HK1123816A1 - Curable resin composition, curable film and their cured products - Google Patents
Curable resin composition, curable film and their cured productsInfo
- Publication number
- HK1123816A1 HK1123816A1 HK09103680.0A HK09103680A HK1123816A1 HK 1123816 A1 HK1123816 A1 HK 1123816A1 HK 09103680 A HK09103680 A HK 09103680A HK 1123816 A1 HK1123816 A1 HK 1123816A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- curable
- resin composition
- cured products
- film
- curable resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007144462 | 2007-05-31 | ||
JP2007319601 | 2007-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1123816A1 true HK1123816A1 (en) | 2009-06-26 |
Family
ID=39711980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09103680.0A HK1123816A1 (en) | 2007-05-31 | 2009-04-22 | Curable resin composition, curable film and their cured products |
Country Status (8)
Country | Link |
---|---|
US (1) | US9062145B2 (zh) |
EP (1) | EP1997840B1 (zh) |
JP (1) | JP5649773B2 (zh) |
KR (2) | KR101559363B1 (zh) |
CN (1) | CN101314630B (zh) |
DE (1) | DE602008006486D1 (zh) |
HK (1) | HK1123816A1 (zh) |
TW (1) | TWI409287B (zh) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5463110B2 (ja) * | 2009-09-24 | 2014-04-09 | ナミックス株式会社 | カバーレイフィルム |
JP5473650B2 (ja) * | 2010-02-08 | 2014-04-16 | 三菱レイヨン株式会社 | 樹脂組成物及びこれを用いたプリプレグ並びに繊維強化複合材料 |
WO2012014871A1 (ja) * | 2010-07-26 | 2012-02-02 | 三菱レイヨン株式会社 | 樹脂組成物、これを用いたプリプレグ、及び繊維強化複合材料 |
CN103079982B (zh) * | 2010-09-09 | 2017-05-10 | 三菱电机株式会社 | 电梯用绳缆 |
US9835942B2 (en) | 2010-12-14 | 2017-12-05 | Kaneka Corporation | Photosensitive resin composition and use thereof |
US9318402B2 (en) * | 2011-03-24 | 2016-04-19 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg and resin sheet and metal foil-clad laminate |
CN103492949B (zh) * | 2011-04-25 | 2016-12-28 | 株式会社钟化 | 新颖的感光性树脂组合物及其利用 |
US8598281B2 (en) | 2011-09-01 | 2013-12-03 | Sabic Innovative Plastics Ip B.V. | Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same |
KR101561106B1 (ko) | 2012-01-25 | 2015-10-19 | 가부시키가이샤 가네카 | 신규한 절연막용 수지 조성물 및 그 이용 |
CN104081884B (zh) | 2012-01-25 | 2017-12-19 | 株式会社钟化 | 新颖的含颜料绝缘膜用树脂组合物及其利用 |
JP5690759B2 (ja) * | 2012-02-15 | 2015-03-25 | 株式会社日立製作所 | 熱硬化性樹脂組成物、硬化物、導線、電気機器用コイル及び電気機器 |
CN102807658B (zh) | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
JP6022893B2 (ja) * | 2012-10-24 | 2016-11-09 | ナミックス株式会社 | カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法 |
CN103965606A (zh) * | 2013-02-04 | 2014-08-06 | 联茂电子股份有限公司 | 一种低介电材料 |
JP6106464B2 (ja) * | 2013-02-28 | 2017-03-29 | ナミックス株式会社 | 積層型電子部品およびその製造方法 |
US9455067B2 (en) | 2013-03-18 | 2016-09-27 | Iteq Corporation | Low dielectric materials |
US9245667B2 (en) | 2013-03-18 | 2016-01-26 | Iteq Corporation | Circuit board |
JP6188788B2 (ja) | 2013-03-22 | 2017-08-30 | ナミックス株式会社 | 樹脂組成物、ならびに、それによる接着フィルム、カバーレイフィルム、層間接着剤 |
TWI491671B (zh) * | 2013-05-21 | 2015-07-11 | Elite Material Co Ltd | Low dielectric halogen-free resin compositions and circuit boards for which they are used |
JP6301173B2 (ja) * | 2014-03-28 | 2018-03-28 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、その硬化物、複合材料 |
SG11201705654PA (en) * | 2015-01-13 | 2017-08-30 | Hitachi Chemical Co Ltd | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
US10822527B2 (en) | 2015-01-19 | 2020-11-03 | Tomoegawa Co., Ltd. | Thermosetting adhesive composition, thermosetting adhesive film, and composite film |
CN104725828B (zh) * | 2015-03-04 | 2017-11-21 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
EP3290480B1 (en) * | 2015-04-30 | 2020-12-09 | Showa Denko Materials Co., Ltd. | Resin composition, prepreg, laminate and multilayer printed wiring board |
JP6675183B2 (ja) | 2015-11-30 | 2020-04-01 | ナミックス株式会社 | 熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置 |
CN105300432A (zh) * | 2015-12-04 | 2016-02-03 | 常熟市裕华计量检测咨询服务有限公司 | 耐压测试仪 |
US10442115B2 (en) | 2016-05-25 | 2019-10-15 | Johns Manville | Manufacturing thermoplastic composites and articles |
KR20190015190A (ko) * | 2016-05-31 | 2019-02-13 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 적층체, 수지 조성물층이 부착된 반도체 웨이퍼, 수지 조성물층이 부착된 반도체 탑재용 기판 및 반도체 장치 |
WO2018030112A1 (ja) * | 2016-08-10 | 2018-02-15 | パナソニックIpマネジメント株式会社 | 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法 |
CN108148196B (zh) * | 2016-12-02 | 2020-01-24 | 广东生益科技股份有限公司 | 一种苯乙烯基硅氧基聚苯醚树脂及其制备方法和应用 |
US20180179424A1 (en) * | 2016-12-23 | 2018-06-28 | Industrial Technology Research Institute | Adhesive composition and composite substrate employing the same |
WO2018168715A1 (ja) * | 2017-03-13 | 2018-09-20 | リンテック株式会社 | 樹脂組成物及び樹脂シート |
KR102056303B1 (ko) * | 2017-05-15 | 2019-12-16 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 사용한 프리프레그 및 금속박 적층판 |
TWI765028B (zh) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | 樹脂薄片、層合體及樹脂薄片的製造方法 |
EP3715393B1 (en) * | 2017-12-28 | 2023-03-08 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, resin-including film, resin-including metal foil, metal-clad laminate, and wiring board |
KR102165971B1 (ko) * | 2018-01-09 | 2020-10-15 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
WO2019188189A1 (ja) * | 2018-03-28 | 2019-10-03 | パナソニックIpマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
US10995182B2 (en) | 2018-04-30 | 2021-05-04 | Shpp Global Technologies B.V. | Phenylene ether oligomer, curable composition comprising the phenylene ether oligomer, and thermoset composition derived therefrom |
KR20210015760A (ko) * | 2018-05-29 | 2021-02-10 | 나믹스 가부시끼가이샤 | 열경화성 수지 조성물, 이를 포함하는 필름, 및 이들을 사용한 다층 배선판 |
EP3805316A4 (en) * | 2018-06-01 | 2022-04-06 | Mitsubishi Gas Chemical Company, Inc. | RESIN COMPOSITION, PREPREG, METAL FOIL COVERED LAMINATE, RESIN FOIL AND CIRCUIT BOARD |
TW202012481A (zh) * | 2018-07-20 | 2020-04-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板 |
KR102400111B1 (ko) * | 2019-02-08 | 2022-05-19 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판 |
JP7219654B2 (ja) * | 2019-03-28 | 2023-02-08 | 東京応化工業株式会社 | 組成物及び絶縁部の形成方法 |
JP7507382B2 (ja) * | 2019-03-29 | 2024-06-28 | パナソニックIpマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
WO2020217676A1 (ja) * | 2019-04-26 | 2020-10-29 | Dic株式会社 | 硬化性樹脂組成物 |
WO2020217675A1 (ja) * | 2019-04-26 | 2020-10-29 | Dic株式会社 | 硬化性樹脂組成物 |
WO2020222973A1 (en) | 2019-04-30 | 2020-11-05 | Sabic Global Technologies B.V. | Curable poly(polyphenylene ether) oligomer compositions for coatings |
CN113950509A (zh) | 2019-06-27 | 2022-01-18 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属层压板以及布线板 |
US20220282043A1 (en) * | 2019-08-20 | 2022-09-08 | Tokyo Ohka Kogyo Co., Ltd. | Curable composition for insulating film formation, insulating film formation method, and terminally maleimide-modified polyphenylene ether resin |
WO2021149733A1 (ja) * | 2020-01-24 | 2021-07-29 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、プリプレグ及びプリント配線板 |
JPWO2021172316A1 (zh) * | 2020-02-25 | 2021-09-02 | ||
JPWO2022054861A1 (zh) * | 2020-09-11 | 2022-03-17 | ||
CN112375241B (zh) * | 2020-11-03 | 2021-05-11 | 深圳瑞华泰薄膜科技股份有限公司 | 一种无色透明聚酰亚胺薄膜及其制备方法 |
KR20230165904A (ko) | 2021-04-02 | 2023-12-05 | 제이에스알 가부시끼가이샤 | 절연막 형성용 감방사선성 조성물, 패턴을 갖는 수지막 및 반도체 회로 기판 |
EP4079784A1 (en) * | 2021-04-20 | 2022-10-26 | SHPP Global Technologies B.V. | Phenylene ether oligomer and curable thermosetting composition comprising the phenylene ether oligomer |
WO2022255141A1 (ja) * | 2021-06-02 | 2022-12-08 | 信越ポリマー株式会社 | 接着剤組成物 |
KR102613586B1 (ko) * | 2022-12-06 | 2023-12-14 | 주식회사 신아티앤씨 | 저유전정접 수지 조성물 |
CN117447696A (zh) * | 2023-10-25 | 2024-01-26 | 东莞联茂电子科技有限公司 | 可固化聚苯醚树脂、树脂组合物及其应用 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4298720A (en) * | 1979-07-23 | 1981-11-03 | Mitsui Toatsu Chemicals Incorporated | Thermosetting resin composition from maleimide compound and alkenyl phenol |
JPS56133355A (en) * | 1980-03-24 | 1981-10-19 | Mitsubishi Gas Chem Co Inc | Curable polyphenylene ether resin composition |
JPS6253319A (ja) * | 1985-08-30 | 1987-03-09 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物 |
JPH0370716A (ja) | 1989-08-11 | 1991-03-26 | Mitsubishi Petrochem Co Ltd | 耐熱性に優れ吸水率の低い硬化物を与えるビスマレイミド樹脂組成物 |
CA2082606A1 (en) | 1991-11-11 | 1993-05-12 | Takanari Yamaguchi | Liquid crystalline polyester resin composition |
JPH05310891A (ja) | 1992-05-14 | 1993-11-22 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物及びその硬化方法 |
JP3617725B2 (ja) * | 1995-06-06 | 2005-02-09 | 株式会社東芝 | 樹脂組成物および樹脂封止型半導体装置 |
FR2781653B1 (fr) * | 1998-08-03 | 2000-10-06 | Oreal | Dispositif pour l'application d'un produit de maquillage comportant une brosse, procede de fabrication et applicateur |
CN1522387A (zh) * | 2001-05-30 | 2004-08-18 | 钟渊化学工业株式会社 | 光敏性树脂组合物及用该组合物的光敏性干膜抗蚀剂、光敏性射线遮挡膜 |
US6835785B2 (en) * | 2002-01-28 | 2004-12-28 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
TWI250995B (en) * | 2002-07-25 | 2006-03-11 | Mitsubishi Gas Chemical Co | Vinyl compound and cured product thereof |
JP2004067727A (ja) * | 2002-08-01 | 2004-03-04 | Mitsubishi Gas Chem Co Inc | ビニル化合物およびその硬化物 |
JP4038667B2 (ja) * | 2002-07-25 | 2008-01-30 | 三菱瓦斯化学株式会社 | ビニル化合物およびその硬化物 |
JP2005120173A (ja) * | 2003-10-15 | 2005-05-12 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物。 |
JP4314465B2 (ja) * | 2003-10-22 | 2009-08-19 | 三菱瓦斯化学株式会社 | ビニル化合物の製造法 |
WO2005073264A1 (ja) * | 2004-01-30 | 2005-08-11 | Nippon Steel Chemical Co., Ltd. | 硬化性樹脂組成物 |
JP2006089683A (ja) | 2004-09-27 | 2006-04-06 | Nippon Steel Chem Co Ltd | 難燃性樹脂組成物 |
JP4661196B2 (ja) * | 2004-07-27 | 2011-03-30 | 日立化成工業株式会社 | 低誘電率絶縁性樹脂組成物 |
JP4867217B2 (ja) * | 2004-08-19 | 2012-02-01 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物および硬化性フィルムおよびフィルム |
US7358287B2 (en) | 2005-05-31 | 2008-04-15 | Ovation Polymer Technology And Engineered Materials, Inc. | Flame retardant polycarbonate composition |
JP4876778B2 (ja) * | 2005-12-22 | 2012-02-15 | 三菱瓦斯化学株式会社 | 保存安定性に優れる硬化性樹脂組成物、硬化性フィルムおよびフィルム |
JP2007262191A (ja) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | 難燃硬化性樹脂組成物 |
-
2008
- 2008-05-14 JP JP2008127211A patent/JP5649773B2/ja active Active
- 2008-05-22 US US12/153,677 patent/US9062145B2/en active Active
- 2008-05-27 TW TW97119495A patent/TWI409287B/zh active
- 2008-05-29 CN CN 200810108861 patent/CN101314630B/zh active Active
- 2008-05-30 EP EP20080251904 patent/EP1997840B1/en not_active Expired - Fee Related
- 2008-05-30 DE DE200860006486 patent/DE602008006486D1/de active Active
- 2008-05-30 KR KR1020080051131A patent/KR101559363B1/ko active IP Right Grant
-
2009
- 2009-04-22 HK HK09103680.0A patent/HK1123816A1/xx not_active IP Right Cessation
-
2015
- 2015-01-19 KR KR20150008846A patent/KR20150028270A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20150028270A (ko) | 2015-03-13 |
US9062145B2 (en) | 2015-06-23 |
JP2009161725A (ja) | 2009-07-23 |
TWI409287B (zh) | 2013-09-21 |
JP5649773B2 (ja) | 2015-01-07 |
CN101314630A (zh) | 2008-12-03 |
KR20080106118A (ko) | 2008-12-04 |
CN101314630B (zh) | 2011-08-10 |
EP1997840A1 (en) | 2008-12-03 |
US20080300350A1 (en) | 2008-12-04 |
KR101559363B1 (ko) | 2015-10-12 |
EP1997840B1 (en) | 2011-04-27 |
DE602008006486D1 (de) | 2011-06-09 |
TW200906905A (en) | 2009-02-16 |
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