HK1043162B - 鍍銅材料、其製造方法及鍍銅的方法 - Google Patents

鍍銅材料、其製造方法及鍍銅的方法

Info

Publication number
HK1043162B
HK1043162B HK02104082.9A HK02104082A HK1043162B HK 1043162 B HK1043162 B HK 1043162B HK 02104082 A HK02104082 A HK 02104082A HK 1043162 B HK1043162 B HK 1043162B
Authority
HK
Hong Kong
Prior art keywords
copper electroplating
manufacturing same
copper
electroplating
manufacturing
Prior art date
Application number
HK02104082.9A
Other languages
English (en)
Other versions
HK1043162A1 (en
Inventor
松木詩路士
秋山一則
Original Assignee
東亞合成株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000267018A external-priority patent/JP4033616B2/ja
Priority claimed from JP2000310547A external-priority patent/JP3839653B2/ja
Application filed by 東亞合成株式會社 filed Critical 東亞合成株式會社
Publication of HK1043162A1 publication Critical patent/HK1043162A1/xx
Publication of HK1043162B publication Critical patent/HK1043162B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C01G3/02—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
HK02104082.9A 2000-09-04 2002-05-31 鍍銅材料、其製造方法及鍍銅的方法 HK1043162B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000267018A JP4033616B2 (ja) 2000-09-04 2000-09-04 銅メッキ材料の製造方法
JP2000310547A JP3839653B2 (ja) 2000-10-11 2000-10-11 電解メッキ用塩基性炭酸銅の製造方法

Publications (2)

Publication Number Publication Date
HK1043162A1 HK1043162A1 (en) 2002-09-06
HK1043162B true HK1043162B (zh) 2005-03-24

Family

ID=26599175

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104082.9A HK1043162B (zh) 2000-09-04 2002-05-31 鍍銅材料、其製造方法及鍍銅的方法

Country Status (6)

Country Link
US (1) US20020053518A1 (zh)
KR (2) KR100539652B1 (zh)
CN (1) CN1170010C (zh)
DE (1) DE10143076B4 (zh)
HK (1) HK1043162B (zh)
TW (1) TW539652B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6723219B2 (en) * 2001-08-27 2004-04-20 Micron Technology, Inc. Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
TWI267494B (en) * 2004-06-18 2006-12-01 Tsurumisoda Co Ltd Copper plating material, and copper plating method
DE602006020682D1 (de) * 2006-03-17 2011-04-28 Univ Bremen Synthetische Perlmutter, Verfahren und Vorrichtung zu ihrer Herstellung
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
KR101313844B1 (ko) 2012-04-02 2013-10-01 (주)에이치에스켐텍 동폐액으로부터 동 도금 재료용 및 고품위 산화동을 제조하는 방법
CN103303961B (zh) * 2013-05-23 2014-12-17 东又悦（苏州）电子科技新材料有限公司 一种球状电镀级氧化铜粉的制备方法
CN103303960B (zh) * 2013-05-23 2014-12-31 东又悦（苏州）电子科技新材料有限公司 一种球状碱式碳酸铜粉的制备方法
JP6619718B2 (ja) * 2016-10-14 2019-12-11 株式会社荏原製作所 基板のめっきに使用される酸化銅粉体、該酸化銅粉体を用いて基板をめっきする方法、該酸化銅粉体を用いてめっき液を管理する方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3417629C1 (de) * 1984-05-12 1985-01-24 Th. Goldschmidt Ag, 4300 Essen Verfahren zur Herstellung von basischem Kupfercarbonat
JPS6158816A (ja) * 1984-08-21 1986-03-26 Mitsujiro Konishi 亜酸化銅の製造方法
US4677234A (en) * 1985-02-04 1987-06-30 Union Carbide Corporation Process for the preparation of ethylene glycol
DE68916756D1 (de) * 1988-11-22 1994-08-18 Du Pont Verfahren zur Reinigung von gesättigten Halokohlenwasserstoffen.
JP2753855B2 (ja) * 1989-04-27 1998-05-20 鶴見曹達株式会社 銅メッキ材料の製造方法
JPH0380116A (ja) * 1989-08-23 1991-04-04 Sumitomo Metal Mining Co Ltd 酸化第二銅粉末の製造方法
JPH0452296A (ja) * 1990-06-20 1992-02-20 Permelec Electrode Ltd 銅めっき方法
US5492681A (en) * 1993-03-22 1996-02-20 Hickson Corporation Method for producing copper oxide
JP5072136B2 (ja) * 1998-07-24 2012-11-14 千代田化工建設株式会社 多孔性スピネル型複合酸化物の製造方法

Also Published As

Publication number Publication date
KR20020018963A (ko) 2002-03-09
KR20050089783A (ko) 2005-09-08
HK1043162A1 (en) 2002-09-06
TW539652B (en) 2003-07-01
CN1170010C (zh) 2004-10-06
DE10143076A1 (de) 2002-05-29
DE10143076B4 (de) 2009-11-26
KR100683598B1 (ko) 2007-02-16
KR100539652B1 (ko) 2005-12-30
CN1342787A (zh) 2002-04-03
US20020053518A1 (en) 2002-05-09

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20210903