IE55078B1 - A plastics moulded semiconductor device and a method of producing it - Google Patents

A plastics moulded semiconductor device and a method of producing it

Info

Publication number
IE55078B1
IE55078B1 IE2368/83A IE236883A IE55078B1 IE 55078 B1 IE55078 B1 IE 55078B1 IE 2368/83 A IE2368/83 A IE 2368/83A IE 236883 A IE236883 A IE 236883A IE 55078 B1 IE55078 B1 IE 55078B1
Authority
IE
Ireland
Prior art keywords
leads
semiconductor chip
stage
semiconductor device
electrodes
Prior art date
Application number
IE2368/83A
Other languages
English (en)
Other versions
IE832368L (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE832368L publication Critical patent/IE832368L/xx
Publication of IE55078B1 publication Critical patent/IE55078B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/458—Materials of insulating layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/916—Narrow band gap semiconductor material, <<1ev

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IE2368/83A 1982-10-08 1983-10-07 A plastics moulded semiconductor device and a method of producing it IE55078B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177353A JPS5966157A (ja) 1982-10-08 1982-10-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
IE832368L IE832368L (en) 1984-04-08
IE55078B1 true IE55078B1 (en) 1990-05-23

Family

ID=16029481

Family Applications (1)

Application Number Title Priority Date Filing Date
IE2368/83A IE55078B1 (en) 1982-10-08 1983-10-07 A plastics moulded semiconductor device and a method of producing it

Country Status (7)

Country Link
US (2) US4984059A (enExample)
EP (1) EP0108502B1 (enExample)
JP (1) JPS5966157A (enExample)
KR (1) KR860000410B1 (enExample)
CA (1) CA1217876A (enExample)
DE (1) DE3379008D1 (enExample)
IE (1) IE55078B1 (enExample)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS61230344A (ja) * 1985-04-05 1986-10-14 Toray Silicone Co Ltd 樹脂封止型半導体装置
JPS6344750A (ja) * 1986-08-12 1988-02-25 Shinko Electric Ind Co Ltd 樹脂封止型半導体装置の製造方法およびこれに用いるリ−ドフレ−ム
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
JPH0724275B2 (ja) * 1987-11-06 1995-03-15 三菱電機株式会社 半導体装置
JP2706077B2 (ja) * 1988-02-12 1998-01-28 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
JPH0215663A (ja) * 1988-07-04 1990-01-19 Tomoegawa Paper Co Ltd リードフレーム用両面接着テープ
JP2522524B2 (ja) * 1988-08-06 1996-08-07 株式会社東芝 半導体装置の製造方法
JPH0650749B2 (ja) * 1989-06-28 1994-06-29 株式会社東芝 半導体装置及びその製造方法
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
JPH0693469B2 (ja) * 1989-11-28 1994-11-16 株式会社東芝 樹脂封止型半導体装置
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
EP0503072B1 (en) * 1990-09-10 1997-12-17 Fujitsu Limited Semiconductor device and its manufacturing process
KR920018907A (ko) * 1991-03-23 1992-10-22 김광호 반도체 리드 프레임
JP2509422B2 (ja) * 1991-10-30 1996-06-19 三菱電機株式会社 半導体装置及びその製造方法
EP0550013B1 (en) * 1991-12-27 2000-07-26 Fujitsu Limited Semiconductor device and method of producing the same
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
JP3088193B2 (ja) * 1992-06-05 2000-09-18 三菱電機株式会社 Ｌｏｃ構造を有する半導体装置の製造方法並びにこれに使用するリードフレーム
JPH06209054A (ja) * 1993-01-08 1994-07-26 Mitsubishi Electric Corp 半導体装置
USRE40061E1 (en) 1993-04-06 2008-02-12 Micron Technology, Inc. Multi-chip stacked devices
US5291061A (en) * 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
US5596172A (en) * 1993-05-07 1997-01-21 Motorola, Inc. Planar encapsulation process
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
JPH07176677A (ja) * 1993-08-31 1995-07-14 Texas Instr Inc <Ti> 低コストリードフレームの設計及び製造方法
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
JP3152662B2 (ja) * 1994-11-10 2001-04-03 マイクロン、テクノロジー、インコーポレーテッド 半導体デバイス用多層リードフレーム
US5965936A (en) 1997-12-31 1999-10-12 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
TW314650B (enExample) * 1995-06-21 1997-09-01 Oki Electric Ind Co Ltd
GB2344934A (en) * 1995-10-24 2000-06-21 Altera Corp Integrated circuit package
US5770479A (en) * 1996-01-11 1998-06-23 Micron Technology, Inc. Bonding support for leads-over-chip process
US5872398A (en) 1996-01-11 1999-02-16 Micron Technology, Inc. Reduced stress LOC assembly including cantilevered leads
US6277225B1 (en) 1996-03-13 2001-08-21 Micron Technology, Inc. Stress reduction feature for LOC lead frame
US6384333B1 (en) 1996-05-21 2002-05-07 Micron Technology, Inc. Underfill coating for LOC package
US5733800A (en) * 1996-05-21 1998-03-31 Micron Technology, Inc. Underfill coating for LOC package
JP3870301B2 (ja) * 1996-06-11 2007-01-17 ヤマハ株式会社 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム
US5717246A (en) 1996-07-29 1998-02-10 Micron Technology, Inc. Hybrid frame with lead-lock tape
US5759875A (en) * 1996-10-04 1998-06-02 Micron Technology, Inc. Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use
US6072228A (en) * 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US5847445A (en) * 1996-11-04 1998-12-08 Micron Technology, Inc. Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
US5907769A (en) * 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
JP3398004B2 (ja) * 1997-03-24 2003-04-21 ローム株式会社 パッケージ型半導体装置の構造
US5923081A (en) * 1997-05-15 1999-07-13 Micron Technology, Inc. Compression layer on the leadframe to reduce stress defects
US5982018A (en) 1997-05-23 1999-11-09 Micron Technology, Inc. Thin film capacitor coupons for memory modules and multi-chip modules
US6054754A (en) 1997-06-06 2000-04-25 Micron Technology, Inc. Multi-capacitance lead frame decoupling device
EP0887850A3 (en) 1997-06-23 2001-05-02 STMicroelectronics, Inc. Lead-frame forming for improved thermal performance
US6005286A (en) * 1997-10-06 1999-12-21 Micron Technology, Inc. Increasing the gap between a lead frame and a semiconductor die
US6515359B1 (en) * 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6114756A (en) 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6124150A (en) 1998-08-20 2000-09-26 Micron Technology, Inc. Transverse hybrid LOC package
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
TW463346B (en) * 1999-05-04 2001-11-11 Sitron Prec Co Ltd Dual-leadframe package structure and its manufacturing method
US20030151120A1 (en) * 2000-06-28 2003-08-14 Hundt Michael J. Lead-frame forming for improved thermal performance
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
JP2003017645A (ja) * 2001-07-03 2003-01-17 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法
EP1451869B1 (en) * 2001-11-23 2012-07-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of enveloping an integrated circuit
US6791842B2 (en) * 2002-11-12 2004-09-14 Kingpak Technology Inc. Image sensor structure
US20040109525A1 (en) * 2002-12-09 2004-06-10 Chieng Koc Vai Chieng Aka Michael Automatic chip counting system (process)
US6921967B2 (en) * 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8116102B2 (en) * 2007-12-26 2012-02-14 Infineon Technologies Ag Integrated circuit device and method of producing
SG142321A1 (en) * 2008-04-24 2009-11-26 Micron Technology Inc Pre-encapsulated cavity interposer
JPWO2013047533A1 (ja) * 2011-09-29 2015-03-26 シャープ株式会社 半導体装置
US20210081013A1 (en) 2014-09-02 2021-03-18 Delta Electronics, Inc. Power supply apparatus
US10447166B2 (en) 2015-08-31 2019-10-15 Delta Electronics, Inc. Power module
US11036269B2 (en) 2014-09-02 2021-06-15 Delta Electronics (Shanghai) Co., Ltd. Power module and manufacturing method thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7104239A (enExample) * 1970-04-16 1971-10-19
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
GB1478797A (en) * 1974-09-17 1977-07-06 Siemens Ag Semiconductor arrangements
JPS522281A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Method of making semiconductor devices
JPS522282A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Semiconductor device
JPS5240062A (en) * 1975-09-26 1977-03-28 Hitachi Ltd Process for production of semiconductor devices
JPS5413776A (en) * 1977-07-01 1979-02-01 Nec Corp Semiconductor devices
US4215360A (en) * 1978-11-09 1980-07-29 General Motors Corporation Power semiconductor device assembly having a lead frame with interlock members
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
JPS55113339A (en) * 1979-02-22 1980-09-01 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS55140249A (en) * 1979-04-18 1980-11-01 Fujitsu Ltd Semiconductor device
US4308339A (en) * 1980-02-07 1981-12-29 Westinghouse Electric Corp. Method for manufacturing tape including lead frames
GB2091035B (en) * 1981-01-12 1985-01-09 Avx Corp Integrated circuit device and sub-assembly
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
JPS5848952A (ja) * 1981-09-18 1983-03-23 Sumitomo Electric Ind Ltd Ｉｃ用リ−ドフレ−ム
JPS58158950A (ja) * 1982-03-16 1983-09-21 Nec Corp 半導体装置
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JP3595558B2 (ja) * 1991-08-09 2004-12-02 キヤノン株式会社 カメラ及び自動焦点調節装置

Also Published As

Publication number Publication date
DE3379008D1 (en) 1989-02-23
EP0108502B1 (en) 1989-01-18
IE832368L (en) 1984-04-08
JPH041503B2 (enExample) 1992-01-13
KR860000410B1 (ko) 1986-04-17
CA1217876A (en) 1987-02-10
EP0108502A3 (en) 1985-08-07
JPS5966157A (ja) 1984-04-14
EP0108502A2 (en) 1984-05-16
KR840006561A (ko) 1984-11-30
USRE35109E (en) 1995-12-05
US4984059A (en) 1991-01-08

Similar Documents

Publication Publication Date Title
EP0108502B1 (en) A plastics moulded semiconductor device and a method of producing it
US6703696B2 (en) Semiconductor package
US5444301A (en) Semiconductor package and method for manufacturing the same
US7321162B1 (en) Semiconductor package having reduced thickness
KR0145768B1 (ko) 리드 프레임과 그를 이용한 반도체 패키지 제조방법
KR900002908B1 (ko) 수지 봉지형 반도체 장치
JPS62259450A (ja) 集積回路ダイ・リ−ドフレ−ム相互接続組立体及び方法
KR0144164B1 (ko) 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법
KR20030035952A (ko) 리드 프레임과 그 제조 방법 및 그 리드 프레임을 이용한반도체 장치의 제조 방법
US6534344B2 (en) Integrated circuit chip and method for fabricating the same
US7173321B2 (en) Semiconductor package having multiple row of leads
EP0320997B1 (en) Semiconductor device having a lead frame
JP3134445B2 (ja) 樹脂封止型半導体装置
KR19990034731A (ko) 리드 온 칩형 리드 프레임과 그를 이용한 패키지
KR960003854B1 (ko) 반도체 장치 제조방법
JPH10125845A (ja) Ｌｏｃ用リードフレーム及びそれを用いた半導体チップパッケージ
KR100258852B1 (ko) 반도체 패키지의 제조 방법
KR100575859B1 (ko) 볼 그리드 어레이 패키지
JPH08162596A (ja) リードフレーム及び半導体装置
KR100201389B1 (ko) 반도체 패키지
JPS59155160A (ja) 樹脂封止型電子装置
KR970008530A (ko) 표면 실장용 리드프레임 및 그를 이용한 반도체 패키지와 그 제조방법
KR19980020498A (ko) 센터 본딩 패드를 갖는 반도체 칩 패키지와 그 제조 방법
JPS63273324A (ja) 樹脂封止型回路装置の製造方法
JPH06204380A (ja) リードフレーム及びこれを用いた樹脂封止型半導体装置

Legal Events

Date Code Title Description
MM4A Patent lapsed