HK1128099A1 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- HK1128099A1 HK1128099A1 HK09105527.2A HK09105527A HK1128099A1 HK 1128099 A1 HK1128099 A1 HK 1128099A1 HK 09105527 A HK09105527 A HK 09105527A HK 1128099 A1 HK1128099 A1 HK 1128099A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06037—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking multi-dimensional coding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0707—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/44—Methods for charging or discharging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/248—Supports; Mounting means by structural association with other equipment or articles with receiving set provided with an AC/DC converting device, e.g. rectennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/24—Alkaline accumulators
- H01M10/30—Nickel accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/34—Gastight accumulators
- H01M10/345—Gastight metal hydride accumulators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Near-Field Transmission Systems (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Secondary Cells (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006070387 | 2006-03-15 | ||
PCT/JP2007/055014 WO2007108371A1 (en) | 2006-03-15 | 2007-03-07 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1128099A1 true HK1128099A1 (en) | 2009-10-16 |
Family
ID=38522403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09105527.2A HK1128099A1 (en) | 2006-03-15 | 2009-06-19 | Semiconductor device |
Country Status (6)
Country | Link |
---|---|
US (1) | US7710270B2 (zh) |
JP (3) | JP5315438B2 (zh) |
CN (1) | CN101385039B (zh) |
HK (1) | HK1128099A1 (zh) |
TW (1) | TWI442324B (zh) |
WO (1) | WO2007108371A1 (zh) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007018162A1 (en) * | 2005-08-11 | 2007-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and wireless communication system |
JP2007183919A (ja) * | 2005-12-05 | 2007-07-19 | Nec Corp | Rfidタグ |
US9130602B2 (en) | 2006-01-18 | 2015-09-08 | Qualcomm Incorporated | Method and apparatus for delivering energy to an electrical or electronic device via a wireless link |
US8018323B2 (en) * | 2006-01-30 | 2011-09-13 | Baohua Qi | RFID sensor device based on pulse-processing |
KR101299932B1 (ko) * | 2006-03-10 | 2013-08-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2007108371A1 (en) * | 2006-03-15 | 2007-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2007105606A1 (en) | 2006-03-15 | 2007-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8013714B2 (en) * | 2006-03-27 | 2011-09-06 | Baohua Qi | RFID sensor using pulse processing |
US8132026B2 (en) * | 2006-06-02 | 2012-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device and mobile electronic device having the same |
EP1895450B1 (en) | 2006-08-31 | 2014-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and power receiving device |
EP2064687A4 (en) | 2006-09-22 | 2010-10-06 | Semiconductor Energy Lab | WHEELED VEHICLE EQUIPPED WITH RFID LABEL, RFID LABEL, SPEED MEASURING SYSTEM, AND SPEED MEASURING METHOD |
US7965180B2 (en) | 2006-09-28 | 2011-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Wireless sensor device |
US7839124B2 (en) * | 2006-09-29 | 2010-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device |
US7791012B2 (en) * | 2006-09-29 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising photoelectric conversion element and high-potential and low-potential electrodes |
US7808206B2 (en) | 2006-10-31 | 2010-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Electric power charge and discharge system |
US8044813B1 (en) * | 2006-11-16 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Radio field intensity measurement device, and radio field intensity detector and game console using the same |
US7830113B2 (en) * | 2006-11-28 | 2010-11-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, communication system, and method of charging the semiconductor device |
JP5361176B2 (ja) * | 2006-12-13 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP5100355B2 (ja) * | 2006-12-22 | 2012-12-19 | 株式会社半導体エネルギー研究所 | 温度制御装置 |
JP5161552B2 (ja) | 2006-12-26 | 2013-03-13 | 株式会社半導体エネルギー研究所 | 半導体メモリ装置及び半導体装置 |
JP5210613B2 (ja) * | 2006-12-27 | 2013-06-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP5312810B2 (ja) * | 2007-01-19 | 2013-10-09 | 株式会社半導体エネルギー研究所 | 充電装置 |
US8026795B2 (en) * | 2007-02-22 | 2011-09-27 | Baohua Qi | RFID sensor array and sensor group based on pulse-processing |
US9774086B2 (en) | 2007-03-02 | 2017-09-26 | Qualcomm Incorporated | Wireless power apparatus and methods |
US8305190B2 (en) | 2007-03-20 | 2012-11-06 | Golba Llc | Method and apparatus for power management for a radio frequency identification system |
US7750852B2 (en) * | 2007-04-13 | 2010-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8169285B2 (en) * | 2007-05-25 | 2012-05-01 | Infineon Technologies Austria Ag | Semiconductor device with integrated coils |
EP2000956B1 (en) | 2007-05-31 | 2010-12-15 | Semiconductor Energy Laboratory Co., Ltd. | power supply for RFID transponder |
US9124120B2 (en) | 2007-06-11 | 2015-09-01 | Qualcomm Incorporated | Wireless power system and proximity effects |
US8120484B2 (en) * | 2007-06-14 | 2012-02-21 | Rexam Healthcare Packaging Inc. | Closure and package with RFID kernel tag and boost antenna |
EP2019425A1 (en) * | 2007-07-27 | 2009-01-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9294157B2 (en) * | 2007-08-20 | 2016-03-22 | Gui-Yang Lu | Radio-frequency identification system |
JP5248240B2 (ja) | 2007-08-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2009087928A (ja) * | 2007-09-13 | 2009-04-23 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2009205669A (ja) * | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP5181759B2 (ja) * | 2008-03-21 | 2013-04-10 | ソニー株式会社 | Icカード |
CN101303744A (zh) | 2008-04-18 | 2008-11-12 | 上海坤锐电子科技有限公司 | 用于射频识别系统的信号增强器芯片及其信号增强器 |
US8547227B2 (en) * | 2008-09-10 | 2013-10-01 | Avery Dennison Corporation | RF communication device with energy enhancement |
WO2010032602A1 (en) | 2008-09-18 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2010032603A1 (en) * | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and wireless tag using the same |
JP5578797B2 (ja) | 2009-03-13 | 2014-08-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
IT1393784B1 (it) * | 2009-04-16 | 2012-05-08 | Visionee Srl | Ricevitore riproduttore sonoro. |
US8624545B2 (en) * | 2009-10-09 | 2014-01-07 | Convenientpower Hk Ltd | Portable electronic device with antenna and power transfer coil |
KR101822527B1 (ko) | 2010-07-28 | 2018-01-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 무선 급전 시스템 및 무선 급전 방법 |
JP5755066B2 (ja) | 2010-07-30 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 無線給電システム、及び無線給電方法 |
JP5755067B2 (ja) | 2010-07-30 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 無線給電システム、及び無線給電方法 |
US9391476B2 (en) | 2010-09-09 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding device, wireless power feeding system using the same and wireless power feeding method |
CN103530674B (zh) * | 2010-11-16 | 2018-10-16 | 赵东晶 | 一种用于无线设备配对的存储卡 |
WO2012070634A1 (en) | 2010-11-26 | 2012-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Power transmission device and wireless power transmission system including the same |
KR20120059938A (ko) * | 2010-12-01 | 2012-06-11 | 한국전자통신연구원 | 무선 주파수 식별 태그 |
US9054544B2 (en) | 2010-12-22 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding device, power receiving device, and wireless power feed system |
US9065302B2 (en) | 2010-12-24 | 2015-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Wireless power feeding system |
EP2658777B1 (en) * | 2010-12-31 | 2019-07-03 | Battelle Memorial Institute | Anti-icing, de-icing, and heating configuration, integration, and power methods for aircraft, aerodynamic and complex surfaces |
WO2012096365A1 (ja) * | 2011-01-14 | 2012-07-19 | 株式会社村田製作所 | Rfidチップパッケージ及びrfidタグ |
KR20120084659A (ko) | 2011-01-20 | 2012-07-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 급전 장치 및 비접촉 급전 시스템 |
US9325205B2 (en) | 2011-03-04 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving power supply system |
TWI548057B (zh) * | 2011-04-22 | 2016-09-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
JP5780894B2 (ja) | 2011-09-16 | 2015-09-16 | 株式会社半導体エネルギー研究所 | 非接触給電システム |
JP2013078171A (ja) | 2011-09-29 | 2013-04-25 | Semiconductor Energy Lab Co Ltd | 受電装置及び非接触給電システム |
US9246357B2 (en) | 2011-12-07 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Contactless power feeding system |
US10235543B2 (en) * | 2011-12-13 | 2019-03-19 | Infineon Technologies Ag | Booster antenna structure for a chip card |
TWI566508B (zh) | 2011-12-16 | 2017-01-11 | 半導體能源研究所股份有限公司 | 直流對直流轉換器、受電裝置及供電系統 |
JP6088234B2 (ja) | 2011-12-23 | 2017-03-01 | 株式会社半導体エネルギー研究所 | 受電装置、無線給電システム |
US9391674B2 (en) | 2012-04-26 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding system and power feeding method |
US9390850B2 (en) | 2012-07-13 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power transmitting device, power feeding system, and power feeding method |
CN103592478A (zh) * | 2012-08-17 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | 辐射信号源 |
CN102880896A (zh) * | 2012-09-07 | 2013-01-16 | 南昌大学 | 无线充电超薄有源电子标签 |
EP2747195B1 (en) | 2012-12-21 | 2017-02-08 | Stichting IMEC Nederland | Antenna arrangement for wireless powering |
WO2014199507A1 (ja) | 2013-06-14 | 2014-12-18 | ルネサスエレクトロニクス株式会社 | 通信制御装置及び実装基板 |
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-
2007
- 2007-03-07 WO PCT/JP2007/055014 patent/WO2007108371A1/en active Application Filing
- 2007-03-07 CN CN2007800059770A patent/CN101385039B/zh not_active Expired - Fee Related
- 2007-03-14 US US11/717,686 patent/US7710270B2/en not_active Expired - Fee Related
- 2007-03-14 TW TW096108759A patent/TWI442324B/zh not_active IP Right Cessation
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2009
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2012
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2015
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JP2012234551A (ja) | 2012-11-29 |
CN101385039A (zh) | 2009-03-11 |
US20070229281A1 (en) | 2007-10-04 |
TWI442324B (zh) | 2014-06-21 |
CN101385039B (zh) | 2012-03-21 |
US7710270B2 (en) | 2010-05-04 |
JP2015156220A (ja) | 2015-08-27 |
JP5890552B2 (ja) | 2016-03-22 |
JP2014078725A (ja) | 2014-05-01 |
TW200802121A (en) | 2008-01-01 |
WO2007108371A1 (en) | 2007-09-27 |
JP5315438B2 (ja) | 2013-10-16 |
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