HK1084502A1 - Multilayer capacitor - Google Patents

Multilayer capacitor

Info

Publication number
HK1084502A1
HK1084502A1 HK06103824.0A HK06103824A HK1084502A1 HK 1084502 A1 HK1084502 A1 HK 1084502A1 HK 06103824 A HK06103824 A HK 06103824A HK 1084502 A1 HK1084502 A1 HK 1084502A1
Authority
HK
Hong Kong
Prior art keywords
multilayer capacitor
multilayer
capacitor
Prior art date
Application number
HK06103824.0A
Other languages
English (en)
Inventor
Masaaki Togashi
Taisuke Ahiko
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002264821A external-priority patent/JP3824565B2/ja
Priority claimed from JP2002264822A external-priority patent/JP3847234B2/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1084502A1 publication Critical patent/HK1084502A1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
HK06103824.0A 2002-09-10 2006-03-27 Multilayer capacitor HK1084502A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002264821A JP3824565B2 (ja) 2002-09-10 2002-09-10 積層コンデンサ
JP2002264822A JP3847234B2 (ja) 2002-09-10 2002-09-10 積層コンデンサ
PCT/JP2003/011490 WO2004025673A1 (ja) 2002-09-10 2003-09-09 積層コンデンサ

Publications (1)

Publication Number Publication Date
HK1084502A1 true HK1084502A1 (en) 2006-07-28

Family

ID=31996136

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06103824.0A HK1084502A1 (en) 2002-09-10 2006-03-27 Multilayer capacitor

Country Status (5)

Country Link
US (4) US7075774B2 (ko)
KR (1) KR100678496B1 (ko)
HK (1) HK1084502A1 (ko)
TW (1) TWI291186B (ko)
WO (1) WO2004025673A1 (ko)

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* Cited by examiner, † Cited by third party
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US7075774B2 (en) * 2002-09-10 2006-07-11 Tdk Corporation Multilayer capacitor
JP2006245049A (ja) * 2005-02-28 2006-09-14 Tdk Corp 電子部品及び電子機器
KR100616687B1 (ko) * 2005-06-17 2006-08-28 삼성전기주식회사 적층형 칩 커패시터
KR100944098B1 (ko) * 2005-08-19 2010-02-24 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 커패시터
US7697262B2 (en) * 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
JP4462194B2 (ja) * 2006-01-17 2010-05-12 Tdk株式会社 積層型貫通コンデンサアレイ
JP4915130B2 (ja) * 2006-04-18 2012-04-11 ソニー株式会社 可変コンデンサ
JP2007317786A (ja) * 2006-05-24 2007-12-06 Tdk Corp 積層コンデンサ
US7667949B2 (en) * 2006-08-05 2010-02-23 John Maxwell Capacitor having improved surface breakdown voltage performance and method for marking same
JP4626605B2 (ja) * 2006-11-07 2011-02-09 株式会社村田製作所 積層コンデンサ
DE102006056872A1 (de) * 2006-12-01 2008-06-12 Epcos Ag Vielschicht-Kondensator
US20080165468A1 (en) * 2007-01-05 2008-07-10 Avx Corporation Very low profile multilayer components
US20080174936A1 (en) * 2007-01-19 2008-07-24 Western Lights Semiconductor Corp. Apparatus and Method to Store Electrical Energy
JP4358873B2 (ja) * 2007-03-30 2009-11-04 Tdk株式会社 積層コンデンサアレイ
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
KR100887124B1 (ko) * 2007-08-06 2009-03-04 삼성전기주식회사 적층형 칩 커패시터
JP4501970B2 (ja) * 2007-08-23 2010-07-14 Tdk株式会社 積層コンデンサ
KR100905879B1 (ko) * 2007-09-28 2009-07-03 삼성전기주식회사 적층형 캐패시터
JP4475338B2 (ja) * 2008-02-14 2010-06-09 Tdk株式会社 積層コンデンサ
JP4450084B2 (ja) * 2008-03-14 2010-04-14 Tdk株式会社 積層コンデンサ及び積層コンデンサの実装構造
JP5217584B2 (ja) * 2008-04-07 2013-06-19 株式会社村田製作所 積層セラミック電子部品
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
GB2466097B (en) * 2008-08-18 2013-02-13 Avx Corp Ultra broadband capacitor
KR100992286B1 (ko) * 2008-10-10 2010-11-05 삼성전기주식회사 적층형 칩 커패시터
JP4905497B2 (ja) * 2009-04-22 2012-03-28 株式会社村田製作所 電子部品
JP5532027B2 (ja) * 2010-09-28 2014-06-25 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR20130012715A (ko) * 2011-07-26 2013-02-05 삼성전기주식회사 적층형 세라믹 캐패시터
KR101963258B1 (ko) * 2012-02-07 2019-03-28 삼성전기주식회사 어레이형 적층 세라믹 전자 부품
JP5573868B2 (ja) * 2012-03-07 2014-08-20 株式会社村田製作所 等価回路作成方法、等価回路作成プログラム及び等価回路作成装置
DE102013102686A1 (de) * 2013-03-15 2014-09-18 Epcos Ag Elektronisches Bauelement
JP2015084399A (ja) * 2013-10-25 2015-04-30 サムソン エレクトロ−メカニックス カンパニーリミテッド. アレイ型積層セラミック電子部品及びその実装基板
US10461040B2 (en) * 2017-06-28 2019-10-29 Apple Inc. Matched ceramic capacitor structures
RU2020115560A (ru) * 2017-10-23 2021-11-25 ЭйВиЭкс КОРПОРЭЙШН Многослойное электронное устройство с улучшенным соединением и способ его изготовления

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US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
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US6252177B1 (en) * 1998-02-18 2001-06-26 Compaq Computer Corporation Low inductance capacitor mounting structure for capacitors of a printed circuit board
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US6570210B1 (en) * 2000-06-19 2003-05-27 Koninklijke Philips Electronics N.V. Multilayer pillar array capacitor structure for deep sub-micron CMOS
JP3930245B2 (ja) 2000-11-14 2007-06-13 Tdk株式会社 積層型電子部品
JP3727542B2 (ja) 2001-02-05 2005-12-14 Tdk株式会社 積層貫通型コンデンサ
KR100544908B1 (ko) * 2002-04-01 2006-01-24 가부시키가이샤 무라타 세이사쿠쇼 세라믹 전자부품 및 그 제조방법
US7075774B2 (en) * 2002-09-10 2006-07-11 Tdk Corporation Multilayer capacitor

Also Published As

Publication number Publication date
US20060203426A1 (en) 2006-09-14
US7196897B2 (en) 2007-03-27
US20060007634A1 (en) 2006-01-12
KR100678496B1 (ko) 2007-02-06
TWI291186B (en) 2007-12-11
US7075774B2 (en) 2006-07-11
KR20060033855A (ko) 2006-04-20
US7224572B2 (en) 2007-05-29
TW200414239A (en) 2004-08-01
US7224569B2 (en) 2007-05-29
US20060203425A1 (en) 2006-09-14
US20060203427A1 (en) 2006-09-14
WO2004025673A1 (ja) 2004-03-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120909