JPS57171691A - Automatic brush plating method - Google Patents

Automatic brush plating method

Info

Publication number
JPS57171691A
JPS57171691A JP5613381A JP5613381A JPS57171691A JP S57171691 A JPS57171691 A JP S57171691A JP 5613381 A JP5613381 A JP 5613381A JP 5613381 A JP5613381 A JP 5613381A JP S57171691 A JPS57171691 A JP S57171691A
Authority
JP
Japan
Prior art keywords
anode
cathode
auxiliary
brush plating
impregnating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5613381A
Other languages
Japanese (ja)
Inventor
Tadashi Hoashi
Hiroshi Kurose
Kazumi Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5613381A priority Critical patent/JPS57171691A/en
Publication of JPS57171691A publication Critical patent/JPS57171691A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To stabilize the pH ion quantity of a plating liquid, and to automatically perform uniform brush plating, by making an anode press-contact with the side of a cathode by prescribed pressure, sliding it automatically, and using an auxiliary anode when replacing a solution impregnating material of the anode.
CONSTITUTION: Form an electric power source 1, a cathode and an anode are connected to a substance to be plated (cathode) 2 and an anode 3 of a brushing tool, respectively, and an auxiliary anode 4 is connected in parallel with the anode 3. As for the auxiliary anode 4, a magnet 41 is provided on the tip of a lead wire L1 so that power is supplied from the auxiliary anode 4 when replacing a solution impregnating material of the anode 3. Also, on the bottom surface of a vessel 43 of the auxiliary anode 4, a solution impregnating material 44 is provided. The anode 3 is made to contact with the cathode 3 by necessary pressure, is electrified, and is slided so as to be rubbed against it by use of a magnet or rotation of the eccentric shaft, etc. According to this method, brush plating which requires work of many hours can be performed automatically, easily and continuously.
COPYRIGHT: (C)1982,JPO&Japio
JP5613381A 1981-04-13 1981-04-13 Automatic brush plating method Pending JPS57171691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5613381A JPS57171691A (en) 1981-04-13 1981-04-13 Automatic brush plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5613381A JPS57171691A (en) 1981-04-13 1981-04-13 Automatic brush plating method

Publications (1)

Publication Number Publication Date
JPS57171691A true JPS57171691A (en) 1982-10-22

Family

ID=13018571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5613381A Pending JPS57171691A (en) 1981-04-13 1981-04-13 Automatic brush plating method

Country Status (1)

Country Link
JP (1) JPS57171691A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609894A (en) * 1983-06-29 1985-01-18 Sumitomo Metal Ind Ltd Automatic profile plating device
WO2004001100A1 (en) * 2002-06-25 2003-12-31 Integran Technologies, Inc. Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
JP2007290220A (en) * 2006-04-25 2007-11-08 Pilot Corporation Rotative delivering type writing implement
US7771289B2 (en) 2004-12-17 2010-08-10 Integran Technologies, Inc. Sports articles formed using nanostructured materials
KR101005005B1 (en) 2010-08-31 2010-12-30 한국기계연구원 Method of fabricating solar cell wafer eletrode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609894A (en) * 1983-06-29 1985-01-18 Sumitomo Metal Ind Ltd Automatic profile plating device
WO2004001100A1 (en) * 2002-06-25 2003-12-31 Integran Technologies, Inc. Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US7771289B2 (en) 2004-12-17 2010-08-10 Integran Technologies, Inc. Sports articles formed using nanostructured materials
JP2007290220A (en) * 2006-04-25 2007-11-08 Pilot Corporation Rotative delivering type writing implement
KR101005005B1 (en) 2010-08-31 2010-12-30 한국기계연구원 Method of fabricating solar cell wafer eletrode

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