EP0995808A4 - Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold - Google Patents
Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal moldInfo
- Publication number
- EP0995808A4 EP0995808A4 EP99939202A EP99939202A EP0995808A4 EP 0995808 A4 EP0995808 A4 EP 0995808A4 EP 99939202 A EP99939202 A EP 99939202A EP 99939202 A EP99939202 A EP 99939202A EP 0995808 A4 EP0995808 A4 EP 0995808A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- metal mold
- thin sheet
- improved wear
- exhibiting improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5798998 | 1998-03-10 | ||
JP5798998 | 1998-03-10 | ||
JP15454598A JP4186199B2 (en) | 1998-06-03 | 1998-06-03 | Copper alloy with excellent die wear resistance, repeated bending fatigue resistance and solderability |
JP15454598 | 1998-06-03 | ||
JP4432299 | 1999-02-23 | ||
JP4432299A JP4186201B2 (en) | 1998-03-10 | 1999-02-23 | Copper alloy and copper alloy thin plate with excellent die wear resistance and resin adhesion |
PCT/JP1999/001116 WO1999046415A1 (en) | 1998-03-10 | 1999-03-09 | Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0995808A1 EP0995808A1 (en) | 2000-04-26 |
EP0995808A4 true EP0995808A4 (en) | 2006-04-12 |
EP0995808B1 EP0995808B1 (en) | 2009-08-26 |
Family
ID=27291858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99939202A Expired - Lifetime EP0995808B1 (en) | 1998-03-10 | 1999-03-09 | Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0995808B1 (en) |
KR (1) | KR100562790B1 (en) |
CN (1) | CN1102177C (en) |
DE (1) | DE19980583T1 (en) |
HK (1) | HK1028425A1 (en) |
TW (1) | TW442576B (en) |
WO (1) | WO1999046415A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2783336B1 (en) | 1998-09-11 | 2001-10-12 | Schlumberger Ind Sa | DATA TRANSMISSION METHOD AND CARD FOR SUCH TRANSMISSION |
JP3918397B2 (en) | 2000-04-11 | 2007-05-23 | 三菱マテリアル株式会社 | Adhesion-resistant oxygen-free copper rough wire, its manufacturing method and manufacturing apparatus |
KR100415959B1 (en) * | 2000-03-14 | 2004-01-24 | 닛코 킨조쿠 가부시키가이샤 | Copper alloy foil for hard disc drive suspension |
DE10240777A1 (en) * | 2002-08-30 | 2004-03-11 | Röhm GmbH & Co. KG | Wasserkalibrator |
JP3999676B2 (en) * | 2003-01-22 | 2007-10-31 | Dowaホールディングス株式会社 | Copper-based alloy and method for producing the same |
JP5866411B2 (en) * | 2013-08-09 | 2016-02-17 | 三菱マテリアル株式会社 | Copper alloy sheet and method for producing copper alloy sheet |
JP5866410B2 (en) * | 2013-08-09 | 2016-02-17 | 三菱マテリアル株式会社 | Copper alloy sheet and method for producing copper alloy sheet |
CN103952587B (en) * | 2014-04-30 | 2016-02-03 | 北京科技大学 | A kind of complex phase Cu alloy material and preparation method thereof |
CN104481420B (en) * | 2014-09-22 | 2016-08-03 | 铁岭米勒石油新材料有限公司 | A kind of Novel sucker rod box cupling and preparation technology thereof |
CN105400988A (en) * | 2015-11-10 | 2016-03-16 | 太仓捷公精密金属材料有限公司 | Copper alloy metallic material |
CN105543538A (en) * | 2015-12-23 | 2016-05-04 | 常熟市三荣装饰材料有限公司 | Goods shelf |
CN105908008A (en) * | 2016-06-25 | 2016-08-31 | 聂超 | Ship propeller high-strength casting material and casting process thereof |
CN106244949A (en) * | 2016-08-01 | 2016-12-21 | 宁波达尔机械科技有限公司 | A kind of rolling bearing inner ring alloy material and preparation method thereof |
CN106381417A (en) * | 2016-11-15 | 2017-02-08 | 扬州丰泽轨道交通科技有限公司 | Carbon brush holder for high-speed railway and manufacturing method thereof |
CN107805731A (en) * | 2017-10-23 | 2018-03-16 | 江苏都盛科技发展有限公司 | A kind of new alloy material for electric heater |
CN115747558A (en) * | 2022-11-17 | 2023-03-07 | 安徽鑫科铜业有限公司 | Copper alloy strip for integrated circuit lead frame and manufacturing method and application thereof |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1180893A (en) * | 1967-06-26 | 1970-02-11 | Olin Mathieson | Copper Base Alloy. |
US3522039A (en) * | 1967-06-26 | 1970-07-28 | Olin Mathieson | Copper base alloy |
US3522038A (en) * | 1967-06-26 | 1970-07-28 | Olin Corp | Copper base alloy |
US4668471A (en) * | 1985-05-08 | 1987-05-26 | Mitsubishi Shindoh Co., Ltd. | Copper alloy lead material for leads of a semiconductor device |
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
JPH02111850A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Manufacture of copper alloy for lead frame |
JPH02111828A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Manufacture of copper alloy for lead frame |
JPH02111829A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Copper alloy for lead frame |
EP0384260A1 (en) * | 1989-02-21 | 1990-08-29 | Mitsubishi Shindoh Co., Ltd. | Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated |
JPH0441631A (en) * | 1990-06-04 | 1992-02-12 | Mitsubishi Shindoh Co Ltd | High strength cu alloy for lead frame of semiconductor device |
JPH07242965A (en) * | 1994-03-03 | 1995-09-19 | Mitsubishi Materials Corp | Copper alloy excellent in plating property and electrical conductivity and thin sheet or strip constituted of the same copper alloy |
EP0767244A1 (en) * | 1995-08-10 | 1997-04-09 | Mitsubishi Shindoh Co., Ltd. | High-strength copper based alloy free from smutting during pretreatment for plating |
JPH1017956A (en) * | 1996-06-27 | 1998-01-20 | Mitsubishi Materials Corp | Method for inoculating c into molten ferrum-containing copper alloy |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6270541A (en) * | 1985-09-20 | 1987-04-01 | Mitsubishi Metal Corp | Cu-alloy lead material for semiconductor device |
JPS6293325A (en) * | 1985-10-18 | 1987-04-28 | Mitsubishi Shindo Kk | Cu alloy lead material for semiconductor device |
-
1999
- 1999-03-09 TW TW088103623A patent/TW442576B/en not_active IP Right Cessation
- 1999-03-09 CN CN99800259A patent/CN1102177C/en not_active Expired - Lifetime
- 1999-03-09 EP EP99939202A patent/EP0995808B1/en not_active Expired - Lifetime
- 1999-03-09 DE DE19980583T patent/DE19980583T1/en not_active Withdrawn
- 1999-03-09 WO PCT/JP1999/001116 patent/WO1999046415A1/en active IP Right Grant
- 1999-03-09 KR KR1019997010404A patent/KR100562790B1/en not_active IP Right Cessation
-
2000
- 2000-12-09 HK HK00107927A patent/HK1028425A1/en not_active IP Right Cessation
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1180893A (en) * | 1967-06-26 | 1970-02-11 | Olin Mathieson | Copper Base Alloy. |
US3522039A (en) * | 1967-06-26 | 1970-07-28 | Olin Mathieson | Copper base alloy |
US3522038A (en) * | 1967-06-26 | 1970-07-28 | Olin Corp | Copper base alloy |
US4668471A (en) * | 1985-05-08 | 1987-05-26 | Mitsubishi Shindoh Co., Ltd. | Copper alloy lead material for leads of a semiconductor device |
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
JPH02111850A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Manufacture of copper alloy for lead frame |
JPH02111828A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Manufacture of copper alloy for lead frame |
JPH02111829A (en) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | Copper alloy for lead frame |
EP0384260A1 (en) * | 1989-02-21 | 1990-08-29 | Mitsubishi Shindoh Co., Ltd. | Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated |
JPH0441631A (en) * | 1990-06-04 | 1992-02-12 | Mitsubishi Shindoh Co Ltd | High strength cu alloy for lead frame of semiconductor device |
JPH07242965A (en) * | 1994-03-03 | 1995-09-19 | Mitsubishi Materials Corp | Copper alloy excellent in plating property and electrical conductivity and thin sheet or strip constituted of the same copper alloy |
EP0767244A1 (en) * | 1995-08-10 | 1997-04-09 | Mitsubishi Shindoh Co., Ltd. | High-strength copper based alloy free from smutting during pretreatment for plating |
JPH1017956A (en) * | 1996-06-27 | 1998-01-20 | Mitsubishi Materials Corp | Method for inoculating c into molten ferrum-containing copper alloy |
Non-Patent Citations (5)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 219 (C - 0943) 22 May 1992 (1992-05-22) * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) * |
See also references of WO9946415A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999046415A1 (en) | 1999-09-16 |
DE19980583T1 (en) | 2000-04-13 |
TW442576B (en) | 2001-06-23 |
CN1102177C (en) | 2003-02-26 |
EP0995808A1 (en) | 2000-04-26 |
KR20010012450A (en) | 2001-02-15 |
KR100562790B1 (en) | 2006-03-21 |
HK1028425A1 (en) | 2001-02-16 |
EP0995808B1 (en) | 2009-08-26 |
CN1256715A (en) | 2000-06-14 |
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