HK1073531A1 - Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained - Google Patents
Method of preparation of organic optoelectronic and electronic devices and devices thereby obtainedInfo
- Publication number
- HK1073531A1 HK1073531A1 HK05105407A HK05105407A HK1073531A1 HK 1073531 A1 HK1073531 A1 HK 1073531A1 HK 05105407 A HK05105407 A HK 05105407A HK 05105407 A HK05105407 A HK 05105407A HK 1073531 A1 HK1073531 A1 HK 1073531A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- layer
- devices
- preparation
- organic
- fluorinated polymer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 238000002360 preparation method Methods 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 abstract 3
- 229920002313 fluoropolymer Polymers 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000007641 inkjet printing Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
- H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3127—Layers comprising fluoro (hydro)carbon compounds, e.g. polytetrafluoroethylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Light Receiving Elements (AREA)
- Bipolar Transistors (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0207134.8A GB0207134D0 (en) | 2002-03-27 | 2002-03-27 | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
PCT/GB2003/001214 WO2003083960A1 (en) | 2002-03-27 | 2003-03-21 | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1073531A1 true HK1073531A1 (en) | 2005-10-07 |
Family
ID=9933751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05105407A HK1073531A1 (en) | 2002-03-27 | 2005-06-28 | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
Country Status (10)
Country | Link |
---|---|
US (1) | US7326653B2 (xx) |
EP (1) | EP1490915B1 (xx) |
JP (2) | JP2005522000A (xx) |
CN (1) | CN1653628B (xx) |
AT (1) | ATE365974T1 (xx) |
AU (1) | AU2003215757A1 (xx) |
DE (1) | DE60314610T2 (xx) |
GB (1) | GB0207134D0 (xx) |
HK (1) | HK1073531A1 (xx) |
WO (1) | WO2003083960A1 (xx) |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3823981B2 (ja) * | 2003-05-12 | 2006-09-20 | セイコーエプソン株式会社 | パターンと配線パターン形成方法、デバイスとその製造方法、電気光学装置、電子機器及びアクティブマトリクス基板の製造方法 |
JP4344270B2 (ja) * | 2003-05-30 | 2009-10-14 | セイコーエプソン株式会社 | 液晶表示装置の製造方法 |
DE10340643B4 (de) * | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
JP2007508674A (ja) * | 2003-10-13 | 2007-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | エレクトロルミネッセントディスプレイパネル |
JP2005123083A (ja) * | 2003-10-17 | 2005-05-12 | Dainippon Screen Mfg Co Ltd | 塗布組成物および有機el素子の製造方法 |
US7226819B2 (en) * | 2003-10-28 | 2007-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Methods for forming wiring and manufacturing thin film transistor and droplet discharging method |
JP3915806B2 (ja) | 2003-11-11 | 2007-05-16 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP4556566B2 (ja) * | 2003-11-11 | 2010-10-06 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
KR100993826B1 (ko) * | 2003-11-19 | 2010-11-12 | 삼성전자주식회사 | 표시장치 및 이의 제조 방법 |
JP4583776B2 (ja) * | 2004-02-13 | 2010-11-17 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP2006012786A (ja) | 2004-06-22 | 2006-01-12 | Samsung Sdi Co Ltd | 有機電界発光素子、並びに該製造方法 |
US20050282308A1 (en) * | 2004-06-22 | 2005-12-22 | Albrecht Uhlig | Organic electroluminescent display device and method of producing the same |
DE102004031071B4 (de) * | 2004-06-22 | 2008-04-30 | Samsung SDI Co., Ltd., Suwon | Verfahren zur Behandlung einer organischen Leuchtdiode (OLED) zur Verlängerung der Lebensdauer |
JP2006024695A (ja) * | 2004-07-07 | 2006-01-26 | Nec Lcd Technologies Ltd | ナノ粒子インクを用いた配線形成方法 |
DE102004036734A1 (de) | 2004-07-29 | 2006-03-23 | Konarka Technologies, Inc., Lowell | Kostengünstige organische Solarzelle und Verfahren zur Herstellung |
DE112005001923T5 (de) * | 2004-08-10 | 2007-09-27 | Cambridge Display Technology Ltd. | Lichtemissionsvorrichtung |
KR101186966B1 (ko) * | 2004-11-09 | 2012-10-02 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 유기 트랜지스터를 제조하기 위한 자체-정렬 공정 |
GB0510382D0 (en) | 2005-05-20 | 2005-06-29 | Cambridge Display Tech Ltd | Ink jet printing compositions in opto-electrical devices |
EP1892257A4 (en) * | 2005-06-10 | 2012-02-15 | Sumitomo Chemical Co | AROMATIC POULTRY POLYMER |
EP1891690A1 (de) * | 2005-06-16 | 2008-02-27 | Siemens Aktiengesellschaft | Organischer zeilendetektor und verfahren zu seiner herstellung |
JP2007027589A (ja) * | 2005-07-20 | 2007-02-01 | Seiko Epson Corp | 膜パターンの形成方法、デバイス、電気光学装置、及び電子機器 |
KR101209046B1 (ko) | 2005-07-27 | 2012-12-06 | 삼성디스플레이 주식회사 | 박막트랜지스터 기판과 박막트랜지스터 기판의 제조방법 |
JP4506605B2 (ja) * | 2005-07-28 | 2010-07-21 | ソニー株式会社 | 半導体装置の製造方法 |
DE102005037289A1 (de) * | 2005-08-08 | 2007-02-22 | Siemens Ag | Fotodetektor, Röntgenstrahlenflachbilddetektor und Verfahren zur Herstellung dergleichen |
DE112006002220B4 (de) | 2005-08-23 | 2018-05-24 | Cambridge Display Technology Ltd. | Organische elektronische Vorrichtungsstrukturen und Herstellungsverfahren |
GB0517195D0 (en) | 2005-08-23 | 2005-09-28 | Cambridge Display Tech Ltd | Molecular electronic device structures and fabrication methods |
US20070048894A1 (en) * | 2005-08-26 | 2007-03-01 | Osram Opto Semiconductors Gmbh | System and method for reduced material pileup |
JP4872288B2 (ja) * | 2005-09-22 | 2012-02-08 | 凸版印刷株式会社 | 有機el素子及びその製造方法 |
GB2432256B (en) | 2005-11-14 | 2009-12-23 | Cambridge Display Tech Ltd | Organic optoelectrical device |
JP4706845B2 (ja) * | 2006-02-15 | 2011-06-22 | 凸版印刷株式会社 | 有機el素子の製造方法 |
US8124172B2 (en) * | 2006-03-02 | 2012-02-28 | E.I. Du Pont De Nemours And Company | Process for making contained layers and devices made with same |
TWI336953B (en) * | 2006-03-29 | 2011-02-01 | Pioneer Corp | Organic electroluminescent display panel and manufacturing method thereof |
TW200739982A (en) * | 2006-04-06 | 2007-10-16 | Nat Univ Chung Cheng | Method for manufacturing full-color organic light-emitting diode array based on microcontact printing technology |
GB2437113B (en) | 2006-04-12 | 2008-11-26 | Cambridge Display Tech Ltd | Light-emissive display and method of manufacturing the same |
JP4742977B2 (ja) * | 2006-05-12 | 2011-08-10 | 凸版印刷株式会社 | 有機elディスプレイパネルの製造方法 |
WO2007145977A1 (en) * | 2006-06-05 | 2007-12-21 | E. I. Du Pont De Nemours And Company | Process for making an organic electronic device |
DE102006026981A1 (de) * | 2006-06-10 | 2007-12-13 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer strukturierten Schicht auf einem Trägersubstrat |
DE102006027292B4 (de) * | 2006-06-13 | 2010-06-17 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer strukturierten Schichtfolge auf einem Substrat |
JP4222390B2 (ja) * | 2006-07-25 | 2009-02-12 | セイコーエプソン株式会社 | パターンの形成方法、及び液晶表示装置の製造方法 |
US8084767B2 (en) | 2006-08-01 | 2011-12-27 | Cambridge Display Technology Limited | Opto-electrical devices and methods of manufacturing the same |
JP2008041960A (ja) * | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
GB0618698D0 (en) | 2006-09-22 | 2006-11-01 | Cambridge Display Tech Ltd | Molecular electronic device fabrication methods and structures |
US20080145697A1 (en) * | 2006-12-13 | 2008-06-19 | General Electric Company | Opto-electronic devices containing sulfonated light-emitting copolymers |
CN101361192B (zh) * | 2006-12-18 | 2010-06-02 | 松下电器产业株式会社 | 半导体设备 |
WO2008129819A1 (ja) * | 2007-04-13 | 2008-10-30 | Nikon Corporation | 表示素子の製造方法、表示素子の製造装置、及び表示素子 |
WO2008149498A1 (ja) * | 2007-05-31 | 2008-12-11 | Panasonic Corporation | 有機el素子、およびその製造方法 |
WO2009055628A1 (en) * | 2007-10-26 | 2009-04-30 | E. I. Du Pont De Nemours And Company | Process and materials for making contained layers and devices made with same |
GB2455747B (en) * | 2007-12-19 | 2011-02-09 | Cambridge Display Tech Ltd | Electronic devices and methods of making the same using solution processing techniques |
GB0724774D0 (en) * | 2007-12-19 | 2008-01-30 | Cambridge Display Tech Ltd | Organic thin film transistors, active matrix organic optical devices and methods of making the same |
US7888867B2 (en) * | 2007-12-28 | 2011-02-15 | Panasonic Corporation | Organic el device having bank with groove, organic el display panel, and method for manufacturing the organic el device |
US20090226139A1 (en) * | 2008-01-31 | 2009-09-10 | Coretek Opto Corp. | Optoelectronic component and optical subassembly for optical communication |
GB0803950D0 (en) | 2008-03-03 | 2008-04-09 | Cambridge Display Technology O | Solvent for printing composition |
GB2458454B (en) * | 2008-03-14 | 2011-03-16 | Cambridge Display Tech Ltd | Electronic devices and methods of making the same using solution processing techniques |
GB2462410B (en) | 2008-07-21 | 2011-04-27 | Cambridge Display Tech Ltd | Compositions and methods for manufacturing light-emissive devices |
GB0814971D0 (en) | 2008-08-15 | 2008-09-24 | Cambridge Display Tech Ltd | Opto-electrical devices and methods of manufacturing the same |
GB2462688B (en) | 2008-08-22 | 2012-03-07 | Cambridge Display Tech Ltd | Opto-electrical devices and methods of manufacturing the same |
US7999175B2 (en) | 2008-09-09 | 2011-08-16 | Palo Alto Research Center Incorporated | Interdigitated back contact silicon solar cells with laser ablated grooves |
US9150966B2 (en) * | 2008-11-14 | 2015-10-06 | Palo Alto Research Center Incorporated | Solar cell metallization using inline electroless plating |
GB2466842B (en) | 2009-01-12 | 2011-10-26 | Cambridge Display Tech Ltd | Interlayer formulation for flat films |
GB2466843A (en) | 2009-01-12 | 2010-07-14 | Cambridge Display Tech Ltd | Interlayer formulation for flat films |
JP5727478B2 (ja) * | 2009-07-27 | 2015-06-03 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 閉じ込め層を製作するための方法および物質ならびにそれによって製作されるデバイス |
KR101108162B1 (ko) * | 2010-01-11 | 2012-01-31 | 서울대학교산학협력단 | 고해상도 유기 박막 패턴 형성 방법 |
WO2011139771A2 (en) * | 2010-04-27 | 2011-11-10 | Orthogonal Inc. | Method for forming a multicolor oled device |
US8962424B2 (en) | 2011-03-03 | 2015-02-24 | Palo Alto Research Center Incorporated | N-type silicon solar cell with contact/protection structures |
FR2988517B1 (fr) * | 2012-03-22 | 2014-04-11 | Commissariat Energie Atomique | Procede de fabrication de plots d'assemblage sur un support pour l'auto-assemblage d'une puce de circuit integre sur le support |
US20130248822A1 (en) * | 2012-03-23 | 2013-09-26 | Xiong Gong | Broadband Polymer Photodetectors Using Zinc Oxide Nanowire as an Electron-Transporting Layer |
CN103066004B (zh) * | 2012-11-20 | 2016-02-17 | 京东方科技集团股份有限公司 | 一种表面处理方法 |
US9614191B2 (en) | 2013-01-17 | 2017-04-04 | Kateeva, Inc. | High resolution organic light-emitting diode devices, displays, and related methods |
US9444050B2 (en) * | 2013-01-17 | 2016-09-13 | Kateeva, Inc. | High resolution organic light-emitting diode devices, displays, and related method |
EP2784839B1 (en) | 2013-03-26 | 2017-10-25 | Novaled GmbH | Method of manufacturing an organic field effect transistor |
US9298088B2 (en) | 2013-07-24 | 2016-03-29 | Orthogonal, Inc. | Fluorinated photopolymer with fluorinated sensitizer |
US9541829B2 (en) | 2013-07-24 | 2017-01-10 | Orthogonal, Inc. | Cross-linkable fluorinated photopolymer |
CN106662808A (zh) | 2014-02-07 | 2017-05-10 | 正交公司 | 可交联的氟化光聚合物 |
US9328418B2 (en) * | 2014-09-16 | 2016-05-03 | Eastman Kodak Company | Method of forming a patterned polymer layer |
WO2016085902A1 (en) * | 2014-11-25 | 2016-06-02 | E. I. Du Pont De Nemours And Company | Low surface energy photoresist composition and process |
CN104716275A (zh) * | 2015-03-20 | 2015-06-17 | 京东方科技集团股份有限公司 | 电子器件的封装方法和封装系统 |
KR20180017163A (ko) | 2015-06-12 | 2018-02-20 | 메르크 파텐트 게엠베하 | 플루오로폴리머 뱅크 구조들을 갖는 유기 전자 디바이스들 |
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JP6928764B2 (ja) * | 2016-01-28 | 2021-09-01 | 東京エレクトロン株式会社 | 金属酸化物のスピンオン堆積の方法 |
CN109564984B (zh) | 2016-08-17 | 2022-07-05 | 默克专利有限公司 | 具有岸结构的电子器件 |
JP6923163B2 (ja) * | 2016-12-14 | 2021-08-18 | 国立大学法人山形大学 | 組成物および有機光電子素子並びにその製造方法 |
CN109786552B (zh) * | 2019-01-22 | 2020-10-16 | 合肥京东方光电科技有限公司 | 有机薄膜及其制作方法、显示装置和光学器件 |
CN110828521B (zh) * | 2019-11-18 | 2023-06-02 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板及显示装置 |
CN111224020A (zh) * | 2020-01-14 | 2020-06-02 | 吉林建筑大学 | 一种基于喷墨融合的薄膜电极材料沉积方法 |
CN113314509B (zh) * | 2020-02-27 | 2022-11-08 | 群创光电股份有限公司 | 发光装置 |
CN113054058B (zh) * | 2021-03-16 | 2023-07-25 | 哈尔滨工业大学 | 一种柔性疏水基衬底上图案化刻蚀pedot:pss透明电极的紫外光刻方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4539507A (en) | 1983-03-25 | 1985-09-03 | Eastman Kodak Company | Organic electroluminescent devices having improved power conversion efficiencies |
GB8909011D0 (en) | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
GB9423692D0 (en) | 1994-11-23 | 1995-01-11 | Philips Electronics Uk Ltd | A photoresponsive device |
DE69739955D1 (de) | 1996-02-26 | 2010-09-16 | Idemitsu Kosan Co | Organische elektrolumineszente Vorrichtung und Verfahren zu ihrer Herstellung |
GB9609282D0 (en) | 1996-05-03 | 1996-07-10 | Cambridge Display Tech Ltd | Protective thin oxide layer |
DE69710781T2 (de) | 1996-07-29 | 2002-10-31 | Cambridge Display Tech Ltd | Elektrolumineszierende anordnungen mit elektrodenschutz |
GB9623185D0 (en) | 1996-11-09 | 1997-01-08 | Epigem Limited | Improved micro relief element and preparation thereof |
JP3899566B2 (ja) | 1996-11-25 | 2007-03-28 | セイコーエプソン株式会社 | 有機el表示装置の製造方法 |
US5904154A (en) * | 1997-07-24 | 1999-05-18 | Vanguard International Semiconductor Corporation | Method for removing fluorinated photoresist layers from semiconductor substrates |
GB9718393D0 (en) | 1997-08-29 | 1997-11-05 | Cambridge Display Tech Ltd | Electroluminescent Device |
JP3633229B2 (ja) | 1997-09-01 | 2005-03-30 | セイコーエプソン株式会社 | 発光素子の製造方法および多色表示装置の製造方法 |
CN100530758C (zh) | 1998-03-17 | 2009-08-19 | 精工爱普生株式会社 | 薄膜构图的衬底及其表面处理 |
GB2335884A (en) | 1998-04-02 | 1999-10-06 | Cambridge Display Tech Ltd | Flexible substrates for electronic or optoelectronic devices |
US6080031A (en) | 1998-09-02 | 2000-06-27 | Motorola, Inc. | Methods of encapsulating electroluminescent apparatus |
US6960877B1 (en) | 1998-12-17 | 2005-11-01 | Cambrdige Display Technology Limited | Organic light-emitting devices including specific barrier layers |
AU4678100A (en) | 1999-05-04 | 2000-11-17 | E.I. Du Pont De Nemours And Company | Fluorinated polymers, photoresists and processes for microlithography |
NO311797B1 (no) | 1999-05-12 | 2002-01-28 | Thin Film Electronics Asa | Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene |
US6878297B1 (en) | 1999-06-09 | 2005-04-12 | Cambridge Display Technology, Limited | Method of producing organic light-emissive devices |
GB9920543D0 (en) | 1999-08-31 | 1999-11-03 | Cambridge Display Tech Ltd | A formulation for depositing a light-emitting polymer layer |
EP1243033B1 (en) * | 1999-12-21 | 2019-12-04 | Flexenable Limited | Solution processing |
BR0016660A (pt) | 1999-12-21 | 2003-02-25 | Plastic Logic Ltd | Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória |
US6633121B2 (en) | 2000-01-31 | 2003-10-14 | Idemitsu Kosan Co., Ltd. | Organic electroluminescence display device and method of manufacturing same |
JP2001284047A (ja) * | 2000-04-03 | 2001-10-12 | Sharp Corp | 有機エレクトロルミネッセンス表示装置の製造方法 |
JP2001326069A (ja) | 2000-05-15 | 2001-11-22 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
US7148148B2 (en) | 2001-12-06 | 2006-12-12 | Seiko Epson Corporation | Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method |
JP2003283103A (ja) | 2002-03-22 | 2003-10-03 | Seiko Epson Corp | パターン形成方法および装置並びにデバイスの製造方法およびデバイス |
GB0215309D0 (en) * | 2002-07-03 | 2002-08-14 | Cambridge Display Tech Ltd | Combined information display and information input device |
US7217496B2 (en) * | 2004-11-12 | 2007-05-15 | International Business Machines Corporation | Fluorinated photoresist materials with improved etch resistant properties |
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2002
- 2002-03-27 GB GBGB0207134.8A patent/GB0207134D0/en not_active Ceased
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2003
- 2003-03-21 DE DE60314610T patent/DE60314610T2/de not_active Expired - Lifetime
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- 2003-03-21 AU AU2003215757A patent/AU2003215757A1/en not_active Abandoned
- 2003-03-21 EP EP03745325A patent/EP1490915B1/en not_active Expired - Lifetime
- 2003-03-21 CN CN038106663A patent/CN1653628B/zh not_active Expired - Fee Related
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- 2003-03-21 US US10/509,311 patent/US7326653B2/en not_active Expired - Lifetime
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EP1490915B1 (en) | 2007-06-27 |
CN1653628B (zh) | 2010-10-13 |
DE60314610D1 (de) | 2007-08-09 |
DE60314610T2 (de) | 2008-03-06 |
GB0207134D0 (en) | 2002-05-08 |
EP1490915A1 (en) | 2004-12-29 |
WO2003083960A1 (en) | 2003-10-09 |
CN1653628A (zh) | 2005-08-10 |
AU2003215757A1 (en) | 2003-10-13 |
ATE365974T1 (de) | 2007-07-15 |
US20050196969A1 (en) | 2005-09-08 |
JP2005522000A (ja) | 2005-07-21 |
US7326653B2 (en) | 2008-02-05 |
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