HK1075278A1 - Process for electroplating metallic and metal matrix composite foils - Google Patents

Process for electroplating metallic and metal matrix composite foils

Info

Publication number
HK1075278A1
HK1075278A1 HK05107489A HK05107489A HK1075278A1 HK 1075278 A1 HK1075278 A1 HK 1075278A1 HK 05107489 A HK05107489 A HK 05107489A HK 05107489 A HK05107489 A HK 05107489A HK 1075278 A1 HK1075278 A1 HK 1075278A1
Authority
HK
Hong Kong
Prior art keywords
metal matrix
matrix composite
composite foils
matrix composites
electroplating metallic
Prior art date
Application number
HK05107489A
Other languages
English (en)
Inventor
Palumbo Gino
Brooks Iain
Mccrea Jonathan
Hibbard Glenn
Gonzales Francisco
Tomantschger Klaus
Erb Uwe
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Publication of HK1075278A1 publication Critical patent/HK1075278A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
HK05107489A 2002-06-25 2005-08-25 Process for electroplating metallic and metal matrix composite foils HK1075278A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/007023 WO2004001100A1 (en) 2002-06-25 2002-06-25 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents

Publications (1)

Publication Number Publication Date
HK1075278A1 true HK1075278A1 (en) 2005-12-09

Family

ID=29762587

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05107489A HK1075278A1 (en) 2002-06-25 2005-08-25 Process for electroplating metallic and metal matrix composite foils

Country Status (16)

Country Link
EP (2) EP1826294A1 (xx)
JP (1) JP2005530926A (xx)
KR (1) KR100890819B1 (xx)
AT (1) ATE387522T1 (xx)
AU (1) AU2002321112B2 (xx)
BR (1) BR0215787B1 (xx)
CA (1) CA2490464C (xx)
DE (1) DE60225352T2 (xx)
DK (1) DK1516076T3 (xx)
ES (1) ES2301666T3 (xx)
HK (1) HK1075278A1 (xx)
IL (1) IL165904A0 (xx)
MX (1) MXPA04011940A (xx)
PT (1) PT1516076E (xx)
WO (1) WO2004001100A1 (xx)
ZA (1) ZA200410368B (xx)

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US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7354354B2 (en) 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
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US20070170068A1 (en) * 2006-01-24 2007-07-26 Usc, Llc Electrocomposite coatings for hard chrome replacement
US8202627B2 (en) * 2006-01-24 2012-06-19 Usc, Llc Electrocomposite coatings for hard chrome replacement
US7897265B2 (en) 2006-01-26 2011-03-01 Hamilton Sundstrand Corporation Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance
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US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US20070275262A1 (en) * 2006-05-23 2007-11-29 Dechao Lin Reducing formation of tin whiskers on a tin plating layer
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
US7955721B2 (en) * 2008-01-16 2011-06-07 Hamilton Sundstrand Corporation Article having cobalt-phosphorous coating and method for heat treating
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US8309233B2 (en) * 2009-06-02 2012-11-13 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on ferrous-alloy substrates
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US20130186765A1 (en) * 2012-01-23 2013-07-25 Seagate Technology Llc Electrodeposition methods
KR101491752B1 (ko) * 2012-05-04 2015-02-11 강원대학교산학협력단 연료 전지용 바이폴라 플레이트 및 그 제조방법과 이를 포함하는 연료 전지
DE102012211941B4 (de) * 2012-07-09 2021-04-22 Hilti Aktiengesellschaft Werkzeugmaschine und Herstellungsverfahren
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JP6296491B2 (ja) * 2013-03-14 2018-03-20 セイコーインスツル株式会社 金属構造体、金属構造体の製造方法、ばね部品、時計用発停レバーおよび時計
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Also Published As

Publication number Publication date
KR20050024394A (ko) 2005-03-10
EP1826294A1 (en) 2007-08-29
DK1516076T3 (da) 2008-06-23
ATE387522T1 (de) 2008-03-15
EP1516076B1 (en) 2008-02-27
PT1516076E (pt) 2008-03-11
BR0215787A (pt) 2005-03-01
DE60225352D1 (de) 2008-04-10
JP2005530926A (ja) 2005-10-13
AU2002321112A1 (en) 2004-01-06
KR100890819B1 (ko) 2009-04-06
MXPA04011940A (es) 2005-03-31
WO2004001100A1 (en) 2003-12-31
CA2490464A1 (en) 2003-12-31
ZA200410368B (en) 2006-07-26
EP1516076A1 (en) 2005-03-23
DE60225352T2 (de) 2008-06-12
BR0215787B1 (pt) 2013-12-03
AU2002321112B2 (en) 2008-07-03
ES2301666T3 (es) 2008-07-01
CA2490464C (en) 2008-09-02
IL165904A0 (en) 2006-01-15

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