FR2502525A1 - Procede et appareil pour le soudage de pieces a la machine, en particulier de plaquettes de circuits imprimes - Google Patents
Procede et appareil pour le soudage de pieces a la machine, en particulier de plaquettes de circuits imprimes Download PDFInfo
- Publication number
- FR2502525A1 FR2502525A1 FR8204971A FR8204971A FR2502525A1 FR 2502525 A1 FR2502525 A1 FR 2502525A1 FR 8204971 A FR8204971 A FR 8204971A FR 8204971 A FR8204971 A FR 8204971A FR 2502525 A1 FR2502525 A1 FR 2502525A1
- Authority
- FR
- France
- Prior art keywords
- welding
- parts
- movement
- station
- fact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 60
- 230000008569 process Effects 0.000 claims abstract description 40
- 238000001035 drying Methods 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims description 20
- 239000000945 filler Substances 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 8
- 230000003750 conditioning effect Effects 0.000 claims description 4
- 150000001768 cations Chemical class 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 206010013647 Drowning Diseases 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000238876 Acari Species 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JCCNYMKQOSZNPW-UHFFFAOYSA-N loratadine Chemical compound C1CN(C(=O)OCC)CCC1=C1C2=NC=CC=C2CCC2=CC(Cl)=CC=C21 JCCNYMKQOSZNPW-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 235000021178 picnic Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003797 telogen phase Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3111809A DE3111809C2 (de) | 1981-03-25 | 1981-03-25 | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2502525A1 true FR2502525A1 (fr) | 1982-10-01 |
| FR2502525B1 FR2502525B1 (enExample) | 1985-05-17 |
Family
ID=6128282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8204971A Granted FR2502525A1 (fr) | 1981-03-25 | 1982-03-24 | Procede et appareil pour le soudage de pieces a la machine, en particulier de plaquettes de circuits imprimes |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4512508A (enExample) |
| JP (1) | JPS5886971A (enExample) |
| DE (1) | DE3111809C2 (enExample) |
| FR (1) | FR2502525A1 (enExample) |
| GB (1) | GB2098905B (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2572972A1 (fr) * | 1984-11-15 | 1986-05-16 | Outillages Scient Lab | Machine de soudage. |
| EP0278885A1 (fr) * | 1987-02-12 | 1988-08-17 | O.S.L. Outillages Scientifiques Et De Laboratoires S.A. | Installation pour la soudure à l'étain de circuits imprimés sur une plaque-support |
| BE1001750A5 (fr) * | 1986-12-03 | 1990-02-27 | Tamura Seisakusho Kk | Appareil de soudage automatique. |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027468A (ja) * | 1983-07-25 | 1985-02-12 | Ideya:Kk | 半田デイツプ装置 |
| KR890004818B1 (ko) * | 1983-11-14 | 1989-11-27 | 네혼덴네쯔 게이기 가부시기 가이샤 | Ic용 전자동 납땜장치 |
| DE3419974A1 (de) * | 1984-05-29 | 1985-12-05 | Ernst 6983 Kreuzwertheim Hohnerlein | Heizvorrichtung fuer eine transportstrasse |
| US4637541A (en) * | 1985-06-28 | 1987-01-20 | Unit Industries, Inc. | Circuit board soldering device |
| US4776508A (en) * | 1985-06-28 | 1988-10-11 | Unit Design Inc. | Electronic component lead tinning device |
| KR920008948B1 (ko) * | 1987-02-12 | 1992-10-12 | 니혼 덴네쯔 게이기 가부시끼가이샤 | 프린트 기판의 납땜방법 및 그의 장치 |
| US4840305A (en) * | 1987-03-30 | 1989-06-20 | Westinghouse Electric Corp. | Method for vapor phase soldering |
| DE3724005A1 (de) * | 1987-07-21 | 1989-02-02 | Friedrich Dieter | Prozessgesteuerte erwaermungseinrichtung |
| US5433368A (en) * | 1992-11-10 | 1995-07-18 | Spigarelli; Donald J. | Soldering system |
| DE19541340A1 (de) * | 1995-11-06 | 1997-05-15 | Linde Ag | Verfahren zum kontinuierlichen, selektiven Löten von Baueinheiten, insbesondere Leiterplatten |
| US5797539A (en) * | 1996-08-22 | 1998-08-25 | Eastman Kodak Company | Circuit board reflow ovens |
| JP4238400B2 (ja) * | 1998-01-14 | 2009-03-18 | 株式会社デンソー | 噴流半田付け方法及びその装置 |
| JP2002172459A (ja) | 2000-09-26 | 2002-06-18 | Sony Corp | はんだ付け装置 |
| JP2003188517A (ja) * | 2001-12-18 | 2003-07-04 | Senju Metal Ind Co Ltd | プリント基板の部分はんだ付け方法およびその装置 |
| PL2029307T3 (pl) * | 2006-05-29 | 2011-07-29 | Kirsten Soldering Ag | Urządzenie do lutowania z modułami do lutowania i co najmniej jedną mobilną i wymienną stacją do lutowania wstawianą w moduł do lutowania; odpowiadająca stacja rezerwowa (stand-by) |
| CN109227052B (zh) * | 2018-10-30 | 2020-06-19 | 湖南旺达机械制造有限公司 | 一种板材的铆焊工艺 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671264A (en) * | 1952-05-24 | 1954-03-09 | Rca Corp | Method of soldering printed circuits |
| US3218193A (en) * | 1961-09-19 | 1965-11-16 | Leesona Corp | Automatic foam fluxing |
| DE7512723U (de) * | 1975-02-19 | 1975-09-04 | Iemme Italia Spa | Mittels Zinnschmelzwelle arbeitende Schweißmaschine |
| JPS54146250A (en) * | 1978-05-09 | 1979-11-15 | Toshiba Corp | Method and apparatus for automatic soldering |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB801510A (en) * | 1954-01-11 | 1958-09-17 | Sylvania Electric Prod | Soldering machine and method |
| GB846961A (en) * | 1957-12-03 | 1960-09-07 | Mullard Ltd | Improvements in or relating to soldering printed circuits |
| FR1345595A (fr) * | 1962-08-21 | 1963-12-13 | Chausson Usines Sa | Installation pour le soudage de faisceaux d'échangeurs thermiques, notamment de radiateurs de refroidissement et radiateurs obtenus |
| GB1004225A (en) * | 1963-03-27 | 1965-09-15 | Electrovert Mfg Co Ltd | Apparatus for processing with a liquid |
| GB1122913A (en) * | 1966-02-07 | 1968-08-07 | M E L Equipment Co Ltd | Processes and apparatus wherein a mound of liquid is raised by vibrations |
| US3421211A (en) * | 1966-03-17 | 1969-01-14 | Hewlett Packard Co | Method of making and cleaning printed circuit assemblies |
| US3430332A (en) * | 1966-04-01 | 1969-03-04 | Electrovert Mfg Co Ltd | Production line soldering with application of ultrasonic energy directing to molten solder |
| US3500536A (en) * | 1966-11-17 | 1970-03-17 | Burroughs Corp | Process for finishing solder joints on a circuit board |
| US3499220A (en) * | 1967-02-28 | 1970-03-10 | Amerace Esna Corp | Method of and apparatus for making a flexible,printed electrical circuit |
| US3465415A (en) * | 1967-03-08 | 1969-09-09 | Western Electric Co | Methods of eliminating icicle-like formations on wave soldered connections on circuit substrates |
| US3536243A (en) * | 1968-01-08 | 1970-10-27 | Branson Instr | Ultrasonic soldering apparatus |
| US3670698A (en) * | 1969-07-24 | 1972-06-20 | Bata Shoe Co | Apparatus for immersing lasted boots in a liquid bath |
| US3685714A (en) * | 1970-07-20 | 1972-08-22 | Libbey Owens Ford Co | Soldering apparatus |
| DE2148680A1 (de) * | 1971-09-29 | 1973-04-05 | Zevatron Gmbh | Automatische loetmaschine |
| NL7212888A (enExample) * | 1971-09-29 | 1973-04-02 | ||
| US3765591A (en) * | 1972-01-19 | 1973-10-16 | Dynamics Corp America | Wave soldering electrical connections |
| DD108706A1 (enExample) * | 1972-10-11 | 1974-10-05 | ||
| DE2428143A1 (de) * | 1974-06-11 | 1976-01-02 | Zevatron Gmbh | Schlepploetmaschine |
| US3945618A (en) * | 1974-08-01 | 1976-03-23 | Branson Ultrasonics Corporation | Sonic apparatus |
| JPS5540075A (en) * | 1978-09-14 | 1980-03-21 | Toshiba Corp | Carrier separating coupling mechanism of automatic soldering device |
| US4311266A (en) * | 1978-12-25 | 1982-01-19 | Kenshi Kondo | Soldering apparatus |
| CH639580A5 (de) * | 1979-01-23 | 1983-11-30 | Karl Flury | Loetanlage zum loeten von leiterplatten und verfahren zu deren betrieb. |
| BG29840A1 (en) * | 1979-06-28 | 1981-02-16 | Minchev | Apparatus for soldering the winding to the collector of electric machines |
| US4277518A (en) * | 1979-11-13 | 1981-07-07 | Gyrex Corp. | Solder-coating method |
| DE3006431C2 (de) * | 1980-02-21 | 1981-07-02 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zum Anlöten von an Trägerstreifen angeordneten Anschlußstiften an Schaltungsplatten und Tauchlötbad zur Durchführung des Verfahrens |
| GB2083773B (en) * | 1980-08-01 | 1984-10-24 | Aiwa Co | A soldering method for electric and/or electronic components |
-
1981
- 1981-03-25 DE DE3111809A patent/DE3111809C2/de not_active Expired
-
1982
- 1982-03-18 GB GB8207860A patent/GB2098905B/en not_active Expired
- 1982-03-23 US US06/360,955 patent/US4512508A/en not_active Expired - Fee Related
- 1982-03-24 FR FR8204971A patent/FR2502525A1/fr active Granted
- 1982-03-25 JP JP57048063A patent/JPS5886971A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671264A (en) * | 1952-05-24 | 1954-03-09 | Rca Corp | Method of soldering printed circuits |
| US3218193A (en) * | 1961-09-19 | 1965-11-16 | Leesona Corp | Automatic foam fluxing |
| DE7512723U (de) * | 1975-02-19 | 1975-09-04 | Iemme Italia Spa | Mittels Zinnschmelzwelle arbeitende Schweißmaschine |
| JPS54146250A (en) * | 1978-05-09 | 1979-11-15 | Toshiba Corp | Method and apparatus for automatic soldering |
Non-Patent Citations (1)
| Title |
|---|
| Patent Abstracts of Japan vol. 4, no. 12, 29 janvier 1980 page 59C71 & JP-A-54-146250 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2572972A1 (fr) * | 1984-11-15 | 1986-05-16 | Outillages Scient Lab | Machine de soudage. |
| EP0185566A1 (fr) * | 1984-11-15 | 1986-06-25 | Outillages Scientifiques Et De Laboratoires O.S.L. S.A. | Machine de soudage |
| US4616775A (en) * | 1984-11-15 | 1986-10-14 | Outillages Scientifiques Et De Laboratoires O.S.L. S.A. | Translatable soldering machine |
| BE1001750A5 (fr) * | 1986-12-03 | 1990-02-27 | Tamura Seisakusho Kk | Appareil de soudage automatique. |
| EP0278885A1 (fr) * | 1987-02-12 | 1988-08-17 | O.S.L. Outillages Scientifiques Et De Laboratoires S.A. | Installation pour la soudure à l'étain de circuits imprimés sur une plaque-support |
| FR2611109A1 (fr) * | 1987-02-12 | 1988-08-19 | Outillages Scient Lab | Installations de soudure automatique a l'etain |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5886971A (ja) | 1983-05-24 |
| GB2098905A (en) | 1982-12-01 |
| GB2098905B (en) | 1985-05-01 |
| DE3111809A1 (de) | 1982-12-30 |
| DE3111809C2 (de) | 1985-05-15 |
| FR2502525B1 (enExample) | 1985-05-17 |
| US4512508A (en) | 1985-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property | ||
| ST | Notification of lapse |