EP0146798A3 - Process for the environmentally friendly etching of printed circuits, and apparatus for performing the process - Google Patents

Process for the environmentally friendly etching of printed circuits, and apparatus for performing the process Download PDF

Info

Publication number
EP0146798A3
EP0146798A3 EP84114317A EP84114317A EP0146798A3 EP 0146798 A3 EP0146798 A3 EP 0146798A3 EP 84114317 A EP84114317 A EP 84114317A EP 84114317 A EP84114317 A EP 84114317A EP 0146798 A3 EP0146798 A3 EP 0146798A3
Authority
EP
European Patent Office
Prior art keywords
etching
environmentally friendly
printed circuits
friendly etching
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84114317A
Other languages
German (de)
Other versions
EP0146798A2 (en
EP0146798B1 (en
Inventor
Walter Holzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AT84114317T priority Critical patent/ATE51648T1/en
Publication of EP0146798A2 publication Critical patent/EP0146798A2/en
Publication of EP0146798A3 publication Critical patent/EP0146798A3/en
Application granted granted Critical
Publication of EP0146798B1 publication Critical patent/EP0146798B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)

Abstract

There is disclosed a process and apparatus for etching printed board circuits wherein etching of a printed circuit board is effected in turbulent flow of the etching solution and wherein concentration of the etching solution is maintained at effective levels by electrolysis.
EP84114317A 1983-12-13 1984-11-27 Process for the environmentally friendly etching of printed circuits, and apparatus for performing the process Expired - Lifetime EP0146798B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT84114317T ATE51648T1 (en) 1983-12-13 1984-11-27 PROCESS FOR ECO-FRIENDLY ETCHING OF CIRCUIT BOARDS AND EQUIPMENT FOR IMPLEMENTING THE WORKING PROCESS.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833345050 DE3345050A1 (en) 1983-12-13 1983-12-13 METHOD FOR THE ENVIRONMENTALLY FRIENDLY ASSEMBLY OF CIRCUIT BOARDS AND DEVICE FOR EXERCISING THE WORKING METHOD
DE3345050 1983-12-13

Publications (3)

Publication Number Publication Date
EP0146798A2 EP0146798A2 (en) 1985-07-03
EP0146798A3 true EP0146798A3 (en) 1986-05-21
EP0146798B1 EP0146798B1 (en) 1990-04-04

Family

ID=6216822

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84114317A Expired - Lifetime EP0146798B1 (en) 1983-12-13 1984-11-27 Process for the environmentally friendly etching of printed circuits, and apparatus for performing the process

Country Status (7)

Country Link
US (1) US4595451A (en)
EP (1) EP0146798B1 (en)
JP (1) JPS61143583A (en)
AT (1) ATE51648T1 (en)
AU (1) AU573770B2 (en)
CA (1) CA1227111A (en)
DE (2) DE3345050A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3839651A1 (en) * 1988-11-24 1990-05-31 Hoellmueller Hans SYSTEM FOR ESTABLISHING OBJECTS
WO1991011544A1 (en) * 1990-01-30 1991-08-08 Uzhgorodsky Gosudarstvenny Universitet Method and device for regeneration of iron chloride solution for pickling of copper
DE4402788A1 (en) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Process for removing metals
WO1995031590A1 (en) * 1994-05-11 1995-11-23 Siemens S.A. Device for processing printed circuit boards
US5486282A (en) * 1994-11-30 1996-01-23 Ibm Corporation Electroetching process for seed layer removal in electrochemical fabrication of wafers
GB2316366A (en) * 1996-08-16 1998-02-25 Rolls Royce Plc Apparatus for chemically machining or etching metal components uses acid jets for agitation
US6372081B1 (en) 1999-01-05 2002-04-16 International Business Machines Corporation Process to prevent copper contamination of semiconductor fabs
US6348159B1 (en) * 1999-02-15 2002-02-19 First Solar, Llc Method and apparatus for etching coated substrates
US6332973B1 (en) * 2000-01-25 2001-12-25 Advanced Micro Devices, Inc. CMOS chemical bath purification
US7597815B2 (en) * 2003-05-29 2009-10-06 Dressel Pte. Ltd. Process for producing a porous track membrane
DE102005015758A1 (en) * 2004-12-08 2006-06-14 Astec Halbleitertechnologie Gmbh Method and device for etching substrates received in an etching solution

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103154A (en) * 1981-05-11 1983-02-16 Airvision Engineering Ltd Liquid treatment of articles
EP0122963A1 (en) * 1983-04-13 1984-10-31 Forschungszentrum Jülich Gmbh Apparatus for regenerating an ammoniacal etching solution

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2008766B2 (en) * 1970-02-23 1971-07-29 Licentia Patent Verwaltungs GmbH, 6000 Frankfurt Regenerating cupric chloride etching - solution enriched with cuprous chloride
AT313671B (en) * 1971-03-08 1974-02-25 Hoellmueller Maschbau H Process for regenerating etching solutions for copper and copper alloys, regeneration system for carrying out this process and measuring and control device for this regeneration system
JPS4829977A (en) * 1971-08-20 1973-04-20
DE2241462A1 (en) * 1972-08-23 1974-03-07 Bach & Co Cupric chloride-contg etching soln regeneration - by oxidising cuprous chloride and recovery of hydrogen chloride and oxygen using part of cupric chloride
US3880409A (en) * 1973-04-18 1975-04-29 In Line Technology Inc Solution agitation apparatus
JPS5916984B2 (en) * 1974-09-17 1984-04-18 アイシン精機株式会社 Brake hydraulic control device for vehicles
US4073708A (en) * 1976-06-18 1978-02-14 The Boeing Company Apparatus and method for regeneration of chromosulfuric acid etchants
JPS556711A (en) * 1978-06-29 1980-01-18 Hitachi Cable Method of manufacturing flat cable
JPS5569267A (en) * 1978-11-13 1980-05-24 Yamatoya Shokai:Kk Automatic etching machine
US4302273A (en) * 1980-06-04 1981-11-24 Rca Corporation Etching tank in which the solution circulates by convection
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103154A (en) * 1981-05-11 1983-02-16 Airvision Engineering Ltd Liquid treatment of articles
EP0122963A1 (en) * 1983-04-13 1984-10-31 Forschungszentrum Jülich Gmbh Apparatus for regenerating an ammoniacal etching solution

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENTS ABSTRACTS OF JAPAN, Band 4, Nr.106, (C-20) (588), 30. Juli 1980 & JP-A-55 069 267 (YAMATOYA SHIYOUKAI K.K.) 24-05-1980 *

Also Published As

Publication number Publication date
DE3345050C2 (en) 1993-01-21
US4595451A (en) 1986-06-17
DE3345050A1 (en) 1985-06-20
EP0146798A2 (en) 1985-07-03
ATE51648T1 (en) 1990-04-15
DE3481848D1 (en) 1990-05-10
CA1227111A (en) 1987-09-22
JPH0573831B2 (en) 1993-10-15
JPS61143583A (en) 1986-07-01
EP0146798B1 (en) 1990-04-04
AU3664584A (en) 1985-06-20
AU573770B2 (en) 1988-06-23

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