HK1105424A1 - Epoxy resin composition for prepreg, prepreg, and multilayeredprinted wiring board - Google Patents

Epoxy resin composition for prepreg, prepreg, and multilayeredprinted wiring board

Info

Publication number
HK1105424A1
HK1105424A1 HK07113714A HK07113714A HK1105424A1 HK 1105424 A1 HK1105424 A1 HK 1105424A1 HK 07113714 A HK07113714 A HK 07113714A HK 07113714 A HK07113714 A HK 07113714A HK 1105424 A1 HK1105424 A1 HK 1105424A1
Authority
HK
Hong Kong
Prior art keywords
prepreg
multilayeredprinted
resin composition
epoxy resin
wiring board
Prior art date
Application number
HK07113714A
Other languages
English (en)
Inventor
Hidetsugu Motobe
Yoshihiko Nakamura
Takeshi Koizumi
Ryuji Takahashi
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of HK1105424A1 publication Critical patent/HK1105424A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK07113714A 2004-11-30 2007-12-17 Epoxy resin composition for prepreg, prepreg, and multilayeredprinted wiring board HK1105424A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/017760 WO2006059363A1 (ja) 2004-11-30 2004-11-30 プリプレグ用エポキシ樹脂組成物およびプリプレグ、多層プリント配線板

Publications (1)

Publication Number Publication Date
HK1105424A1 true HK1105424A1 (en) 2008-02-15

Family

ID=36564808

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07113714A HK1105424A1 (en) 2004-11-30 2007-12-17 Epoxy resin composition for prepreg, prepreg, and multilayeredprinted wiring board

Country Status (7)

Country Link
US (1) US8062750B2 (xx)
EP (1) EP1818350B1 (xx)
JP (1) JP4697144B2 (xx)
CN (1) CN1989166B (xx)
HK (1) HK1105424A1 (xx)
TW (1) TW200617053A (xx)
WO (1) WO2006059363A1 (xx)

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JP4858359B2 (ja) * 2007-08-28 2012-01-18 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、それを用いたプリプレグ、積層板、プリント配線板
US20100261837A1 (en) * 2007-11-29 2010-10-14 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
JP5281280B2 (ja) * 2007-12-25 2013-09-04 パナソニック株式会社 エポキシ樹脂組成物、プリプレグ、金属張積層板、多層プリント配線板
JP5399733B2 (ja) * 2009-02-16 2014-01-29 新日鉄住金化学株式会社 難燃性リン含有エポキシ樹脂組成物及びその硬化物
JP5136573B2 (ja) * 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
EP2534189B1 (en) * 2010-02-12 2015-05-06 Dow Global Technologies LLC Phosphorus-containing epoxy resin
CN105254847B (zh) * 2010-02-24 2019-04-05 日立化成工业株式会社 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
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TWI487725B (zh) * 2010-03-15 2015-06-11 新日鐵住金化學股份有限公司 難燃性含磷環氧樹脂組成物及其硬化物
WO2011118584A1 (ja) * 2010-03-26 2011-09-29 パナソニック電工株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板
EP3263664B1 (en) 2010-04-16 2020-11-04 Swimc Llc Coating compositions for packaging articles and methods of coating
JP5566200B2 (ja) * 2010-06-18 2014-08-06 新光電気工業株式会社 配線基板及びその製造方法
KR102135072B1 (ko) 2011-02-07 2020-07-20 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품을 위한 코팅 조성물 및 코팅 방법
JP5633931B2 (ja) * 2011-02-22 2014-12-03 新日鉄住金化学株式会社 リン含有エポキシ樹脂及び該樹脂組成物、硬化物
JP2012241179A (ja) * 2011-05-24 2012-12-10 Panasonic Corp プリプレグ用エポキシ樹脂組成物、プリプレグ、および多層プリント配線板
JP5917098B2 (ja) 2011-11-11 2016-05-11 新日鉄住金化学株式会社 リン含有フェノール樹脂の製造方法
JP5917227B2 (ja) * 2012-03-28 2016-05-11 新日鉄住金化学株式会社 リン含有エポキシ樹脂の製造方法
IN2015DN00445A (xx) 2012-08-09 2015-06-19 Valspar Sourcing Inc
CN107425030B (zh) 2012-08-20 2020-11-06 赫普塔冈微光有限公司 光学晶片的制造
JP2014111719A (ja) * 2012-11-12 2014-06-19 Panasonic Corp 積層板、金属張積層板、プリント配線板、多層プリント配線板
JP6358533B2 (ja) * 2014-03-27 2018-07-18 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
JP6291978B2 (ja) * 2014-03-31 2018-03-14 三菱ケミカル株式会社 リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
JP6340877B2 (ja) * 2014-03-31 2018-06-13 三菱ケミカル株式会社 リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
KR102429146B1 (ko) 2014-04-14 2022-08-04 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품용 조성물의 제조방법 및 상기 조성물의 사용 방법
WO2016067329A1 (ja) * 2014-10-27 2016-05-06 日本ゼオン株式会社 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
US9894761B2 (en) * 2015-06-12 2018-02-13 Panasonic Intellectual Property Management Co., Ltd. Prepreg, metal-clad laminated plate and printed wiring board
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
JP6859916B2 (ja) * 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
CN107974045A (zh) * 2017-12-14 2018-05-01 威海光威复合材料股份有限公司 彩色树脂及预浸料的生产方法
CN108912174B (zh) * 2018-06-22 2021-02-09 四川东材科技集团股份有限公司 一种阻燃双烷环型多元醇树脂及其制备方法
CN114889251B (zh) * 2022-04-29 2023-04-07 江苏耀鸿电子有限公司 一种高阻燃柔性环氧树脂覆铜板及其制备方法

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Also Published As

Publication number Publication date
CN1989166B (zh) 2010-04-28
TWI341848B (xx) 2011-05-11
TW200617053A (en) 2006-06-01
US8062750B2 (en) 2011-11-22
WO2006059363A1 (ja) 2006-06-08
EP1818350B1 (en) 2012-10-03
JPWO2006059363A1 (ja) 2008-06-05
EP1818350A4 (en) 2008-04-30
JP4697144B2 (ja) 2011-06-08
CN1989166A (zh) 2007-06-27
US20090008127A1 (en) 2009-01-08
EP1818350A1 (en) 2007-08-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161130