IL165276A0 - Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board - Google Patents

Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board

Info

Publication number
IL165276A0
IL165276A0 IL16527600A IL16527600A IL165276A0 IL 165276 A0 IL165276 A0 IL 165276A0 IL 16527600 A IL16527600 A IL 16527600A IL 16527600 A IL16527600 A IL 16527600A IL 165276 A0 IL165276 A0 IL 165276A0
Authority
IL
Israel
Prior art keywords
verification
polarity
alignment
components
circuit board
Prior art date
Application number
IL16527600A
Other languages
English (en)
Original Assignee
Original Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Original Solutions Inc filed Critical Original Solutions Inc
Publication of IL165276A0 publication Critical patent/IL165276A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IL16527600A 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board IL165276A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/247,811 US6272018B1 (en) 1999-02-11 1999-02-11 Method for the verification of the polarity and presence of components on a printed circuit board
PCT/CA2000/000129 WO2000048012A1 (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Publications (1)

Publication Number Publication Date
IL165276A0 true IL165276A0 (en) 2005-12-18

Family

ID=22936477

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16527600A IL165276A0 (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board
IL14475100A IL144751A (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL14475100A IL144751A (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Country Status (12)

Country Link
US (2) US6272018B1 (ko)
EP (1) EP1153309B1 (ko)
JP (1) JP2003530680A (ko)
KR (1) KR20010105343A (ko)
CN (1) CN1340163A (ko)
AU (1) AU2529800A (ko)
CA (1) CA2362151A1 (ko)
DE (1) DE60002305T2 (ko)
HK (1) HK1044375A1 (ko)
IL (2) IL165276A0 (ko)
MX (1) MXPA01008152A (ko)
WO (1) WO2000048012A1 (ko)

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KR102630710B1 (ko) * 2015-12-31 2024-01-26 엘지디스플레이 주식회사 엑스레이 검출기용 어레이기판, 이를 포함하는 엑스레이 검출기, 엑스레이 검출기용 어레이기판의 제조방법 및 엑스레이 검출기의 제조방법
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JP6705777B2 (ja) * 2017-07-10 2020-06-03 ファナック株式会社 機械学習装置、検査装置及び機械学習方法
CN107895064B (zh) * 2017-10-19 2020-01-10 上海望友信息科技有限公司 元器件极性检测方法、系统、计算机可读存储介质及设备
JP6855597B2 (ja) * 2018-01-10 2021-04-07 株式会社Ｆｕｊｉ 作業機、及び極性の判定方法
CN108693462A (zh) * 2018-06-13 2018-10-23 奇酷互联网络科技（深圳）有限公司 电路板检测方法、系统、可读存储介质、设备及电路板
CN109270436B (zh) * 2018-10-24 2021-04-20 深圳市科汇龙科技有限公司 一种pcb线路板高效全自动质量及外观检测一体设备
CN109738789B (zh) * 2019-01-02 2021-09-21 深圳市大族数控科技股份有限公司 飞针测试机测试方法、装置、飞针测试机及存储介质
CN110568831A (zh) * 2019-09-20 2019-12-13 惠州市新一代工业互联网创新研究院 一种基于物联网技术的首件检测系统
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Also Published As

Publication number Publication date
CA2362151A1 (en) 2000-08-17
IL144751A0 (en) 2002-06-30
US6272018B1 (en) 2001-08-07
WO2000048012A1 (en) 2000-08-17
KR20010105343A (ko) 2001-11-28
MXPA01008152A (es) 2002-10-23
CN1340163A (zh) 2002-03-13
HK1044375A1 (zh) 2002-10-18
AU2529800A (en) 2000-08-29
JP2003530680A (ja) 2003-10-14
DE60002305T2 (de) 2004-02-26
IL144751A (en) 2005-03-20
DE60002305D1 (de) 2003-05-28
EP1153309B1 (en) 2003-04-23
US6480394B1 (en) 2002-11-12
EP1153309A1 (en) 2001-11-14

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