HK1207037A1 - 包含交聯聚合物組合物的信息承載卡及其製造方法 - Google Patents
包含交聯聚合物組合物的信息承載卡及其製造方法Info
- Publication number
- HK1207037A1 HK1207037A1 HK15107549.4A HK15107549A HK1207037A1 HK 1207037 A1 HK1207037 A1 HK 1207037A1 HK 15107549 A HK15107549 A HK 15107549A HK 1207037 A1 HK1207037 A1 HK 1207037A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- making
- cross
- same
- polymer composition
- linked polymer
- Prior art date
Links
- 229920006037 cross link polymer Polymers 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/75—Printability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
- B32B27/205—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents the fillers creating voids or cavities, e.g. by stretching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31598—Next to silicon-containing [silicone, cement, etc.] layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261619700P | 2012-04-03 | 2012-04-03 | |
US13/647,982 US9122968B2 (en) | 2012-04-03 | 2012-10-09 | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
PCT/US2013/033784 WO2013151823A1 (en) | 2012-04-03 | 2013-03-26 | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1207037A1 true HK1207037A1 (zh) | 2016-01-22 |
Family
ID=49232937
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15107549.4A HK1207037A1 (zh) | 2012-04-03 | 2015-08-06 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15107546.7A HK1207182A1 (zh) | 2012-04-03 | 2015-08-06 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15107547.6A HK1207099A1 (zh) | 2012-04-03 | 2015-08-06 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109380.2A HK1208748A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109379.5A HK1208695A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109378.6A HK1208747A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15107546.7A HK1207182A1 (zh) | 2012-04-03 | 2015-08-06 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15107547.6A HK1207099A1 (zh) | 2012-04-03 | 2015-08-06 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109380.2A HK1208748A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109379.5A HK1208695A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
HK15109378.6A HK1208747A1 (zh) | 2012-04-03 | 2015-09-24 | 包含交聯聚合物組合物的信息承載卡及其製造方法 |
Country Status (5)
Country | Link |
---|---|
US (15) | US9122968B2 (zh) |
EP (3) | EP2834075B1 (zh) |
CN (3) | CN104487988B (zh) |
HK (6) | HK1207037A1 (zh) |
WO (3) | WO2013151823A1 (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013110325A1 (en) * | 2012-01-25 | 2013-08-01 | Assa Abloy Ab | Functional laminate warp elimination method |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
US8857722B2 (en) | 2012-07-20 | 2014-10-14 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
US10032099B2 (en) | 2012-07-20 | 2018-07-24 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
WO2014149926A1 (en) | 2013-03-15 | 2014-09-25 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
EP3036113B1 (en) * | 2013-08-21 | 2022-09-14 | X-Card Holdings, LLC | Apparatus and method for making information carrying cards through radiation curing, and resulting products |
WO2015061611A1 (en) | 2013-10-25 | 2015-04-30 | Cpi Card Group - Colorado, Inc. | Multi-metal layered card |
NZ743934A (en) | 2014-05-22 | 2021-12-24 | Composecure Llc | Transaction and id cards having selected texture and coloring |
US10783422B2 (en) * | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
PT3138049T (pt) | 2015-07-08 | 2020-11-03 | Composecure Llc | Cartão inteligente metálico com capacidade de interface dupla |
MA43067A (fr) * | 2015-07-16 | 2018-05-23 | Messer Austria Gmbh | Dispositif et procédé pour réchauffer des produits métalliques |
CN108027892B (zh) * | 2015-09-18 | 2021-04-09 | X卡控股有限公司 | 用于信息携带卡的自定心嵌体和芯层、过程以及得到的产品 |
FR3045891A1 (fr) * | 2015-12-22 | 2017-06-23 | Oberthur Technologies | Procede de fabrication par lamination a chaud d'une carte a microcircuit comportant un flex dans une cavite et carte ainsi obtenue |
US10089568B2 (en) | 2016-06-01 | 2018-10-02 | CPI Card Group—Colorado, Inc. | IC chip card with integrated biometric sensor pads |
US11439025B2 (en) * | 2016-06-08 | 2022-09-06 | Fuji Corporation | Method for forming circuit |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
WO2018022755A1 (en) | 2016-07-27 | 2018-02-01 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
CN106280089A (zh) * | 2016-08-11 | 2017-01-04 | 陈绍铢 | 一种卡片纸及其应用 |
WO2018152218A1 (en) | 2017-02-14 | 2018-08-23 | Cpi Card Group - Colorado, Inc. | Edge-to-edge metal card and production method |
SG10202104318RA (en) | 2017-08-07 | 2021-05-28 | X Card Holdings Llc | Card having metallic core layer and systems and methods for card manufacturing |
PL3679523T4 (pl) * | 2017-09-07 | 2023-07-24 | Composecure Llc | Karta transakcyjna z wbudowanymi komponentami elektronicznymi i proces produkcji |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CN111492377B (zh) | 2017-10-18 | 2024-04-02 | 安全创造有限责任公司 | 具有窗或窗图案和可选背光的金属、陶瓷或陶瓷涂层的交易卡 |
TWI651655B (zh) * | 2017-12-15 | 2019-02-21 | 宏通數碼科技股份有限公司 | 電子顯示卡及其製作方法 |
EP3762871B1 (en) | 2018-03-07 | 2024-08-07 | X-Card Holdings, LLC | Metal card |
EP3651068A1 (fr) * | 2018-11-12 | 2020-05-13 | Thales Dis France SA | Procédé de réalisation d'un insert électronique pour support portable multi-composants et insert obtenu |
CN109942989A (zh) * | 2019-03-21 | 2019-06-28 | 东莞市科田智能卡科技有限公司 | 一种pvc卡基材 |
CN110041641A (zh) * | 2019-04-29 | 2019-07-23 | 佛山市菲锐表面科技有限公司 | 一种基于3d网络结构的低收缩pvc材料的制备方法 |
US11106961B2 (en) * | 2019-10-09 | 2021-08-31 | Beauiiful Card Corporation | Mini smart card and method of manufacturing the same |
USD1032613S1 (en) * | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
CN111619146A (zh) * | 2020-06-04 | 2020-09-04 | 浙江锦盛装饰材料有限公司 | 一种水性同步套印套压装饰膜生产工艺 |
CN112770551B (zh) * | 2021-04-07 | 2021-07-13 | 四川英创力电子科技股份有限公司 | 多层泡沫印制电路板的压合铆合方法及印制电路板 |
WO2024085874A1 (en) * | 2022-10-20 | 2024-04-25 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
Family Cites Families (222)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2890202A (en) * | 1953-07-20 | 1959-06-09 | Pittsburgh Plate Glass Co | Method of preparing acrylate esters of epoxy resins |
US3024216A (en) | 1958-07-28 | 1962-03-06 | Union Carbide Corp | Compositions of partially hydrolyzed vinyl chloride-vinyl acetate copolymers and polyurethane resins, polyethylene coated with same and process for making coated article |
US3847654A (en) * | 1970-06-08 | 1974-11-12 | M & T Chemicals Inc | Substrate bonded with vinyl dispersion textured coating |
JPS5271590A (en) | 1975-12-01 | 1977-06-15 | Bridgestone Corp | Production of novel high polymer |
US4115479A (en) * | 1976-08-11 | 1978-09-19 | Vynacron Dental Co. | Casting resins by polymerizing liquid monomer in mixture of particulated vinyl halide resins |
DE2837435B2 (de) | 1978-08-28 | 1981-06-25 | Friedrich Horst 5840 Schwerte Papenmeier | Verfahren und Vorrichtung zum Aufbereiten von PVC-Pulver |
US4310451A (en) | 1979-10-25 | 1982-01-12 | Diamond Shamrock Plastics Corporation | Free flowing rigid PVC resin powder compositions |
US4382201A (en) | 1981-04-27 | 1983-05-03 | General Electric Company | Ultrasonic transducer and process to obtain high acoustic attenuation in the backing |
US4480079A (en) * | 1982-04-12 | 1984-10-30 | Imperial Chemical Industries Plc | Copolymerization of unsaturated urethane monomers |
US4399061A (en) | 1981-10-14 | 1983-08-16 | Rca Corporation | Preparation of video disc molding composition |
DE3248385A1 (de) | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
US4463128A (en) * | 1983-05-09 | 1984-07-31 | W. R. Grace & Co. | Reactive plastisol dispersion |
JPS60252992A (ja) | 1984-05-30 | 1985-12-13 | Toshiba Corp | Icカ−ド |
FR2570101B1 (fr) | 1984-09-07 | 1987-09-25 | Sotimag | Procede antifraude pour document de valeur |
US4592976A (en) | 1984-12-07 | 1986-06-03 | N. Peter Whitehead | Identification card |
DE3685033D1 (de) * | 1985-01-25 | 1992-06-04 | Ici Plc | Polymerisierbare urethanzusammensetzungen. |
DE8504263U1 (de) | 1985-02-15 | 1986-06-12 | Schwan-Stabilo Schwanhäußer GmbH & Co, 8500 Nürnberg | Pudermine für Kosmetikstifte |
DE3519053A1 (de) | 1985-05-28 | 1986-12-18 | W.R. Grace & Co., Cambridge, Mass. | Dichtungsmasse |
KR940003375B1 (ko) * | 1986-05-21 | 1994-04-21 | 가부시끼가이샤 히다찌세이사꾸쇼 | 반도체 장치 및 그 제조 방법 |
JPH0686177B2 (ja) | 1986-09-29 | 1994-11-02 | 河西工業株式会社 | 自動車用内装部品 |
GB8624082D0 (en) | 1986-10-08 | 1986-11-12 | Dunlop Cct Sa | Vinyl chloride polymer products |
JPS63185630A (ja) * | 1987-01-29 | 1988-08-01 | 東洋鋼板株式会社 | 高硬度塩化ビニル被覆鋼板の製造方法 |
US4775699A (en) | 1987-04-14 | 1988-10-04 | The B. F. Goodrich Company | Crosslinked porous skinless particles of PVC resin |
US4742085A (en) | 1987-04-14 | 1988-05-03 | The B. F. Goodrich Company | Crosslinked porous skinless particles of PVC resin and process for producing same |
US4775700A (en) | 1987-04-14 | 1988-10-04 | The B. F. Goodrich Company | Process for producing porous skinless particles of crosslinked PVC resin |
US4775701A (en) | 1987-04-14 | 1988-10-04 | The B. F. Goodrich Company | Mass process for producing porous friable particles of crosslinked PVC resin |
US4775698A (en) | 1987-04-14 | 1988-10-04 | The B. F. Goodrich Company | Process for producing porous substantially skinless particles of crosslinked PVC resin |
US4775702A (en) | 1987-04-14 | 1988-10-04 | The B. F. Goodrich Company | Inversion process for producing low-skin porous friable particles of crosslinked PVC resin |
DE68912426T2 (de) | 1988-06-21 | 1994-05-11 | Gec Avery Ltd | Herstellung von tragbaren elektronischen Karten. |
KR970005475B1 (ko) | 1988-07-15 | 1997-04-16 | 클레리언트 파이넌스(비브이아이) 리미티드 | 폴리-[α-히드록시-(아크릴,크로톤,또는 아크릴+크로톤)산]의 폴리락톤류 및 상응하는 염류의 제조방법 |
US5084501A (en) | 1988-11-07 | 1992-01-28 | Armstrong World Industries, Inc. | Highly filled resin powder |
US5204405A (en) * | 1988-11-09 | 1993-04-20 | Nippon Petrochemicals Co., Ltd. | Thermoplastic resin composition and method for preparing the same |
US5324506A (en) | 1988-11-23 | 1994-06-28 | Estee Lauder, Inc. | Colored cosmetic compositions |
US5143723A (en) | 1988-11-23 | 1992-09-01 | Estee Lauder, Inc. | Colored cosmetic compositions |
US4954195A (en) | 1989-02-13 | 1990-09-04 | Lockheed Corporation | Production of thermoset composites containing thermoplastic fillers |
DE69027295T2 (de) | 1990-01-19 | 1997-01-23 | Minnesota Mining & Mfg | Wärmehärtbare Zusammensetzung |
JPH03239595A (ja) | 1990-02-16 | 1991-10-25 | Dainippon Printing Co Ltd | カード製造方法 |
NL9000840A (nl) | 1990-04-10 | 1991-11-01 | Wavin Bv | Werkwijze en installatie voor het vervaardigen van kunststofvoortbrengsels met behulp van een warm mengsel van pvc-poeder en additieven, alsmede een voor toepassing bij deze werkwijze geschikte warmmenger. |
US5198501A (en) | 1990-08-20 | 1993-03-30 | Air Products And Chemicals, Inc. | In-situ polymerized blends of vinyl acetate/ethylene copolymar and poly(vinyl chloride) |
JPH04216850A (ja) * | 1990-12-17 | 1992-08-06 | Nippon Zeon Co Ltd | 塩化ビニル系プラスチゾル組成物 |
DE4135937C2 (de) | 1991-10-31 | 1997-07-03 | Pegulan Tarkett Ag | Verfahren zu Herstellen von Latex-, PVC-, und Weichmacher-freien Textil- oder Kunststoff-Boden- und Wandbelägen |
US5233022A (en) | 1991-08-26 | 1993-08-03 | United Technologies Automotive, Inc. | Flow property shelf life of PVC dry blend powders |
US5198170A (en) | 1991-09-19 | 1993-03-30 | The B. F. Goodrich Company | Method for extrusion of powered PVC compounds |
JP3049894B2 (ja) * | 1991-11-27 | 2000-06-05 | 日本ゼオン株式会社 | アクリル酸エステル系共重合体プラスチゾル組成物 |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
US5604266A (en) * | 1992-10-15 | 1997-02-18 | Ecomat, Inc. | Cured unsaturated polyest-polyurethane highly filled resin materials and process for preparing them |
FR2701268B1 (fr) | 1993-02-05 | 1995-04-14 | Atochem Elf Sa | Peintures à base de poudres de polyamide destinées au revêtement de profilés PVC. |
US5407893A (en) | 1993-08-19 | 1995-04-18 | Konica Corporation | Material for making identification cards |
JPH0793817A (ja) | 1993-09-24 | 1995-04-07 | Canon Inc | 情報記録媒体 |
FR2713648B1 (fr) | 1993-12-15 | 1996-03-01 | Rhone Poulenc Chimie | Composition stabilisante pour polymère chloré comportant des béta-dicétones. |
FR2716555B1 (fr) | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
CN1046462C (zh) | 1994-03-31 | 1999-11-17 | 揖斐电株式会社 | 电子部件搭载装置 |
JPH0817288A (ja) | 1994-07-04 | 1996-01-19 | Matsushita Electric Ind Co Ltd | 透明タッチパネル |
FR2724477B1 (fr) * | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
AU704645B2 (en) * | 1995-04-13 | 1999-04-29 | Dainippon Printing Co. Ltd. | IC card and IC module |
US5784782A (en) * | 1996-09-06 | 1998-07-28 | International Business Machines Corporation | Method for fabricating printed circuit boards with cavities |
FR2761497B1 (fr) | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
FR2762115B1 (fr) * | 1997-04-10 | 1999-12-03 | Schlumberger Ind Sa | Procede d'insertion d'un module electronique dans un corps de carte a memoire electronique |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
US6607135B1 (en) * | 1997-06-23 | 2003-08-19 | Rohm Co., Ltd. | Module for IC card, IC card, and method for manufacturing module for IC card |
NO310365B1 (no) | 1997-07-18 | 2001-06-25 | Norsk Hydro As | PVC-blanding, anvendelse av denne og metode for dens fremstilling |
US6238223B1 (en) | 1997-08-20 | 2001-05-29 | Micro Technology, Inc. | Method of depositing a thermoplastic polymer in semiconductor fabrication |
US6052062A (en) | 1997-08-20 | 2000-04-18 | Micron Technology, Inc. | Cards, communication devices, and methods of forming and encoding visibly perceptible information on the same |
FR2769110B1 (fr) | 1997-09-26 | 1999-12-03 | Gemplus Card Int | Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette |
US6037879A (en) | 1997-10-02 | 2000-03-14 | Micron Technology, Inc. | Wireless identification device, RFID device, and method of manufacturing wireless identification device |
US7012504B2 (en) | 2002-04-01 | 2006-03-14 | Micron Technology, Inc. | Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device |
US6768415B1 (en) | 1997-10-03 | 2004-07-27 | Micron Technology, Inc. | Wireless identification device, RFID device with push-on/push-off switch, method of manufacturing wireless identification device |
DK1056811T3 (da) | 1998-02-17 | 2005-02-14 | Du Pont | Fremgangsmåde til fremstilling af pulverbelægninger |
US6241153B1 (en) | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
US6353242B1 (en) | 1998-03-30 | 2002-03-05 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory |
FR2779851B1 (fr) * | 1998-06-12 | 2002-11-29 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre et carte obtenue |
PT1108207E (pt) | 1998-08-26 | 2008-08-06 | Sensors For Med & Science Inc | Dispositivos de sensores ópticos |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
US6100804A (en) | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
JP2000148959A (ja) | 1998-11-13 | 2000-05-30 | Henkel Japan Ltd | Icカードの製造法 |
DE19855167A1 (de) | 1998-11-30 | 2000-05-31 | Basf Coatings Ag | Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung |
DE19855146A1 (de) | 1998-11-30 | 2000-05-31 | Basf Coatings Ag | Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung |
DE19855125A1 (de) | 1998-11-30 | 2000-05-31 | Basf Coatings Ag | Aus mindestens drei Komponenten bestehendes Beschichtungsmittel, Verfahren zu seiner Herstellung sowie seine Verwendung |
US6730734B1 (en) | 1998-12-08 | 2004-05-04 | Rohm And Haas Company | Impact modifier compositions which enhance the impact strength properties and lower the viscosity of melt processed plastics resins and methods of making said compositions |
SE521714C2 (sv) | 1999-01-20 | 2003-12-02 | Bozena Olsson | Nagellacksbortagande medel |
US8636648B2 (en) | 1999-03-01 | 2014-01-28 | West View Research, Llc | Endoscopic smart probe |
DE19915765C2 (de) * | 1999-04-08 | 2001-06-21 | Cubit Electronics Gmbh | Kontaktloser Transponder und Verfahren zu seiner Herstellung |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
FR2794266B1 (fr) | 1999-05-25 | 2002-01-25 | Gemplus Card Int | Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout |
ES2383122T3 (es) | 1999-08-27 | 2012-06-18 | Angiodevice International Gmbh | Dispositivo de polímero biocompatible |
NL1013028C2 (nl) | 1999-09-10 | 2001-03-13 | Dsm Nv | Informatiedragend vormdeel. |
US6784230B1 (en) | 1999-09-23 | 2004-08-31 | Rohm And Haas Company | Chlorinated vinyl resin/cellulosic blends: compositions, processes, composites, and articles therefrom |
DE19947521A1 (de) | 1999-10-02 | 2001-04-05 | Basf Coatings Ag | Mit aktinischer Strahlung aktivierbare Bindungen enthaltendes festes Stoffgemisch und seine Verwendung |
ATE353349T1 (de) | 1999-12-03 | 2007-02-15 | China Petrochemical Corp | Voll vulkanisiertes kautschukpulver mit kontrollierbarem partikeldurchmesser sowie herstellungsverfahren und verwendung dafür |
US7592394B2 (en) | 1999-12-15 | 2009-09-22 | Arkema France | Plastic compositions having mineral-like appearance |
EP1111001B1 (en) | 1999-12-23 | 2006-06-14 | Rohm And Haas Company | Plastics additives composition, process and blends thereof |
DE10014399A1 (de) * | 2000-03-23 | 2001-10-04 | Wacker Polymer Systems Gmbh | Vernetzbare Polymerzusammensetzung |
WO2001073865A2 (en) | 2000-03-24 | 2001-10-04 | Cymbet Corporation | Continuous processing of thin-film batteries and like devices |
US6611050B1 (en) | 2000-03-30 | 2003-08-26 | International Business Machines Corporation | Chip edge interconnect apparatus and method |
US7893435B2 (en) | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
JP2002033296A (ja) | 2000-04-26 | 2002-01-31 | Lintec Corp | シリコンウエハ用の補強材および該補強材を用いたicチップの製造方法 |
US6380272B1 (en) | 2000-08-23 | 2002-04-30 | Kuei Yung Wang Chen | Manufacturing method for structural members from foamed plastic composites containing wood flour |
US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
KR100818964B1 (ko) | 2000-09-21 | 2008-04-04 | 롬 앤드 하스 캄파니 | 고산성 수성 나노복합체 분산물 |
US6599993B1 (en) * | 2000-10-11 | 2003-07-29 | Basf Corporation | Low gloss textured powder coating |
US20020091178A1 (en) | 2001-01-05 | 2002-07-11 | Hossein Amin-Javaheri | Polyvinyl chloride composition |
GB2371264A (en) * | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
US20020119294A1 (en) | 2001-02-28 | 2002-08-29 | Jason Monkarsh | Light-emitting, light-rechargeable labels for containers |
JP3916405B2 (ja) | 2001-03-06 | 2007-05-16 | 松下電器産業株式会社 | 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 |
US6551537B2 (en) | 2001-03-08 | 2003-04-22 | Nan Ya Plastics Corporation | Manufacturing method for structural members from foamed plastic composites containing wood flour |
US20020125431A1 (en) | 2001-03-12 | 2002-09-12 | Peter Hwang | Infrared radiation detection device |
US6462273B1 (en) * | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
US20020132086A1 (en) | 2001-03-19 | 2002-09-19 | Hsu Tang Su-Tuan | Sweat-absorbing and non-slip pad |
FR2824939B1 (fr) | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
JP3478281B2 (ja) * | 2001-06-07 | 2003-12-15 | ソニー株式会社 | Icカード |
US6790893B2 (en) | 2001-11-30 | 2004-09-14 | Pyrophobic Systems Ltd. | Compound of intumescent powder and thermoplastic material |
US7097549B2 (en) | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
DE10163825A1 (de) | 2001-12-22 | 2003-07-03 | Degussa | Pulverlackzusammensetzungen aus kristallinen Urethanacrylaten und deren Verwendung |
AU2002361855A1 (en) * | 2001-12-24 | 2003-07-15 | Digimarc Id Systems Llc | Pet based multi-multi-layer smart cards |
US6639309B2 (en) | 2002-03-28 | 2003-10-28 | Sandisk Corporation | Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board |
CN1308391C (zh) * | 2002-03-29 | 2007-04-04 | 三洋化成工业株式会社 | 热交联性树脂分散体 |
US20030189314A1 (en) | 2002-04-08 | 2003-10-09 | Quattro Johnny S. | Non-metallic edge gliding board |
US20040002559A1 (en) | 2002-04-10 | 2004-01-01 | Malisa Troutman | Flame retardant coatings |
KR100668404B1 (ko) * | 2002-04-23 | 2007-01-16 | 가부시키가이샤 리코 | 정보 기록 표시 카드와 그것을 이용하는 화상 처리 방법및 화상 처리 장치 |
US20030216701A1 (en) | 2002-05-15 | 2003-11-20 | Gentho Sumarta | Synthetic glove and process for making |
FR2840459B1 (fr) | 2002-05-28 | 2004-07-16 | Itt Mfg Enterprises Inc | Connecteur electrique pour une carte a puce comportant un commutateur perfectionne |
US6918984B2 (en) | 2002-06-24 | 2005-07-19 | Loctite (R&D) Limited | Photocurable adhesive compositions, reaction products of which have low halide ion content |
US6786415B2 (en) * | 2002-08-06 | 2004-09-07 | Jung-Hua Yiu | Memory card connector |
JP3866178B2 (ja) * | 2002-10-08 | 2007-01-10 | 株式会社ルネサステクノロジ | Icカード |
US6861475B2 (en) | 2002-10-16 | 2005-03-01 | Rohm And Haas Company | Smooth, flexible powder coatings |
US7137148B2 (en) | 2002-10-31 | 2006-11-21 | Microflex Corporation | PVC based medical gloves and formulations therefor |
JP2004185208A (ja) | 2002-12-02 | 2004-07-02 | Sony Corp | Icカード |
GB0229747D0 (en) | 2002-12-20 | 2003-01-29 | Axis Shield Asa | Assay |
EP1581587B1 (de) | 2003-01-08 | 2007-04-11 | Süd-Chemie Ag | Masterbatche auf der basis pre-exfolierter nanoclays und ihre verwendung |
DE10311639A1 (de) | 2003-03-14 | 2004-09-23 | Röhm GmbH & Co. KG | Antistatisch beschichteter Formkörper und Verfahren zu seiner Herstellung |
FR2853115B1 (fr) | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
CN1239587C (zh) | 2003-04-03 | 2006-02-01 | 中国石油化工股份有限公司 | 一种复合粉末及其制备方法和用途 |
US7917298B1 (en) | 2003-04-17 | 2011-03-29 | Nanosys, Inc. | Nanocrystal taggants |
US20040216658A1 (en) | 2003-04-30 | 2004-11-04 | Wu-Chueh Lin | Pool float and method of making the same |
JP4235042B2 (ja) | 2003-06-11 | 2009-03-04 | 共同印刷株式会社 | 非接触icカード、icモジュール及び非接触icカードの製造方法 |
EP1643966B1 (en) | 2003-06-17 | 2010-07-21 | Cognis IP Management GmbH | Modified soy proteins in skin tightening compositions |
US7230047B2 (en) | 2003-06-25 | 2007-06-12 | Henkel Corporation | Reformable compositions |
US7147625B2 (en) | 2003-07-01 | 2006-12-12 | Icet, Inc. | Leg bag accessory |
EP1502922A1 (en) | 2003-07-30 | 2005-02-02 | Loctite (R & D) Limited | Curable encapsulant compositions |
US7763315B2 (en) * | 2003-08-25 | 2010-07-27 | Sakuranomiya Chemical Co., Ltd | Process for preparing a metal coating material comprising condensation polymerized resin nanoparticles |
US7566001B2 (en) * | 2003-08-29 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US6946628B2 (en) | 2003-09-09 | 2005-09-20 | Klai Enterprises, Inc. | Heating elements deposited on a substrate and related method |
DE10350556A1 (de) | 2003-10-29 | 2005-06-02 | Clariant Gmbh | Wasserbasierende Pigmentpräparationen |
CA2580715A1 (en) | 2003-12-10 | 2005-06-23 | Landqart Ag | Identification card and the production method thereof |
GB2410308B (en) | 2004-01-20 | 2008-06-25 | Uponor Innovation Ab | Multilayer pipe |
TWI457835B (zh) * | 2004-02-04 | 2014-10-21 | Semiconductor Energy Lab | 攜帶薄膜積體電路的物品 |
US20050182156A1 (en) | 2004-02-18 | 2005-08-18 | Guixi Liu | Glove made with non-toxic plasticizer ATBC |
US20050218551A1 (en) | 2004-04-01 | 2005-10-06 | Izhar Halahmi | Process for producing polar polyolefines and modified polyolefines thereof |
IL161473A0 (en) | 2004-04-18 | 2004-09-27 | Polyram Ram On Ind Lp | Star-like polyolefin having high propylene content and polar derivatives thereof and method for its production |
US20060042827A1 (en) | 2004-09-02 | 2006-03-02 | Chou Wai P | SD/MMC cards |
CN1772802A (zh) | 2004-11-11 | 2006-05-17 | 东莞强发制鞋有限公司 | 一种止滑耐油鞋底的成型材料 |
US7297370B2 (en) | 2004-12-22 | 2007-11-20 | General Electric Company | Curable encapsulant composition, device including same, and associated method |
EP1851063B1 (de) | 2005-02-17 | 2014-04-30 | Tritron GmbH | Vorbehandlung und/oder vorbeschichtung von nicht saugfähigen substraten und/oder nicht saugfähigen trägermaterialien |
DE102005013439A1 (de) | 2005-03-21 | 2006-09-28 | Basf Ag | Verfahren zur Herstellung von Polymerisatpulvern |
US8012809B2 (en) * | 2005-03-23 | 2011-09-06 | Cardxx, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
EP1882220A2 (en) * | 2005-03-26 | 2008-01-30 | Privasys, Inc. | Electronic financial transaction cards and methods |
US7237724B2 (en) * | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
WO2006116772A2 (en) * | 2005-04-27 | 2006-11-02 | Privasys, Inc. | Electronic cards and methods for making same |
JP2006339757A (ja) * | 2005-05-31 | 2006-12-14 | Denso Corp | アンテナコイル、通信基板モジュールの製造方法及びカード型無線機 |
US7601563B2 (en) | 2005-06-10 | 2009-10-13 | Kingston Technology Corporation | Small form factor molded memory card and a method thereof |
DE102005037611A1 (de) | 2005-08-05 | 2007-02-15 | Eckart Gmbh & Co. Kg | Metalleffektpigmente mit anorganisch/organischer Mischschicht, Verfahren zur Herstellung solcher Metalleffektpigmente und deren Verwendung |
GB0519608D0 (en) | 2005-09-26 | 2005-11-02 | Sec Dep For The Home Departmen | Document and method of manufacuring same |
DE102005049916A1 (de) | 2005-10-17 | 2007-04-19 | Degussa Gmbh | Lagerstabile, reaktive Pulverlackzusammensetzungen mit kristallinen Bestandteilen |
KR101376401B1 (ko) | 2005-10-27 | 2014-03-27 | 3디 시스템즈 인코오퍼레이티드 | 무-안티몬 광경화성 수지 조성물 및 3차원 물품 |
US7511371B2 (en) | 2005-11-01 | 2009-03-31 | Sandisk Corporation | Multiple die integrated circuit package |
US20070104938A1 (en) | 2005-11-09 | 2007-05-10 | Union Looper Co., Ltd. | Foam cushion with a high water-absorption ability |
US8034153B2 (en) | 2005-12-22 | 2011-10-11 | Momentive Performances Materials, Inc. | Wear resistant low friction coating composition, coated components, and method for coating thereof |
DE102005062027A1 (de) | 2005-12-22 | 2007-06-28 | Basf Ag | Wässrige Dispersionen von Polymeren, die einen Fluoreszenzfarbstoff enthalten, Verfahren zu ihrer Herstellung und ihre Verwendung zum Markieren von Materialien |
DE502007004317D1 (de) | 2006-01-19 | 2010-08-19 | Basf Se | Polymerisatpulver mit hohem kautschukanteil und deren herstellung |
US8378013B2 (en) | 2006-02-14 | 2013-02-19 | Arkema France | Hybrid impact modifiers and method for preparing the same |
WO2007097785A1 (en) | 2006-02-21 | 2007-08-30 | Patel Gordhanbhai N | Method of making smart cards with an encapsulant |
DE102006009131A1 (de) | 2006-02-24 | 2007-09-06 | Eckart Gmbh & Co.Kg | Mit anorganisch/organischen Mischschichten beschichtete Perlglanzpigmente und Verfahren zu deren Herstellung |
DE102006009130A1 (de) | 2006-02-24 | 2007-08-30 | Eckart Gmbh & Co. Kg | Wetterstabile Perlglanzpigmente auf Basis dünner Glasplättchen und Verfahren zu deren Herstellung |
US8200320B2 (en) | 2006-03-03 | 2012-06-12 | PhysioWave, Inc. | Integrated physiologic monitoring systems and methods |
US7668588B2 (en) | 2006-03-03 | 2010-02-23 | PhysioWave, Inc. | Dual-mode physiologic monitoring systems and methods |
DE102006012302A1 (de) | 2006-03-15 | 2007-09-27 | Seaquist Perfect Dispensing Gmbh | Abgabevorrichtung |
EP2013821B1 (en) * | 2006-04-10 | 2011-10-12 | Innovatier, Inc. | An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards |
FR2900484B3 (fr) | 2006-04-28 | 2008-08-08 | Ask Sa | Support de dispositif d'identification radiofrequence et son procede de fabrication |
FR2900485B3 (fr) | 2006-04-28 | 2008-08-08 | Ask Sa | Support de dispositif d'identification radiofrequence et son procede de fabrication |
AU2007263131B2 (en) * | 2006-06-19 | 2012-02-16 | Nagravision S.A. | Method of fabricating cards each comprising an electronic module and intermediate products |
US8138591B2 (en) | 2006-09-23 | 2012-03-20 | Stats Chippac Ltd | Integrated circuit package system with stacked die |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US8322624B2 (en) | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
CZ307210B6 (cs) | 2006-10-27 | 2018-03-28 | Austin Detonator S.R.O. | Izolace, obklopující vodič elektrického proudu, pro zlepšení separovatelnosti od zpracovávané rubaniny |
CL2007003131A1 (es) * | 2006-11-01 | 2008-07-04 | Lucite Int Inc | Metodo para fabricar un articulo que comprende formular composicion acrilica que tiene un agente de transferencia con grupo que reacciona con isocianato y luego unir a una composicion que contiene isocianato; articulo; metodo que mejora la eficiencia |
KR101489008B1 (ko) | 2006-11-06 | 2015-02-04 | 조셉 펠드먼 | 다층구조의 신분증 |
JP4860436B2 (ja) | 2006-11-07 | 2012-01-25 | トッパン・フォームズ株式会社 | Icカードおよびその製造方法 |
FR2909029B1 (fr) | 2006-11-27 | 2011-10-21 | Solvay | Procede de fabrication d'une plaque composite a base de pvc et structure incluant une telle plaque |
US8017147B2 (en) | 2008-04-07 | 2011-09-13 | Mazed Mohammad A | Nutritional supplement for the prevention of cardiovascular disease, alzheimer's disease, diabetes, and regulation and reduction of blood sugar and insulin resistance |
WO2008068052A1 (en) | 2006-12-07 | 2008-06-12 | Agfa-Gevaert | Method of producing an information carrier |
US20080194736A1 (en) | 2007-02-13 | 2008-08-14 | Minqiu Lu | PVC nanocomposite manufacturing technology and applications |
JP5174802B2 (ja) * | 2007-03-02 | 2013-04-03 | 三井化学株式会社 | 不織布積層体 |
US7868441B2 (en) | 2007-04-13 | 2011-01-11 | Maxim Integrated Products, Inc. | Package on-package secure module having BGA mesh cap |
TW200845236A (en) | 2007-05-04 | 2008-11-16 | Utac Taiwan | Memory card and method for fabricating the same |
US20080282540A1 (en) * | 2007-05-14 | 2008-11-20 | Innovatier, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
EP1995231B1 (en) | 2007-05-25 | 2013-11-20 | Evonik Röhm GmbH | Process for preparation of methyl methacrylate using recycled methanol |
KR100798685B1 (ko) * | 2007-05-31 | 2008-01-28 | 주식회사 제이디씨텍 | 액정 표시부를 갖는 스마트디스플레이카드의 제조방법 |
DE102007041027A1 (de) | 2007-08-29 | 2009-03-05 | Eckart Gmbh | Effektpigmente auf Basis von aus anorganisch-organischen Mischphasen gebildeten Substraten, deren Herstellung und Verwendung |
US7845839B2 (en) | 2007-11-13 | 2010-12-07 | Intematix Corporation | Light emitting display |
EP2207847B1 (en) | 2007-11-16 | 2012-11-14 | E. I. du Pont de Nemours and Company | Multilayer articles containing bimodal ionomer compositions |
US7879922B2 (en) * | 2007-11-20 | 2011-02-01 | PolyuMAC Inc. | Rigid, closed-cell, graft-polymer foam; rigid flexible cellular foam; rigid flexible cellular foam mixtures; and method for manufacturing a rigid, closed-cell, graft-polymer foam |
US20090142981A1 (en) | 2007-12-03 | 2009-06-04 | Velsicol Chemical Corporation | Novel Compositions Comprising Structural Isomers Of 1,4-Cyclohexanedimethanol Dibenzoate and Polymer Compositions Containing Same |
EP2232414A4 (en) | 2007-12-19 | 2011-05-04 | Linda Seah | INLAYS WITHOUT CONTACT AND WITH DOUBLE INTERFACE AND METHOD OF MANUFACTURING THE SAME |
US20090159699A1 (en) * | 2007-12-24 | 2009-06-25 | Dynamics Inc. | Payment cards and devices operable to receive point-of-sale actions before point-of-sale and forward actions at point-of-sale |
JP5181724B2 (ja) | 2008-02-27 | 2013-04-10 | 凸版印刷株式会社 | Icカード及びその製造方法 |
US20090247369A1 (en) | 2008-03-27 | 2009-10-01 | Shuo-Hsiu Johnny Chang | Hygienic exercise equipment and manufacturing method thereof |
US8814052B2 (en) | 2008-08-20 | 2014-08-26 | X-Card Holdings, Llc | Secure smart card system |
JP2010059225A (ja) * | 2008-09-01 | 2010-03-18 | Toray Ind Inc | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
EP2353179A4 (en) | 2008-10-17 | 2012-10-03 | Occam Portfolio Llc | SOLDER-FREE FLEXIBLE CIRCUIT ARRANGEMENTS AND METHODS OF MANUFACTURING THE SAME |
JP2010250467A (ja) | 2009-04-14 | 2010-11-04 | Toppan Printing Co Ltd | デュアルインターフェイスicカードの製造方法及びアンテナ内蔵カード |
US9567426B2 (en) | 2009-05-29 | 2017-02-14 | Cytec Technology Corp. | Engineered crosslinked thermoplastic particles for interlaminar toughening |
US8413894B2 (en) | 2009-11-05 | 2013-04-09 | X-Card Holdings, Llc | Card with illuminated codes for use in secure transactions |
KR20110058183A (ko) | 2009-11-26 | 2011-06-01 | 이스마트코리아 유한회사 | Ic 카드 제조 방법 |
KR101092845B1 (ko) | 2009-12-03 | 2011-12-14 | (주)이모트 | Rfid 태그 내장 형 인레이와, 이를 포함하는 카드, 및 rfid 태그 내장형 인레이의 제조 방법 |
JP2011144213A (ja) * | 2010-01-12 | 2011-07-28 | Toray Ind Inc | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
TW201201450A (en) | 2010-06-28 | 2012-01-01 | En-Min Jow | Memory element having wireless recognition function and portable electronic device integrating the same |
AU2011250831A1 (en) * | 2010-12-03 | 2012-06-21 | Bayer Intellectual Property Gmbh | Security and/or valuable documents with a top layer with a scratch-resistant finish |
US9594999B2 (en) * | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
ES2950145T3 (es) | 2012-09-04 | 2023-10-05 | Idemia America Corp | Capa central para una tarjeta portadora de información |
DE102013102718A1 (de) * | 2013-03-18 | 2014-09-18 | Infineon Technologies Ag | Chipkartenmodulanordnung |
EP3036113B1 (en) * | 2013-08-21 | 2022-09-14 | X-Card Holdings, LLC | Apparatus and method for making information carrying cards through radiation curing, and resulting products |
-
2012
- 2012-10-09 US US13/647,982 patent/US9122968B2/en active Active
- 2012-10-10 US US13/648,805 patent/US9275321B2/en active Active
- 2012-10-11 US US13/649,663 patent/US9183486B2/en active Active
-
2013
- 2013-03-26 EP EP13773028.9A patent/EP2834075B1/en active Active
- 2013-03-26 CN CN201380026495.9A patent/CN104487988B/zh active Active
- 2013-03-26 WO PCT/US2013/033784 patent/WO2013151823A1/en active Application Filing
- 2013-03-27 EP EP13772768.1A patent/EP2834304A4/en not_active Withdrawn
- 2013-03-27 CN CN201380026484.0A patent/CN104470988B/zh active Active
- 2013-03-27 WO PCT/US2013/033963 patent/WO2013151833A1/en active Application Filing
- 2013-03-28 CN CN201380026486.XA patent/CN104471594B/zh active Active
- 2013-03-28 EP EP13772855.6A patent/EP2834780B1/en active Active
- 2013-03-28 WO PCT/US2013/034216 patent/WO2013151850A1/en active Application Filing
-
2015
- 2015-07-22 US US14/806,272 patent/US9688850B2/en active Active
- 2015-08-06 HK HK15107549.4A patent/HK1207037A1/zh unknown
- 2015-08-06 HK HK15107546.7A patent/HK1207182A1/zh unknown
- 2015-08-06 HK HK15107547.6A patent/HK1207099A1/zh unknown
- 2015-09-24 HK HK15109380.2A patent/HK1208748A1/zh unknown
- 2015-09-24 HK HK15109379.5A patent/HK1208695A1/zh unknown
- 2015-09-24 HK HK15109378.6A patent/HK1208747A1/zh unknown
- 2015-10-14 US US14/883,007 patent/US10611907B2/en active Active
-
2016
- 2016-01-27 US US15/007,517 patent/US10570281B2/en active Active
-
2017
- 2017-05-26 US US15/606,944 patent/US10392502B2/en active Active
-
2018
- 2018-04-13 US US15/952,715 patent/US11555108B2/en active Active
-
2019
- 2019-06-18 US US16/444,656 patent/US11560474B2/en active Active
- 2019-07-18 US US16/515,402 patent/US10836894B2/en active Active
-
2020
- 2020-01-14 US US16/742,185 patent/US11359084B2/en active Active
- 2020-03-02 US US16/806,132 patent/US11390737B2/en active Active
- 2020-11-09 US US17/092,872 patent/US11359085B2/en active Active
-
2022
- 2022-12-13 US US18/065,141 patent/US20230116583A1/en active Pending
-
2023
- 2023-01-20 US US18/157,563 patent/US20230159740A1/en active Pending
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1208695A1 (zh) | 包含交聯聚合物組合物的信息承載卡及其製造方法 | |
HK1212794A1 (zh) | 包括交聯聚合物組合物的信息携帶卡及其製作方法 | |
HK1205172A1 (zh) | 聚合物、方法和組合物 | |
HK1208163A1 (zh) | 藥物偶聯物,偶聯方法,及其用途 | |
EP2813955A4 (en) | INFORMATION ASSIGNMENT METHOD AND DEVICE | |
EP2820174A4 (en) | PROCESS AND USE FOR MOLECULAR TAGS | |
GB201322105D0 (en) | Slot atennna and information terminal apparatus using the same | |
EP2937818A4 (en) | Information code, information code generation method, information code reader device, and information code usage system | |
EP2858009A4 (en) | RFID READ DEVICE, AND INFORMATION READING METHOD USING THE SAME | |
EP2821707A4 (en) | INFORMATION SENDING DEVICE, INFORMATION SENDING DEVICE CONTROL PROCEDURE AND INFORMATION SENDING DEVICE CONTROL PROGRAM | |
EP2937817A4 (en) | Information code, information code generation method, information code reader device, and information code usage system | |
EP2813952A4 (en) | INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING, PROGRAM AND INFORMATION MEMORY MEDIUM | |
HK1205166A1 (zh) | 聚合物、組合物和用途 | |
EP3779793C0 (en) | INFORMATION CODE AND INFORMATION CODE READING DEVICE | |
SG11201405912WA (en) | Information input method, device, terminal and storage medium | |
EP2866178A4 (en) | INFORMATION MANAGEMENT PROCESS AND DEVICE | |
ZA201504433B (en) | Identity information systems and methods | |
EP2828335A4 (en) | POLYMER COMPOSITION AND METHOD OF MANUFACTURING THE SAME | |
EP2940559A4 (en) | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM MEMORY | |
EP2915832A4 (en) | LACTID COPOLYMER, METHOD FOR ITS PREPARATION AND RESIN COMPOSITION THEREWITH | |
EP2848636A4 (en) | POLYMER, METHOD FOR THE PRODUCTION THEREOF, AND COMPOSITION AND FILM THEREWITH | |
EP2889732A4 (en) | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING, PROGRAM AND INFORMATION STORAGE MEDIUM | |
EP2814191A4 (en) | PORTABLE INFORMATION TERMINAL, ITS DEMODULATION METHOD AND ITS CONTROL PROGRAM | |
EP2873697A4 (en) | PROCESS FOR PREPARING A POLYMER COMPOSITION, AND POLYMER COMPOSITION THUS OBTAINED | |
EP2711870B8 (en) | Mobile terminal and information reading preventing method |