HK1043162A1 - Material for copper electroplating, method for manufacturing same and copper electroplating method. - Google Patents

Material for copper electroplating, method for manufacturing same and copper electroplating method.

Info

Publication number
HK1043162A1
HK1043162A1 HK02104082A HK02104082A HK1043162A1 HK 1043162 A1 HK1043162 A1 HK 1043162A1 HK 02104082 A HK02104082 A HK 02104082A HK 02104082 A HK02104082 A HK 02104082A HK 1043162 A1 HK1043162 A1 HK 1043162A1
Authority
HK
Hong Kong
Prior art keywords
copper electroplating
manufacturing same
copper
electroplating
manufacturing
Prior art date
Application number
HK02104082A
Other versions
HK1043162B (en
Inventor
Shiroshi Matsuki
Kazunori Akiyama
Original Assignee
Tsurumi Soda Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000267018A external-priority patent/JP4033616B2/en
Priority claimed from JP2000310547A external-priority patent/JP3839653B2/en
Application filed by Tsurumi Soda Kk filed Critical Tsurumi Soda Kk
Publication of HK1043162A1 publication Critical patent/HK1043162A1/en
Publication of HK1043162B publication Critical patent/HK1043162B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C01G3/02—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
HK02104082.9A 2000-09-04 2002-05-31 Material for copper electroplating, method for manufacturing same and copper electroplating method HK1043162B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000267018A JP4033616B2 (en) 2000-09-04 2000-09-04 Manufacturing method of copper plating material
JP2000310547A JP3839653B2 (en) 2000-10-11 2000-10-11 Method for producing basic copper carbonate for electrolytic plating

Publications (2)

Publication Number Publication Date
HK1043162A1 true HK1043162A1 (en) 2002-09-06
HK1043162B HK1043162B (en) 2005-03-24

Family

ID=26599175

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104082.9A HK1043162B (en) 2000-09-04 2002-05-31 Material for copper electroplating, method for manufacturing same and copper electroplating method

Country Status (6)

Country Link
US (1) US20020053518A1 (en)
KR (2) KR100539652B1 (en)
CN (1) CN1170010C (en)
DE (1) DE10143076B4 (en)
HK (1) HK1043162B (en)
TW (1) TW539652B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6723219B2 (en) * 2001-08-27 2004-04-20 Micron Technology, Inc. Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
TWI267494B (en) * 2004-06-18 2006-12-01 Tsurumisoda Co Ltd Copper plating material, and copper plating method
ATE502138T1 (en) * 2006-03-17 2011-04-15 Univ Bremen SYNTHETIC NUT OF PEARL, METHOD AND APPARATUS FOR THE PRODUCTION THEREOF
US8262894B2 (en) * 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
KR101313844B1 (en) 2012-04-02 2013-10-01 (주)에이치에스켐텍 Manufacturing method of high quality copper oxide and material for copper plating from waste copper liquid
CN103303961B (en) * 2013-05-23 2014-12-17 东又悦（苏州）电子科技新材料有限公司 Preparation method of spherical electroplating-level copper oxide powder
CN103303960B (en) * 2013-05-23 2014-12-31 东又悦（苏州）电子科技新材料有限公司 Preparation method of spherical basic cupric carbonate powder
JP6619718B2 (en) * 2016-10-14 2019-12-11 株式会社荏原製作所 Copper oxide powder used for substrate plating, method of plating a substrate using the copper oxide powder, method of managing plating solution using the copper oxide powder

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3417629C1 (en) * 1984-05-12 1985-01-24 Th. Goldschmidt Ag, 4300 Essen Process for the production of basic copper carbonate
JPS6158816A (en) * 1984-08-21 1986-03-26 Mitsujiro Konishi Manufacture of cuprous oxide
US4677234A (en) * 1985-02-04 1987-06-30 Union Carbide Corporation Process for the preparation of ethylene glycol
ATE108429T1 (en) * 1988-11-22 1994-07-15 Du Pont PROCESS FOR PURIFICATION OF SATURATED HALCOCARBONS.
JP2753855B2 (en) * 1989-04-27 1998-05-20 鶴見曹達株式会社 Manufacturing method of copper plating material
JPH0380116A (en) * 1989-08-23 1991-04-04 Sumitomo Metal Mining Co Ltd Production of copper (ii) oxide powder
JPH0452296A (en) * 1990-06-20 1992-02-20 Permelec Electrode Ltd Copper plating method
US5492681A (en) * 1993-03-22 1996-02-20 Hickson Corporation Method for producing copper oxide
JP5072136B2 (en) * 1998-07-24 2012-11-14 千代田化工建設株式会社 Method for producing porous spinel complex oxide

Also Published As

Publication number Publication date
TW539652B (en) 2003-07-01
KR100539652B1 (en) 2005-12-30
CN1342787A (en) 2002-04-03
KR20020018963A (en) 2002-03-09
KR100683598B1 (en) 2007-02-16
KR20050089783A (en) 2005-09-08
DE10143076B4 (en) 2009-11-26
HK1043162B (en) 2005-03-24
DE10143076A1 (en) 2002-05-29
CN1170010C (en) 2004-10-06
US20020053518A1 (en) 2002-05-09

Similar Documents

Publication Publication Date Title
GB2384007B (en) Copper-based, sintered sliding material and method for producing same
WO2002015264A3 (en) Encapsulated organic-electronic component, method for producing the same and use thereof
MX230141B (en) Nickel hydroxide electrode material and method for making the same.
HK1038007A1 (en) Method for making 4-carboxyamino-2-substituted-1,2,3,4-tetrahydroquinoline.
ZA995598B (en) Extruded, unbalanced solid surface composites and method for making and using same.
IL161893A0 (en) 5-Phenylpyrimidines, agents comprising the same, method for production and use thereof
HUP0104203A3 (en) Copper alloy, and process for making it
ZA992721B (en) Method for fabricating an excavator base.
MX240745B (en) Hydroprocessing process.
MXPA03005491A (en) Method for leaching copper concentrate.
MX227439B (en) Hydroprocessing process.
HK1054056A1 (en) Ni based alloy, method for producing the same, andforging dieni.
MXPA02001851A (en) Improved coating method.
ZA200205875B (en) Method for providing improved polymeric composition.
MXPA03001010A (en) Copper electrowinning.
HK1043162A1 (en) Material for copper electroplating, method for manufacturing same and copper electroplating method.
MXPA02012826A (en) Epoxy resing and process for making the same.
PL366168A1 (en) Impregnate, method for the production and use thereof
PL373741A1 (en) Method for making propylene monofilaments, propylene monofilaments and their use
EG23312A (en) Method for reducing metal-containing in particulariron-ore-containing, particulate material.
MXPA03002517A (en) Hydrocracking process.
MXPA03005569A (en) New process.
HUP0300734A3 (en) Fuse link, method for the production thereof and soldering substance
ZA200002546B (en) Sorbate-preserved compositions, method for the manufacture thereof and their use.
MXPA03005110A (en) Filtering method.

Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20210903