WO2008118340A3 - Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp - Google Patents

Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp Download PDF

Info

Publication number
WO2008118340A3
WO2008118340A3 PCT/US2008/003684 US2008003684W WO2008118340A3 WO 2008118340 A3 WO2008118340 A3 WO 2008118340A3 US 2008003684 W US2008003684 W US 2008003684W WO 2008118340 A3 WO2008118340 A3 WO 2008118340A3
Authority
WO
WIPO (PCT)
Prior art keywords
functional material
stamp
pattern
raised surface
substrate
Prior art date
Application number
PCT/US2008/003684
Other languages
French (fr)
Other versions
WO2008118340A2 (en
Inventor
Graciela Beatriz Blanchet
Hee Hyun Lee
Gary Delmar Jaycox
Original Assignee
Du Pont
Graciela Beatriz Blanchet
Hee Hyun Lee
Gary Delmar Jaycox
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, Graciela Beatriz Blanchet, Hee Hyun Lee, Gary Delmar Jaycox filed Critical Du Pont
Priority to EP08727034A priority Critical patent/EP2126630A2/en
Priority to JP2009554579A priority patent/JP2010525961A/en
Priority to CN200880007421XA priority patent/CN101627337B/en
Publication of WO2008118340A2 publication Critical patent/WO2008118340A2/en
Publication of WO2008118340A3 publication Critical patent/WO2008118340A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/16—Two dimensionally sectional layer

Abstract

The invention provides a method to form a pattern of functional material on a substrate. The method uses an elastomeric stamp having a relief structure with a raised surface and having a modulus of elasticity of at least 10 MegaPascal. At least the raised surface of the stamp is treated by exposing the stamp to heat, radiation, electrons, a stream of charged gas, chemical fluids, chemical vapors, and combinations thereof, to enhance wettability of the surface. A composition of the functional material and a liquid is applied to the relief structure and the liquid is removed to form a film on the raised surface. The elastomeric stamp transfers the functional material from the raised surface to the substrate to form a pattern of the functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
PCT/US2008/003684 2007-03-22 2008-03-20 Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp WO2008118340A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08727034A EP2126630A2 (en) 2007-03-22 2008-03-20 Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp
JP2009554579A JP2010525961A (en) 2007-03-22 2008-03-20 Method of forming a pattern of functional material on a substrate by treating the surface of the stamp
CN200880007421XA CN101627337B (en) 2007-03-22 2008-03-20 Method to form a pattern of functional material on a substrate by treating a surface of a stamp

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/726,771 US20080233280A1 (en) 2007-03-22 2007-03-22 Method to form a pattern of functional material on a substrate by treating a surface of a stamp
US11/726,771 2007-03-22

Publications (2)

Publication Number Publication Date
WO2008118340A2 WO2008118340A2 (en) 2008-10-02
WO2008118340A3 true WO2008118340A3 (en) 2009-03-19

Family

ID=39529378

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/003684 WO2008118340A2 (en) 2007-03-22 2008-03-20 Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp

Country Status (6)

Country Link
US (1) US20080233280A1 (en)
EP (1) EP2126630A2 (en)
JP (1) JP2010525961A (en)
KR (1) KR20100015410A (en)
CN (1) CN101627337B (en)
WO (1) WO2008118340A2 (en)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101468960B1 (en) * 2008-07-16 2014-12-04 삼성전자주식회사 Fabrication mehtod of lithography mask and formation method of fine pattern using the same
US9082673B2 (en) 2009-10-05 2015-07-14 Zena Technologies, Inc. Passivated upstanding nanostructures and methods of making the same
US8835831B2 (en) 2010-06-22 2014-09-16 Zena Technologies, Inc. Polarized light detecting device and fabrication methods of the same
US9515218B2 (en) 2008-09-04 2016-12-06 Zena Technologies, Inc. Vertical pillar structured photovoltaic devices with mirrors and optical claddings
US8791470B2 (en) 2009-10-05 2014-07-29 Zena Technologies, Inc. Nano structured LEDs
US8299472B2 (en) 2009-12-08 2012-10-30 Young-June Yu Active pixel sensor with nanowire structured photodetectors
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
US9299866B2 (en) 2010-12-30 2016-03-29 Zena Technologies, Inc. Nanowire array based solar energy harvesting device
US9000353B2 (en) 2010-06-22 2015-04-07 President And Fellows Of Harvard College Light absorption and filtering properties of vertically oriented semiconductor nano wires
US8384007B2 (en) 2009-10-07 2013-02-26 Zena Technologies, Inc. Nano wire based passive pixel image sensor
US8274039B2 (en) * 2008-11-13 2012-09-25 Zena Technologies, Inc. Vertical waveguides with various functionality on integrated circuits
US8748799B2 (en) 2010-12-14 2014-06-10 Zena Technologies, Inc. Full color single pixel including doublet or quadruplet si nanowires for image sensors
US8889455B2 (en) 2009-12-08 2014-11-18 Zena Technologies, Inc. Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor
US8519379B2 (en) * 2009-12-08 2013-08-27 Zena Technologies, Inc. Nanowire structured photodiode with a surrounding epitaxially grown P or N layer
US8546742B2 (en) 2009-06-04 2013-10-01 Zena Technologies, Inc. Array of nanowires in a single cavity with anti-reflective coating on substrate
US8866065B2 (en) 2010-12-13 2014-10-21 Zena Technologies, Inc. Nanowire arrays comprising fluorescent nanowires
US8269985B2 (en) 2009-05-26 2012-09-18 Zena Technologies, Inc. Determination of optimal diameters for nanowires
US9406709B2 (en) 2010-06-22 2016-08-02 President And Fellows Of Harvard College Methods for fabricating and using nanowires
US9343490B2 (en) 2013-08-09 2016-05-17 Zena Technologies, Inc. Nanowire structured color filter arrays and fabrication method of the same
US8890271B2 (en) 2010-06-30 2014-11-18 Zena Technologies, Inc. Silicon nitride light pipes for image sensors
US9478685B2 (en) 2014-06-23 2016-10-25 Zena Technologies, Inc. Vertical pillar structured infrared detector and fabrication method for the same
US8507840B2 (en) 2010-12-21 2013-08-13 Zena Technologies, Inc. Vertically structured passive pixel arrays and methods for fabricating the same
US8229255B2 (en) 2008-09-04 2012-07-24 Zena Technologies, Inc. Optical waveguides in image sensors
US8124193B2 (en) * 2009-03-09 2012-02-28 Xerox Corporation Gloss control of UV curable formulations through micro-patterning
US8257826B1 (en) 2009-04-08 2012-09-04 Lockheed Martin Corporation Nanoporous coating synthesis and apparatus
TWI452011B (en) * 2010-01-20 2014-09-11 Hon Hai Prec Ind Co Ltd Method of manufacturing carbon nano tubes device
JP5916086B2 (en) * 2010-01-31 2016-05-11 国立大学法人九州大学 Plasma oxidation-reduction method, animal and plant growth promotion method using the same, and plasma generation apparatus used for animal and plant growth promotion method
JP5775683B2 (en) * 2010-11-10 2015-09-09 セーレン株式会社 Conductive metal pattern forming method and electronic / electrical device
CN102093583B (en) * 2010-12-02 2012-09-26 西北工业大学 Irreversible bonding method using polydimethylsiloxane as substrate material
KR101321104B1 (en) * 2010-12-22 2013-10-23 한국기계연구원 Method of producing stamp for nano-imprint
FR2973391B1 (en) * 2011-03-30 2013-05-03 Centre Nat Rech Scient METHOD FOR FORMING PATTERNS OF OBJECTS ON THE SURFACE OF A SUBSTRATE
JP2012221858A (en) * 2011-04-12 2012-11-12 Chiyoda Gravure Corp Exothermal resin substrate and production method therefor
FR2985601B1 (en) * 2012-01-06 2016-06-03 Soitec Silicon On Insulator METHOD FOR MANUFACTURING SUBSTRATE AND SEMICONDUCTOR STRUCTURE
CN102800379B (en) * 2012-07-31 2014-05-07 江苏科技大学 Silver conductive composition without screen printing and used for line manufacturing
JP6012098B2 (en) * 2012-08-06 2016-10-25 株式会社光金属工業所 Resin product and method for producing resin product
US9346239B2 (en) 2012-09-26 2016-05-24 Eastman Kodak Company Method for providing patterns of functional materials
US9321239B2 (en) 2012-09-26 2016-04-26 Eastman Kodak Company Direct laser-engraveable patternable elements and uses
US9205638B2 (en) 2013-02-05 2015-12-08 Eastman Kodak Company Method of forming printed patterns
JP6115953B2 (en) * 2013-07-02 2017-04-19 国立研究開発法人産業技術総合研究所 Method for producing a structure having a large number of nano metal bodies transferred on the surface
SG11201602772VA (en) * 2013-10-11 2016-05-30 3M Innovative Properties Co Plasma treatment of flexographic printing surface
CN110764366A (en) * 2013-11-29 2020-02-07 Ev 集团 E·索尔纳有限责任公司 Stamp having stamp structure and method of manufacturing the same
CN114089597A (en) * 2013-12-19 2022-02-25 Illumina公司 Substrate comprising a nanopatterned surface and method for the production thereof
US9398698B2 (en) 2013-12-19 2016-07-19 Eastman Kodak Company Forming patterns of electrically conductive materials
US9096051B1 (en) 2014-01-23 2015-08-04 Eastman Kodak Company Forming printed patterns of multiple print materials
WO2015119616A1 (en) 2014-02-07 2015-08-13 Eastman Kodak Company Photopolymerizable compositions for electroless plating methods
US9188861B2 (en) 2014-03-05 2015-11-17 Eastman Kodak Company Photopolymerizable compositions for electroless plating methods
US20150352828A1 (en) 2014-06-09 2015-12-10 Gregory L. Zwadlo Reducing print line width on flexo plates
RU2701780C2 (en) * 2014-09-22 2019-10-01 Конинклейке Филипс Н.В. Transfer method, as well as device and computer program product for implementation thereof
US10174425B2 (en) 2015-09-22 2019-01-08 Eastman Kodak Company Non-aqueous compositions and articles using stannous alkoxides
EP3497106B1 (en) 2016-08-09 2020-05-13 Eastman Kodak Company Silver ion carboxylate primary alkylamine complexes
WO2018031235A1 (en) 2016-08-09 2018-02-15 Eastman Kodak Company Silver ion carboxylate n-heteroaromatic complexes and uses
JP6875811B2 (en) * 2016-09-16 2021-05-26 株式会社Ｓｃｒｅｅｎホールディングス Pattern collapse recovery method, board processing method and board processing equipment
EP3548498B1 (en) 2016-11-29 2021-04-21 Eastman Kodak Company Silver ion alpha-oxy carboxylate-oxime complexes for photolithographic processes to generate electrically conducting metallic structures
WO2018169672A1 (en) 2017-03-13 2018-09-20 Eastman Kodak Company Silver-containing compositions containing cellulosic polymers and uses
KR102385096B1 (en) 2017-03-27 2022-04-12 주식회사 다이셀 Manufacturing method of resin molded article and manufacturing method of optical part
US10334739B1 (en) 2018-03-15 2019-06-25 Eastman Kodak Company Printing an electrical device using flexographic plate with protective features
WO2020036173A1 (en) * 2018-08-14 2020-02-20 Ｓｃｉｖａｘ株式会社 Microstructure manufacturing method
EP3904580A4 (en) * 2018-12-26 2022-10-05 Kuraray Co., Ltd. Patterned fiber substrate
CN110136889B (en) * 2019-05-23 2020-08-04 北京印刷学院 Preparation method of three-dimensional stretchable conductor
CN110211729B (en) * 2019-06-24 2021-02-26 南京邮电大学 Multi-layer coaxial structure micro-cable and preparation method thereof
CN114206573A (en) * 2019-08-13 2022-03-18 美国陶氏有机硅公司 Method of making an elastomeric article
KR102389523B1 (en) * 2020-06-11 2022-04-25 한국기계연구원 Hydrophilic fine-pattern stamp and manufacturing method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998010334A1 (en) * 1996-09-04 1998-03-12 Kimberly-Clark Worldwide, Inc. Method of contact printing on metal alloy-coated polymer films
JPH11145314A (en) * 1997-11-10 1999-05-28 Rohm Co Ltd Marking method to electronic unit
US20020084252A1 (en) * 2000-12-28 2002-07-04 Buchwalter Stephen L. Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
US20020172895A1 (en) * 2001-05-16 2002-11-21 Breen Tricial L. Vapor phase surface modification of composite substrates to form a molecularly thin release layer
WO2003023082A2 (en) * 2001-09-10 2003-03-20 Surface Logix, Inc. System and process for automated microcontact printing
WO2008042079A2 (en) * 2006-09-28 2008-04-10 E. I. Du Pont De Nemours And Company Method to form a pattern of functional material on a substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2549474A1 (en) * 1975-11-05 1977-05-12 Dynamit Nobel Ag METHOD FOR MANUFACTURING LAMINATED SAFETY GLASS
US5260163A (en) * 1992-05-07 1993-11-09 E. I. Du Pont De Nemours And Company Photoenhanced diffusion patterning for organic polymer films
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6887332B1 (en) * 2000-04-21 2005-05-03 International Business Machines Corporation Patterning solution deposited thin films with self-assembled monolayers
US7060774B2 (en) * 2002-02-28 2006-06-13 Merck Patent Gesellschaft Prepolymer material, polymer material, imprinting process and their use
US6911385B1 (en) * 2002-08-22 2005-06-28 Kovio, Inc. Interface layer for the fabrication of electronic devices
GB0323903D0 (en) * 2003-10-11 2003-11-12 Koninkl Philips Electronics Nv Elastomeric stamp,patterning method using such a stamp and method for producing such a stamp
KR100631017B1 (en) * 2004-04-30 2006-10-04 엘지.필립스 엘시디 주식회사 A method for forming pattern using printing method
US20060021533A1 (en) * 2004-07-30 2006-02-02 Jeans Albert H Imprint stamp
US20080000373A1 (en) * 2006-06-30 2008-01-03 Maria Petrucci-Samija Printing form precursor and process for preparing a stamp from the precursor
CN100397107C (en) * 2006-09-13 2008-06-25 友达光电股份有限公司 Method for fabricating color filter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998010334A1 (en) * 1996-09-04 1998-03-12 Kimberly-Clark Worldwide, Inc. Method of contact printing on metal alloy-coated polymer films
JPH11145314A (en) * 1997-11-10 1999-05-28 Rohm Co Ltd Marking method to electronic unit
US20020084252A1 (en) * 2000-12-28 2002-07-04 Buchwalter Stephen L. Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
US20020172895A1 (en) * 2001-05-16 2002-11-21 Breen Tricial L. Vapor phase surface modification of composite substrates to form a molecularly thin release layer
WO2003023082A2 (en) * 2001-09-10 2003-03-20 Surface Logix, Inc. System and process for automated microcontact printing
WO2008042079A2 (en) * 2006-09-28 2008-04-10 E. I. Du Pont De Nemours And Company Method to form a pattern of functional material on a substrate

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
CHANG J C ET AL: "A modified microstamping technique enhances polylysine transfer and neuronal cell patterning", BIOMATERIALS, ELSEVIER SCIENCE PUBLISHERS BV., BARKING, GB, vol. 24, no. 17, 1 August 2003 (2003-08-01), pages 2863 - 2870, XP004424099, ISSN: 0142-9612 *
SCHMALENBERG K E ET AL: "Microcontact printing of proteins on oxygen plasma-activated poly(methyl methacrylate)", BIOMATERIALS, ELSEVIER SCIENCE PUBLISHERS BV., BARKING, GB, vol. 25, no. 10, 1 May 2004 (2004-05-01), pages 1851 - 1857, XP004485100, ISSN: 0142-9612 *
SCHMID H ET AL: "Siloxane polymers for high-resolution, high-accuracy soft lithography", MACROMOLECULES, ACS, WASHINGTON, DC, US, vol. 33, no. 8, 25 March 2000 (2000-03-25), pages 3042 - 3049, XP002385970, ISSN: 0024-9297 *
See also references of EP2126630A2 *
TSENG F-G ET AL: "Protein micro arrays immobilized by mu-stamps and -protein wells on PhastGel<(>R) pad", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 83, no. 1-3, 15 March 2002 (2002-03-15), pages 22 - 29, XP004344480, ISSN: 0925-4005 *

Also Published As

Publication number Publication date
KR20100015410A (en) 2010-02-12
WO2008118340A2 (en) 2008-10-02
CN101627337B (en) 2012-09-05
JP2010525961A (en) 2010-07-29
EP2126630A2 (en) 2009-12-02
US20080233280A1 (en) 2008-09-25
CN101627337A (en) 2010-01-13

Similar Documents

Publication Publication Date Title
WO2008118340A3 (en) Method to form a pattern of functional material on a substrate including the treatment of a surface of a stamp
WO2008042079A3 (en) Method to form a pattern of functional material on a substrate
JP5796449B2 (en) Manufacturing method of electronic device, manufacturing method of carrier substrate with resin layer
TW200736852A (en) Resist composition, method for forming resist pattern, and semiconductor device and method for manufacturing the same
GB0207134D0 (en) Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained
WO2008078516A1 (en) Apparatus for manufacturing silicon oxide thin film and method for forming the silicon oxide thin film
TW200618699A (en) Thin-film pattern forming method, semiconductor device, electro-optic device, and electronic apparatus
WO2009001935A1 (en) Method for forming thin film, method for manufacturing organic electroluminescent device, method for manufacturing semiconductor device, and method for manufacturing optical device
KR20070105040A (en) Resist composition, method of fabricating resist pattern using the same and array substrate fabricated using the same
TWI263676B (en) Compositions for chemically treating a substrate using foam technology
TW200746441A (en) Manufacturing method of thin film transistor and thin film transistor, and display
WO2010064185A3 (en) Electronic devices having plastic substrates
WO2011090262A3 (en) Lithography method using tilted evaporation
TW201129667A (en) Fabricating method of film adhesive, adhesive sheet, semiconductor device and fabricating method thereof
JP2005311325A5 (en)
WO2004088728A3 (en) Method of manufacturing a flexible electronic device and flexible device
BRPI0514490A (en) process for coating a substrate at atmospheric pressure, and process for coating a substrate at atmospheric pressure
EP1806794A3 (en) Method for manufacturing semiconductor device
WO2008105503A1 (en) Processed substrates having water-repellent areas in patterns, process for production thereof, and process for production of members having patterms made of functional material films
JP2006100808A5 (en)
WO2006111766A3 (en) Methods and apparatus for the manufacture of microstructures
WO2009028314A1 (en) Semiconductor device manufacturing method
WO2010009716A3 (en) Radiation-emitting device and method for producing a radiation-emitting device
TW200709859A (en) Method for patterning coatings
TW201627155A (en) Glass laminate, method for producing same and method for manufacturing electronic device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880007421.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08727034

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008727034

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2009554579

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097020910

Country of ref document: KR

Kind code of ref document: A