HK1028425A1 - Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold - Google Patents

Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Info

Publication number
HK1028425A1
HK1028425A1 HK00107927A HK00107927A HK1028425A1 HK 1028425 A1 HK1028425 A1 HK 1028425A1 HK 00107927 A HK00107927 A HK 00107927A HK 00107927 A HK00107927 A HK 00107927A HK 1028425 A1 HK1028425 A1 HK 1028425A1
Authority
HK
Hong Kong
Prior art keywords
copper alloy
metal mold
thin sheet
improved wear
exhibiting improved
Prior art date
Application number
HK00107927A
Inventor
Akihito Mori
Takeshi Suzuki
Tadao Sakakibara
Yoshiharu Mae
Keishi Nogami
Yutaka Koshiba
Original Assignee
Mitsubishi Shindoh Corp
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/en
Priority claimed from JP4432299A external-priority patent/JP4186201B2/en
Application filed by Mitsubishi Shindoh Corp, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Corp
Publication of HK1028425A1 publication Critical patent/HK1028425A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
HK00107927A 1998-03-10 2000-12-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold HK1028425A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP15454598A JP4186199B2 (en) 1998-06-03 1998-06-03 Copper alloy with excellent die wear resistance, repeated bending fatigue resistance and solderability
JP4432299A JP4186201B2 (en) 1998-03-10 1999-02-23 Copper alloy and copper alloy thin plate with excellent die wear resistance and resin adhesion
PCT/JP1999/001116 WO1999046415A1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Publications (1)

Publication Number Publication Date
HK1028425A1 true HK1028425A1 (en) 2001-02-16

Family

ID=27291858

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00107927A HK1028425A1 (en) 1998-03-10 2000-12-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Country Status (7)

Country Link
EP (1) EP0995808B1 (en)
KR (1) KR100562790B1 (en)
CN (1) CN1102177C (en)
DE (1) DE19980583T1 (en)
HK (1) HK1028425A1 (en)
TW (1) TW442576B (en)
WO (1) WO1999046415A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783336B1 (en) 1998-09-11 2001-10-12 Schlumberger Ind Sa DATA TRANSMISSION METHOD AND CARD FOR SUCH TRANSMISSION
JP3918397B2 (en) 2000-04-11 2007-05-23 三菱マテリアル株式会社 Adhesion-resistant oxygen-free copper rough wire, its manufacturing method and manufacturing apparatus
TW527427B (en) 2000-03-14 2003-04-11 Nippon Mining Co Copper-alloy foil to be used for suspension member of hard-disc drive
DE10240777A1 (en) * 2002-08-30 2004-03-11 Röhm GmbH & Co. KG Wasserkalibrator
JP3999676B2 (en) 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 Copper-based alloy and method for producing the same
JP5866410B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
JP5866411B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
CN103952587B (en) * 2014-04-30 2016-02-03 北京科技大学 A kind of complex phase Cu alloy material and preparation method thereof
CN104481420B (en) * 2014-09-22 2016-08-03 铁岭米勒石油新材料有限公司 A kind of Novel sucker rod box cupling and preparation technology thereof
CN105400988A (en) * 2015-11-10 2016-03-16 太仓捷公精密金属材料有限公司 Copper alloy metallic material
CN105543538A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Goods shelf
CN105908008A (en) * 2016-06-25 2016-08-31 聂超 Ship propeller high-strength casting material and casting process thereof
CN106244949A (en) * 2016-08-01 2016-12-21 宁波达尔机械科技有限公司 A kind of rolling bearing inner ring alloy material and preparation method thereof
CN106381417A (en) * 2016-11-15 2017-02-08 扬州丰泽轨道交通科技有限公司 Carbon brush holder for high-speed railway and manufacturing method thereof
CN107805731A (en) * 2017-10-23 2018-03-16 江苏都盛科技发展有限公司 A kind of new alloy material for electric heater
CN115747558A (en) * 2022-11-17 2023-03-07 安徽鑫科铜业有限公司 Copper alloy strip for integrated circuit lead frame and manufacturing method and application thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
DE1758125B2 (en) * 1967-06-26 1974-03-21 Olin Corp., New Haven, Conn. (V.St.A.) Use of copper alloys for objects with high strength and high electrical conductivity at the same time
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
JPS61257443A (en) 1985-05-08 1986-11-14 Mitsubishi Shindo Kk Cu alloy as lead material for semiconductor device
JPS6270541A (en) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp Cu-alloy lead material for semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPS6293325A (en) * 1985-10-18 1987-04-28 Mitsubishi Shindo Kk Cu alloy lead material for semiconductor device
JPH02111829A (en) 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH02111850A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
JPH02111828A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
JPH02221344A (en) * 1989-02-21 1990-09-04 Mitsubishi Shindoh Co Ltd High strength cu alloy having hot rollability and heating adhesiveness in plating
JP2673967B2 (en) * 1990-06-04 1997-11-05 三菱伸銅 株式会社 Cu alloy lead frame material for high strength semiconductor devices
JP2962139B2 (en) * 1994-03-03 1999-10-12 三菱マテリアル株式会社 Copper alloy with excellent plating properties and conductivity and thin plate or strip made of this copper alloy
JP3728776B2 (en) * 1995-08-10 2005-12-21 三菱伸銅株式会社 High-strength copper alloy that does not generate smut during plating pretreatment process
JP3317145B2 (en) * 1996-06-27 2002-08-26 三菱マテリアル株式会社 Method of inoculating C into molten Fe-containing copper alloy

Also Published As

Publication number Publication date
TW442576B (en) 2001-06-23
DE19980583T1 (en) 2000-04-13
KR20010012450A (en) 2001-02-15
EP0995808A4 (en) 2006-04-12
CN1256715A (en) 2000-06-14
KR100562790B1 (en) 2006-03-21
CN1102177C (en) 2003-02-26
WO1999046415A1 (en) 1999-09-16
EP0995808B1 (en) 2009-08-26
EP0995808A1 (en) 2000-04-26

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Legal Events

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PF Patent in force
PE Patent expired

Effective date: 20190308