IL144751A - Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board - Google Patents

Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Info

Publication number
IL144751A
IL144751A IL14475100A IL14475100A IL144751A IL 144751 A IL144751 A IL 144751A IL 14475100 A IL14475100 A IL 14475100A IL 14475100 A IL14475100 A IL 14475100A IL 144751 A IL144751 A IL 144751A
Authority
IL
Israel
Prior art keywords
verification
polarity
alignment
components
circuit board
Prior art date
Application number
IL14475100A
Other languages
English (en)
Other versions
IL144751A0 (en
Inventor
Michael Feld
David Tordjman
Alex Feld
Original Assignee
Original Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Original Solutions Inc filed Critical Original Solutions Inc
Publication of IL144751A0 publication Critical patent/IL144751A0/xx
Publication of IL144751A publication Critical patent/IL144751A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/161Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/168Wrong mounting prevention
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IL14475100A 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board IL144751A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/247,811 US6272018B1 (en) 1999-02-11 1999-02-11 Method for the verification of the polarity and presence of components on a printed circuit board
PCT/CA2000/000129 WO2000048012A1 (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Publications (2)

Publication Number Publication Date
IL144751A0 IL144751A0 (en) 2002-06-30
IL144751A true IL144751A (en) 2005-03-20

Family

ID=22936477

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16527600A IL165276A0 (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board
IL14475100A IL144751A (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL16527600A IL165276A0 (en) 1999-02-11 2000-02-11 Method for the verification of the polarity, presence, alignment of components and short circuits ona printed circuit board

Country Status (12)

Country Link
US (2) US6272018B1 (xx)
EP (1) EP1153309B1 (xx)
JP (1) JP2003530680A (xx)
KR (1) KR20010105343A (xx)
CN (1) CN1340163A (xx)
AU (1) AU2529800A (xx)
CA (1) CA2362151A1 (xx)
DE (1) DE60002305T2 (xx)
HK (1) HK1044375A1 (xx)
IL (2) IL165276A0 (xx)
MX (1) MXPA01008152A (xx)
WO (1) WO2000048012A1 (xx)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3744251B2 (ja) * 1999-04-02 2006-02-08 松下電器産業株式会社 電子部品実装方法
US6668449B2 (en) * 2001-06-25 2003-12-30 Micron Technology, Inc. Method of making a semiconductor device having an opening in a solder mask
US7214925B2 (en) * 2001-09-17 2007-05-08 The Boeing Company Pattern method and system for detecting foreign object debris
US7031132B1 (en) 2002-06-14 2006-04-18 Mitchell Dennis A Short circuit diagnostic tool
JP3610494B2 (ja) * 2002-06-26 2005-01-12 オリオン電機株式会社 プリント基板の極性表示
US6650022B1 (en) * 2002-09-11 2003-11-18 Motorola, Inc. Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system
FR2861948B1 (fr) * 2003-10-30 2006-03-24 Airbus France Procede pour determiner des modifications apportees a une carte electronique et methodes de fabrication d'une carte electronique et d'un equipement muni d'une carte electronique
DE102004011327B3 (de) * 2004-03-09 2005-11-10 S-Y Systems Technologies Europe Gmbh Vorrichtung und Verfahren zum Bestimmen, ob ein Bauteil fehlt.
US7265822B2 (en) * 2004-10-01 2007-09-04 Test Coach Corporation Method and apparatus for determining presence of a component in a printed circuit board
TWI270328B (en) * 2005-09-27 2007-01-01 Inventec Corp Method of inspecting manually-inserted elements
US7652471B2 (en) * 2006-12-27 2010-01-26 Honeywell International Inc. Magnetic tagging of magnetoresistive sensors
JP5023045B2 (ja) * 2008-03-05 2012-09-12 株式会社リコー 欠品判定用の機器
US20100155106A1 (en) * 2008-12-22 2010-06-24 Sun Microsystems, Inc. Method and apparatus for optical differentiation to detect missing components on a circuit board
CN101697001B (zh) * 2009-01-22 2011-07-13 依利安达(广州)电子有限公司 一种检测多层印制电路板层间位置偏移的方法
JP2012099670A (ja) * 2010-11-02 2012-05-24 Sumitomo Wiring Syst Ltd 実装基板
CN102438407B (zh) * 2011-10-10 2015-06-03 深圳创维数字技术有限公司 机插电子元器件的pcb板封装设计方法及pcb板
CN103118482B (zh) * 2012-12-28 2015-08-05 威力盟电子(苏州)有限公司 具有质量辨识标记的电路板及其辨识方法
CN104020388A (zh) * 2014-05-09 2014-09-03 东莞市五株电子科技有限公司 一种测试pcb内部短路的方法
CN105242197A (zh) * 2015-09-09 2016-01-13 苏州威盛视信息科技有限公司 Aoi扫描缺陷检测处理方法
CN105203901A (zh) * 2015-09-10 2015-12-30 苏州威盛视信息科技有限公司 元件短路aoi检测方法
KR102630710B1 (ko) * 2015-12-31 2024-01-26 엘지디스플레이 주식회사 엑스레이 검출기용 어레이기판, 이를 포함하는 엑스레이 검출기, 엑스레이 검출기용 어레이기판의 제조방법 및 엑스레이 검출기의 제조방법
US10302496B2 (en) 2016-02-09 2019-05-28 Nasa Solutions, Llc Method and apparatus for determining presence and operation of a component in a printed circuit board
CN106093750B (zh) * 2016-06-17 2018-12-18 深圳市燕麦科技股份有限公司 用于电路板测试的转接电路板和转接装置
JP6705777B2 (ja) * 2017-07-10 2020-06-03 ファナック株式会社 機械学習装置、検査装置及び機械学習方法
CN107895064B (zh) * 2017-10-19 2020-01-10 上海望友信息科技有限公司 元器件极性检测方法、系统、计算机可读存储介质及设备
WO2019138469A1 (ja) * 2018-01-10 2019-07-18 株式会社Fuji 作業機、及び極性の判定方法
CN108693462A (zh) * 2018-06-13 2018-10-23 奇酷互联网络科技(深圳)有限公司 电路板检测方法、系统、可读存储介质、设备及电路板
CN109270436B (zh) * 2018-10-24 2021-04-20 深圳市科汇龙科技有限公司 一种pcb线路板高效全自动质量及外观检测一体设备
CN109738789B (zh) * 2019-01-02 2021-09-21 深圳市大族数控科技股份有限公司 飞针测试机测试方法、装置、飞针测试机及存储介质
CN110568831A (zh) * 2019-09-20 2019-12-13 惠州市新一代工业互联网创新研究院 一种基于物联网技术的首件检测系统
KR20210070780A (ko) * 2019-12-05 2021-06-15 엘지디스플레이 주식회사 디지털 엑스레이 검출기용 박막 트랜지스터 어레이 기판과 디지털 엑스레이 검출기 및 그 제조 방법

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3043022A (en) * 1959-07-02 1962-07-10 Electronic Training Aids Inc Training panel for electronic technicians
US3588347A (en) 1969-03-13 1971-06-28 Western Electric Co Method and apparatus for aligning a mask and a substrate using infrared radiation
US3988535A (en) * 1975-11-04 1976-10-26 Western Electric Company, Inc. Automated positioning
US4259661A (en) 1978-09-01 1981-03-31 Burroughs Corporation Apparatus and method for recognizing a pattern
JPS5867093A (ja) 1981-10-19 1983-04-21 株式会社東芝 印刷回路基板検査方法及びその装置
US4442542A (en) 1982-01-29 1984-04-10 Sperry Corporation Preprocessing circuitry apparatus for digital data
DE3267548D1 (en) 1982-05-28 1986-01-02 Ibm Deutschland Process and device for an automatic optical inspection
US4514436A (en) 1983-07-28 1985-04-30 At&T Technologies, Inc. Methods of highlighting pinholes in a surface layer of an article
US4565314A (en) * 1983-09-09 1986-01-21 At&T Bell Laboratories Registration and assembly of integrated circuit packages
US4692690A (en) 1983-12-26 1987-09-08 Hitachi, Ltd. Pattern detecting apparatus
US5774572A (en) 1984-12-20 1998-06-30 Orbotech Ltd. Automatic visual inspection system
US5774573A (en) 1984-12-20 1998-06-30 Orbotech Ltd. Automatic visual inspection system
CA1242815A (en) 1987-03-20 1988-10-04 Pak K. Leung Defect detection method of semiconductor wafer patterns
US4975972A (en) 1988-10-18 1990-12-04 At&T Bell Laboratories Method and apparatus for surface inspection
US5034802A (en) * 1989-12-11 1991-07-23 Hewlett-Packard Company Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
JP3092809B2 (ja) * 1989-12-21 2000-09-25 株式会社日立製作所 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置
JPH03122578U (xx) * 1990-03-26 1991-12-13
US5109319A (en) * 1990-11-01 1992-04-28 Jerome Potash Terminal arrangement for axial lead electrically asymmetric electronic components
IL96541A (en) 1990-12-04 2000-08-13 Orbot Instr Ltd Apparatus and method for microscopic inspection of articles
US5586058A (en) 1990-12-04 1996-12-17 Orbot Instruments Ltd. Apparatus and method for inspection of a patterned object by comparison thereof to a reference
US5204910A (en) 1991-05-24 1993-04-20 Motorola, Inc. Method for detection of defects lacking distinct edges
KR960007481B1 (ko) 1991-05-27 1996-06-03 가부시끼가이샤 히다찌세이사꾸쇼 패턴검사방법 및 장치
EP0526080B1 (en) * 1991-07-22 1996-10-02 Omron Corporation Teaching method and system for mounted component inspection
US5237622A (en) 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
US5260154A (en) 1992-03-09 1993-11-09 Gary Forrest Evaluating photolithographic exposures
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
EP0637070B1 (en) * 1993-07-28 1997-09-24 The Whitaker Corporation Perimeter independent precision locating member for a semiconductor chip and method of making said member
JP3238803B2 (ja) * 1993-08-24 2001-12-17 ローム株式会社 面実装型有極性電子部品の基板実装構造
JPH07191618A (ja) * 1993-12-27 1995-07-28 Satoshi Inoue 導光板を用いた表示装置
US5457880A (en) * 1994-02-08 1995-10-17 Digital Equipment Corporation Embedded features for monitoring electronics assembly manufacturing processes
US5644102A (en) 1994-03-01 1997-07-01 Lsi Logic Corporation Integrated circuit packages with distinctive coloration
JPH0823160A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp プリント配線板と電子部品の接続方法
US5864394A (en) 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5550583A (en) * 1994-10-03 1996-08-27 Lucent Technologies Inc. Inspection apparatus and method
GB2295224A (en) 1994-11-17 1996-05-22 Surface Inspection Ltd A surface inspection lighting apparatus
KR100220006B1 (ko) * 1994-11-30 1999-09-01 구자홍 좌표값을 갖는 인쇄회로기판
JPH08233555A (ja) 1994-12-28 1996-09-13 Matsushita Electric Ind Co Ltd レジストパターンの測定方法及びレジストパターンの測定装置
JP3647100B2 (ja) 1995-01-12 2005-05-11 キヤノン株式会社 検査装置およびこれを用いた露光装置やデバイス生産方法
US5751910A (en) * 1995-05-22 1998-05-12 Eastman Kodak Company Neural network solder paste inspection system
US5946409A (en) * 1995-05-31 1999-08-31 Nec Corporation Pick-up apparatus and method for semiconductor devices
US5943437A (en) 1995-10-09 1999-08-24 Kabushiki Kaisha Kobe Seiko Sho Method and apparatus for classifying a defect on a semiconductor wafer
FR2740220B1 (fr) 1995-10-18 1997-11-21 Snecma Procede de detection automatique des zones expertisables dans des images de pieces mecaniques
JP2956755B2 (ja) 1996-03-11 1999-10-04 日本電気株式会社 微細パターン検査装置
TW326619B (en) 1996-03-15 1998-02-11 Matsushita Electric Ind Co Ltd Electronic part mounting apparatus and method thereof
US5699400A (en) 1996-05-08 1997-12-16 Vivid Technologies, Inc. Operator console for article inspection systems
JPH1032810A (ja) 1996-07-15 1998-02-03 Matsushita Electric Works Ltd 画像処理検査装置
IL118872A (en) 1996-07-16 2000-06-01 Orbot Instr Ltd Optical inspection method and apparatus
US5795688A (en) 1996-08-14 1998-08-18 Micron Technology, Inc. Process for detecting defects in photomasks through aerial image comparisons
KR19980039100A (ko) 1996-11-27 1998-08-17 배순훈 부품의 클린칭 방향을 이용한 미삽 검사장치 및 방법
US6042995A (en) 1997-12-09 2000-03-28 Lucent Technologies Inc. Lithographic process for device fabrication using a multilayer mask which has been previously inspected
US6051348A (en) 1999-08-17 2000-04-18 Advanced Micro Devices Method for detecting malfunction in photolithographic fabrication track

Also Published As

Publication number Publication date
HK1044375A1 (zh) 2002-10-18
IL165276A0 (en) 2005-12-18
IL144751A0 (en) 2002-06-30
CA2362151A1 (en) 2000-08-17
EP1153309A1 (en) 2001-11-14
EP1153309B1 (en) 2003-04-23
JP2003530680A (ja) 2003-10-14
DE60002305T2 (de) 2004-02-26
MXPA01008152A (es) 2002-10-23
KR20010105343A (ko) 2001-11-28
AU2529800A (en) 2000-08-29
US6480394B1 (en) 2002-11-12
US6272018B1 (en) 2001-08-07
WO2000048012A1 (en) 2000-08-17
DE60002305D1 (de) 2003-05-28
CN1340163A (zh) 2002-03-13

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