HK1048666B - 印刷線路板 - Google Patents

印刷線路板

Info

Publication number
HK1048666B
HK1048666B HK03100802.5A HK03100802A HK1048666B HK 1048666 B HK1048666 B HK 1048666B HK 03100802 A HK03100802 A HK 03100802A HK 1048666 B HK1048666 B HK 1048666B
Authority
HK
Hong Kong
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Application number
HK03100802.5A
Other languages
English (en)
Other versions
HK1048666A1 (en
Inventor
松村正美
小川勇太
Original Assignee
太陽油墨製造株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽油墨製造株式會社 filed Critical 太陽油墨製造株式會社
Publication of HK1048666A1 publication Critical patent/HK1048666A1/xx
Publication of HK1048666B publication Critical patent/HK1048666B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK03100802.5A 1999-05-06 2003-02-04 印刷線路板 HK1048666B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12558599 1999-05-06
PCT/JP2000/002936 WO2000068740A1 (fr) 1999-05-06 2000-05-08 Composition d'encre resistant au soudage

Publications (2)

Publication Number Publication Date
HK1048666A1 HK1048666A1 (en) 2003-04-11
HK1048666B true HK1048666B (zh) 2007-12-07

Family

ID=14913828

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03100802.5A HK1048666B (zh) 1999-05-06 2003-02-04 印刷線路板

Country Status (5)

Country Link
JP (1) JP3924431B2 (zh)
CN (2) CN1313883C (zh)
HK (1) HK1048666B (zh)
TW (1) TW494276B (zh)
WO (1) WO2000068740A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002234932A (ja) * 2001-02-09 2002-08-23 Nippon Kayaku Co Ltd アルカリ水溶液可溶性エポキシカルボキシレート化合物及びそれを用いた感光性樹脂組成物並びにその硬化物
JP4713753B2 (ja) * 2001-03-29 2011-06-29 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びその硬化物
JP4312598B2 (ja) 2001-07-26 2009-08-12 チバ ホールディング インコーポレーテッド 感光性樹脂組成物
SG100761A1 (en) * 2001-09-28 2003-12-26 Nanya Plastics Corp Photosensitive thermosetting resin composition
JP4328645B2 (ja) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
WO2006004158A1 (ja) 2004-07-07 2006-01-12 Taiyo Ink Mfg. Co., Ltd. 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物
JP4559892B2 (ja) * 2005-03-28 2010-10-13 太陽インキ製造株式会社 着色感光性樹脂組成物及びその硬化物
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same
JP4849860B2 (ja) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP2007256477A (ja) * 2006-03-22 2007-10-04 Fujifilm Corp 光学補償シートの製造方法およびその製造方法により作製された光学補償シートを含む偏光板、および液晶表示装置
JP4994922B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
JP5189878B2 (ja) * 2008-04-01 2013-04-24 関西ペイント株式会社 樹脂組成物、レジスト組成物及びレジストパターン形成方法
CN105517364B (zh) * 2014-09-25 2018-10-23 深南电路有限公司 一种用于印刷电路板的电镀金方法
CN106318019B (zh) * 2015-07-06 2020-03-17 南亚塑胶工业股份有限公司 印刷电路板用低介电抗焊光阻油墨组合物
US10527936B2 (en) 2016-06-17 2020-01-07 Nan Ya Plastics Corporation Low Dk/Df solder resistant composition use for printed circuit board
JP6892668B2 (ja) * 2016-10-14 2021-06-23 互応化学工業株式会社 感光性樹脂組成物
CN109970953B (zh) * 2017-12-27 2021-04-09 太阳油墨（苏州）有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
JP6563158B1 (ja) * 2018-02-08 2019-08-21 関西ペイント株式会社 レジスト組成物及びレジスト膜
JP6986476B2 (ja) * 2018-03-29 2021-12-22 株式会社タムラ製作所 感光性樹脂組成物
CN110895381A (zh) * 2019-11-20 2020-03-20 深圳市容大感光科技股份有限公司 感光阻焊油墨组合物、其用途及含有其的线路板
EP4215551A4 (en) * 2020-09-18 2024-03-13 Konica Minolta, Inc. CURABLE COMPOSITION, SOLDER RESIST AND CIRCUIT BOARD INK
CN117003933B (zh) * 2023-08-14 2024-01-19 江门市金桥新材料有限公司 一种无皂聚合阳离子分散体及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP3154782B2 (ja) * 1992-01-06 2001-04-09 太陽インキ製造株式会社 レジストインキ組成物及びソルダーレジスト膜形成法
CN1147868A (zh) * 1995-03-13 1997-04-16 互応化学工业株式会社 感光性树脂组合物及其用于涂膜、抗蚀印色、抗蚀保护膜、焊料抗蚀保护膜和印刷电路基片
JPH09160239A (ja) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd ソルダーレジスト樹脂組成物
JPH10114852A (ja) * 1996-10-11 1998-05-06 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物
CN1065971C (zh) * 1996-12-27 2001-05-16 清华大学 有机碱催化的无显影气相光刻胶
JPH1114852A (ja) * 1997-06-20 1999-01-22 Sharp Corp 光電複合器具
JPH1165117A (ja) * 1997-08-27 1999-03-05 Tamura Kaken Kk 感光性樹脂組成物及びそれを用いたソルダーレジストインク

Also Published As

Publication number Publication date
CN1313883C (zh) 2007-05-02
WO2000068740A1 (fr) 2000-11-16
TW494276B (en) 2002-07-11
CN1364247A (zh) 2002-08-14
CN1821876B (zh) 2010-10-06
JP3924431B2 (ja) 2007-06-06
CN1821876A (zh) 2006-08-23
HK1048666A1 (en) 2003-04-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110508