HK83786A - An integrated circuit device and sub-assembly therefor - Google Patents
An integrated circuit device and sub-assembly thereforInfo
- Publication number
- HK83786A HK83786A HK837/86A HK83786A HK83786A HK 83786 A HK83786 A HK 83786A HK 837/86 A HK837/86 A HK 837/86A HK 83786 A HK83786 A HK 83786A HK 83786 A HK83786 A HK 83786A
- Authority
- HK
- Hong Kong
- Prior art keywords
- capacitor
- power supply
- terminals
- chip
- circuit
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000003985 ceramic capacitor Substances 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01043—Technetium [Tc]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/339,490 US4454529A (en) | 1981-01-12 | 1982-01-15 | Integrated circuit device having internal dampening for a plurality of power supplies |
Publications (1)
Publication Number | Publication Date |
---|---|
HK83786A true HK83786A (en) | 1986-11-14 |
Family
ID=23329237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK837/86A HK83786A (en) | 1982-01-15 | 1986-11-06 | An integrated circuit device and sub-assembly therefor |
Country Status (8)
Country | Link |
---|---|
US (1) | US4454529A (ko) |
JP (1) | JPS58124259A (ko) |
CA (1) | CA1180824A (ko) |
DE (1) | DE3234668A1 (ko) |
FR (1) | FR2521780B1 (ko) |
GB (1) | GB2113908B (ko) |
HK (1) | HK83786A (ko) |
SG (1) | SG62286G (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4527185A (en) * | 1981-01-12 | 1985-07-02 | Avx Corporation | Integrated circuit device and subassembly |
JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
FR2550009B1 (fr) * | 1983-07-29 | 1986-01-24 | Inf Milit Spatiale Aeronaut | Boitier de composant electronique muni d'un condensateur |
US4534105A (en) * | 1983-08-10 | 1985-08-13 | Rca Corporation | Method for grounding a pellet support pad in an integrated circuit device |
JPH0828447B2 (ja) * | 1983-10-05 | 1996-03-21 | 富士通株式会社 | 半導体装置の製造方法 |
US4595945A (en) * | 1983-10-21 | 1986-06-17 | At&T Bell Laboratories | Plastic package with lead frame crossunder |
US4680613A (en) * | 1983-12-01 | 1987-07-14 | Fairchild Semiconductor Corporation | Low impedance package for integrated circuit die |
JPS60192359A (ja) * | 1984-03-14 | 1985-09-30 | Nec Corp | 半導体メモリ装置 |
DE3424876A1 (de) * | 1984-07-06 | 1986-02-06 | Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover | Integrierter schaltkreis |
US4714981A (en) * | 1986-04-09 | 1987-12-22 | Rca Corporation | Cover for a semiconductor package |
US5173621A (en) * | 1986-06-30 | 1992-12-22 | Fairchild Semiconductor Corporation | Transceiver with isolated power rails for ground bounce reduction |
KR960013630B1 (ko) * | 1986-06-30 | 1996-10-10 | 페어차일드 세미콘덕터 코퍼레이션 | 집적회로에서의 접지 변동 감소 장치 |
US5065224A (en) * | 1986-06-30 | 1991-11-12 | Fairchild Semiconductor Corporation | Low noise integrated circuit and leadframe |
US4819056A (en) * | 1986-07-03 | 1989-04-04 | Delco Electronics Corporation | Hybrid thick film circuit device |
DE3635375A1 (de) * | 1986-10-17 | 1988-04-28 | Heraeus Gmbh W C | Systemtraeger fuer elektronische bauelemente |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
AU2780689A (en) * | 1987-11-20 | 1989-06-14 | Magellan Corporation (Australia) Pty Ltd | Z-folded capacitor construction |
US5099306A (en) * | 1988-11-21 | 1992-03-24 | Honeywell Inc. | Stacked tab leadframe assembly |
DE3900512A1 (de) * | 1989-01-10 | 1990-07-19 | Tucker Gmbh Bostik | Halbleiterbauelement fuer ein schaltnetzteil |
US5049979A (en) * | 1990-06-18 | 1991-09-17 | Microelectronics And Computer Technology Corporation | Combined flat capacitor and tab integrated circuit chip and method |
US5219787A (en) * | 1990-07-23 | 1993-06-15 | Microelectronics And Computer Technology Corporation | Trenching techniques for forming channels, vias and components in substrates |
US10361802B1 (en) | 1999-02-01 | 2019-07-23 | Blanding Hovenweep, Llc | Adaptive pattern recognition based control system and method |
US8352400B2 (en) | 1991-12-23 | 2013-01-08 | Hoffberg Steven M | Adaptive pattern recognition based controller apparatus and method and human-factored interface therefore |
JPH06173081A (ja) * | 1992-12-03 | 1994-06-21 | Murata Mfg Co Ltd | 電子部品 |
DE4410212A1 (de) * | 1994-03-24 | 1995-09-28 | Telefunken Microelectron | Elektronische Baugruppe |
DE19520700B4 (de) * | 1994-06-09 | 2004-09-09 | Samsung Electronics Co., Ltd., Suwon | Halbleiterbausteinanordnung |
US5877930A (en) * | 1997-03-27 | 1999-03-02 | Digital Equipment Corporation | Input and output noise reduction circuit |
US7966078B2 (en) | 1999-02-01 | 2011-06-21 | Steven Hoffberg | Network media appliance system and method |
JP2002026251A (ja) * | 2000-07-11 | 2002-01-25 | Toshiba Corp | 半導体装置 |
US6683781B2 (en) * | 2002-05-23 | 2004-01-27 | Industrial Technology Research Institute | Packaging structure with low switching noises |
JP4661645B2 (ja) * | 2005-03-23 | 2011-03-30 | トヨタ自動車株式会社 | パワー半導体モジュール |
US20070096269A1 (en) * | 2005-10-31 | 2007-05-03 | Mediatek Inc. | Leadframe for semiconductor packages |
DE102011002864A1 (de) * | 2011-01-19 | 2012-07-19 | Zf Friedrichshafen Ag | Leiterplatine und Verfahren zur Herstellung einer Leiterplatine |
US10204737B2 (en) | 2014-06-11 | 2019-02-12 | Avx Corporation | Low noise capacitors |
JP6620404B2 (ja) * | 2015-03-03 | 2019-12-18 | Tdk株式会社 | 電子部品 |
DE102015106151B4 (de) * | 2015-04-22 | 2019-07-11 | Infineon Technologies Ag | Leiterplatte mit eingebettetem Leistungshalbleiterchip |
CN110098156B (zh) * | 2018-01-29 | 2023-04-18 | 光宝新加坡有限公司 | 用于电容耦合隔离器的电容耦合封装结构 |
US11869727B2 (en) * | 2021-08-31 | 2024-01-09 | Kemet Electronics Corporation | Device and process for forming membrane type capacitor devices |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5332233B1 (ko) * | 1968-12-25 | 1978-09-07 | ||
US3866311A (en) * | 1971-06-14 | 1975-02-18 | Nat Semiconductor Corp | Method of providing electrically isolated overlapping metallic conductors |
US3942245A (en) * | 1971-11-20 | 1976-03-09 | Ferranti Limited | Related to the manufacture of lead frames and the mounting of semiconductor devices thereon |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4200880A (en) * | 1978-03-28 | 1980-04-29 | Microwave Semiconductor Corp. | Microwave transistor with distributed output shunt tuning |
US4210885A (en) * | 1978-06-30 | 1980-07-01 | International Business Machines Corporation | Thin film lossy line for preventing reflections in microcircuit chip package interconnections |
US4234666A (en) * | 1978-07-26 | 1980-11-18 | Western Electric Company, Inc. | Carrier tapes for semiconductor devices |
US4249196A (en) * | 1978-08-21 | 1981-02-03 | Burroughs Corporation | Integrated circuit module with integral capacitor |
FR2456388A1 (fr) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier |
JPS568854A (en) * | 1979-07-04 | 1981-01-29 | Mitsubishi Electric Corp | Package for semiconductor device |
US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
DE3001613C2 (de) * | 1980-01-17 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu |
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1982
- 1982-01-15 US US06/339,490 patent/US4454529A/en not_active Expired - Lifetime
- 1982-05-25 CA CA000403600A patent/CA1180824A/en not_active Expired
- 1982-06-16 GB GB08217391A patent/GB2113908B/en not_active Expired
- 1982-06-24 FR FR8211096A patent/FR2521780B1/fr not_active Expired
- 1982-07-19 JP JP57125607A patent/JPS58124259A/ja active Granted
- 1982-09-18 DE DE19823234668 patent/DE3234668A1/de not_active Withdrawn
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1986
- 1986-07-14 SG SG622/86A patent/SG62286G/en unknown
- 1986-11-06 HK HK837/86A patent/HK83786A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2521780B1 (fr) | 1987-03-20 |
JPS58124259A (ja) | 1983-07-23 |
FR2521780A1 (fr) | 1983-08-19 |
SG62286G (en) | 1987-03-27 |
US4454529A (en) | 1984-06-12 |
GB2113908A (en) | 1983-08-10 |
CA1180824A (en) | 1985-01-08 |
JPS6352781B2 (ko) | 1988-10-20 |
DE3234668A1 (de) | 1983-07-21 |
GB2113908B (en) | 1985-12-04 |
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