HK1207037A1 - Information carrying card comprising a cross-linked polymer composition, and method of making the same - Google Patents

Information carrying card comprising a cross-linked polymer composition, and method of making the same

Info

Publication number
HK1207037A1
HK1207037A1 HK15107549.4A HK15107549A HK1207037A1 HK 1207037 A1 HK1207037 A1 HK 1207037A1 HK 15107549 A HK15107549 A HK 15107549A HK 1207037 A1 HK1207037 A1 HK 1207037A1
Authority
HK
Hong Kong
Prior art keywords
making
cross
same
polymer composition
linked polymer
Prior art date
Application number
HK15107549.4A
Other languages
English (en)
Chinese (zh)
Inventor
Mark A Cox
Original Assignee
X Card Holdings Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Card Holdings Llc filed Critical X Card Holdings Llc
Publication of HK1207037A1 publication Critical patent/HK1207037A1/xx

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    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • H—ELECTRICITY
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

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  • Microelectronics & Electronic Packaging (AREA)
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  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)
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HK15107549.4A 2012-04-03 2015-08-06 Information carrying card comprising a cross-linked polymer composition, and method of making the same HK1207037A1 (en)

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US13/647,982 US9122968B2 (en) 2012-04-03 2012-10-09 Information carrying card comprising a cross-linked polymer composition, and method of making the same
PCT/US2013/033784 WO2013151823A1 (fr) 2012-04-03 2013-03-26 Carte support d'informations comportant une composition de polymère réticulée et son procédé de fabrication

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HK15107547.6A HK1207099A1 (en) 2012-04-03 2015-08-06 Information carrying card comprising a cross-linked polymer composition, and method of making the same
HK15109379.5A HK1208695A1 (en) 2012-04-03 2015-09-24 Information carrying card comprising a cross-linked polymer composition, and method of making the same
HK15109378.6A HK1208747A1 (en) 2012-04-03 2015-09-24 Information carrying card comprising a cross-linked polymer composition, and method of making the same
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HK15107547.6A HK1207099A1 (en) 2012-04-03 2015-08-06 Information carrying card comprising a cross-linked polymer composition, and method of making the same
HK15109379.5A HK1208695A1 (en) 2012-04-03 2015-09-24 Information carrying card comprising a cross-linked polymer composition, and method of making the same
HK15109378.6A HK1208747A1 (en) 2012-04-03 2015-09-24 Information carrying card comprising a cross-linked polymer composition, and method of making the same
HK15109380.2A HK1208748A1 (en) 2012-04-03 2015-09-24 Information carrying card comprising a cross-linked polymer composition, and method of making the same

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Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013110325A1 (fr) * 2012-01-25 2013-08-01 Assa Abloy Ab Procédé d'élimination d'enroulement stratifié fonctionnel
US9594999B2 (en) 2012-04-03 2017-03-14 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US10032099B2 (en) 2012-07-20 2018-07-24 CPI Card Group—Colorado, Inc. Weighted transaction card
US8857722B2 (en) 2012-07-20 2014-10-14 CPI Card Group—Colorado, Inc. Weighted transaction card
EP2973236B1 (fr) 2013-03-15 2019-01-09 X-Card Holdings, LLC Méthode de fabrication d'une couche centrale pour une carte contenant des informations, et produits résultants
US10773503B2 (en) 2013-08-21 2020-09-15 X-Card Holdings, Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products
WO2015061611A1 (fr) 2013-10-25 2015-04-30 Cpi Card Group - Colorado, Inc. Carte multicouche polymétallique
NZ743934A (en) 2014-05-22 2021-12-24 Composecure Llc Transaction and id cards having selected texture and coloring
US10783422B2 (en) * 2014-11-03 2020-09-22 Composecure, Llc Ceramic-containing and ceramic composite transaction cards
EP3138049B1 (fr) 2015-07-08 2020-08-19 Composecure, LLC Carte à puce métallique avec capacité à double interface
MA43067A (fr) * 2015-07-16 2018-05-23 Messer Austria Gmbh Dispositif et procédé pour réchauffer des produits métalliques
CN108027892B (zh) * 2015-09-18 2021-04-09 X卡控股有限公司 用于信息携带卡的自定心嵌体和芯层、过程以及得到的产品
FR3045891A1 (fr) * 2015-12-22 2017-06-23 Oberthur Technologies Procede de fabrication par lamination a chaud d'une carte a microcircuit comportant un flex dans une cavite et carte ainsi obtenue
WO2017210305A1 (fr) 2016-06-01 2017-12-07 Cpi Card Group - Colorado, Inc. Carte à puce à circuit intégré comprenant des plages de détection biométriques
US11439025B2 (en) * 2016-06-08 2022-09-06 Fuji Corporation Method for forming circuit
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
CN109564634A (zh) 2016-07-27 2019-04-02 安全创造有限责任公司 用于交易卡的经包覆模制的电子部件及其制造方法
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
CN106280089A (zh) * 2016-08-11 2017-01-04 陈绍铢 一种卡片纸及其应用
WO2018152218A1 (fr) 2017-02-14 2018-08-23 Cpi Card Group - Colorado, Inc. Carte métallique bord à bord et procédé de production
CN111201142B (zh) 2017-08-07 2023-06-13 X卡控股有限公司 具有金属芯层的卡以及用于卡制造的系统和方法
WO2019079007A1 (fr) 2017-10-18 2019-04-25 Composecure, Llc Carte de transaction en métal, en céramique, ou revêtue céramique ayant une fenêtre ou un motif de fenêtre et un rétroéclairage facultatif
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
ES2943857T3 (es) 2017-09-07 2023-06-16 Composecure Llc Tarjeta de transacción con componentes electrónicos integrados y procedimiento de fabricación
TWI651655B (zh) * 2017-12-15 2019-02-21 宏通數碼科技股份有限公司 電子顯示卡及其製作方法
WO2019173455A1 (fr) 2018-03-07 2019-09-12 X-Card Holdings, Llc Carte métallique
EP3651068A1 (fr) * 2018-11-12 2020-05-13 Thales Dis France SA Procédé de réalisation d'un insert électronique pour support portable multi-composants et insert obtenu
CN109942989A (zh) * 2019-03-21 2019-06-28 东莞市科田智能卡科技有限公司 一种pvc卡基材
CN110041641A (zh) * 2019-04-29 2019-07-23 佛山市菲锐表面科技有限公司 一种基于3d网络结构的低收缩pvc材料的制备方法
US11106961B2 (en) * 2019-10-09 2021-08-31 Beauiiful Card Corporation Mini smart card and method of manufacturing the same
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
CN111619146A (zh) * 2020-06-04 2020-09-04 浙江锦盛装饰材料有限公司 一种水性同步套印套压装饰膜生产工艺
CN112770551B (zh) * 2021-04-07 2021-07-13 四川英创力电子科技股份有限公司 多层泡沫印制电路板的压合铆合方法及印制电路板
WO2024085874A1 (fr) * 2022-10-20 2024-04-25 X-Card Holdings, Llc Couche centrale pour carte contenant des informations, carte contenant des informations obtenue et leurs procédés de fabrication

Family Cites Families (222)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2890202A (en) * 1953-07-20 1959-06-09 Pittsburgh Plate Glass Co Method of preparing acrylate esters of epoxy resins
US3024216A (en) 1958-07-28 1962-03-06 Union Carbide Corp Compositions of partially hydrolyzed vinyl chloride-vinyl acetate copolymers and polyurethane resins, polyethylene coated with same and process for making coated article
US3847654A (en) * 1970-06-08 1974-11-12 M & T Chemicals Inc Substrate bonded with vinyl dispersion textured coating
JPS5271590A (en) 1975-12-01 1977-06-15 Bridgestone Corp Production of novel high polymer
US4115479A (en) * 1976-08-11 1978-09-19 Vynacron Dental Co. Casting resins by polymerizing liquid monomer in mixture of particulated vinyl halide resins
DE2837435B2 (de) 1978-08-28 1981-06-25 Friedrich Horst 5840 Schwerte Papenmeier Verfahren und Vorrichtung zum Aufbereiten von PVC-Pulver
US4310451A (en) 1979-10-25 1982-01-12 Diamond Shamrock Plastics Corporation Free flowing rigid PVC resin powder compositions
US4382201A (en) 1981-04-27 1983-05-03 General Electric Company Ultrasonic transducer and process to obtain high acoustic attenuation in the backing
US4480079A (en) * 1982-04-12 1984-10-30 Imperial Chemical Industries Plc Copolymerization of unsaturated urethane monomers
US4399061A (en) 1981-10-14 1983-08-16 Rca Corporation Preparation of video disc molding composition
DE3248385A1 (de) 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
US4463128A (en) * 1983-05-09 1984-07-31 W. R. Grace & Co. Reactive plastisol dispersion
JPS60252992A (ja) 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
FR2570101B1 (fr) 1984-09-07 1987-09-25 Sotimag Procede antifraude pour document de valeur
US4592976A (en) 1984-12-07 1986-06-03 N. Peter Whitehead Identification card
GB8600837D0 (en) * 1985-01-25 1986-02-19 Ici Plc Polymerisable compositions
DE8504263U1 (de) 1985-02-15 1986-06-12 Schwan-Stabilo Schwanhäußer GmbH & Co, 8500 Nürnberg Pudermine für Kosmetikstifte
DE3519053A1 (de) 1985-05-28 1986-12-18 W.R. Grace & Co., Cambridge, Mass. Dichtungsmasse
EP0246893A3 (fr) * 1986-05-21 1989-03-22 Hitachi, Ltd. Dispositif semi-conducteur comprenant un substrat isolant pour des conducteurs et procédé pour sa fabrication
JPH0686177B2 (ja) 1986-09-29 1994-11-02 河西工業株式会社 自動車用内装部品
GB8624082D0 (en) 1986-10-08 1986-11-12 Dunlop Cct Sa Vinyl chloride polymer products
JPS63185630A (ja) * 1987-01-29 1988-08-01 東洋鋼板株式会社 高硬度塩化ビニル被覆鋼板の製造方法
US4775702A (en) 1987-04-14 1988-10-04 The B. F. Goodrich Company Inversion process for producing low-skin porous friable particles of crosslinked PVC resin
US4775699A (en) 1987-04-14 1988-10-04 The B. F. Goodrich Company Crosslinked porous skinless particles of PVC resin
US4775698A (en) 1987-04-14 1988-10-04 The B. F. Goodrich Company Process for producing porous substantially skinless particles of crosslinked PVC resin
US4775701A (en) 1987-04-14 1988-10-04 The B. F. Goodrich Company Mass process for producing porous friable particles of crosslinked PVC resin
US4742085A (en) 1987-04-14 1988-05-03 The B. F. Goodrich Company Crosslinked porous skinless particles of PVC resin and process for producing same
US4775700A (en) 1987-04-14 1988-10-04 The B. F. Goodrich Company Process for producing porous skinless particles of crosslinked PVC resin
WO1989012871A1 (fr) 1988-06-21 1989-12-28 W & T Avery Limited Fabrication de jetons electroniques portatifs
KR970005475B1 (ko) 1988-07-15 1997-04-16 클레리언트 파이넌스(비브이아이) 리미티드 폴리-[α-히드록시-(아크릴,크로톤,또는 아크릴+크로톤)산]의 폴리락톤류 및 상응하는 염류의 제조방법
US5084501A (en) 1988-11-07 1992-01-28 Armstrong World Industries, Inc. Highly filled resin powder
US5204405A (en) * 1988-11-09 1993-04-20 Nippon Petrochemicals Co., Ltd. Thermoplastic resin composition and method for preparing the same
US5143723A (en) 1988-11-23 1992-09-01 Estee Lauder, Inc. Colored cosmetic compositions
US5324506A (en) 1988-11-23 1994-06-28 Estee Lauder, Inc. Colored cosmetic compositions
US4954195A (en) 1989-02-13 1990-09-04 Lockheed Corporation Production of thermoset composites containing thermoplastic fillers
ES2088781T3 (es) 1990-01-19 1996-09-16 Minnesota Mining & Mfg Composicion termoendurecible.
JPH03239595A (ja) 1990-02-16 1991-10-25 Dainippon Printing Co Ltd カード製造方法
NL9000840A (nl) 1990-04-10 1991-11-01 Wavin Bv Werkwijze en installatie voor het vervaardigen van kunststofvoortbrengsels met behulp van een warm mengsel van pvc-poeder en additieven, alsmede een voor toepassing bij deze werkwijze geschikte warmmenger.
US5198501A (en) 1990-08-20 1993-03-30 Air Products And Chemicals, Inc. In-situ polymerized blends of vinyl acetate/ethylene copolymar and poly(vinyl chloride)
JPH04216850A (ja) * 1990-12-17 1992-08-06 Nippon Zeon Co Ltd 塩化ビニル系プラスチゾル組成物
DE4135937C2 (de) 1991-10-31 1997-07-03 Pegulan Tarkett Ag Verfahren zu Herstellen von Latex-, PVC-, und Weichmacher-freien Textil- oder Kunststoff-Boden- und Wandbelägen
US5233022A (en) 1991-08-26 1993-08-03 United Technologies Automotive, Inc. Flow property shelf life of PVC dry blend powders
US5198170A (en) 1991-09-19 1993-03-30 The B. F. Goodrich Company Method for extrusion of powered PVC compounds
JP3049894B2 (ja) * 1991-11-27 2000-06-05 日本ゼオン株式会社 アクリル酸エステル系共重合体プラスチゾル組成物
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
US5604266A (en) * 1992-10-15 1997-02-18 Ecomat, Inc. Cured unsaturated polyest-polyurethane highly filled resin materials and process for preparing them
FR2701268B1 (fr) 1993-02-05 1995-04-14 Atochem Elf Sa Peintures à base de poudres de polyamide destinées au revêtement de profilés PVC.
US5407893A (en) 1993-08-19 1995-04-18 Konica Corporation Material for making identification cards
JPH0793817A (ja) 1993-09-24 1995-04-07 Canon Inc 情報記録媒体
FR2713648B1 (fr) 1993-12-15 1996-03-01 Rhone Poulenc Chimie Composition stabilisante pour polymère chloré comportant des béta-dicétones.
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
EP0754567B1 (fr) 1994-03-31 2003-05-28 Ibiden Co., Ltd. Dispositif comprenant un composant electronique
JPH0817288A (ja) 1994-07-04 1996-01-19 Matsushita Electric Ind Co Ltd 透明タッチパネル
FR2724477B1 (fr) * 1994-09-13 1997-01-10 Gemplus Card Int Procede de fabrication de cartes sans contact
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
US5784782A (en) * 1996-09-06 1998-07-28 International Business Machines Corporation Method for fabricating printed circuit boards with cavities
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
FR2762115B1 (fr) * 1997-04-10 1999-12-03 Schlumberger Ind Sa Procede d'insertion d'un module electronique dans un corps de carte a memoire electronique
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
WO1998059317A1 (fr) * 1997-06-23 1998-12-30 Rohm Co., Ltd. Module pour carte a circuit integre, carte a circuit integre, et procede de fabrication d'un tel module
NO310365B1 (no) 1997-07-18 2001-06-25 Norsk Hydro As PVC-blanding, anvendelse av denne og metode for dens fremstilling
US6238223B1 (en) 1997-08-20 2001-05-29 Micro Technology, Inc. Method of depositing a thermoplastic polymer in semiconductor fabrication
US6052062A (en) 1997-08-20 2000-04-18 Micron Technology, Inc. Cards, communication devices, and methods of forming and encoding visibly perceptible information on the same
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
US6037879A (en) 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
US6768415B1 (en) 1997-10-03 2004-07-27 Micron Technology, Inc. Wireless identification device, RFID device with push-on/push-off switch, method of manufacturing wireless identification device
US7012504B2 (en) 2002-04-01 2006-03-14 Micron Technology, Inc. Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device
KR20010040921A (ko) 1998-02-17 2001-05-15 메리 이. 보울러 분말 코팅의 생산 방법
US6241153B1 (en) 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6353242B1 (en) 1998-03-30 2002-03-05 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory
FR2779851B1 (fr) * 1998-06-12 2002-11-29 Gemplus Card Int Procede de fabrication d'une carte a circuit integre et carte obtenue
PT1108207E (pt) 1998-08-26 2008-08-06 Sensors For Med & Science Inc Dispositivos de sensores ópticos
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
JP2000148959A (ja) 1998-11-13 2000-05-30 Henkel Japan Ltd Ｉｃカードの製造法
DE19855125A1 (de) 1998-11-30 2000-05-31 Basf Coatings Ag Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung
DE19855167A1 (de) 1998-11-30 2000-05-31 Basf Coatings Ag Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung
DE19855146A1 (de) 1998-11-30 2000-05-31 Basf Coatings Ag Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung
US6730734B1 (en) 1998-12-08 2004-05-04 Rohm And Haas Company Impact modifier compositions which enhance the impact strength properties and lower the viscosity of melt processed plastics resins and methods of making said compositions
SE521714C2 (sv) 1999-01-20 2003-12-02 Bozena Olsson Nagellacksbortagande medel
US8636648B2 (en) 1999-03-01 2014-01-28 West View Research, Llc Endoscopic smart probe
DE19915765C2 (de) * 1999-04-08 2001-06-21 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
FR2794266B1 (fr) * 1999-05-25 2002-01-25 Gemplus Card Int Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout
DK2093245T3 (da) 1999-08-27 2012-06-04 Angiodevice Internat Gmbh Biocompatible polymer device
NL1013028C2 (nl) 1999-09-10 2001-03-13 Dsm Nv Informatiedragend vormdeel.
US6784230B1 (en) 1999-09-23 2004-08-31 Rohm And Haas Company Chlorinated vinyl resin/cellulosic blends: compositions, processes, composites, and articles therefrom
DE19947521A1 (de) 1999-10-02 2001-04-05 Basf Coatings Ag Mit aktinischer Strahlung aktivierbare Bindungen enthaltendes festes Stoffgemisch und seine Verwendung
AU7503100A (en) 1999-12-03 2001-06-12 Beijing Research Institute Of Chemical Industry, Sinopec Full vulcanized powdered rubber with controllable particle diameter, preparing method and uses thereof
US7592394B2 (en) 1999-12-15 2009-09-22 Arkema France Plastic compositions having mineral-like appearance
EP1111001B1 (fr) 1999-12-23 2006-06-14 Rohm And Haas Company Additives pour plastics, la préparation et les mélanges
DE10014399A1 (de) 2000-03-23 2001-10-04 Wacker Polymer Systems Gmbh Vernetzbare Polymerzusammensetzung
US6962613B2 (en) 2000-03-24 2005-11-08 Cymbet Corporation Low-temperature fabrication of thin-film energy-storage devices
US6611050B1 (en) 2000-03-30 2003-08-26 International Business Machines Corporation Chip edge interconnect apparatus and method
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
JP2002033296A (ja) 2000-04-26 2002-01-31 Lintec Corp シリコンウエハ用の補強材および該補強材を用いたｉｃチップの製造方法
US6380272B1 (en) 2000-08-23 2002-04-30 Kuei Yung Wang Chen Manufacturing method for structural members from foamed plastic composites containing wood flour
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
BR0113995A (pt) 2000-09-21 2003-08-12 Rohm & Haas Processo para preparar uma dispersão aquosa polimérica nanocompósita de argila, produto de aditivo plástico, produto em pó nanocompósito, resina termoplástica ou aditivo de plásticos, composição polimérica nanocompósita de núcleo-casca, e, produto de revestimento, adesivo, calafetação ou selante
US6599993B1 (en) * 2000-10-11 2003-07-29 Basf Corporation Low gloss textured powder coating
US20020091178A1 (en) 2001-01-05 2002-07-11 Hossein Amin-Javaheri Polyvinyl chloride composition
GB2371264A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Smart card with embedded antenna
US20020119294A1 (en) 2001-02-28 2002-08-29 Jason Monkarsh Light-emitting, light-rechargeable labels for containers
JP3916405B2 (ja) 2001-03-06 2007-05-16 松下電器産業株式会社 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
US6551537B2 (en) 2001-03-08 2003-04-22 Nan Ya Plastics Corporation Manufacturing method for structural members from foamed plastic composites containing wood flour
US20020125431A1 (en) 2001-03-12 2002-09-12 Peter Hwang Infrared radiation detection device
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
US20020132086A1 (en) 2001-03-19 2002-09-19 Hsu Tang Su-Tuan Sweat-absorbing and non-slip pad
FR2824939B1 (fr) 2001-05-16 2003-10-10 A S K Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede
JP3478281B2 (ja) * 2001-06-07 2003-12-15 ソニー株式会社 Ｉｃカード
US6790893B2 (en) 2001-11-30 2004-09-14 Pyrophobic Systems Ltd. Compound of intumescent powder and thermoplastic material
US7097549B2 (en) 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
DE10163825A1 (de) 2001-12-22 2003-07-03 Degussa Pulverlackzusammensetzungen aus kristallinen Urethanacrylaten und deren Verwendung
WO2003056499A2 (fr) * 2001-12-24 2003-07-10 Digimarc Id Systems Llc Cartes a puce a contact ayant un noyau document et cartes a puce sans contact comprenant une structure multicouche, un document d'identification a base de pet, et leurs procedes de production
US6639309B2 (en) 2002-03-28 2003-10-28 Sandisk Corporation Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board
US7112625B2 (en) 2002-03-29 2006-09-26 Sanyo Chemical Industries, Ltd. Thermocrosslinkable resin dispersion
US20030189314A1 (en) 2002-04-08 2003-10-09 Quattro Johnny S. Non-metallic edge gliding board
US20040002559A1 (en) 2002-04-10 2004-01-01 Malisa Troutman Flame retardant coatings
EP1502763A4 (fr) * 2002-04-23 2008-03-26 Ricoh Kk Carte d'enregistrement/affichage de donnees, procede de traitement d'image utilisant celle-ci et processeur d'image
US20030216701A1 (en) 2002-05-15 2003-11-20 Gentho Sumarta Synthetic glove and process for making
FR2840459B1 (fr) 2002-05-28 2004-07-16 Itt Mfg Enterprises Inc Connecteur electrique pour une carte a puce comportant un commutateur perfectionne
US6918984B2 (en) 2002-06-24 2005-07-19 Loctite (R&D) Limited Photocurable adhesive compositions, reaction products of which have low halide ion content
US6786415B2 (en) * 2002-08-06 2004-09-07 Jung-Hua Yiu Memory card connector
JP3866178B2 (ja) * 2002-10-08 2007-01-10 株式会社ルネサステクノロジ Ｉｃカード
US6861475B2 (en) 2002-10-16 2005-03-01 Rohm And Haas Company Smooth, flexible powder coatings
US7137148B2 (en) 2002-10-31 2006-11-21 Microflex Corporation PVC based medical gloves and formulations therefor
JP2004185208A (ja) 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
GB0229747D0 (en) 2002-12-20 2003-01-29 Axis Shield Asa Assay
US7528191B2 (en) 2003-01-08 2009-05-05 Rockwood Clay Additives, Gmbh Composition based on pre-exfoliated nanoclay and use thereof
DE10311639A1 (de) 2003-03-14 2004-09-23 Röhm GmbH & Co. KG Antistatisch beschichteter Formkörper und Verfahren zu seiner Herstellung
FR2853115B1 (fr) 2003-03-28 2005-05-06 A S K Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
CN1239587C (zh) 2003-04-03 2006-02-01 中国石油化工股份有限公司 一种复合粉末及其制备方法和用途
US7917298B1 (en) 2003-04-17 2011-03-29 Nanosys, Inc. Nanocrystal taggants
US20040216658A1 (en) 2003-04-30 2004-11-04 Wu-Chueh Lin Pool float and method of making the same
JP4235042B2 (ja) 2003-06-11 2009-03-04 共同印刷株式会社 非接触ｉｃカード、ｉｃモジュール及び非接触ｉｃカードの製造方法
EP1643967A1 (fr) 2003-06-17 2006-04-12 E.I. Dupont De Nemours And Company Proteines de soja modifiees dans des compositions de soins personnels
US7230047B2 (en) 2003-06-25 2007-06-12 Henkel Corporation Reformable compositions
US7147625B2 (en) 2003-07-01 2006-12-12 Icet, Inc. Leg bag accessory
EP1502922A1 (fr) 2003-07-30 2005-02-02 Loctite (R & D) Limited Compositions d'encapsulation réticulables
EP1659159B1 (fr) * 2003-08-25 2015-11-11 Sakuranomiya Chemical Co., Ltd. Matiere de revetement destinee a des metaux et recipient metallique recouvert de ladite matiere de revetement
US7566001B2 (en) * 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US6946628B2 (en) 2003-09-09 2005-09-20 Klai Enterprises, Inc. Heating elements deposited on a substrate and related method
DE10350556A1 (de) 2003-10-29 2005-06-02 Clariant Gmbh Wasserbasierende Pigmentpräparationen
SI1691988T1 (sl) 2003-12-10 2008-10-31 Landqart Identifikacijska kartica in postopek za njeno izdelavo
GB2410308B (en) 2004-01-20 2008-06-25 Uponor Innovation Ab Multilayer pipe
TWI457835B (zh) * 2004-02-04 2014-10-21 Semiconductor Energy Lab 攜帶薄膜積體電路的物品
US20050182156A1 (en) 2004-02-18 2005-08-18 Guixi Liu Glove made with non-toxic plasticizer ATBC
US20050218551A1 (en) 2004-04-01 2005-10-06 Izhar Halahmi Process for producing polar polyolefines and modified polyolefines thereof
IL161473A0 (en) 2004-04-18 2004-09-27 Polyram Ram On Ind Lp Star-like polyolefin having high propylene content and polar derivatives thereof and method for its production
US20060042827A1 (en) 2004-09-02 2006-03-02 Chou Wai P SD/MMC cards
CN1772802A (zh) 2004-11-11 2006-05-17 东莞强发制鞋有限公司 一种止滑耐油鞋底的成型材料
US7297370B2 (en) 2004-12-22 2007-11-20 General Electric Company Curable encapsulant composition, device including same, and associated method
CA2598163C (fr) 2005-02-17 2011-03-22 Tritron Gmbh & Co. Kg Pretraitement et enduction preliminaire de substrats non absorbants et/ou de materiaux de support non absorbants
DE102005013439A1 (de) 2005-03-21 2006-09-28 Basf Ag Verfahren zur Herstellung von Polymerisatpulvern
JP2008537215A (ja) 2005-03-23 2008-09-11 カードエックスエックス インコーポレイテッド 高品質外面を有する等方性熱硬化接着材料を使用して集積電子機器を備えた最新スマートカードを製造する方法。
EP1882220A2 (fr) * 2005-03-26 2008-01-30 Privasys, Inc. Procedes et cartes de transactions financieres electroniques
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
KR20080003006A (ko) * 2005-04-27 2008-01-04 프라이베이시스, 인크. 전자 카드 및 그의 제조방법
JP2006339757A (ja) * 2005-05-31 2006-12-14 Denso Corp アンテナコイル、通信基板モジュールの製造方法及びカード型無線機
US7601563B2 (en) 2005-06-10 2009-10-13 Kingston Technology Corporation Small form factor molded memory card and a method thereof
DE102005037611A1 (de) 2005-08-05 2007-02-15 Eckart Gmbh & Co. Kg Metalleffektpigmente mit anorganisch/organischer Mischschicht, Verfahren zur Herstellung solcher Metalleffektpigmente und deren Verwendung
GB0519608D0 (en) 2005-09-26 2005-11-02 Sec Dep For The Home Departmen Document and method of manufacuring same
DE102005049916A1 (de) 2005-10-17 2007-04-19 Degussa Gmbh Lagerstabile, reaktive Pulverlackzusammensetzungen mit kristallinen Bestandteilen
US8334025B2 (en) 2005-10-27 2012-12-18 3D Systems, Inc. Antimony-free photocurable resin composition and three dimensional article
US7511371B2 (en) 2005-11-01 2009-03-31 Sandisk Corporation Multiple die integrated circuit package
US20070104938A1 (en) 2005-11-09 2007-05-10 Union Looper Co., Ltd. Foam cushion with a high water-absorption ability
DE102005062027A1 (de) 2005-12-22 2007-06-28 Basf Ag Wässrige Dispersionen von Polymeren, die einen Fluoreszenzfarbstoff enthalten, Verfahren zu ihrer Herstellung und ihre Verwendung zum Markieren von Materialien
US8034153B2 (en) 2005-12-22 2011-10-11 Momentive Performances Materials, Inc. Wear resistant low friction coating composition, coated components, and method for coating thereof
US20100249325A1 (en) 2006-01-19 2010-09-30 Basf Se Polymer powder with high rubber content and production thereof
DK1984442T3 (da) 2006-02-14 2010-07-26 Arkema France Hybrid-kraftpåvirkningsmodifikatorer og fremgangsmåde til fremstilling af disse
US20090020615A1 (en) 2006-02-21 2009-01-22 Patel Gordhanbhai N Method of making smart cards with an excapsulant
DE102006009130A1 (de) 2006-02-24 2007-08-30 Eckart Gmbh & Co. Kg Wetterstabile Perlglanzpigmente auf Basis dünner Glasplättchen und Verfahren zu deren Herstellung
DE102006009131A1 (de) 2006-02-24 2007-09-06 Eckart Gmbh & Co.Kg Mit anorganisch/organischen Mischschichten beschichtete Perlglanzpigmente und Verfahren zu deren Herstellung
US8200320B2 (en) 2006-03-03 2012-06-12 PhysioWave, Inc. Integrated physiologic monitoring systems and methods
US7668588B2 (en) 2006-03-03 2010-02-23 PhysioWave, Inc. Dual-mode physiologic monitoring systems and methods
DE102006012302A1 (de) 2006-03-15 2007-09-27 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
CN101467164B (zh) * 2006-04-10 2013-08-21 因诺瓦蒂尔公司 用于电子卡和标签的电子嵌入件模块、电子卡和用于制造此类电子嵌入件模块和卡的方法
FR2900484B3 (fr) 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900485B3 (fr) 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
ES2402781T3 (es) * 2006-06-19 2013-05-08 Nagraid S.A. Procedimiento de fabricación de tarjetas cada una comprendiendo un módulo electrónico y productos intermedios
US8138591B2 (en) 2006-09-23 2012-03-20 Stats Chippac Ltd Integrated circuit package system with stacked die
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
CZ307210B6 (cs) 2006-10-27 2018-03-28 Austin Detonator S.R.O. Izolace, obklopující vodič elektrického proudu, pro zlepšení separovatelnosti od zpracovávané rubaniny
CL2007003131A1 (es) * 2006-11-01 2008-07-04 Lucite Int Inc Metodo para fabricar un articulo que comprende formular composicion acrilica que tiene un agente de transferencia con grupo que reacciona con isocianato y luego unir a una composicion que contiene isocianato; articulo; metodo que mejora la eficiencia
CN103342032B (zh) 2006-11-06 2016-01-06 约瑟夫·费尔德曼 层压式标识证件
JP4860436B2 (ja) 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
FR2909029B1 (fr) 2006-11-27 2011-10-21 Solvay Procede de fabrication d'une plaque composite a base de pvc et structure incluant une telle plaque
US8017147B2 (en) 2008-04-07 2011-09-13 Mazed Mohammad A Nutritional supplement for the prevention of cardiovascular disease, alzheimer's disease, diabetes, and regulation and reduction of blood sugar and insulin resistance
CN101594999B (zh) 2006-12-07 2011-10-12 爱克发-格法特公司 制造信息载体的方法
US20080194736A1 (en) 2007-02-13 2008-08-14 Minqiu Lu PVC nanocomposite manufacturing technology and applications
EP2116367B1 (fr) * 2007-03-02 2018-04-04 Mitsui Chemicals, Inc. Tissu non-tissé stratifié
US7868441B2 (en) 2007-04-13 2011-01-11 Maxim Integrated Products, Inc. Package on-package secure module having BGA mesh cap
TW200845236A (en) 2007-05-04 2008-11-16 Utac Taiwan Memory card and method for fabricating the same
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
ES2446522T3 (es) 2007-05-25 2014-03-10 Evonik Röhm Gmbh Procedimiento para la preparación de metacrilato de metilo usando metanol reciclado
KR100798685B1 (ko) * 2007-05-31 2008-01-28 주식회사 제이디씨텍 액정 표시부를 갖는 스마트디스플레이카드의 제조방법
DE102007041027A1 (de) 2007-08-29 2009-03-05 Eckart Gmbh Effektpigmente auf Basis von aus anorganisch-organischen Mischphasen gebildeten Substraten, deren Herstellung und Verwendung
US7845839B2 (en) 2007-11-13 2010-12-07 Intematix Corporation Light emitting display
CN101861356B (zh) 2007-11-16 2013-09-11 纳幕尔杜邦公司 包含双峰离聚物组合物的制品
US7879922B2 (en) * 2007-11-20 2011-02-01 PolyuMAC Inc. Rigid, closed-cell, graft-polymer foam; rigid flexible cellular foam; rigid flexible cellular foam mixtures; and method for manufacturing a rigid, closed-cell, graft-polymer foam
US20090142981A1 (en) 2007-12-03 2009-06-04 Velsicol Chemical Corporation Novel Compositions Comprising Structural Isomers Of 1,4-Cyclohexanedimethanol Dibenzoate and Polymer Compositions Containing Same
WO2009078810A1 (fr) 2007-12-19 2009-06-25 Linda Seah Inlays sans contact et à interface double et procédé de fabrication de ceux-ci
US11238329B2 (en) * 2007-12-24 2022-02-01 Dynamics Inc. Payment cards and devices with gift card, global integration, and magnetic stripe reader communication functionality
JP5181724B2 (ja) 2008-02-27 2013-04-10 凸版印刷株式会社 Ｉｃカード及びその製造方法
US20090247369A1 (en) 2008-03-27 2009-10-01 Shuo-Hsiu Johnny Chang Hygienic exercise equipment and manufacturing method thereof
WO2010022129A1 (fr) 2008-08-20 2010-02-25 Xcard Holdings Llc Système de carte à puce sécurisé
JP2010059225A (ja) * 2008-09-01 2010-03-18 Toray Ind Inc 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料
JP2012506156A (ja) 2008-10-17 2012-03-08 オッカム ポートフォリオ リミテッド ライアビリティ カンパニー はんだを使用しないフレキシブル回路アセンブリおよび製造方法
JP2010250467A (ja) 2009-04-14 2010-11-04 Toppan Printing Co Ltd デュアルインターフェイスｉｃカードの製造方法及びアンテナ内蔵カード
US9567426B2 (en) 2009-05-29 2017-02-14 Cytec Technology Corp. Engineered crosslinked thermoplastic particles for interlaminar toughening
US8413894B2 (en) 2009-11-05 2013-04-09 X-Card Holdings, Llc Card with illuminated codes for use in secure transactions
KR20110058183A (ko) 2009-11-26 2011-06-01 이스마트코리아 유한회사 Ｉｃ 카드 제조 방법
KR101092845B1 (ko) 2009-12-03 2011-12-14 (주)이모트 Ｒｆｉｄ 태그 내장 형 인레이와, 이를 포함하는 카드, 및 ｒｆｉｄ 태그 내장형 인레이의 제조 방법
JP2011144213A (ja) * 2010-01-12 2011-07-28 Toray Ind Inc 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料
TW201201450A (en) 2010-06-28 2012-01-01 En-Min Jow Memory element having wireless recognition function and portable electronic device integrating the same
AU2011250831A1 (en) * 2010-12-03 2012-06-21 Bayer Intellectual Property Gmbh Security and/or valuable documents with a top layer with a scratch-resistant finish
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9594999B2 (en) * 2012-04-03 2017-03-14 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
WO2014039183A1 (fr) * 2012-09-04 2014-03-13 X-Card Holdings, Llc Carte support d'informations comportant une composition de polymère réticulée et son procédé de fabrication
DE102013102718A1 (de) * 2013-03-18 2014-09-18 Infineon Technologies Ag Chipkartenmodulanordnung
US10773503B2 (en) * 2013-08-21 2020-09-15 X-Card Holdings, Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products

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US9183486B2 (en) 2015-11-10
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CN104470988A (zh) 2015-03-25
CN104471594A (zh) 2015-03-25
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US20210070979A1 (en) 2021-03-11
US20230116583A1 (en) 2023-04-13
US20130258622A1 (en) 2013-10-03
US9122968B2 (en) 2015-09-01
HK1208695A1 (en) 2016-03-11
US20190300695A1 (en) 2019-10-03
EP2834304A4 (fr) 2015-12-30
EP2834075A4 (fr) 2015-12-23
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US11359085B2 (en) 2022-06-14
US20190345320A1 (en) 2019-11-14
US10611907B2 (en) 2020-04-07
US20180230300A1 (en) 2018-08-16
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US20160031201A1 (en) 2016-02-04
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