HK1028425A1 - Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold - Google Patents

Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Info

Publication number
HK1028425A1
HK1028425A1 HK00107927A HK00107927A HK1028425A1 HK 1028425 A1 HK1028425 A1 HK 1028425A1 HK 00107927 A HK00107927 A HK 00107927A HK 00107927 A HK00107927 A HK 00107927A HK 1028425 A1 HK1028425 A1 HK 1028425A1
Authority
HK
Hong Kong
Prior art keywords
copper alloy
metal mold
thin sheet
improved wear
exhibiting improved
Prior art date
Application number
HK00107927A
Other languages
English (en)
Inventor
Akihito Mori
Takeshi Suzuki
Tadao Sakakibara
Yoshiharu Mae
Keishi Nogami
Yutaka Koshiba
Original Assignee
Mitsubishi Shindoh Corp
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/ja
Priority claimed from JP4432299A external-priority patent/JP4186201B2/ja
Application filed by Mitsubishi Shindoh Corp, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Corp
Publication of HK1028425A1 publication Critical patent/HK1028425A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
HK00107927A 1998-03-10 2000-12-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold HK1028425A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP15454598A JP4186199B2 (ja) 1998-06-03 1998-06-03 耐打抜き金型摩耗性、耐繰り返し曲げ疲労特性およびはんだ付け性に優れた銅合金
JP4432299A JP4186201B2 (ja) 1998-03-10 1999-02-23 耐打抜き金型摩耗性および樹脂密着性に優れた銅合金および銅合金薄板
PCT/JP1999/001116 WO1999046415A1 (fr) 1998-03-10 1999-03-09 Alliage de cuivre et feuille mince en alliage de cuivre possedant une resistance a l'usure amelioree en tant que moule metallique d'estampage

Publications (1)

Publication Number Publication Date
HK1028425A1 true HK1028425A1 (en) 2001-02-16

Family

ID=27291858

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00107927A HK1028425A1 (en) 1998-03-10 2000-12-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Country Status (7)

Country Link
EP (1) EP0995808B1 (ko)
KR (1) KR100562790B1 (ko)
CN (1) CN1102177C (ko)
DE (1) DE19980583T1 (ko)
HK (1) HK1028425A1 (ko)
TW (1) TW442576B (ko)
WO (1) WO1999046415A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783336B1 (fr) 1998-09-11 2001-10-12 Schlumberger Ind Sa Procede de transmission de donnees et carte pour une telle transmission
JP3918397B2 (ja) 2000-04-11 2007-05-23 三菱マテリアル株式会社 耐密着性無酸素銅荒引線、その製造方法及び製造装置
TW527427B (en) 2000-03-14 2003-04-11 Nippon Mining Co Copper-alloy foil to be used for suspension member of hard-disc drive
DE10240777A1 (de) * 2002-08-30 2004-03-11 Röhm GmbH & Co. KG Wasserkalibrator
JP3999676B2 (ja) 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 銅基合金およびその製造方法
JP5866411B2 (ja) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 銅合金薄板および銅合金薄板の製造方法
JP5866410B2 (ja) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 銅合金薄板および銅合金薄板の製造方法
CN103952587B (zh) * 2014-04-30 2016-02-03 北京科技大学 一种复相铜合金材料及其制备方法
CN104481420B (zh) * 2014-09-22 2016-08-03 铁岭米勒石油新材料有限公司 一种新型抽油杆接箍及其制备工艺
CN105400988A (zh) * 2015-11-10 2016-03-16 太仓捷公精密金属材料有限公司 一种铜合金金属材料
CN105543538A (zh) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 货架
CN105908008A (zh) * 2016-06-25 2016-08-31 聂超 一种船用螺旋桨高强度铸造材料及其铸造工艺
CN106244949A (zh) * 2016-08-01 2016-12-21 宁波达尔机械科技有限公司 一种滚动轴承内圈用合金材料及其制备方法
CN106381417A (zh) * 2016-11-15 2017-02-08 扬州丰泽轨道交通科技有限公司 一种高铁用碳刷架及其制备方法
CN107805731A (zh) * 2017-10-23 2018-03-16 江苏都盛科技发展有限公司 一种用于电加热器的新型合金材料
CN115747558A (zh) * 2022-11-17 2023-03-07 安徽鑫科铜业有限公司 一种集成电路引线框架用铜合金带及其制造方法和应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1758125B2 (de) * 1967-06-26 1974-03-21 Olin Corp., New Haven, Conn. (V.St.A.) Verwendung von Kupferlegierungen für Gegenstände mit gleichzeitiger hoher Festigkeit und hoher elektrischer Leitfähigkeit
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
JPS61257443A (ja) * 1985-05-08 1986-11-14 Mitsubishi Shindo Kk 半導体装置用Ｃｕ合金リ−ド素材
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPS6270541A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材
JPS6293325A (ja) * 1985-10-18 1987-04-28 Mitsubishi Shindo Kk 半導体装置用Ｃｕ合金リ−ド素材
JPH02111829A (ja) 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JPH02111828A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
JPH02111850A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
JPH02221344A (ja) * 1989-02-21 1990-09-04 Mitsubishi Shindoh Co Ltd 熱間圧延性およびめっき加熱密着性のすぐれた高強度Ｃｕ合金
JP2673967B2 (ja) * 1990-06-04 1997-11-05 三菱伸銅 株式会社 高強度を有する半導体装置のＣｕ合金製リードフレーム材
JP2962139B2 (ja) * 1994-03-03 1999-10-12 三菱マテリアル株式会社 メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条
JP3728776B2 (ja) * 1995-08-10 2005-12-21 三菱伸銅株式会社 めっき予備処理工程中にスマットが発生することのない高強度銅合金
JP3317145B2 (ja) * 1996-06-27 2002-08-26 三菱マテリアル株式会社 Ｆｅ含有銅合金溶湯にＣを接種する方法

Also Published As

Publication number Publication date
WO1999046415A1 (fr) 1999-09-16
KR100562790B1 (ko) 2006-03-21
CN1102177C (zh) 2003-02-26
CN1256715A (zh) 2000-06-14
EP0995808A4 (en) 2006-04-12
EP0995808B1 (en) 2009-08-26
DE19980583T1 (de) 2000-04-13
TW442576B (en) 2001-06-23
KR20010012450A (ko) 2001-02-15
EP0995808A1 (en) 2000-04-26

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Effective date: 20190308