FR2469858A1 - Procede et dispositif de revetement en soudure de plaquettes a circuits imprimes - Google Patents

Procede et dispositif de revetement en soudure de plaquettes a circuits imprimes

Info

Publication number
FR2469858A1
FR2469858A1 FR8022336A FR8022336A FR2469858A1 FR 2469858 A1 FR2469858 A1 FR 2469858A1 FR 8022336 A FR8022336 A FR 8022336A FR 8022336 A FR8022336 A FR 8022336A FR 2469858 A1 FR2469858 A1 FR 2469858A1
Authority
FR
France
Prior art keywords
plate
contact member
wafer
contact
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8022336A
Other languages
English (en)
Other versions
FR2469858B1 (fr
Inventor
Peter Schillke
Robert R Walls
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gyrex Corp
Original Assignee
Gyrex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gyrex Corp filed Critical Gyrex Corp
Publication of FR2469858A1 publication Critical patent/FR2469858A1/fr
Application granted granted Critical
Publication of FR2469858B1 publication Critical patent/FR2469858B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

UN PROCEDE D'APPLICATION EN CONTINU D'UN REVETEMENT EN SOUDURE A DES TROUS ET DES PISTES REVETUS DE CUIVRE D'UNE PLAQUETTE A CIRCUITS IMPRIMES EST DECRIT. LA SURFACE SUPERIEURE DE LA PLAQUETTE REVETUE D'UN FONDANT EST AMENEE EN CONTACT AVEC UN ORGANE DE CONTACT 32 ET LA PLAQUETTE 44 ET L'ORGANE DE CONTACT SONT ACHEMINES DANS UN BAIN DE SOUDURE EN FUSION 30. LA SOUDURE EST DEPLACEE PAR LA PLAQUETTE DE FACON A PRODUIRE UNE FORCE DE POUSSEE QUI APPLIQUE LA PLAQUETTE CONTRE L'ORGANE DE CONTACT. LA VITESSE DE L'ORGANE DE CONTACT EST CONTROLEE DE FACON A DEFINIR UN TEMPS D'ARRET DE LA PLAQUETTE ET A MAINTENIR LE CONTACT ENTRE LA PLAQUETTE DE L'ORGANE DE CONTACT. UN DISPOSITIF D'APPLICATION DU PROCEDE COMPREND UN MOYEN 30 CONTENANT UN BAIN DE SOUDURE EN FUSION ET UN MOYEN 32 VENANT EN CONTACT AVEC LA SURFACE SUPERIEURE DE LA PLAQUETTE. DE PLUS, LE DISPOSITIF COMPREND UN MOYEN POUR DEPLACER LA PLAQUETTE DANS LE BAIN ALORS QUE LA SOUDURE DEPLACEE EXERCE UNE FORCE DE POUSSEE SUR LA PLAQUETTE.
FR8022336A 1979-11-13 1980-10-17 Procede et dispositif de revetement en soudure de plaquettes a circuits imprimes Expired FR2469858B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/093,215 US4277518A (en) 1979-11-13 1979-11-13 Solder-coating method

Publications (2)

Publication Number Publication Date
FR2469858A1 true FR2469858A1 (fr) 1981-05-22
FR2469858B1 FR2469858B1 (fr) 1986-01-31

Family

ID=22237782

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8022336A Expired FR2469858B1 (fr) 1979-11-13 1980-10-17 Procede et dispositif de revetement en soudure de plaquettes a circuits imprimes

Country Status (8)

Country Link
US (1) US4277518A (fr)
JP (1) JPS5683991A (fr)
CA (1) CA1161570A (fr)
CH (1) CH642212A5 (fr)
DE (1) DE3038841A1 (fr)
FR (1) FR2469858B1 (fr)
GB (1) GB2063925B (fr)
IT (1) IT1205236B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390120A (en) * 1980-12-15 1983-06-28 Bell Telephone Laboratories, Incorporated Soldering methods and apparatus
DE3111809C2 (de) * 1981-03-25 1985-05-15 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
JPS59173374U (ja) * 1983-05-09 1984-11-19 凸版印刷株式会社 加熱装置
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels
DE3536304A1 (de) * 1985-10-11 1987-04-16 Kaspar Eidenberg Verfahren zum verzinnen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
US4766677A (en) * 1986-05-27 1988-08-30 Detrex Chemical Industries, Inc. Method and apparatus for vapor phase soldering
GB8613105D0 (en) * 1986-05-29 1986-07-02 Lymn P P A Solder leveller
JPS639188A (ja) * 1986-06-27 1988-01-14 テレダイン　インダストリ−ズ　インコ−ポレ−テツド プリント基板を半田処理する装置
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
WO1989000905A1 (fr) * 1987-08-06 1989-02-09 Gyrex Corporation Procede et appareil pour etamer des cartes de circuits imprimes
EP0329808A1 (fr) * 1988-02-25 1989-08-30 Gebr. Schmid GmbH & Co. Procédé et dispositif de nettoyage de plaque de circuit fraîchement étamées
DE3879929D1 (de) * 1988-02-25 1993-05-06 Schmid Gmbh & Co Geb Vorrichtung zur behandlung von elektrischen leiterplatten.
US4903631A (en) 1988-05-27 1990-02-27 Teledyne Industries, Inc. System for soldering printed circuits
US5007369A (en) * 1988-05-27 1991-04-16 Teledyne Industries, Inc. Apparatus for solder coating printed circuit panels
SE465432B (sv) * 1988-07-15 1991-09-09 Lars Lindblom Saett och anordning vid varmfoerzinkning av ett foeremaal
DE3935059C1 (fr) * 1989-10-20 1991-02-21 Juergen 8609 Bischberg De Ruemmer
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
US5180611A (en) * 1990-07-18 1993-01-19 Argus International Method for irradiation of printed wiring boards and the like
US5240738A (en) * 1991-12-31 1993-08-31 International Business Machines Corporation Method of applying solder to a flexible circuit
US5308658A (en) * 1993-02-03 1994-05-03 Teledyne Industries, Inc. Process and apparatus for efficient spray coating
US6042648A (en) * 1997-07-15 2000-03-28 Corey; Dave O. Vertical circuit board soldering apparatus
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
DE102011082537A1 (de) * 2011-09-12 2013-03-14 Robert Bosch Gmbh Leiterplatte und elektrische Bauteile zum Einsatz in aggressiver Umgebung und Verfahren zur Herstellung einer solchen Leiterplatte
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532262A (en) * 1966-11-03 1970-10-06 Zeva Elektrijzitaetsgesellscha Drag-soldering method and machine
US3721379A (en) * 1970-08-21 1973-03-20 Western Electric Co Apparatus for treating articles with a liquid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1011280A (en) * 1909-09-20 1911-12-12 Lufkin Foundry And Machine Company Soda-tank for dipping lumber.
US3000342A (en) * 1956-05-11 1961-09-19 United Shoe Machinery Corp Dip soldering machines
US3474500A (en) * 1967-11-14 1969-10-28 Du Pont Process and apparatus for forming a foam fiber batt
DE1935707A1 (de) * 1968-07-16 1970-02-19 Electrovert Mfg Co Ltd Verfahren und Vorrichtung zum UEberziehen von gedruckten Schaltungsplatten mit Flussmittel und anschliessender Beschichtung mit Zinn oder Lot
US3825994A (en) * 1972-11-15 1974-07-30 Rca Corp Method of soldering circuit components to a substrate
JPS5390136A (en) * 1977-01-20 1978-08-08 Matsushita Electric Ind Co Ltd Soldering apparatus
JPS556835U (fr) * 1978-06-28 1980-01-17
DE2856460C3 (de) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532262A (en) * 1966-11-03 1970-10-06 Zeva Elektrijzitaetsgesellscha Drag-soldering method and machine
US3721379A (en) * 1970-08-21 1973-03-20 Western Electric Co Apparatus for treating articles with a liquid

Also Published As

Publication number Publication date
DE3038841A1 (de) 1981-05-27
DE3038841C2 (fr) 1990-07-05
FR2469858B1 (fr) 1986-01-31
JPS643353B2 (fr) 1989-01-20
GB2063925B (en) 1984-01-25
IT1205236B (it) 1989-03-15
CA1161570A (fr) 1984-01-31
CH642212A5 (fr) 1984-03-30
JPS5683991A (en) 1981-07-08
IT8025927A0 (it) 1980-11-12
GB2063925A (en) 1981-06-10
US4277518A (en) 1981-07-07

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TP Transmission of property
ST Notification of lapse