DE3111809C2 - Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken - Google Patents

Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken

Info

Publication number
DE3111809C2
DE3111809C2 DE3111809A DE3111809A DE3111809C2 DE 3111809 C2 DE3111809 C2 DE 3111809C2 DE 3111809 A DE3111809 A DE 3111809A DE 3111809 A DE3111809 A DE 3111809A DE 3111809 C2 DE3111809 C2 DE 3111809C2
Authority
DE
Germany
Prior art keywords
workpiece
soldering
solder
workpieces
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3111809A
Other languages
German (de)
English (en)
Other versions
DE3111809A1 (de
Inventor
Heino 3549 Twistetal-Nieder-Waroldern Pachschwöll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeva 3548 Arolsen De GmbH
Original Assignee
Zevatron Gesellschaft fur Fertigungseinrichtungen Der Elektronik 3548 Arolsen De GmbH
Zevatron Gesellschaft Fuer Fertigungseinrichtungen Der Elektronik 3548 Arolsen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zevatron Gesellschaft fur Fertigungseinrichtungen Der Elektronik 3548 Arolsen De GmbH, Zevatron Gesellschaft Fuer Fertigungseinrichtungen Der Elektronik 3548 Arolsen GmbH filed Critical Zevatron Gesellschaft fur Fertigungseinrichtungen Der Elektronik 3548 Arolsen De GmbH
Priority to DE3111809A priority Critical patent/DE3111809C2/de
Priority to GB8207860A priority patent/GB2098905B/en
Priority to US06/360,955 priority patent/US4512508A/en
Priority to FR8204971A priority patent/FR2502525A1/fr
Priority to JP57048063A priority patent/JPS5886971A/ja
Publication of DE3111809A1 publication Critical patent/DE3111809A1/de
Application granted granted Critical
Publication of DE3111809C2 publication Critical patent/DE3111809C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE3111809A 1981-03-25 1981-03-25 Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken Expired DE3111809C2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE3111809A DE3111809C2 (de) 1981-03-25 1981-03-25 Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken
GB8207860A GB2098905B (en) 1981-03-25 1982-03-18 A method and apparatus for the machine soldering of workpieces
US06/360,955 US4512508A (en) 1981-03-25 1982-03-23 Method and apparatus for the machine soldering of workpieces
FR8204971A FR2502525A1 (fr) 1981-03-25 1982-03-24 Procede et appareil pour le soudage de pieces a la machine, en particulier de plaquettes de circuits imprimes
JP57048063A JPS5886971A (ja) 1981-03-25 1982-03-25 部品の自動ハンダづけ方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3111809A DE3111809C2 (de) 1981-03-25 1981-03-25 Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken

Publications (2)

Publication Number Publication Date
DE3111809A1 DE3111809A1 (de) 1982-12-30
DE3111809C2 true DE3111809C2 (de) 1985-05-15

Family

ID=6128282

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3111809A Expired DE3111809C2 (de) 1981-03-25 1981-03-25 Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken

Country Status (5)

Country Link
US (1) US4512508A (enExample)
JP (1) JPS5886971A (enExample)
DE (1) DE3111809C2 (enExample)
FR (1) FR2502525A1 (enExample)
GB (1) GB2098905B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027468A (ja) * 1983-07-25 1985-02-12 Ideya:Kk 半田デイツプ装置
KR890004818B1 (ko) * 1983-11-14 1989-11-27 네혼덴네쯔 게이기 가부시기 가이샤 Ic용 전자동 납땜장치
DE3419974A1 (de) * 1984-05-29 1985-12-05 Ernst 6983 Kreuzwertheim Hohnerlein Heizvorrichtung fuer eine transportstrasse
FR2572972B1 (fr) * 1984-11-15 1987-02-13 Outillages Scient Lab Machine de soudage.
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
JPS63140763A (ja) * 1986-12-03 1988-06-13 Tamura Seisakusho Co Ltd 自動はんだ付け装置
KR920008948B1 (ko) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 프린트 기판의 납땜방법 및 그의 장치
FR2611109A1 (fr) * 1987-02-12 1988-08-19 Outillages Scient Lab Installations de soudure automatique a l'etain
US4840305A (en) * 1987-03-30 1989-06-20 Westinghouse Electric Corp. Method for vapor phase soldering
DE3724005A1 (de) * 1987-07-21 1989-02-02 Friedrich Dieter Prozessgesteuerte erwaermungseinrichtung
US5433368A (en) * 1992-11-10 1995-07-18 Spigarelli; Donald J. Soldering system
DE19541340A1 (de) * 1995-11-06 1997-05-15 Linde Ag Verfahren zum kontinuierlichen, selektiven Löten von Baueinheiten, insbesondere Leiterplatten
US5797539A (en) * 1996-08-22 1998-08-25 Eastman Kodak Company Circuit board reflow ovens
JP4238400B2 (ja) * 1998-01-14 2009-03-18 株式会社デンソー 噴流半田付け方法及びその装置
JP2002172459A (ja) 2000-09-26 2002-06-18 Sony Corp はんだ付け装置
JP2003188517A (ja) * 2001-12-18 2003-07-04 Senju Metal Ind Co Ltd プリント基板の部分はんだ付け方法およびその装置
PL2029307T3 (pl) * 2006-05-29 2011-07-29 Kirsten Soldering Ag Urządzenie do lutowania z modułami do lutowania i co najmniej jedną mobilną i wymienną stacją do lutowania wstawianą w moduł do lutowania; odpowiadająca stacja rezerwowa (stand-by)
CN109227052B (zh) * 2018-10-30 2020-06-19 湖南旺达机械制造有限公司 一种板材的铆焊工艺

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671264A (en) * 1952-05-24 1954-03-09 Rca Corp Method of soldering printed circuits
GB801510A (en) * 1954-01-11 1958-09-17 Sylvania Electric Prod Soldering machine and method
GB846961A (en) * 1957-12-03 1960-09-07 Mullard Ltd Improvements in or relating to soldering printed circuits
US3218193A (en) * 1961-09-19 1965-11-16 Leesona Corp Automatic foam fluxing
FR1345595A (fr) * 1962-08-21 1963-12-13 Chausson Usines Sa Installation pour le soudage de faisceaux d'échangeurs thermiques, notamment de radiateurs de refroidissement et radiateurs obtenus
GB1004225A (en) * 1963-03-27 1965-09-15 Electrovert Mfg Co Ltd Apparatus for processing with a liquid
GB1122913A (en) * 1966-02-07 1968-08-07 M E L Equipment Co Ltd Processes and apparatus wherein a mound of liquid is raised by vibrations
US3421211A (en) * 1966-03-17 1969-01-14 Hewlett Packard Co Method of making and cleaning printed circuit assemblies
US3430332A (en) * 1966-04-01 1969-03-04 Electrovert Mfg Co Ltd Production line soldering with application of ultrasonic energy directing to molten solder
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3499220A (en) * 1967-02-28 1970-03-10 Amerace Esna Corp Method of and apparatus for making a flexible,printed electrical circuit
US3465415A (en) * 1967-03-08 1969-09-09 Western Electric Co Methods of eliminating icicle-like formations on wave soldered connections on circuit substrates
US3536243A (en) * 1968-01-08 1970-10-27 Branson Instr Ultrasonic soldering apparatus
US3670698A (en) * 1969-07-24 1972-06-20 Bata Shoe Co Apparatus for immersing lasted boots in a liquid bath
US3685714A (en) * 1970-07-20 1972-08-22 Libbey Owens Ford Co Soldering apparatus
DE2148680A1 (de) * 1971-09-29 1973-04-05 Zevatron Gmbh Automatische loetmaschine
NL7212888A (enExample) * 1971-09-29 1973-04-02
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
DD108706A1 (enExample) * 1972-10-11 1974-10-05
DE2428143A1 (de) * 1974-06-11 1976-01-02 Zevatron Gmbh Schlepploetmaschine
US3945618A (en) * 1974-08-01 1976-03-23 Branson Ultrasonics Corporation Sonic apparatus
DE7512723U (de) * 1975-02-19 1975-09-04 Iemme Italia Spa Mittels Zinnschmelzwelle arbeitende Schweißmaschine
JPS54146250A (en) * 1978-05-09 1979-11-15 Toshiba Corp Method and apparatus for automatic soldering
JPS5540075A (en) * 1978-09-14 1980-03-21 Toshiba Corp Carrier separating coupling mechanism of automatic soldering device
US4311266A (en) * 1978-12-25 1982-01-19 Kenshi Kondo Soldering apparatus
CH639580A5 (de) * 1979-01-23 1983-11-30 Karl Flury Loetanlage zum loeten von leiterplatten und verfahren zu deren betrieb.
BG29840A1 (en) * 1979-06-28 1981-02-16 Minchev Apparatus for soldering the winding to the collector of electric machines
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
DE3006431C2 (de) * 1980-02-21 1981-07-02 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum Anlöten von an Trägerstreifen angeordneten Anschlußstiften an Schaltungsplatten und Tauchlötbad zur Durchführung des Verfahrens
GB2083773B (en) * 1980-08-01 1984-10-24 Aiwa Co A soldering method for electric and/or electronic components

Also Published As

Publication number Publication date
JPS5886971A (ja) 1983-05-24
GB2098905A (en) 1982-12-01
GB2098905B (en) 1985-05-01
FR2502525A1 (fr) 1982-10-01
DE3111809A1 (de) 1982-12-30
FR2502525B1 (enExample) 1985-05-17
US4512508A (en) 1985-04-23

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