ES475242A1 - Procedimiento para la produccion de una capa protectora de la soldadura sobre circuitos impresos. - Google Patents
Procedimiento para la produccion de una capa protectora de la soldadura sobre circuitos impresos.Info
- Publication number
- ES475242A1 ES475242A1 ES475242A ES475242A ES475242A1 ES 475242 A1 ES475242 A1 ES 475242A1 ES 475242 A ES475242 A ES 475242A ES 475242 A ES475242 A ES 475242A ES 475242 A1 ES475242 A1 ES 475242A1
- Authority
- ES
- Spain
- Prior art keywords
- rate
- circuit
- curtain
- contacting
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
- B05C5/004—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles the work consisting of separate rectangular flat articles, e.g. flat sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/005—Curtain coaters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Procedimiento para la producción de una capa protectora de la soldadura sobre circuitos impresos, en el que, en pasos sucesivos, se aplica en capa tenue al circuito impreso una substancia líquida endurecible por irradiación, especialmente con luz ultravioleta, se irradia esta capa conforme a imagen, respetando los lugares de soldadura, y a continuación se revela con un agente disolutor de los lugares no irradiados.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1418277 | 1977-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES475242A1 true ES475242A1 (es) | 1979-04-16 |
Family
ID=4398641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES475242A Expired ES475242A1 (es) | 1977-11-21 | 1978-11-20 | Procedimiento para la produccion de una capa protectora de la soldadura sobre circuitos impresos. |
Country Status (10)
Country | Link |
---|---|
US (1) | US4230793B1 (es) |
EP (1) | EP0002040B1 (es) |
JP (1) | JPS5482073A (es) |
AT (1) | AT367943B (es) |
CA (1) | CA1118530A (es) |
DE (1) | DE2861486D1 (es) |
ES (1) | ES475242A1 (es) |
IL (1) | IL56000A (es) |
IT (1) | IT1105948B (es) |
SU (1) | SU890997A3 (es) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4486466A (en) * | 1979-01-12 | 1984-12-04 | Kollmorgen Technologies Corporation | High resolution screen printable resists |
US4506004A (en) * | 1982-04-01 | 1985-03-19 | Sullivan Donald F | Printed wiring board |
JPS5764734A (en) * | 1980-10-08 | 1982-04-20 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element |
DE3114931A1 (de) * | 1981-04-13 | 1982-10-28 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial |
DE3134123A1 (de) * | 1981-08-28 | 1983-03-17 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial |
EP0075537B2 (de) * | 1981-09-17 | 1991-03-20 | Ciba-Geigy Ag | Verfahren zum Beschichten gedruckter Schaltungen |
US4657839A (en) * | 1981-10-21 | 1987-04-14 | Sullivan Donald F | Photoprinting process and apparatus for exposing paste-consistency photopolymers |
US4459320A (en) * | 1981-12-11 | 1984-07-10 | At&T Bell Laboratories | Maskless process for applying a patterned solder mask coating |
CA1198082A (en) * | 1981-12-11 | 1985-12-17 | Gerald B. Fefferman | Applying coating to circuit board spaced from hole edges and curing sub-layer |
USRE32430E (en) * | 1982-04-01 | 1987-06-02 | Printed wiring board | |
US4548884A (en) * | 1982-06-11 | 1985-10-22 | E. I. Du Pont De Nemours And Company | Registering and exposing sheet substrates using photosensitive liquid |
JPS59200490A (ja) * | 1983-04-27 | 1984-11-13 | ソニー株式会社 | 配線基板の製造方法 |
DE3320183A1 (de) * | 1983-06-03 | 1984-12-06 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Verfahren zum herstellen gedruckter schaltungen |
DE3329443A1 (de) * | 1983-08-16 | 1985-03-07 | Hoechst Ag, 6230 Frankfurt | Durch strahlung polymerisierbares gemisch und daraus hergestelltes kopiermaterial |
EP0136534B1 (en) * | 1983-09-06 | 1990-06-13 | Energy Conversion Devices, Inc. | Method of forming a large surface area integrated circuit |
US4696885A (en) * | 1983-09-06 | 1987-09-29 | Energy Conversion Devices, Inc. | Method of forming a large surface area integrated circuit |
US4559896A (en) * | 1983-09-15 | 1985-12-24 | Ciba Geigy Corporation | Coating apparatus |
JPS622595A (ja) * | 1985-06-28 | 1987-01-08 | 株式会社 エイト工業 | 印刷配線板およびその製造方法 |
JPS62290705A (ja) * | 1986-06-10 | 1987-12-17 | Mitsubishi Chem Ind Ltd | 光重合性組成物 |
US4879968A (en) * | 1987-03-03 | 1989-11-14 | Ciba-Geigy Corporation | Separating device for trimming the width of a poured curtain of coating material |
US5183508A (en) * | 1987-11-23 | 1993-02-02 | Epicor Technology, Inc. | Apparatus for patch coating printed circuit boards |
US4938994A (en) * | 1987-11-23 | 1990-07-03 | Epicor Technology, Inc. | Method and apparatus for patch coating printed circuit boards |
US4834821A (en) * | 1988-01-11 | 1989-05-30 | Morton Thiokol, Inc. | Process for preparing polymeric materials for application to printed circuits |
JPH01232791A (ja) * | 1988-03-11 | 1989-09-18 | Mitsubishi Cable Ind Ltd | 回路基板の製造方法 |
JPH01281793A (ja) * | 1988-05-09 | 1989-11-13 | Airetsukusu:Kk | プリント回路基板及びその製造方法 |
DE3931467A1 (de) * | 1989-09-21 | 1991-04-04 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske |
US5136970A (en) * | 1989-10-06 | 1992-08-11 | Fuji Photo Film Co., Ltd. | Coating apparatus with vertically movable solution receiver |
US5206116A (en) * | 1991-03-04 | 1993-04-27 | Shipley Company Inc. | Light-sensitive composition for use as a soldermask and process |
US5538754A (en) * | 1991-03-26 | 1996-07-23 | Shipley Company Inc. | Process for applying fluid on discrete substrates |
US5516545A (en) * | 1991-03-26 | 1996-05-14 | Sandock; Leonard R. | Coating processes and apparatus |
EP0509962A1 (en) * | 1991-04-15 | 1992-10-21 | Ciba-Geigy Ag | A process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate |
US5236746A (en) * | 1991-04-15 | 1993-08-17 | Ciba-Geigy Corporation | Curtain coating process for producing thin photoimageable coatings |
WO1993014444A1 (de) * | 1992-01-07 | 1993-07-22 | Rütgerswerke Aktiengesellschaft | Verfahren und vorrichtung zur beschichtung von leiterplatten |
DE9201546U1 (de) * | 1992-02-08 | 1992-05-21 | Schäfer, Hans-Jürgen, Dipl.-Ing., 4060 Viersen | Vorrichtung zur Beschichtung von Leiterplatten mit lösungsmittelfreien Lackschichten |
US5402314A (en) * | 1992-02-10 | 1995-03-28 | Sony Corporation | Printed circuit board having through-hole stopped with photo-curable solder resist |
JPH06152108A (ja) * | 1992-10-30 | 1994-05-31 | Aroo Denshi Kairo Seisakusho:Yugen | プリント配線基板のコーティング方法およびプリント配線基板 |
DE4243356A1 (de) * | 1992-12-21 | 1994-06-23 | Siemens Ag | Bestückungsverfahren für eine Leiterplatte |
DE4310814C2 (de) * | 1993-04-02 | 1997-11-27 | Du Pont Deutschland | Verfahren zur Beschichtung von Leiterplatten |
US5458921A (en) | 1994-10-11 | 1995-10-17 | Morton International, Inc. | Solvent system for forming films of photoimageable compositions |
SE509938C2 (sv) * | 1996-07-09 | 1999-03-29 | Ericsson Telefon Ab L M | Förfarande och anordning vid mönsterkort |
WO1998027796A1 (en) * | 1996-12-16 | 1998-06-25 | Ciba Specialty Chemicals Holding Inc. | Process and apparatus for the coating of boards |
US6017585A (en) * | 1998-02-24 | 2000-01-25 | National Semiconductor Corporation | High efficiency semiconductor wafer coating apparatus and method |
TW483940B (en) * | 1998-06-24 | 2002-04-21 | Ciba Sc Holding Ag | Method for coating printed circuit boards or similar substrates |
JP2000140739A (ja) | 1998-11-10 | 2000-05-23 | Canon Inc | 枚葉塗工装置、及び該装置を用いた塗工方法とカラーフィルタの製造方法 |
US6287636B1 (en) | 1998-11-25 | 2001-09-11 | Canon Kabushiki Kaisha | Coating apparatus and method utilizing a diluent and a method for producing a color filter substrate |
US6649321B2 (en) | 2001-06-21 | 2003-11-18 | Great Eastern Resin Industrial Co., Ltd. | Styrene-anhydride copolymer containing amido group, the process for producing the same and use thereof |
TWI290016B (en) * | 2002-10-14 | 2007-11-11 | Atotech Deutschland Gmbh | A process and an apparatus for coating printed circuit boards with laser-structurable, thermally curable solder stop lacquers and electroresists |
US7579134B2 (en) * | 2005-03-15 | 2009-08-25 | E. I. Dupont De Nemours And Company | Polyimide composite coverlays and methods and compositions relating thereto |
US7618766B2 (en) * | 2005-12-21 | 2009-11-17 | E. I. Du Pont De Nemours And Company | Flame retardant photoimagable coverlay compositions and methods relating thereto |
US7527915B2 (en) * | 2006-07-19 | 2009-05-05 | E. I. Du Pont De Nemours And Company | Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto |
CN104784970B (zh) * | 2015-04-23 | 2016-08-31 | 南京隆特森化学科技有限公司 | 手性色谱填料涂敷装置及方法 |
RU2715221C2 (ru) * | 2018-06-21 | 2020-02-26 | Федеральный научно-производственный центр акционерное общество "Научно-производственное объединение "Марс" | Способ стабилизации слоя паяльной маски, наносимой методом полива |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1089307B (de) * | 1955-02-03 | 1960-09-15 | Walter Zehnder Hensler | Vorrichtung zum Auftragen von Lack, insbesondere auf Moebelteile |
CH352934A (de) * | 1957-04-15 | 1961-03-15 | Steinemann Ulrich Ag | Lackfördereinrichtung an einer Lackaufgiessmaschine |
BE572753A (es) * | 1957-11-08 | 1900-01-01 | ||
US3205089A (en) * | 1959-12-04 | 1965-09-07 | Gasway Corp | Method and apparatus for flow coating objects |
US3132968A (en) * | 1961-11-13 | 1964-05-12 | Ulrich Steineman Ag Ltd | Curtain coating machine |
US3500610A (en) * | 1962-03-07 | 1970-03-17 | Eastman Kodak Co | Apparatus for coating an article with a liquid substantially free from discrete immiscible matter |
CH452406A (de) * | 1967-03-20 | 1968-05-31 | Steinemann Ulrich Ag | Schlitzgiessmaschine |
DE1772976A1 (de) * | 1968-07-30 | 1971-08-12 | Teldix Gmbh | Fotomechanisches Verfahren zur Herstellung von Leiterplatten |
JPS49103167A (es) * | 1973-02-08 | 1974-09-30 | ||
US4018940A (en) * | 1973-02-08 | 1977-04-19 | W. R. Grace & Co. | Process for forming solder resistant photoresist coatings |
US3876465A (en) * | 1973-03-12 | 1975-04-08 | Zenith Radio Corp | Method and apparatus for coating skirtless cathode ray tube panels |
JPS5091640A (es) * | 1973-12-18 | 1975-07-22 | ||
GB1508802A (en) * | 1974-05-22 | 1978-04-26 | Agfa Gevaert | Coating of viscous aqueous gelatin compositions on a continuous web support |
US4003877A (en) * | 1974-05-24 | 1977-01-18 | Dynachem Corporation | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
DE2541280A1 (de) * | 1975-09-16 | 1977-03-17 | Siemens Ag | Verfahren zur herstellung einer gedruckten verdrahtung mit lotabweisenden teilbereichen |
US4153855A (en) * | 1977-12-16 | 1979-05-08 | The United States Of America As Represented By The Secretary Of The Army | Method of making a plate having a pattern of microchannels |
US4150169A (en) * | 1977-12-27 | 1979-04-17 | Armstrong Cork Company | Method for manufacturing an embossed vinyl surface covering having a clear photopolymerized coating |
-
1978
- 1978-11-11 EP EP78101347A patent/EP0002040B1/de not_active Expired
- 1978-11-11 DE DE7878101347T patent/DE2861486D1/de not_active Expired
- 1978-11-15 US US05960971 patent/US4230793B1/en not_active Expired - Lifetime
- 1978-11-20 AT AT0826878A patent/AT367943B/de not_active IP Right Cessation
- 1978-11-20 IL IL56000A patent/IL56000A/xx unknown
- 1978-11-20 IT IT51961/78A patent/IT1105948B/it active
- 1978-11-20 ES ES475242A patent/ES475242A1/es not_active Expired
- 1978-11-20 SU SU782687105A patent/SU890997A3/ru active
- 1978-11-21 CA CA000316616A patent/CA1118530A/en not_active Expired
- 1978-11-21 JP JP14294778A patent/JPS5482073A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
CA1118530A (en) | 1982-02-16 |
IL56000A0 (en) | 1979-01-31 |
AT367943B (de) | 1982-08-10 |
EP0002040A1 (de) | 1979-05-30 |
JPS5482073A (en) | 1979-06-29 |
IL56000A (en) | 1980-12-31 |
DE2861486D1 (en) | 1982-02-18 |
IT7851961A0 (it) | 1978-11-20 |
US4230793B1 (en) | 1994-06-14 |
JPH0157516B2 (es) | 1989-12-06 |
EP0002040B1 (de) | 1981-12-30 |
IT1105948B (it) | 1985-11-11 |
SU890997A3 (ru) | 1981-12-15 |
US4230793A (en) | 1980-10-28 |
ATA826878A (de) | 1981-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC1A | Transfer granted |