CN107910290A - 一种微观物料的转印刷方法及装置 - Google Patents

一种微观物料的转印刷方法及装置 Download PDF

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CN107910290A
CN107910290A CN201711153688.7A CN201711153688A CN107910290A CN 107910290 A CN107910290 A CN 107910290A CN 201711153688 A CN201711153688 A CN 201711153688A CN 107910290 A CN107910290 A CN 107910290A
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film
transferred
pinching
angle
collet
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许杨剑
潘常良
单庆鹏
马天杰
韩威
许雷
李攀磊
唐哲韬
赵帅
王效贵
梁利华
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Zhejiang University of Technology ZJUT
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
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Abstract

一种微观物料的转印刷方法，将待转移物料张紧，使待转移物料两端的夹紧角与物料垂直，将第二薄膜的粘结面与待转移物料粘结，保持第二薄膜两端的夹紧角为零，分离第二薄膜与待转移物料；将第二薄膜两端的夹紧角与薄膜垂直，保持第三薄膜两端的夹紧角为零，将第三薄膜的粘结面与第二薄膜粘结有物料的一面进行粘结，分离第三、第二薄膜，实现物料转印刷。一种微观物料的转印刷装置，包括基座，在基座上对称地铰接有两根支架，支架与支架间交叉地铰接有两根支撑杆；支架的末端铰接有夹头，夹头与旋转电机连接。本发明，通过调整薄膜的夹紧角，使其与物料间拉脱力大小产生变化，实现薄膜对物料粘结强度的控制，从而完成转印刷工作。

Description

一种微观物料的转印刷方法及装置
技术领域
本发明主要涉及涉及一种半导体器件的制造方法，特别涉及一种微观电子器件的转印刷方法。
背景技术
待转移的物料主要指的是把金属或半导体器件等电子元器件覆盖在一个微结构的薄片上之后，使之形成一个整体的片状薄板结构；再通过转印刷的方式将电子器件转移到电路板上。
转印刷关键的控制参数是薄膜和物料之间的粘结强度，即在薄膜需要粘结物料的时候可以通过控制使两者之间的粘结强度增强，而在需要脱离的时候可以通过控制使两者之间的粘结强度变小。
已有的可以控制薄膜和物料之间的粘结强度设计方案主要有以下5种：
1、运动控制转印刷。通过利用薄膜和物料之间的拉脱速度不同导致所需拉脱力不同（拉脱力大小反应粘结强度大小）这一特点实现对粘结强度的控制。
2、表面凹凸辅助控制转印刷。通过利用薄膜和物料之间接触面的凹凸变化程度不同导致拉脱力不同这一特点来实现控制。
3、切应力增强控制转印刷。薄膜与物料间裂纹起始位置剪应力越大，粘结强度越小，反之亦然。
4、激光驱动控制转印刷。激光脉冲产生接触面的局部高温，从而改变粘结强度。
5、气动控制转印刷。粘结强度由接触面附近加压密封的微通道调节控制。
如何能使转印刷更简便一直是需要改进的问题。
发明内容
为解决已有技术的问题，提供一种微观电子器件的转印刷方法，这种方法简单高效，实施方便。
为实现上述目的，本发明采用以下技术方案：
一种微观物料的转印刷方法，将待转移物料张紧，使待转移物料两端的夹紧角与物料垂直，将第二薄膜的粘结面与待转移物料粘结，保持第二薄膜两端的夹紧角为零，分离第二薄膜与待转移物料；将第二薄膜两端的夹紧角与薄膜垂直，保持第三薄膜两端的夹紧角为零，将第三薄膜的粘结面与第二薄膜粘结有物料的一面进行粘结，分离第三、第二薄膜，将物料转移到第三薄膜的粘结面。
一种微观物料的转印刷装置，包括基座，在基座上对称地铰接有两根支架，支架与支架间交叉地铰接有两根支撑杆；支架的末端铰接有夹头，夹头与旋转电机连接。
上述的一种微观物料的转印刷装置，夹头包括活动夹板，活动夹板与夹头通过螺栓连接。
薄膜的粘结面是指带粘胶的一面。
本发明区别与现有技术，通过调整薄膜的夹紧角，使其与物料间拉脱力大小产生变化，实现薄膜对物料粘结强度的控制，从而完成转印刷工作。
附图说明
图1为本发明转印刷起始状态示意图。
图2为本发明第二薄膜与待转移物料粘结时的状态示意图。
图3为本发明第二薄膜与待转移物料分离时的状态示意图。
图4为本发明待转移物料在薄膜上的排列示意图。
图5为本发明薄膜与物料不同夹紧角时的脱离示意图。
图6为本发明第二薄膜与待转移物料的粘结装置结构示意图。
图7为夹头结构示意图。
图中标记为：1电子器件，2待转移物料，3第二薄膜，4基座，5支架，6夹头，61夹头旋转电机，62活动夹板，63夹紧角为零的夹头，64夹紧角与物料垂直的夹头。
具体实施方式
参照附图，一种微观物料的转印刷装置，包括基座4，在基座上对称地铰接有两根支架5，支架与支架间交叉地铰接有两根支撑杆7；支架的末端铰接有夹头8，夹头与旋转电机61连接；夹头包括活动夹板62，活动夹板与夹头通过螺栓连接。
将待转移物料固定在下方的转印刷装置上，通过活动夹板与夹头将待转移物料夹紧，旋转电机驱动夹头旋转90度，使夹头64与待转移物料保护垂直状态；将第二薄膜3与上方的转印刷装置固定，并且将夹头63保持水平，使夹紧角为零，将第二薄膜的粘结面与待转移物料粘结，分离第二薄膜与待转移物料，电子器件转印到第二薄膜3上；再旋转电机，使夹头相对于第二薄膜的夹紧角垂直，保持第三薄膜两端的夹紧角为零，将第三薄膜的粘结面与第二薄膜粘结有物料的一面进行粘结，分离第三、第二薄膜，将电子器件物料转移到第三薄膜的粘结面。
相互粘结的两张薄膜与物料表面粘性相同的情况下，角度越大，所需拉脱力越小。通过控制夹头与薄膜的夹紧角，调整薄膜与物料间的拉胶力，最终实现电子器件的转印刷。

Claims (3)

1.一种微观物料的转印刷方法，将待转移物料张紧，其特征在于使待转移物料两端的夹紧角与物料垂直，将第二薄膜的粘结面与待转移物料粘结，保持第二薄膜两端的夹紧角为零，分离第二薄膜与待转移物料；将第二薄膜两端的夹紧角与薄膜垂直，保持第三薄膜两端的夹紧角为零，将第三薄膜的粘结面与第二薄膜粘结有物料的一面进行粘结，分离第三、第二薄膜，将物料转移到第三薄膜的粘结面。
2.一种微观物料的转印刷装置，包括基座，其特征在于在基座上对称地铰接有两根支架，支架与支架间交叉地铰接有两根支撑杆；支架的末端铰接有夹头，夹头与旋转电机连接。
3.如权利要求2所述的一种微观物料的转印刷装置，其特征在于夹头包括活动夹板，活动夹板与夹头通过螺栓连接。
CN201711153688.7A 2017-11-20 2017-11-20 一种微观物料的转印刷方法及装置 Withdrawn CN107910290A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609720A (ja) * 1983-06-30 1985-01-18 Japan Steel Works Ltd:The 転写成形における転写用フイルムはぎ取り方法
CN1119404A (zh) * 1994-08-03 1996-03-27 苏马吕株式会社 薄膜剥离方法及其装置
CN101102645A (zh) * 2006-07-05 2008-01-09 株式会社日立制作所 对于基板的导电图案形成装置和导电图案形成方法
CN102821958A (zh) * 2010-03-30 2012-12-12 日本板硝子株式会社 转印体的制备方法
CN207783289U (zh) * 2017-11-20 2018-08-28 浙江工业大学 一种微观物料的转印刷装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609720A (ja) * 1983-06-30 1985-01-18 Japan Steel Works Ltd:The 転写成形における転写用フイルムはぎ取り方法
CN1119404A (zh) * 1994-08-03 1996-03-27 苏马吕株式会社 薄膜剥离方法及其装置
CN101102645A (zh) * 2006-07-05 2008-01-09 株式会社日立制作所 对于基板的导电图案形成装置和导电图案形成方法
CN102821958A (zh) * 2010-03-30 2012-12-12 日本板硝子株式会社 转印体的制备方法
CN207783289U (zh) * 2017-11-20 2018-08-28 浙江工业大学 一种微观物料的转印刷装置

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Application publication date: 20180413