HK1195576A1 - 抗蝕劑用樹脂組合物 - Google Patents

抗蝕劑用樹脂組合物

Info

Publication number
HK1195576A1
HK1195576A1 HK14108957.8A HK14108957A HK1195576A1 HK 1195576 A1 HK1195576 A1 HK 1195576A1 HK 14108957 A HK14108957 A HK 14108957A HK 1195576 A1 HK1195576 A1 HK 1195576A1
Authority
HK
Hong Kong
Prior art keywords
resists
resin composition
resin
composition
Prior art date
Application number
HK14108957.8A
Other languages
English (en)
Inventor
樋口倫也
鈴木文人
酒井善夫
丸澤尚
Original Assignee
互應化學工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 互應化學工業株式會社 filed Critical 互應化學工業株式會社
Publication of HK1195576A1 publication Critical patent/HK1195576A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK14108957.8A 2011-08-11 2014-09-03 抗蝕劑用樹脂組合物 HK1195576A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011176231A JP5814691B2 (ja) 2011-08-11 2011-08-11 レジスト用樹脂組成物
PCT/JP2012/065784 WO2013021734A1 (ja) 2011-08-11 2012-06-20 レジスト用樹脂組成物

Publications (1)

Publication Number Publication Date
HK1195576A1 true HK1195576A1 (zh) 2014-11-14

Family

ID=47668255

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14108957.8A HK1195576A1 (zh) 2011-08-11 2014-09-03 抗蝕劑用樹脂組合物

Country Status (9)

Country Link
US (1) US9128375B2 (zh)
EP (1) EP2743286B1 (zh)
JP (1) JP5814691B2 (zh)
KR (1) KR101561054B1 (zh)
CN (1) CN103748131B (zh)
ES (1) ES2730201T3 (zh)
HK (1) HK1195576A1 (zh)
TW (1) TWI537679B (zh)
WO (1) WO2013021734A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572737B1 (ja) * 2013-06-04 2014-08-13 太陽インキ製造株式会社 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
JP6524572B2 (ja) * 2013-07-01 2019-06-05 互応化学工業株式会社 ソルダーレジスト用組成物及びプリント配線板
JP6204734B2 (ja) * 2013-07-16 2017-09-27 互応化学工業株式会社 ソルダーレジスト用樹脂組成物
JP5596874B1 (ja) * 2013-08-28 2014-09-24 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5722418B1 (ja) * 2013-12-02 2015-05-20 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2016060809A (ja) * 2014-09-17 2016-04-25 日本ゼオン株式会社 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板
JP6525305B2 (ja) * 2014-09-19 2019-06-05 互応化学工業株式会社 硬化性組成物及び被覆配線板の製造方法
JP6635692B2 (ja) * 2014-09-25 2020-01-29 キヤノン株式会社 光造形物の製造方法及び液体吐出ヘッドの製造方法
US9599893B2 (en) * 2014-09-25 2017-03-21 Canon Kabushiki Kaisha Production process for optically shaped product and production process for liquid discharge head
CN107003610B (zh) * 2014-12-10 2020-05-19 互应化学工业株式会社 阻焊剂组合物和经覆盖的印刷线路板
US9835944B2 (en) * 2014-12-10 2017-12-05 Goo Chemical Co., Ltd. Liquid solder resist composition and covered-printed wiring board
WO2016121394A1 (ja) * 2015-01-28 2016-08-04 互応化学工業株式会社 カルボキシル基含有樹脂、感光性樹脂組成物、ドライフィルム、プリント配線板、及びカルボキシル基含有樹脂の製造方法
KR20180125634A (ko) * 2015-01-28 2018-11-23 고오 가가쿠고교 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판
JP6391121B2 (ja) * 2016-01-20 2018-09-19 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
JP5941180B1 (ja) * 2015-03-20 2016-06-29 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI620012B (zh) * 2015-11-02 2018-04-01 互應化學工業股份有限公司 感光性樹脂組成物、乾膜及印刷線路板
US11921424B2 (en) * 2017-03-30 2024-03-05 Hitachi Chemical Company, Ltd. (FIPAS) Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
JP6748663B2 (ja) * 2017-03-31 2020-09-02 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物およびプリント配線板
JP7236817B2 (ja) * 2017-06-19 2023-03-10 日本化薬株式会社 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途
CN107501522A (zh) * 2017-07-27 2017-12-22 滁州金桥德克新材料有限公司 一种增韧改性环氧丙烯酸树脂
KR102071023B1 (ko) * 2017-09-27 2020-01-29 동우 화인켐 주식회사 터치 센서 및 이의 제조방법
TWI788471B (zh) * 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 熱硬化性樹脂組成物、其硬化物及印刷配線板
JP6563158B1 (ja) * 2018-02-08 2019-08-21 関西ペイント株式会社 レジスト組成物及びレジスト膜
JP2020050797A (ja) * 2018-09-27 2020-04-02 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
CN112526823A (zh) * 2019-09-19 2021-03-19 株式会社田村制作所 感光性树脂组合物
JP7133594B2 (ja) 2019-09-19 2022-09-08 株式会社タムラ製作所 感光性樹脂組成物
JP7415443B2 (ja) 2019-10-30 2024-01-17 株式会社レゾナック 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及び、プリント配線板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700643A (en) * 1970-09-02 1972-10-24 Union Carbide Corp Radiation-curable acrylate-capped polycaprolactone compositions
JPS58154765A (ja) * 1982-02-05 1983-09-14 Daicel Chem Ind Ltd 光硬化性樹脂組成物
US5364736A (en) * 1987-12-07 1994-11-15 Morton International, Inc. Photoimageable compositions
JPH10274849A (ja) 1997-03-31 1998-10-13 Nikka Chem Co Ltd ソルダーフォトレジストインキ組成物
JP2000109541A (ja) 1998-10-06 2000-04-18 Nippon Poritekku Kk 感光性熱硬化性樹脂組成物
US6200599B1 (en) 1999-10-07 2001-03-13 The Regents Of The University Of California Ortho ester lipids
US6713230B2 (en) 1999-10-25 2004-03-30 Nan Ya Plastics Corporation Photosensitive ink composition
JP3830330B2 (ja) * 2000-05-17 2006-10-04 三菱化学株式会社 感光性材料
JP2002187934A (ja) 2000-12-20 2002-07-05 Nippon Kayaku Co Ltd ポリカルボン酸樹脂及びそれを用いた感光性樹脂組成物並びにその硬化物
KR20030085031A (ko) * 2001-03-23 2003-11-01 다이요 잉키 세이조 가부시키가이샤 활성 에너지선 경화성 수지, 이것을 함유하는광경화성ㆍ열경화성 수지 조성물 및 그의 경화물
JPWO2003059975A1 (ja) * 2001-12-28 2005-05-19 太陽インキ製造株式会社 感光性樹脂組成物およびプリント配線板
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP4933093B2 (ja) 2005-12-27 2012-05-16 太陽ホールディングス株式会社 アルカリ現像可能な硬化性組成物及びその硬化物
JP4840865B2 (ja) * 2006-11-07 2011-12-21 太陽ホールディングス株式会社 アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
WO2009150769A1 (ja) * 2008-06-09 2009-12-17 互応化学工業株式会社 カルボキシル基含有樹脂及びカルボキシル基含有樹脂を含有する硬化性組成物並びにその硬化物
JP5254723B2 (ja) 2008-09-26 2013-08-07 互応化学工業株式会社 アルカリ現像可能な硬化性組成物及びその硬化物

Also Published As

Publication number Publication date
TW201312269A (zh) 2013-03-16
EP2743286A1 (en) 2014-06-18
KR20140048250A (ko) 2014-04-23
TWI537679B (zh) 2016-06-11
US20140186766A1 (en) 2014-07-03
ES2730201T3 (es) 2019-11-08
US9128375B2 (en) 2015-09-08
JP2013040233A (ja) 2013-02-28
CN103748131B (zh) 2016-02-24
EP2743286B1 (en) 2019-03-20
EP2743286A4 (en) 2015-03-25
KR101561054B1 (ko) 2015-10-16
CN103748131A (zh) 2014-04-23
WO2013021734A1 (ja) 2013-02-14
JP5814691B2 (ja) 2015-11-17

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