MXPA03001399A - Sistema y metodo para proteccion de tablero de circuito. - Google Patents
Sistema y metodo para proteccion de tablero de circuito.Info
- Publication number
- MXPA03001399A MXPA03001399A MXPA03001399A MXPA03001399A MXPA03001399A MX PA03001399 A MXPA03001399 A MX PA03001399A MX PA03001399 A MXPA03001399 A MX PA03001399A MX PA03001399 A MXPA03001399 A MX PA03001399A MX PA03001399 A MXPA03001399 A MX PA03001399A
- Authority
- MX
- Mexico
- Prior art keywords
- circuit board
- protection system
- board protection
- circuit
- protection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49108—Electric battery cell making
- Y10T29/4911—Electric battery cell making including sealing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/625,394 US6380487B1 (en) | 2000-07-26 | 2000-07-26 | Circuit board protection system and method |
PCT/US2001/023522 WO2002009124A1 (en) | 2000-07-26 | 2001-07-26 | Circuit board protection system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA03001399A true MXPA03001399A (es) | 2003-06-06 |
Family
ID=24505870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA03001399A MXPA03001399A (es) | 2000-07-26 | 2001-07-26 | Sistema y metodo para proteccion de tablero de circuito. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6380487B1 (es) |
EP (1) | EP1314169B1 (es) |
AU (1) | AU2001280806A1 (es) |
CA (1) | CA2417496C (es) |
ES (1) | ES2377725T3 (es) |
MX (1) | MXPA03001399A (es) |
WO (1) | WO2002009124A1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6219258B1 (en) * | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
US7118646B2 (en) * | 2004-03-15 | 2006-10-10 | Delphi Technologies, Inc. | Method of manufacturing a sealed electronic module |
US7209360B1 (en) * | 2005-10-28 | 2007-04-24 | Lear Corporation | Leak-tight system for boxes containing electrical and electronic components |
US7652892B2 (en) * | 2006-03-03 | 2010-01-26 | Kingston Technology Corporation | Waterproof USB drives and method of making |
US8011950B2 (en) * | 2009-02-18 | 2011-09-06 | Cinch Connectors, Inc. | Electrical connector |
US8830662B2 (en) * | 2011-03-01 | 2014-09-09 | Apple Inc. | Electronic devices with moisture resistant openings |
JP5693515B2 (ja) | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | 内部耐水性被覆を備える電子デバイス |
JP6081585B2 (ja) * | 2012-06-18 | 2017-02-15 | エイチズィーオー・インコーポレーテッド | 耐湿性エネルギー貯蔵デバイス及び関連方法 |
CN103701963B (zh) * | 2013-12-30 | 2017-05-10 | 惠州Tcl移动通信有限公司 | 一种移动终端的防水处理方法及移动终端 |
CN103701962B (zh) * | 2013-12-30 | 2017-03-29 | 惠州Tcl移动通信有限公司 | 一种移动终端的防水处理方法及移动终端 |
US10362698B2 (en) * | 2017-01-20 | 2019-07-23 | Yaskawa America, Inc. | Method and system for environmental sealing of electrical enclosures |
USD877732S1 (en) | 2018-05-31 | 2020-03-10 | Sensus Spectrum, Llc | Potting cup |
US10694617B2 (en) | 2018-07-31 | 2020-06-23 | Sensus Spectrum, Llc | Plastic injection molded potting cups and related methods |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58166744A (ja) * | 1982-03-26 | 1983-10-01 | Sanyo Electric Co Ltd | 混成集積回路の密封方法 |
US4988577A (en) * | 1989-06-08 | 1991-01-29 | Bussco Engineering, Inc. | Printed circuit board stiffener |
US5293004A (en) * | 1991-09-02 | 1994-03-08 | Nippon Cmk Corp. | Printed circuit board having an electromagnetic shielding layer |
JPH0621660A (ja) * | 1992-06-30 | 1994-01-28 | Matsushita Electric Works Ltd | 接着構造 |
US5375040A (en) * | 1992-09-29 | 1994-12-20 | Eldec Corporation | Modular electronic circuit housing and wiring board |
AU6015596A (en) * | 1995-06-13 | 1997-01-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, wiring board for mounting semiconducto r and method of production of semiconductor device |
US5804881A (en) * | 1995-11-27 | 1998-09-08 | Motorola, Inc. | Method and assembly for providing improved underchip encapsulation |
JPH09188384A (ja) * | 1996-01-08 | 1997-07-22 | Kokusai Electric Co Ltd | 樹脂製ケースの作製方法とその製品 |
JP3720507B2 (ja) * | 1997-01-22 | 2005-11-30 | アルプス電気株式会社 | 筺体 |
US6145280A (en) * | 1998-03-18 | 2000-11-14 | Ntk Powerdex, Inc. | Flexible packaging for polymer electrolytic cell and method of forming same |
US6239980B1 (en) * | 1998-08-31 | 2001-05-29 | General Electric Company | Multimodule interconnect structure and process |
US6292370B1 (en) * | 1999-10-01 | 2001-09-18 | Motorola, Inc. | Flexible circuit board and method for making a flexible circuit board |
JP3621669B2 (ja) * | 2001-09-28 | 2005-02-16 | 株式会社東芝 | カード型電子機器 |
-
2000
- 2000-07-26 US US09/625,394 patent/US6380487B1/en not_active Expired - Lifetime
-
2001
- 2001-07-26 MX MXPA03001399A patent/MXPA03001399A/es active IP Right Grant
- 2001-07-26 ES ES01959224T patent/ES2377725T3/es not_active Expired - Lifetime
- 2001-07-26 CA CA002417496A patent/CA2417496C/en not_active Expired - Fee Related
- 2001-07-26 EP EP01959224A patent/EP1314169B1/en not_active Expired - Lifetime
- 2001-07-26 WO PCT/US2001/023522 patent/WO2002009124A1/en active Application Filing
- 2001-07-26 AU AU2001280806A patent/AU2001280806A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2417496C (en) | 2005-10-18 |
WO2002009124A1 (en) | 2002-01-31 |
AU2001280806A1 (en) | 2002-02-05 |
CA2417496A1 (en) | 2002-01-31 |
EP1314169A4 (en) | 2008-04-02 |
US6380487B1 (en) | 2002-04-30 |
ES2377725T3 (es) | 2012-03-30 |
EP1314169B1 (en) | 2011-12-21 |
EP1314169A1 (en) | 2003-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |