HK1004600A1 - Film peeling method and apparatus - Google Patents

Film peeling method and apparatus

Info

Publication number
HK1004600A1
HK1004600A1 HK98103761A HK98103761A HK1004600A1 HK 1004600 A1 HK1004600 A1 HK 1004600A1 HK 98103761 A HK98103761 A HK 98103761A HK 98103761 A HK98103761 A HK 98103761A HK 1004600 A1 HK1004600 A1 HK 1004600A1
Authority
HK
Hong Kong
Prior art keywords
film peeling
peeling method
film
peeling
Prior art date
Application number
HK98103761A
Other languages
English (en)
Inventor
Fumio Hamamura
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Publication of HK1004600A1 publication Critical patent/HK1004600A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1989—Corner edge bending delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Pile Receivers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Labeling Devices (AREA)
HK98103761A 1994-08-03 1998-05-02 Film peeling method and apparatus HK1004600A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18229594 1994-08-03
JP6264973A JP2642317B2 (ja) 1994-08-03 1994-10-28 フィルム剥離方法及び装置

Publications (1)

Publication Number Publication Date
HK1004600A1 true HK1004600A1 (en) 1998-11-27

Family

ID=26501150

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103761A HK1004600A1 (en) 1994-08-03 1998-05-02 Film peeling method and apparatus

Country Status (9)

Country Link
US (1) US5676789A (xx)
JP (1) JP2642317B2 (xx)
KR (1) KR100210962B1 (xx)
CN (1) CN1044763C (xx)
DE (1) DE19519856A1 (xx)
GB (1) GB2292113B (xx)
HK (1) HK1004600A1 (xx)
MY (1) MY114172A (xx)
TW (1) TW336782U (xx)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100543024B1 (ko) * 1998-01-21 2006-05-25 삼성전자주식회사 액정표시장치의 편광판 제거장치
GB0027855D0 (en) * 2000-11-15 2000-12-27 Display Products Technology Lt Method and apparatus for de-laminating flexible laminates from rigid substrates
JP2002329965A (ja) * 2001-05-07 2002-11-15 New Create Kk 薄膜積層体の製造方法および製造装置
DE10230034B4 (de) * 2002-07-04 2006-10-12 Daimlerchrysler Ag Verfahren und Vorrichtung zum automatisierten Applizieren von Lackfolie auf Karosserieteile sowie automationsgerecht gestalteter Lackfolienverbund
DE10339067B4 (de) * 2003-08-26 2005-08-18 Daimlerchrysler Ag Verfahren und Vorrichtung zum automatisierten Applizieren von Lackfolie auf Karosserieteile
US20050224176A1 (en) * 2004-04-06 2005-10-13 Murphy Clifford J Apparatus and method for preparing shims to be applied to brake pads
WO2006003816A1 (ja) * 2004-07-02 2006-01-12 Sharp Kabushiki Kaisha フィルム剥離方法と装置
TWI336603B (en) * 2004-12-03 2011-01-21 Ngk Spark Plug Co Method and apparatus for producing a wiring board, including film-peeling
JP4836807B2 (ja) * 2007-01-09 2011-12-14 日本メクトロン株式会社 薄膜フィルム剥離具
JP5305604B2 (ja) 2007-03-16 2013-10-02 株式会社東芝 粘着フィルムの剥離装置及び液晶パネルの製造方法
JP5009842B2 (ja) * 2008-03-13 2012-08-22 日本碍子株式会社 マスク自動剥し装置
US20090229766A1 (en) * 2008-03-14 2009-09-17 Aveldson Jason L Adhesive removal device
WO2009125651A1 (ja) * 2008-04-11 2009-10-15 リンテック株式会社 シート剥離装置及び剥離方法
CN102059842B (zh) * 2009-11-12 2013-04-17 南亚电路板股份有限公司 分离装置及其分离方法
CN102064087B (zh) * 2010-10-22 2012-10-03 上海技美电子科技有限公司 撕膜方法、撕膜装置及撕膜设备
DK3301031T3 (da) * 2012-05-03 2019-08-12 Vanrx Pharmasystems Inc Dækselfjernelsessystem til anvendelse i indelukker med kontrolleret miljø
ITBO20120581A1 (it) * 2012-10-25 2014-04-26 Marchesini Group Spa Metodo per rimuovere la pellicola di sigillatura da un contenitore e dispositivo che attua tale metodo
JP5778116B2 (ja) * 2012-11-05 2015-09-16 日東電工株式会社 粘着シート貼付け方法および粘着シート貼付け装置
TWI542470B (zh) * 2012-11-14 2016-07-21 財團法人工業技術研究院 薄膜剝離裝置及其方法
CN103802441B (zh) * 2012-11-14 2016-06-08 财团法人工业技术研究院 薄膜剥离装置及其方法
US20140238617A1 (en) * 2013-02-28 2014-08-28 General Electric Company System and method for removal of a layer
CN103253545B (zh) * 2013-04-26 2015-06-17 吴江市博众精工科技有限公司 一种物料剥离机构
DE102013216710B3 (de) * 2013-08-22 2015-02-05 Bombardier Transportation Gmbh Prüfung der Haftung von elastischen Klebstoffen oder elastischen Dichtungsmaterialien auf Oberflächen von Bauteilen
CN103496610B (zh) * 2013-10-14 2015-12-23 吴江市博众精工科技有限公司 一种揭膜机构
US9751293B2 (en) * 2014-12-04 2017-09-05 Industrial Technology Research Institute Laminated substrate separating device and method for separating laminated substrate
KR101844664B1 (ko) * 2016-07-21 2018-05-14 주식회사 프로텍 기판 부착 캐리어 분리 시스템 및 그 방법
CN106985500B (zh) * 2017-05-18 2019-10-08 深圳市创新特科技有限公司 顶角粘黏铜膜剥离设备
CN109205351A (zh) * 2017-07-04 2019-01-15 青岛微科机器人有限公司 膜分离操作装置
CN107910290A (zh) * 2017-11-20 2018-04-13 浙江工业大学 一种微观物料的转印刷方法及装置
CN108155270B (zh) * 2017-12-13 2019-09-20 北京创昱科技有限公司 一种薄膜与晶片的分离装置和分离方法
CN110415615A (zh) * 2018-04-28 2019-11-05 上海维锐智能科技有限公司 一种薄膜面板贴装装置
JP6916223B2 (ja) * 2019-01-30 2021-08-11 日機装株式会社 剥離装置
JP7149238B2 (ja) * 2019-08-09 2022-10-06 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
US11548273B2 (en) * 2020-01-31 2023-01-10 Asmpt Singapore Pte. Ltd. Apparatus and method for removing a film from a surface
US11889742B2 (en) 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
CN112092400B (zh) * 2020-11-17 2021-02-12 江苏创源电子有限公司 一种振动器贴胶设备
JP2022124709A (ja) * 2021-02-16 2022-08-26 株式会社ディスコ 剥離装置
CN113103731B (zh) * 2021-05-21 2022-08-23 深圳源明杰科技股份有限公司 一种oca撕膜机
CN113411984B (zh) * 2021-07-19 2022-10-25 深圳市欣中大自动化技术有限公司 一种撕膜机构及fpc覆膜装置
CN113923873B (zh) * 2021-10-13 2023-03-24 深圳市智晟威自动化科技有限公司 一种撕膜转接系统
CN116062264A (zh) * 2021-10-29 2023-05-05 三赢科技（深圳）有限公司 撕膜装置
TWI814360B (zh) * 2022-04-27 2023-09-01 博訊生物科技股份有限公司 用於分子檢驗的核酸萃取裝置、方法及撕膜機構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1595436A (en) * 1976-11-22 1981-08-12 Fuji Photo Film Co Ltd Process of stripping developing a photosensitive material and apparatus therefor
US4637850A (en) * 1983-11-22 1987-01-20 Canon Kabushiki Kaisha Press apparatus for planar members
DE3532553C1 (de) * 1985-09-12 1987-03-12 Loehr & Herrmann Gmbh Verfahren und Vorrichtung zum Abziehen der Schutzfolie von einer mit belichtetem Fotoresist beschichteten Leiterplatte
JPS63250190A (ja) * 1987-04-06 1988-10-18 ソマ−ル株式会社 薄膜剥離用引起装置
JPH0522524Y2 (xx) * 1988-03-03 1993-06-10
US5240546A (en) * 1991-04-26 1993-08-31 Sumitomo Electric Industries, Ltd. Apparatus for peeling semiconductor substrate
JP2720244B2 (ja) * 1992-06-11 1998-03-04 富士写真フイルム株式会社 積層方法
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5417922A (en) * 1993-05-14 1995-05-23 Board Of Regents - University Of Nebraska Specimen carrier

Also Published As

Publication number Publication date
JP2642317B2 (ja) 1997-08-20
CN1119404A (zh) 1996-03-27
TW336782U (en) 1998-07-11
JPH0899769A (ja) 1996-04-16
KR100210962B1 (ko) 1999-07-15
DE19519856A1 (de) 1996-02-08
KR960009813A (ko) 1996-03-22
CN1044763C (zh) 1999-08-18
GB9510534D0 (en) 1995-07-19
GB2292113A (en) 1996-02-14
US5676789A (en) 1997-10-14
GB2292113B (en) 1997-11-05
MY114172A (en) 2002-08-30

Similar Documents

Publication Publication Date Title
GB2292113B (en) Film peeling method and apparatus
EP0761317A4 (en) COATING METHOD AND DEVICE
GB9622561D0 (en) Completion apparatus and method
EP0832466A4 (en) COMPUTER-CREATED SELF-CATCHING METHOD AND SYSTEM
GB2285964B (en) Label-applying method and apparatus
HK1001857A1 (en) Stamp-making method and apparatus
AU4244796A (en) Delaminating method and apparatus
SG34246A1 (en) Printing apparatus and method
HK1012306A1 (en) Method and device for peeling a film
SG52160A1 (en) Printing method and apparatus
AUPM606494A0 (en) Apparatus and method
GB2300181B (en) Web-up apparatus and method
GB2307049B (en) Filrtration apparatus and method
GB2295576B (en) De-laminator apparatus and method
HK1024752A1 (en) Photographic apparatus and method
EP0452552A3 (en) Film peeling method and apparatus for practicing same
SG49143A1 (en) Film applying method and film applying apparatus
AU6543094A (en) Film cleaning apparatus and method
GB9515394D0 (en) Method and apparatus
AU1761595A (en) Film wrapping apparatus and method
HUT62825A (en) Peeling apparatus for oil-seeds and method for operating the apparatus
SG54552A1 (en) Diamond-like thin film forming apparatus and method
GB9516916D0 (en) Apparatus and method
GB9409812D0 (en) Pasting apparatus and method
AUPM904194A0 (en) Method and apparatus

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040524