HK1001438A1 - Composite magnetic material and product for eliminating electromagnetic interference - Google Patents
Composite magnetic material and product for eliminating electromagnetic interferenceInfo
- Publication number
- HK1001438A1 HK1001438A1 HK98100186A HK98100186A HK1001438A1 HK 1001438 A1 HK1001438 A1 HK 1001438A1 HK 98100186 A HK98100186 A HK 98100186A HK 98100186 A HK98100186 A HK 98100186A HK 1001438 A1 HK1001438 A1 HK 1001438A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- product
- magnetic material
- electromagnetic interference
- composite magnetic
- eliminating electromagnetic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
- H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Soft Magnetic Materials (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7183911A JPH0935927A (ja) | 1995-07-20 | 1995-07-20 | 複合磁性体及びそれを用いた電磁干渉抑制体 |
PCT/JP1996/002040 WO1997004469A1 (fr) | 1995-07-20 | 1996-07-22 | Materiau magnetique composite et produit pour eliminer les interferences electromagnetiques |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1001438A1 true HK1001438A1 (en) | 1998-06-19 |
Family
ID=16143978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98100186A HK1001438A1 (en) | 1995-07-20 | 1998-01-09 | Composite magnetic material and product for eliminating electromagnetic interference |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0785557B1 (fr) |
JP (1) | JPH0935927A (fr) |
KR (1) | KR100267358B1 (fr) |
CN (1) | CN1135574C (fr) |
DE (1) | DE69604771T2 (fr) |
HK (1) | HK1001438A1 (fr) |
TW (1) | TW305048B (fr) |
WO (1) | WO1997004469A1 (fr) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3404618B2 (ja) * | 1996-09-02 | 2003-05-12 | エヌイーシートーキン株式会社 | 電磁干渉抑制体 |
JP3475386B2 (ja) * | 1997-09-01 | 2003-12-08 | Necトーキン株式会社 | 電磁干渉抑制体 |
US6284363B1 (en) | 1998-03-23 | 2001-09-04 | Fuji Polymer Industries Co., Ltd. | Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same |
DK1097463T3 (da) * | 1998-07-10 | 2003-02-17 | Epcos Ag | Magnetiserbart produkt, brugen af samme såvel som en fremgangsmåde til fremstilling af samme |
JP2000058691A (ja) | 1998-08-07 | 2000-02-25 | Sharp Corp | ミリ波半導体装置 |
JP2000133986A (ja) * | 1998-10-27 | 2000-05-12 | Murata Mfg Co Ltd | 放射ノイズ抑制部品の取付構造 |
US6103134A (en) * | 1998-12-31 | 2000-08-15 | Motorola, Inc. | Circuit board features with reduced parasitic capacitance and method therefor |
CN1246868C (zh) | 1999-09-28 | 2006-03-22 | Nec东金株式会社 | 一种制造复合磁体的方法 |
DE19947130C1 (de) * | 1999-09-30 | 2000-11-02 | Siemens Ag | Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten |
JP2001126910A (ja) * | 1999-10-25 | 2001-05-11 | Tokin Corp | 複合磁性体、複合磁性体シートおよびそれらの製造方法 |
DE10000523A1 (de) * | 2000-01-08 | 2001-07-26 | Inst Maschinen Antriebe Und El | Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz |
DE10016380C2 (de) * | 2000-03-29 | 2002-01-24 | Infineon Technologies Ag | Gehäuse für ein elektrisches Bauteil |
MY131112A (en) * | 2000-04-04 | 2007-07-31 | Nec Tokin Corp | Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
JP4623244B2 (ja) | 2000-04-11 | 2011-02-02 | 信越化学工業株式会社 | 電磁波吸収性熱伝導性シリコーンゴム組成物 |
DE10024439A1 (de) * | 2000-05-19 | 2001-12-06 | Koppe Franz | Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile |
JP3723927B2 (ja) | 2000-07-11 | 2005-12-07 | 日本ライナー株式会社 | エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法 |
JP2002064189A (ja) | 2000-08-21 | 2002-02-28 | Tokin Corp | マグネティック・ランダム・アクセス・メモリ |
JP3865601B2 (ja) | 2001-06-12 | 2007-01-10 | 日東電工株式会社 | 電磁波抑制体シート |
JP2002374092A (ja) * | 2001-06-15 | 2002-12-26 | Polymatech Co Ltd | 放熱性電波吸収体 |
JP3864773B2 (ja) * | 2001-12-10 | 2007-01-10 | 三菱マテリアル株式会社 | 広い周波数帯域の高周波に対して優れた電波吸収特性を示す電波吸収体用混合粉末および電波吸収体 |
DE10162637C1 (de) * | 2001-12-20 | 2003-08-21 | Eupec Gmbh & Co Kg | Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat |
DE10229542B4 (de) | 2002-07-01 | 2004-05-19 | Infineon Technologies Ag | Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben |
WO2004061876A1 (fr) * | 2002-12-27 | 2004-07-22 | Tdk Corporation | Substance granulaire, film mince magnetique et dispositif magnetique |
JP2004266784A (ja) * | 2003-01-10 | 2004-09-24 | Murata Mfg Co Ltd | ノイズフィルタ |
WO2004086837A1 (fr) | 2003-03-25 | 2004-10-07 | Shin-Etsu Polymer Co., Ltd. | Suppresseur de bruit electromagnetique, article comportant une fonction de suppression de bruit electromagnetique et procedes de fabrication de ceux-ci |
WO2005081609A1 (fr) | 2004-02-24 | 2005-09-01 | Shin-Etsu Polymer Co., Ltd. | Suppresseur du bruit du aux ondes electromagnetiques, corps structural dote d’une fonction de suppression du bruit du aux ondes electromagnetiques et leur procede de fabrication |
WO2006059771A1 (fr) * | 2004-12-03 | 2006-06-08 | Nitta Corporation | Inhibiteur d’ interférence électromagnetique, dispositif d’antenne et appareil de communication électronique |
DE102005022473B4 (de) * | 2005-05-14 | 2007-05-24 | Forschungszentrum Karlsruhe Gmbh | Vorrichtung zur Dämpfung von Reflexionen elektromagnetischer Wellen, Verfahren zu ihrer Herstellung und ihre Verwendung |
KR100716679B1 (ko) * | 2005-10-27 | 2007-05-09 | 한국과학기술연구원 | 노이즈 감쇄층, 노이즈 감쇄 회로기판 및 이들의 제조방법 |
KR100712836B1 (ko) * | 2005-11-02 | 2007-05-04 | 한국과학기술연구원 | 전자기파 간섭 차폐용 다층 필름 및 이를 포함하는회로기판 |
US8378777B2 (en) | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
US8466764B2 (en) | 2006-09-12 | 2013-06-18 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
US9589716B2 (en) | 2006-09-12 | 2017-03-07 | Cooper Technologies Company | Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets |
US8941457B2 (en) | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
JPWO2010004996A1 (ja) * | 2008-07-10 | 2012-01-05 | アルプス電気株式会社 | 熱伝導性ノイズ抑制シート |
US9859043B2 (en) | 2008-07-11 | 2018-01-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8659379B2 (en) | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
JP5161813B2 (ja) * | 2008-10-10 | 2013-03-13 | Dowaエレクトロニクス株式会社 | 混合フェライト粉およびその製造方法、並びに、電波吸収体 |
JP5912278B2 (ja) * | 2011-04-06 | 2016-04-27 | Necトーキン株式会社 | 電磁干渉抑制体 |
KR101209979B1 (ko) | 2011-10-24 | 2012-12-07 | 엘지이노텍 주식회사 | 차폐장치 및 무선전력 송신장치 |
DE102011087263A1 (de) * | 2011-11-28 | 2013-05-29 | Lenze Drives Gmbh | Abschirmvorrichtung für elektrische Einheiten |
CN103377787B (zh) * | 2012-04-25 | 2016-06-01 | 比亚迪股份有限公司 | 一种nfc磁片用浆料及其制备方法和一种nfc磁片 |
CN102892279B (zh) * | 2012-09-06 | 2015-09-02 | 刘伟德 | 一种电磁屏蔽材料、应用及其制造方法 |
US9418780B2 (en) | 2012-12-06 | 2016-08-16 | Samsung Electronics Co., Ltd. | Magnetic composite material |
CN104134513A (zh) * | 2013-05-02 | 2014-11-05 | 杨立章 | 软磁复合薄膜和制造方法及其在电子设备中的应用 |
WO2015173196A1 (fr) * | 2014-05-14 | 2015-11-19 | Dsm Ip Assets B.V. | Composition de matériau magnétique doux et composant constitué du matériau |
CN108476604B (zh) | 2015-10-27 | 2020-11-03 | 汉高股份有限及两合公司 | 用于低频emi屏蔽的导电组合物 |
WO2017078404A1 (fr) * | 2015-11-02 | 2017-05-11 | 주식회사 아모그린텍 | Particules magnétiques de forme anisotrope, feuille absorbant les ondes électromagnétiques contenant celles-ci, et module d'antenne contenant celle-ci |
JP6407186B2 (ja) * | 2016-03-23 | 2018-10-17 | Tdk株式会社 | 電子回路パッケージ |
CN106229104A (zh) * | 2016-08-31 | 2016-12-14 | 北京康普锡威科技有限公司 | 一种软磁复合粉末及其磁粉芯制备方法 |
JP6934660B2 (ja) * | 2017-07-31 | 2021-09-15 | 北川工業株式会社 | 電磁波抑制シート |
EP3439438B1 (fr) | 2017-08-02 | 2024-10-09 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Feuille magnétique non uniforme incorporé dans une porteuse de composant |
EP3780925A4 (fr) | 2018-03-30 | 2021-12-22 | Daikin Industries, Ltd. | Matériau d'absorption d'ondes radioelectriques et feuille d'absorption d'ondes radioélectriques |
TWI787517B (zh) * | 2018-06-08 | 2022-12-21 | 日商麥克賽爾股份有限公司 | 電磁波吸收體及電磁波吸收體用組成物 |
CN109411887B (zh) * | 2018-12-07 | 2024-04-05 | 厦门大学嘉庚学院 | 三维镜像工型缝隙分形偶极子超宽频带天线及终端 |
WO2021065672A1 (fr) * | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | Couvercle de dispositif électronique, boîtier, dispositif électronique et module électronique |
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Publication number | Priority date | Publication date | Assignee | Title |
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US2873225A (en) * | 1957-05-20 | 1959-02-10 | Adams Edmond | Magnetic flake core |
CA2005198A1 (fr) * | 1989-01-26 | 1990-07-26 | Charles E. Boyer, Iii | Absorbeur de micro-ondes a filaments metalliques magnetiques aciculaires |
JPH04108666A (ja) * | 1990-08-30 | 1992-04-09 | Tokin Corp | 複合型フェライト材料及びその製造方法 |
JPH04352498A (ja) * | 1991-05-30 | 1992-12-07 | Mitsui Toatsu Chem Inc | 高透磁率を有する電磁シールド用絶縁ペースト |
JPH0595197A (ja) * | 1991-10-01 | 1993-04-16 | Mitsui Toatsu Chem Inc | プリント配線板およびそれに用いる基板 |
JPH06251928A (ja) * | 1992-12-29 | 1994-09-09 | Sony Corp | フェライト樹脂 |
JPH0818271A (ja) * | 1994-06-27 | 1996-01-19 | Tokin Corp | 電子装置およびそのノイズ抑制方法 |
JP3401650B2 (ja) * | 1994-01-20 | 2003-04-28 | エヌイーシートーキン株式会社 | 電磁波干渉抑制体 |
FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
JPH0993034A (ja) * | 1995-09-22 | 1997-04-04 | Tokin Corp | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
-
1995
- 1995-07-20 JP JP7183911A patent/JPH0935927A/ja active Pending
-
1996
- 1996-07-20 TW TW085108847A patent/TW305048B/zh not_active IP Right Cessation
- 1996-07-22 KR KR1019970701959A patent/KR100267358B1/ko not_active IP Right Cessation
- 1996-07-22 WO PCT/JP1996/002040 patent/WO1997004469A1/fr active IP Right Grant
- 1996-07-22 EP EP96924176A patent/EP0785557B1/fr not_active Expired - Lifetime
- 1996-07-22 CN CNB961910607A patent/CN1135574C/zh not_active Expired - Lifetime
- 1996-07-22 DE DE69604771T patent/DE69604771T2/de not_active Expired - Lifetime
-
1998
- 1998-01-09 HK HK98100186A patent/HK1001438A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0785557A1 (fr) | 1997-07-23 |
CN1165579A (zh) | 1997-11-19 |
DE69604771D1 (de) | 1999-11-25 |
WO1997004469A1 (fr) | 1997-02-06 |
JPH0935927A (ja) | 1997-02-07 |
TW305048B (fr) | 1997-05-11 |
CN1135574C (zh) | 2004-01-21 |
EP0785557B1 (fr) | 1999-10-20 |
EP0785557A4 (fr) | 1997-07-30 |
KR100267358B1 (ko) | 2000-10-16 |
KR970706588A (ko) | 1997-11-03 |
DE69604771T2 (de) | 2000-03-09 |
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Legal Events
Date | Code | Title | Description |
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PF | Patent in force | ||
PE | Patent expired |
Effective date: 20160721 |