manufacturing light emitting device
DE102013100121A1 (en) 2013-01-08 2014-07-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
KR102045778B1 (en) * 2013-08-30 2019-11-18 엘지디스플레이 주식회사 Light Emitting Diode Package
JP6606331B2 (en) * 2015-02-16 2019-11-13 ローム株式会社 Electronic equipment
CN113636265A (en) * 2021-08-14 2021-11-12 浙江珵美科技有限公司 Encoder 46TO surface mount packaging device and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1385217A2 (en) * 2002-07-25 2004-01-28 Matsushita Electric Works, Ltd. Photoelectric device-part
US20070238328A1 (en) * 2005-04-15 2007-10-11 Osram Opto Semiconductors Gmbh Surface-mountable optoelectronic component
WO2008081794A1 (en) * 2006-12-28 2008-07-10 Nichia Corporation Light emitting device and method for manufacturing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163419A (en) 1997-11-26 1999-06-18 Rohm Co Ltd Light-emitting device
JP2000183407A (en) * 1998-12-16 2000-06-30 Rohm Co Ltd Optical semiconductor device
US8294172B2 (en) * 2002-04-09 2012-10-23 Lg Electronics Inc. Method of fabricating vertical devices using a metal support film
KR100567559B1 (en) * 2002-07-25 2006-04-05 마츠시다 덴코 가부시키가이샤 Device with photoelectric element
JP3918858B2 (en) 2003-03-18 2007-05-23 住友電気工業株式会社 Light-emitting element mounting member and semiconductor device using the same
KR100580765B1 (en) * 2003-09-22 2006-05-15 엘지이노텍 주식회사 Light emitting diode package and method for manufacturing light emitting diode package
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP3994287B2 (en) * 2004-07-07 2007-10-17 サンケン電気株式会社 Semiconductor light emitting device
TWI239670B (en) * 2004-12-29 2005-09-11 Ind Tech Res Inst Package structure of light emitting diode and its manufacture method
US7432119B2 (en) * 2005-01-11 2008-10-07 Semileds Corporation Light emitting diode with conducting metal substrate
KR20080008767A (en) * 2006-07-21 2008-01-24 (주) 아모센스 Electron parts package and lighting fixtures using the electron parts package
KR100853412B1 (en) 2006-12-05 2008-08-21 (주) 아모센스 Semiconductor package
JP2008288248A (en) * 2007-05-15 2008-11-27 Hitachi Cable Ltd Semiconductor light-emitting element
KR101007087B1 (en) * 2009-10-26 2011-01-10 엘지이노텍 주식회사 Light emitting device and fabrication method thereof
KR101028329B1 (en) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 Light emitting device package and fabricating method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1385217A2 (en) * 2002-07-25 2004-01-28 Matsushita Electric Works, Ltd. Photoelectric device-part
US20070238328A1 (en) * 2005-04-15 2007-10-11 Osram Opto Semiconductors Gmbh Surface-mountable optoelectronic component
WO2008081794A1 (en) * 2006-12-28 2008-07-10 Nichia Corporation Light emitting device and method for manufacturing the same

Also Published As

Publication number Publication date
US8487336B2 (en) 2013-07-16
US20110049553A1 (en) 2011-03-03
CN101874311B (en) 2014-08-27
EP2207212A2 (en) 2010-07-14
KR100999699B1 (en) 2010-12-08
WO2010024635A2 (en) 2010-03-04
CN101874311A (en) 2010-10-27
WO2010024635A3 (en) 2010-06-10
KR20100026759A (en) 2010-03-10
EP2207212B1 (en) 2017-08-30

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