HK1062743A1 - Electrically conductive polymer composite compositions, method for making, and method for electricalconductivity enhancement - Google Patents
Electrically conductive polymer composite compositions, method for making, and method for electricalconductivity enhancementInfo
- Publication number
- HK1062743A1 HK1062743A1 HK04105548A HK04105548A HK1062743A1 HK 1062743 A1 HK1062743 A1 HK 1062743A1 HK 04105548 A HK04105548 A HK 04105548A HK 04105548 A HK04105548 A HK 04105548A HK 1062743 A1 HK1062743 A1 HK 1062743A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electricalconductivity
- enhancement
- making
- electrically conductive
- conductive polymer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/121—Charge-transfer complexes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/705,265 US6599446B1 (en) | 2000-11-03 | 2000-11-03 | Electrically conductive polymer composite compositions, method for making, and method for electrical conductivity enhancement |
PCT/US2001/022468 WO2002037507A1 (en) | 2000-11-03 | 2001-07-17 | Electrically conductive polymer composite compositions, method for making, and method for electrical conductivity enhancement |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1062743A1 true HK1062743A1 (en) | 2004-11-19 |
Family
ID=24832712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04105548A HK1062743A1 (en) | 2000-11-03 | 2004-07-27 | Electrically conductive polymer composite compositions, method for making, and method for electricalconductivity enhancement |
Country Status (13)
Country | Link |
---|---|
US (1) | US6599446B1 (xx) |
EP (1) | EP1338016B1 (xx) |
JP (1) | JP2004513216A (xx) |
KR (1) | KR100803458B1 (xx) |
CN (1) | CN1229818C (xx) |
AU (2) | AU4585902A (xx) |
BR (1) | BR0115103A (xx) |
DE (1) | DE60134487D1 (xx) |
ES (1) | ES2307669T3 (xx) |
HK (1) | HK1062743A1 (xx) |
MY (1) | MY122800A (xx) |
TW (1) | TW554349B (xx) |
WO (1) | WO2002037507A1 (xx) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6469093B1 (en) * | 1999-11-12 | 2002-10-22 | General Electric Company | Conductive polyphenylene ether-polyamide blend |
US6833096B2 (en) * | 2001-08-29 | 2004-12-21 | General Electric Company | Method for removing water and other volatile components from polymer powders |
WO2003024798A1 (en) * | 2001-09-18 | 2003-03-27 | Eikos, Inc. | Esd coatings for use with spacecraft |
FI120151B (fi) * | 2001-09-24 | 2009-07-15 | Premix Oy | Sähköä johtava termoplastinen elastomeeriseos |
US7645400B2 (en) * | 2002-11-01 | 2010-01-12 | Mitsubishi Rayon Co., Ltd. | Composition containing carbon nanotubes having a coating |
JP4243949B2 (ja) * | 2002-11-29 | 2009-03-25 | 日精樹脂工業株式会社 | 絶縁表層を有する導電性樹脂成形品とその成形方法 |
DE10259498A1 (de) * | 2002-12-19 | 2004-07-01 | Bayer Ag | Leitfähige Thermoplaste mit Ruß und Kohlenstoff-Nanofibrillen |
US7105117B2 (en) * | 2003-01-06 | 2006-09-12 | General Motors Corporation | Manufacturing method for increasing thermal and electrical conductivities of polymers |
US20050070658A1 (en) * | 2003-09-30 | 2005-03-31 | Soumyadeb Ghosh | Electrically conductive compositions, methods of manufacture thereof and articles derived from such compositions |
WO2005100478A1 (ja) * | 2004-04-14 | 2005-10-27 | Asahi Kasei Chemicals Corporation | 導電性樹脂組成物 |
US20050244251A1 (en) * | 2004-04-28 | 2005-11-03 | Seidl Kenneth G | Conductive spacer apparatus and method |
GB0410749D0 (en) * | 2004-05-14 | 2004-06-16 | Dow Corning Ireland Ltd | Coating apparatus |
GB2413944B (en) * | 2004-05-14 | 2006-08-16 | Reckitt Benckiser | Method for forming an active material containing coating on a substrate |
US20060293434A1 (en) * | 2004-07-07 | 2006-12-28 | The Trustees Of The University Of Pennsylvania | Single wall nanotube composites |
WO2006096203A2 (en) * | 2004-08-02 | 2006-09-14 | University Of Houston | Carbon nanotube reinforced polymer nanocomposites |
US7534822B2 (en) * | 2004-11-22 | 2009-05-19 | Sabic Innovative Plastics Ip B.V. | Method of making a flame retardant poly(arylene ether)/polyamide composition |
US20060111548A1 (en) * | 2004-11-22 | 2006-05-25 | Mark Elkovitch | Method of making a flame retardant poly(arylene ether)/polyamide composition and the composition thereof |
JP2008537556A (ja) * | 2004-11-22 | 2008-09-18 | サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ | 難燃性ポリ(アリーレンエーテル)/ポリアミド組成物の製造方法及びその組成物 |
US20060167143A1 (en) * | 2004-11-22 | 2006-07-27 | General Electric Company | Flame Retardant Poly(Arylene Ether)/Polyamide Composition |
US7449507B2 (en) * | 2004-11-22 | 2008-11-11 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether)/polyamide composition and method of making |
US7592382B2 (en) * | 2004-11-22 | 2009-09-22 | Sabic Innovative Plastics Ip B.V. | Flame retardant poly(arylene ether)/polyamide compositions, methods, and articles |
US20060183841A1 (en) * | 2005-02-11 | 2006-08-17 | Ashish Aneja | Thermally stable thermoplastic resin compositions, methods of manufacture thereof and articles comprising the same |
WO2007073393A2 (en) * | 2005-02-16 | 2007-06-28 | Georgia Tech Research Corporation | Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity |
US7723408B2 (en) * | 2005-02-16 | 2010-05-25 | Georgia Tech Research Corporation | Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity |
US20060289839A1 (en) * | 2005-06-23 | 2006-12-28 | Emmerson Gordon T | Metal salts of organic acids as conductivity promoters |
JP2009521535A (ja) * | 2005-08-08 | 2009-06-04 | キャボット コーポレイション | ナノチューブを含むポリマー組成物 |
US8264137B2 (en) | 2006-01-03 | 2012-09-11 | Samsung Electronics Co., Ltd. | Curing binder material for carbon nanotube electron emission cathodes |
EP1995280B1 (en) * | 2006-03-17 | 2016-08-24 | Mitsubishi Engineering-Plastics Corporation | Flame retardant polyamide resin composition and molding |
JP4878895B2 (ja) * | 2006-04-03 | 2012-02-15 | 旭化成ケミカルズ株式会社 | 導電性樹脂組成物 |
WO2008054850A2 (en) * | 2006-04-05 | 2008-05-08 | Sabic Innovative Plastics Ip B.V. | Poly (arylene ether)/polymide composition, method and article |
US8030376B2 (en) | 2006-07-12 | 2011-10-04 | Minusnine Technologies, Inc. | Processes for dispersing substances and preparing composite materials |
EP2392623B1 (en) * | 2006-08-02 | 2013-09-18 | Battelle Memorial Institute | Electrically conductive coating composition |
JP4969363B2 (ja) | 2006-08-07 | 2012-07-04 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
FR2907442B1 (fr) * | 2006-10-19 | 2008-12-05 | Arkema France | Materiau composite conducteur a base de polymere thermoplastique et de nanotube de carbone |
US8728354B2 (en) * | 2006-11-20 | 2014-05-20 | Sabic Innovative Plastics Ip B.V. | Electrically conducting compositions |
KR100790424B1 (ko) * | 2006-12-22 | 2008-01-03 | 제일모직주식회사 | 전자파 차폐용 열가소성 수지 조성물 및 플라스틱 성형품 |
US20080169609A1 (en) * | 2007-01-17 | 2008-07-17 | Jonathan Mark Hetland | Thermal signature target form |
US20100001237A1 (en) * | 2007-03-26 | 2010-01-07 | Fornes Timothy D | Method for producing heterogeneous composites |
US20090134370A1 (en) * | 2007-07-20 | 2009-05-28 | Herve Cartier | Conductive halogen free flame retardant thermoplastic composition |
US7781555B2 (en) * | 2007-09-03 | 2010-08-24 | Shin-Etsu Chemical Co., Ltd. | Microcontact printing stamp |
US8003016B2 (en) * | 2007-09-28 | 2011-08-23 | Sabic Innovative Plastics Ip B.V. | Thermoplastic composition with improved positive temperature coefficient behavior and method for making thereof |
US8795557B2 (en) * | 2008-03-31 | 2014-08-05 | Sabic Innovative Plastics Ip B.V. | Flame resistant polyphthalamide/poly(arylene ether) composition |
CN101582302B (zh) * | 2008-05-14 | 2011-12-21 | 清华大学 | 碳纳米管/导电聚合物复合材料 |
US8048341B2 (en) * | 2008-05-28 | 2011-11-01 | Applied Sciences, Inc. | Nanocarbon-reinforced polymer composite and method of making |
EP2637215B1 (en) * | 2008-08-07 | 2019-02-27 | Kyoto Elex Co., Ltd. | Conductive paste for formation of a solar cell element electrode, solar cell element, and manufacturing method for said solar cell element |
CN101654555B (zh) * | 2008-08-22 | 2013-01-09 | 清华大学 | 碳纳米管/导电聚合物复合材料的制备方法 |
TWI383950B (zh) * | 2009-04-22 | 2013-02-01 | Ind Tech Res Inst | 奈米點狀材料的形成方法 |
BRPI1010855A2 (pt) * | 2009-06-12 | 2016-04-05 | Lord Corp | método para proteção de um substrato contra interferência eletromagnética |
US8593153B2 (en) * | 2010-02-26 | 2013-11-26 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Method of fault detection and rerouting |
TWI471072B (zh) * | 2010-12-30 | 2015-01-21 | Ind Tech Res Inst | 具有導電膜層的基板組合及其製造方法 |
CN102555323B (zh) * | 2010-12-31 | 2015-01-21 | 财团法人工业技术研究院 | 具有导电膜层的基板组合及其制造方法 |
KR101284373B1 (ko) * | 2011-08-19 | 2013-07-09 | 숭실대학교산학협력단 | 피부 전극용 전도성 폴리디메틸실록산 복합체 조성물 및 이의 제조방법 |
ITMI20120999A1 (it) * | 2012-06-08 | 2013-12-09 | Getters Spa | Composizione essiccante contenente polveri di ossidi metallici modificate in superficie utili per la fabbricazione e la protezione di dispositivi sensibili all'umidità |
US9024526B1 (en) | 2012-06-11 | 2015-05-05 | Imaging Systems Technology, Inc. | Detector element with antenna |
WO2014080789A1 (ja) * | 2012-11-20 | 2014-05-30 | 横浜ゴム株式会社 | 低温焼成用導電性組成物および太陽電池セル |
US8865279B2 (en) | 2013-03-04 | 2014-10-21 | Sabic Global Technologies B.V. | Reinforced polyphthalamide/poly(phenylene ether) composition |
CN103450665A (zh) * | 2013-08-23 | 2013-12-18 | 北京化工大学常州先进材料研究院 | 一种具有电磁屏蔽功能的长碳纤维增强尼龙复合材料及其制备方法 |
KR101695515B1 (ko) | 2014-01-09 | 2017-01-11 | 롯데첨단소재(주) | 전도성 폴리아미드/폴리페닐렌 에테르 수지 조성물 및 이로부터 제조된 자동차용 성형품 |
CN104448778B (zh) * | 2014-11-27 | 2017-06-06 | 深圳市百事达卓越科技股份有限公司 | 一种导电或导静电的热塑性弹性体、制备方法及应用 |
WO2016090087A1 (en) * | 2014-12-05 | 2016-06-09 | Rhodia Operations | Electrically conductive polymer films and complexes containing a conductivity enhancing agent, and electronic devices containing such films and complexes |
US10056168B2 (en) | 2015-04-10 | 2018-08-21 | Lotte Advanced Materials Co., Ltd. | Electrically conductive polyamide/polyphenylene ether resin composition and molded article for vehicle using the same |
DE102015207814A1 (de) * | 2015-04-28 | 2016-11-03 | Benecke-Kaliko Ag | Elektrisch leitfähige Materialzusammensetzung |
DE102015207818A1 (de) * | 2015-04-28 | 2016-11-17 | Benecke-Kaliko Ag | Leitfähige Folie für eine Widerstandsheizung |
EP3469024B1 (en) * | 2016-06-13 | 2020-05-20 | SABIC Global Technologies B.V. | Polycarbonate-based thermal conductivity and ductility enhanced polymer compositions and uses thereof |
EP3685645A4 (en) | 2017-09-22 | 2021-08-25 | 3M Innovative Properties Company | COMPOSITE ARTICLE |
CN108822452B (zh) * | 2018-05-30 | 2020-09-29 | 浙江德清科赛塑料制品有限公司 | 一种聚四氟乙烯导电膜及其制备方法 |
US11437162B2 (en) | 2019-12-31 | 2022-09-06 | Industrial Technology Research Institute | Conductive material composition and conductive material prepared therefrom |
US11554393B1 (en) * | 2021-06-02 | 2023-01-17 | The United States Of America, As Represented By The Secretary Of The Navy | Electrostatically-assisted two-step conductive polymer applique (CPA) paint removal process |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU455375A1 (ru) | 1972-09-04 | 1974-12-30 | Таганрогский Радиотехнический Институт | Устройство дл контрол оперативного накопител информации |
SU455376A1 (ru) * | 1973-02-27 | 1974-12-30 | Предприятие П/Я В-2913 | Электропровод ща полимерна композици |
JPS5812048A (ja) * | 1981-07-15 | 1983-01-24 | Fujitsu Ltd | デ−タ並べかえ回路 |
US4752415A (en) * | 1982-03-16 | 1988-06-21 | American Cyanamid Co. | Compositions convertible to reinforced conductive components and articles incorporating same |
US4451536A (en) | 1982-06-15 | 1984-05-29 | National Distillers And Chemical Corporation | Heat distortion-resistant thermoplastic semi-conductive composition |
US4663230A (en) | 1984-12-06 | 1987-05-05 | Hyperion Catalysis International, Inc. | Carbon fibrils, method for producing same and compositions containing same |
JPS61278565A (ja) * | 1985-06-03 | 1986-12-09 | Fujikura Rubber Ltd | 電磁波遮蔽用導電性組成物 |
US4806571A (en) * | 1988-05-06 | 1989-02-21 | The Dow Chemical Company | Organic composition containing a fluoroalkyl sulfonic acid salt |
JPH02127467A (ja) * | 1988-11-08 | 1990-05-16 | Asahi Chem Ind Co Ltd | ポリアミド樹脂成形材料 |
EP0582919B2 (en) | 1992-08-11 | 2006-02-15 | Fortum Oil and Gas Oy | Conducting plastics material and a method for its preparation |
US5591382A (en) | 1993-03-31 | 1997-01-07 | Hyperion Catalysis International Inc. | High strength conductive polymers |
US5382622A (en) | 1993-06-29 | 1995-01-17 | Metagal Industria E Comercio Ltda. | Semiconductor polymeric compound based on lampblack, polymeric semiconductor body, and methods of making the semiconductor polymeric compound and the polymeric semiconductor body |
JPH0785722A (ja) | 1993-09-13 | 1995-03-31 | Gunze Ltd | 均一半導電性組成物 |
US6087059A (en) * | 1999-06-28 | 2000-07-11 | Xerox Corporation | Toner and developer compositions |
US6306203B1 (en) * | 1999-09-23 | 2001-10-23 | Xerox Corporation | Phase change inks |
TW484146B (en) * | 2000-12-30 | 2002-04-21 | Polytronics Technology Corp | Excess current protection device and method of manufacturing the same |
-
2000
- 2000-11-03 US US09/705,265 patent/US6599446B1/en not_active Expired - Fee Related
-
2001
- 2001-07-17 AU AU4585902A patent/AU4585902A/xx active Pending
- 2001-07-17 KR KR1020037006147A patent/KR100803458B1/ko not_active IP Right Cessation
- 2001-07-17 JP JP2002540164A patent/JP2004513216A/ja not_active Withdrawn
- 2001-07-17 AU AU2002245859A patent/AU2002245859B2/en not_active Ceased
- 2001-07-17 CN CNB018181473A patent/CN1229818C/zh not_active Expired - Fee Related
- 2001-07-17 EP EP01993005A patent/EP1338016B1/en not_active Expired - Lifetime
- 2001-07-17 DE DE60134487T patent/DE60134487D1/de not_active Expired - Fee Related
- 2001-07-17 ES ES01993005T patent/ES2307669T3/es not_active Expired - Lifetime
- 2001-07-17 BR BR0115103-7A patent/BR0115103A/pt not_active Application Discontinuation
- 2001-07-17 WO PCT/US2001/022468 patent/WO2002037507A1/en active Application Filing
- 2001-10-22 TW TW090126076A patent/TW554349B/zh not_active IP Right Cessation
- 2001-11-02 MY MYPI20015069A patent/MY122800A/en unknown
-
2004
- 2004-07-27 HK HK04105548A patent/HK1062743A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6599446B1 (en) | 2003-07-29 |
CN1229818C (zh) | 2005-11-30 |
AU2002245859B2 (en) | 2007-02-15 |
ES2307669T3 (es) | 2008-12-01 |
KR20040030451A (ko) | 2004-04-09 |
KR100803458B1 (ko) | 2008-02-14 |
CN1471713A (zh) | 2004-01-28 |
DE60134487D1 (de) | 2008-07-31 |
JP2004513216A (ja) | 2004-04-30 |
EP1338016B1 (en) | 2008-06-18 |
WO2002037507A1 (en) | 2002-05-10 |
BR0115103A (pt) | 2003-09-30 |
AU4585902A (en) | 2002-05-15 |
EP1338016A1 (en) | 2003-08-27 |
TW554349B (en) | 2003-09-21 |
MY122800A (en) | 2006-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20100717 |