IL130562A - N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress - Google Patents

N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress

Info

Publication number
IL130562A
IL130562A IL13056297A IL13056297A IL130562A IL 130562 A IL130562 A IL 130562A IL 13056297 A IL13056297 A IL 13056297A IL 13056297 A IL13056297 A IL 13056297A IL 130562 A IL130562 A IL 130562A
Authority
IL
Israel
Prior art keywords
nitrided
trench sidewalls
oxide trench
prevent boron
decrease stress
Prior art date
Application number
IL13056297A
Other languages
English (en)
Other versions
IL130562A0 (en
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of IL130562A0 publication Critical patent/IL130562A0/xx
Publication of IL130562A publication Critical patent/IL130562A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
    • H01L21/76235—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls trench shape altered by a local oxidation of silicon process step, e.g. trench corner rounding by LOCOS

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
IL13056297A 1996-12-31 1997-12-16 N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress IL130562A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/775,571 US5780346A (en) 1996-12-31 1996-12-31 N2 O nitrided-oxide trench sidewalls and method of making isolation structure
PCT/US1997/023307 WO1998029905A1 (fr) 1996-12-31 1997-12-16 Parois laterales de tranchee a l'oxyde nitrure au n2o formees pour empecher la sortie par diffusion de bore et reduire les contraintes

Publications (2)

Publication Number Publication Date
IL130562A0 IL130562A0 (en) 2000-06-01
IL130562A true IL130562A (en) 2003-12-10

Family

ID=25104813

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13056297A IL130562A (en) 1996-12-31 1997-12-16 N2o nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress

Country Status (8)

Country Link
US (3) US5780346A (fr)
EP (1) EP1002336B1 (fr)
JP (1) JP4518573B2 (fr)
KR (1) KR100384761B1 (fr)
AU (1) AU5705798A (fr)
DE (1) DE69733842T2 (fr)
IL (1) IL130562A (fr)
WO (1) WO1998029905A1 (fr)

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Also Published As

Publication number Publication date
EP1002336A1 (fr) 2000-05-24
KR20000069813A (ko) 2000-11-25
US6261925B1 (en) 2001-07-17
KR100384761B1 (ko) 2003-05-22
JP4518573B2 (ja) 2010-08-04
EP1002336B1 (fr) 2005-07-27
WO1998029905A1 (fr) 1998-07-09
AU5705798A (en) 1998-07-31
US6566727B1 (en) 2003-05-20
IL130562A0 (en) 2000-06-01
JP2001507864A (ja) 2001-06-12
DE69733842D1 (de) 2005-09-01
EP1002336A4 (fr) 2000-05-24
US5780346A (en) 1998-07-14
DE69733842T2 (de) 2006-04-27

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