HK1084502A1 - Multilayer capacitor - Google Patents
Multilayer capacitorInfo
- Publication number
- HK1084502A1 HK1084502A1 HK06103824.0A HK06103824A HK1084502A1 HK 1084502 A1 HK1084502 A1 HK 1084502A1 HK 06103824 A HK06103824 A HK 06103824A HK 1084502 A1 HK1084502 A1 HK 1084502A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- multilayer capacitor
- multilayer
- capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002264821A JP3824565B2 (ja) | 2002-09-10 | 2002-09-10 | 積層コンデンサ |
JP2002264822A JP3847234B2 (ja) | 2002-09-10 | 2002-09-10 | 積層コンデンサ |
PCT/JP2003/011490 WO2004025673A1 (ja) | 2002-09-10 | 2003-09-09 | 積層コンデンサ |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1084502A1 true HK1084502A1 (en) | 2006-07-28 |
Family
ID=31996136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06103824.0A HK1084502A1 (en) | 2002-09-10 | 2006-03-27 | Multilayer capacitor |
Country Status (5)
Country | Link |
---|---|
US (4) | US7075774B2 (ko) |
KR (1) | KR100678496B1 (ko) |
HK (1) | HK1084502A1 (ko) |
TW (1) | TWI291186B (ko) |
WO (1) | WO2004025673A1 (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7075774B2 (en) * | 2002-09-10 | 2006-07-11 | Tdk Corporation | Multilayer capacitor |
JP2006245049A (ja) * | 2005-02-28 | 2006-09-14 | Tdk Corp | 電子部品及び電子機器 |
KR100616687B1 (ko) * | 2005-06-17 | 2006-08-28 | 삼성전기주식회사 | 적층형 칩 커패시터 |
KR100944098B1 (ko) * | 2005-08-19 | 2010-02-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 커패시터 |
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7414857B2 (en) * | 2005-10-31 | 2008-08-19 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
JP4462194B2 (ja) * | 2006-01-17 | 2010-05-12 | Tdk株式会社 | 積層型貫通コンデンサアレイ |
JP4915130B2 (ja) * | 2006-04-18 | 2012-04-11 | ソニー株式会社 | 可変コンデンサ |
JP2007317786A (ja) * | 2006-05-24 | 2007-12-06 | Tdk Corp | 積層コンデンサ |
US7667949B2 (en) * | 2006-08-05 | 2010-02-23 | John Maxwell | Capacitor having improved surface breakdown voltage performance and method for marking same |
JP4626605B2 (ja) * | 2006-11-07 | 2011-02-09 | 株式会社村田製作所 | 積層コンデンサ |
DE102006056872A1 (de) * | 2006-12-01 | 2008-06-12 | Epcos Ag | Vielschicht-Kondensator |
US20080165468A1 (en) * | 2007-01-05 | 2008-07-10 | Avx Corporation | Very low profile multilayer components |
US20080174936A1 (en) * | 2007-01-19 | 2008-07-24 | Western Lights Semiconductor Corp. | Apparatus and Method to Store Electrical Energy |
JP4358873B2 (ja) * | 2007-03-30 | 2009-11-04 | Tdk株式会社 | 積層コンデンサアレイ |
US8238116B2 (en) | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
KR100887124B1 (ko) * | 2007-08-06 | 2009-03-04 | 삼성전기주식회사 | 적층형 칩 커패시터 |
JP4501970B2 (ja) * | 2007-08-23 | 2010-07-14 | Tdk株式会社 | 積層コンデンサ |
KR100905879B1 (ko) * | 2007-09-28 | 2009-07-03 | 삼성전기주식회사 | 적층형 캐패시터 |
JP4475338B2 (ja) * | 2008-02-14 | 2010-06-09 | Tdk株式会社 | 積層コンデンサ |
JP4450084B2 (ja) * | 2008-03-14 | 2010-04-14 | Tdk株式会社 | 積層コンデンサ及び積層コンデンサの実装構造 |
JP5217584B2 (ja) * | 2008-04-07 | 2013-06-19 | 株式会社村田製作所 | 積層セラミック電子部品 |
US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
GB2466097B (en) * | 2008-08-18 | 2013-02-13 | Avx Corp | Ultra broadband capacitor |
KR100992286B1 (ko) * | 2008-10-10 | 2010-11-05 | 삼성전기주식회사 | 적층형 칩 커패시터 |
JP4905497B2 (ja) * | 2009-04-22 | 2012-03-28 | 株式会社村田製作所 | 電子部品 |
JP5532027B2 (ja) * | 2010-09-28 | 2014-06-25 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
KR20130012715A (ko) * | 2011-07-26 | 2013-02-05 | 삼성전기주식회사 | 적층형 세라믹 캐패시터 |
KR101963258B1 (ko) * | 2012-02-07 | 2019-03-28 | 삼성전기주식회사 | 어레이형 적층 세라믹 전자 부품 |
JP5573868B2 (ja) * | 2012-03-07 | 2014-08-20 | 株式会社村田製作所 | 等価回路作成方法、等価回路作成プログラム及び等価回路作成装置 |
DE102013102686A1 (de) * | 2013-03-15 | 2014-09-18 | Epcos Ag | Elektronisches Bauelement |
JP2015084399A (ja) * | 2013-10-25 | 2015-04-30 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | アレイ型積層セラミック電子部品及びその実装基板 |
US10461040B2 (en) * | 2017-06-28 | 2019-10-29 | Apple Inc. | Matched ceramic capacitor structures |
RU2020115560A (ru) * | 2017-10-23 | 2021-11-25 | ЭйВиЭкс КОРПОРЭЙШН | Многослойное электронное устройство с улучшенным соединением и способ его изготовления |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE425578B (sv) | 1981-02-26 | 1982-10-11 | Lkb Produkter Ab | Metkropp avsedd att anvendas i en mikrokalorimeter |
JPS6325716Y2 (ko) * | 1981-03-25 | 1988-07-13 | ||
US4470096A (en) * | 1982-06-18 | 1984-09-04 | Motorola Inc. | Multilayer, fully-trimmable, film-type capacitor and method of adjustment |
JPS63117416A (ja) * | 1986-11-06 | 1988-05-21 | 株式会社村田製作所 | 積層形多端子電子部品 |
JPH0635462Y2 (ja) * | 1988-08-11 | 1994-09-14 | 株式会社村田製作所 | 積層型コンデンサ |
JPH03215915A (ja) * | 1990-01-19 | 1991-09-20 | Murata Mfg Co Ltd | 積層コンデンサ |
US5815367A (en) * | 1996-03-11 | 1998-09-29 | Murata Manufacturing Co., Ltd. | Layered capacitors having an internal inductor element |
JPH09298127A (ja) * | 1996-05-09 | 1997-11-18 | Murata Mfg Co Ltd | 積層コンデンサ |
JP3102358B2 (ja) * | 1996-08-15 | 2000-10-23 | 株式会社村田製作所 | トリミングコンデンサおよびそのトリミング方法 |
US6097581A (en) * | 1997-04-08 | 2000-08-01 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
CN1179381C (zh) * | 1997-08-05 | 2004-12-08 | 皇家菲利浦电子有限公司 | 制造多个电子器件的方法 |
JP2991175B2 (ja) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
US6252177B1 (en) * | 1998-02-18 | 2001-06-26 | Compaq Computer Corporation | Low inductance capacitor mounting structure for capacitors of a printed circuit board |
JP3551763B2 (ja) | 1998-05-27 | 2004-08-11 | 株式会社村田製作所 | 積層マイクロチップコンデンサ |
JP2000021676A (ja) | 1998-07-02 | 2000-01-21 | Murata Mfg Co Ltd | ブリッジ回路用積層電子部品 |
JP2000357624A (ja) | 1999-06-16 | 2000-12-26 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
US6525628B1 (en) * | 1999-06-18 | 2003-02-25 | Avx Corporation | Surface mount RC array with narrow tab portions on each of the electrode plates |
US6327134B1 (en) * | 1999-10-18 | 2001-12-04 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor, wiring board, and high-frequency circuit |
US6441459B1 (en) * | 2000-01-28 | 2002-08-27 | Tdk Corporation | Multilayer electronic device and method for producing same |
JP3563665B2 (ja) | 2000-03-30 | 2004-09-08 | Tdk株式会社 | 積層型電子回路部品 |
US6570210B1 (en) * | 2000-06-19 | 2003-05-27 | Koninklijke Philips Electronics N.V. | Multilayer pillar array capacitor structure for deep sub-micron CMOS |
JP3930245B2 (ja) | 2000-11-14 | 2007-06-13 | Tdk株式会社 | 積層型電子部品 |
JP3727542B2 (ja) | 2001-02-05 | 2005-12-14 | Tdk株式会社 | 積層貫通型コンデンサ |
KR100544908B1 (ko) * | 2002-04-01 | 2006-01-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 세라믹 전자부품 및 그 제조방법 |
US7075774B2 (en) * | 2002-09-10 | 2006-07-11 | Tdk Corporation | Multilayer capacitor |
-
2003
- 2003-09-09 US US10/527,023 patent/US7075774B2/en not_active Expired - Lifetime
- 2003-09-09 WO PCT/JP2003/011490 patent/WO2004025673A1/ja active Application Filing
- 2003-09-09 TW TW092124843A patent/TWI291186B/zh not_active IP Right Cessation
- 2003-09-09 KR KR1020057004149A patent/KR100678496B1/ko not_active IP Right Cessation
-
2006
- 2006-03-27 HK HK06103824.0A patent/HK1084502A1/xx not_active IP Right Cessation
- 2006-05-15 US US11/433,474 patent/US7224569B2/en not_active Expired - Fee Related
- 2006-05-15 US US11/433,479 patent/US7224572B2/en not_active Expired - Fee Related
- 2006-05-15 US US11/433,358 patent/US7196897B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060203426A1 (en) | 2006-09-14 |
US7196897B2 (en) | 2007-03-27 |
US20060007634A1 (en) | 2006-01-12 |
KR100678496B1 (ko) | 2007-02-06 |
TWI291186B (en) | 2007-12-11 |
US7075774B2 (en) | 2006-07-11 |
KR20060033855A (ko) | 2006-04-20 |
US7224572B2 (en) | 2007-05-29 |
TW200414239A (en) | 2004-08-01 |
US7224569B2 (en) | 2007-05-29 |
US20060203425A1 (en) | 2006-09-14 |
US20060203427A1 (en) | 2006-09-14 |
WO2004025673A1 (ja) | 2004-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120909 |