GB1498605A - Soldering process - Google Patents
Soldering processInfo
- Publication number
- GB1498605A GB1498605A GB6055/76A GB605576A GB1498605A GB 1498605 A GB1498605 A GB 1498605A GB 6055/76 A GB6055/76 A GB 6055/76A GB 605576 A GB605576 A GB 605576A GB 1498605 A GB1498605 A GB 1498605A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plates
- solder
- sump body
- wave
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
1498605 Soldering HOLLIS ENG Inc 17 Feb 1976 [7 March 1975] 06055/76 Heading B3R In a wave soldering process, particularly for circuit board soldering, solder overflow from a wave 32 is collected in one or more sluices and discharged into a solder reservoir A below the level of solder thereof such that oxidation (dross formation) is minimized without the use of a protective film. As shown, solder is pumped into an inlet of a sump body and hence from a nozzle 14 to form the wave 32. The overflow is collected by plates 26 and directed between the plates and the exterior surfaces of the sump body. The sump body is partially submerged and the lower ends 29 of the plates 26 define, with the exterior of the sump body, sluices through which solder flows into the reservoir below the solder surface. Screws 12 abut the lower ends 29 of the plates 26 so providing an adjustable sluice gap. Horizontal perforated plates 9, 24 are provided in the nozzle and vertical perforated plates (17) in the sump body, the latter plates providing for a back pressure to allow for a uniform wave across the nozzle.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55649075A | 1975-03-07 | 1975-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1498605A true GB1498605A (en) | 1978-01-25 |
Family
ID=24221544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB6055/76A Expired GB1498605A (en) | 1975-03-07 | 1976-02-17 | Soldering process |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS51135855A (en) |
DE (1) | DE2609268A1 (en) |
GB (1) | GB1498605A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2223198A (en) * | 1988-08-31 | 1990-04-04 | Matsushita Electric Ind Co Ltd | An automatic jet soldering apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6316857A (en) * | 1986-07-09 | 1988-01-23 | Tamura Seisakusho Co Ltd | Jet type soldering device |
JP2007064514A (en) * | 2005-08-29 | 2007-03-15 | Usui Kokusai Sangyo Kaisha Ltd | Heat transfer tube for heat exchanger, and heat exchanger incorporating the heat transfer tube |
-
1976
- 1976-02-17 GB GB6055/76A patent/GB1498605A/en not_active Expired
- 1976-03-05 DE DE19762609268 patent/DE2609268A1/en active Pending
- 1976-03-05 JP JP51024031A patent/JPS51135855A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2223198A (en) * | 1988-08-31 | 1990-04-04 | Matsushita Electric Ind Co Ltd | An automatic jet soldering apparatus |
US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
GB2223198B (en) * | 1988-08-31 | 1992-04-29 | Matsushita Electric Ind Co Ltd | An automatic jet soldering apparatus |
Also Published As
Publication number | Publication date |
---|---|
DE2609268A1 (en) | 1976-09-16 |
JPS51135855A (en) | 1976-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
415 | Specification amended (sect. 15/1949) | ||
PS | Patent sealed | ||
SP | Amendment (slips) printed | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |