AU2001250300A1 - Composite copper foil and manufacturing method thereof - Google Patents

Composite copper foil and manufacturing method thereof

Info

Publication number
AU2001250300A1
AU2001250300A1 AU2001250300A AU5030001A AU2001250300A1 AU 2001250300 A1 AU2001250300 A1 AU 2001250300A1 AU 2001250300 A AU2001250300 A AU 2001250300A AU 5030001 A AU5030001 A AU 5030001A AU 2001250300 A1 AU2001250300 A1 AU 2001250300A1
Authority
AU
Australia
Prior art keywords
manufacturing
copper foil
composite copper
composite
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001250300A
Inventor
Raymond Gales
Rene Lanners
Michel Streel
Akitoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil Luxemburg SARL
Original Assignee
Circuit Foil Luxembourg Trading SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading SARL filed Critical Circuit Foil Luxembourg Trading SARL
Publication of AU2001250300A1 publication Critical patent/AU2001250300A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Metals (AREA)
AU2001250300A 2000-02-24 2001-01-18 Composite copper foil and manufacturing method thereof Abandoned AU2001250300A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
LU90532 2000-02-24
LU90532A LU90532B1 (en) 2000-02-24 2000-02-24 Comosite copper foil and manufacturing method thereof
PCT/EP2001/000544 WO2001063016A1 (en) 2000-02-24 2001-01-18 Composite copper foil and manufacturing method thereof

Publications (1)

Publication Number Publication Date
AU2001250300A1 true AU2001250300A1 (en) 2001-09-03

Family

ID=19731872

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001250300A Abandoned AU2001250300A1 (en) 2000-02-24 2001-01-18 Composite copper foil and manufacturing method thereof

Country Status (13)

Country Link
US (1) US7153590B2 (en)
EP (1) EP1257693B1 (en)
JP (1) JP2003524078A (en)
KR (1) KR100729005B1 (en)
CN (1) CN1263898C (en)
AU (1) AU2001250300A1 (en)
BR (1) BR0108935A (en)
CA (1) CA2397984C (en)
DE (1) DE60101259T2 (en)
LU (1) LU90532B1 (en)
RU (1) RU2250934C2 (en)
TW (1) TW573078B (en)
WO (1) WO2001063016A1 (en)

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JP2004169181A (en) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk Ultrathin copper foil with carrier and method for manufacturing the same, and printed wiring board using ultrathin copper foil with carrier
JP3954958B2 (en) * 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 Copper foil with resistive layer and circuit board material with resistive layer
WO2005010239A1 (en) * 2003-07-29 2005-02-03 Nikko Materials Co., Ltd. Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith
KR100767942B1 (en) 2003-10-17 2007-10-17 닛코킨조쿠 가부시키가이샤 Plating solution for electroless copper plating
EP1531656A3 (en) * 2003-11-11 2007-10-03 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4087369B2 (en) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 Ultra-thin copper foil with carrier and printed wiring board
JP4796351B2 (en) * 2004-08-06 2011-10-19 福田金属箔粉工業株式会社 Method for producing electrolytic copper foil
JP2007146289A (en) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil
US7913381B2 (en) 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
AU2007202071A1 (en) * 2006-12-26 2008-07-10 Jx Nippon Mining & Metals Corporation Method for producing sheet-form electrolytic copper from halide solution
JP2010018885A (en) * 2008-06-12 2010-01-28 Furukawa Electric Co Ltd:The Electrolytic copper coating film, method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coating film
CN102203326A (en) * 2008-09-05 2011-09-28 古河电气工业株式会社 Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
JP5407273B2 (en) * 2008-10-24 2014-02-05 ソニー株式会社 Negative electrode current collector, negative electrode and secondary battery
JP5379528B2 (en) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
TWI567251B (en) 2010-03-18 2017-01-21 巴地斯顏料化工廠 Composition for metal electroplating comprising leveling agent
JP6219034B2 (en) * 2010-10-06 2017-10-25 古河電気工業株式会社 Copper foil and manufacturing method thereof, copper foil with carrier and manufacturing method thereof, printed wiring board, multilayer printed wiring board
CN102363891B (en) * 2011-11-18 2013-09-25 山东金宝电子股份有限公司 Double photoelectrolysis copper foil replacing rolled copper foil and used for production of flexible copper clad laminate, and production process of double photoelectrolysis copper foil
CN104047041B (en) * 2013-03-15 2017-04-26 深圳市九和咏精密电路有限公司 Preparation method for printed circuit board
KR102192417B1 (en) * 2013-04-02 2020-12-17 가부시키가이샤 아데카 Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath
CN103397354B (en) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 A kind of additive in cavity after reducing silicon through hole technology copper facing annealing
CN105101627B (en) * 2014-05-09 2019-03-01 Jx日矿日石金属株式会社 Copper foil with carrier and its manufacturing method, printing distributing board and its manufacturing method, laminate, e-machine
KR101852671B1 (en) * 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
JP6099778B1 (en) * 2015-01-21 2017-03-22 Ｊｘ金属株式会社 A copper foil with a carrier, a laminate, a printed wiring board, a printed wiring board manufacturing method, and an electronic device manufacturing method.
JP6650923B2 (en) * 2015-03-24 2020-02-19 三井金属鉱業株式会社 Ultra-thin copper foil with carrier, method for producing the same, copper-clad laminate and printed wiring board
TWI576470B (en) * 2015-07-28 2017-04-01 聚和國際股份有限公司 Electroplating additive
KR101992840B1 (en) 2017-06-20 2019-06-27 케이씨에프테크놀로지스 주식회사 Copper foil with minimized bagginess and tear, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
JP7122675B2 (en) * 2017-10-23 2022-08-22 パナソニックＩｐマネジメント株式会社 Thin-film metal foil with metal substrate, metal-clad transparent substrate material, laminate for see-through electrode, see-through electrode material, and device
CN110042444B (en) * 2019-05-10 2022-03-08 九江德福科技股份有限公司 Additive formula for improving surface uniformity of copper foil
CN110093637A (en) * 2019-06-11 2019-08-06 九江德福科技股份有限公司 For flexibility coat copper plate, the electrolytic copper foil of flexible printed-circuit board and preparation method
CN111005041B (en) * 2019-12-30 2021-10-26 中国科学院青海盐湖研究所 Composite multi-layer structure porous copper foil and preparation method and system thereof
CN114178710A (en) * 2020-08-24 2022-03-15 奥特斯(中国)有限公司 Component carrier and method for producing the same
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Also Published As

Publication number Publication date
CN1404535A (en) 2003-03-19
BR0108935A (en) 2002-12-24
CA2397984A1 (en) 2001-08-30
EP1257693A1 (en) 2002-11-20
CN1263898C (en) 2006-07-12
RU2002123341A (en) 2004-03-20
US20030012975A1 (en) 2003-01-16
CA2397984C (en) 2011-08-02
RU2250934C2 (en) 2005-04-27
JP2003524078A (en) 2003-08-12
KR20020081698A (en) 2002-10-30
DE60101259T2 (en) 2004-11-18
DE60101259D1 (en) 2003-12-24
US7153590B2 (en) 2006-12-26
LU90532B1 (en) 2001-08-27
TW573078B (en) 2004-01-21
WO2001063016A1 (en) 2001-08-30
EP1257693B1 (en) 2003-11-19
KR100729005B1 (en) 2007-06-14

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