FI953085A - Menetelmä monikerroksisen painetun kela-alustan, painettujen kela-alustojen ja painettujen kelakomponenttien valmistamiseksi - Google Patents

Menetelmä monikerroksisen painetun kela-alustan, painettujen kela-alustojen ja painettujen kelakomponenttien valmistamiseksi Download PDF

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Publication number
FI953085A
FI953085A FI953085A FI953085A FI953085A FI 953085 A FI953085 A FI 953085A FI 953085 A FI953085 A FI 953085A FI 953085 A FI953085 A FI 953085A FI 953085 A FI953085 A FI 953085A
Authority
FI
Finland
Prior art keywords
printed coil
substrates
components
making multilayer
substrate
Prior art date
Application number
FI953085A
Other languages
English (en)
Swedish (sv)
Other versions
FI116100B (fi
FI953085A0 (fi
Inventor
Tohru Umeno
Naoki Arai
Original Assignee
Sumitomo Spec Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9875095A external-priority patent/JP3598405B2/ja
Application filed by Sumitomo Spec Metals filed Critical Sumitomo Spec Metals
Publication of FI953085A0 publication Critical patent/FI953085A0/fi
Publication of FI953085A publication Critical patent/FI953085A/fi
Application granted granted Critical
Publication of FI116100B publication Critical patent/FI116100B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/043—Printed circuit coils by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
FI953085A 1994-06-21 1995-06-21 Menetelmä monikerroksisen painetun kela-alustan valmistamiseksi, painetut kela-alustat ja painetut kelakomponentit FI116100B (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP13894694 1994-06-21
JP13894694 1994-06-21
JP9875095 1995-04-24
JP9875095A JP3598405B2 (ja) 1995-04-24 1995-04-24 プリントコイル部品及びプリントコイル基板

Publications (3)

Publication Number Publication Date
FI953085A0 FI953085A0 (fi) 1995-06-21
FI953085A true FI953085A (fi) 1995-12-22
FI116100B FI116100B (fi) 2005-09-15

Family

ID=26439861

Family Applications (1)

Application Number Title Priority Date Filing Date
FI953085A FI116100B (fi) 1994-06-21 1995-06-21 Menetelmä monikerroksisen painetun kela-alustan valmistamiseksi, painetut kela-alustat ja painetut kelakomponentit

Country Status (6)

Country Link
US (1) US5952909A (fi)
EP (1) EP0689214B1 (fi)
KR (1) KR100373410B1 (fi)
CN (2) CN1126878A (fi)
DE (1) DE69512324T2 (fi)
FI (1) FI116100B (fi)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI102791B1 (fi) * 1995-04-04 1999-02-15 Nokia Telecommunications Oy Induktiivinen komponentti
EP0741395A1 (en) * 1995-05-04 1996-11-06 AT&T IPM Corp. Post-mountable planar magnetic device and method of manufacture thereof
US5986533A (en) * 1996-06-18 1999-11-16 Dale Electronics, Inc. Monolithic thick film inductor
US6440750B1 (en) 1997-06-10 2002-08-27 Agere Systems Guardian Corporation Method of making integrated circuit having a micromagnetic device
US6118351A (en) * 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
FR2772973B1 (fr) * 1997-12-23 2000-06-30 Sextant Avionique Bobinage pour transformateur planar
JP3173654B2 (ja) * 1998-12-28 2001-06-04 スミダコーポレーション株式会社 インダクタンス素子
FR2788371B1 (fr) * 1999-01-12 2001-03-09 Vishay Sa Transformateur configurable
EP1022750A1 (fr) * 1999-01-22 2000-07-26 Ecole Polytechnique Federale De Lausanne Composant électronique discret de type inductif, et procédé de réalisation de tels composants
US6255714B1 (en) 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
US6335671B1 (en) * 1999-08-20 2002-01-01 Tyco Electronics Logistics Ag Surface mount circuit assembly
DE19945013C5 (de) * 1999-09-20 2005-10-13 Epcos Ag Planartransformator
US6307458B1 (en) * 1999-09-22 2001-10-23 Ericsson Inc. Split inductor with fractional turn of each winding and PCB including same
US6429763B1 (en) * 2000-02-01 2002-08-06 Compaq Information Technologies Group, L.P. Apparatus and method for PCB winding planar magnetic devices
IL136301A (en) * 2000-05-22 2005-09-25 Payton Planar Magnetics Ltd Method of insulating a planar transformer printed circuit and lead frame windings forms
ITTO20001128A1 (it) * 2000-12-04 2002-06-04 Fiat Ricerche Induttore planare con nucleo ferromagnetico e relativo metodo di fabbricazione.
US6628531B2 (en) * 2000-12-11 2003-09-30 Pulse Engineering, Inc. Multi-layer and user-configurable micro-printed circuit board
JP4165034B2 (ja) * 2001-05-14 2008-10-15 サンケン電気株式会社 トランス
FI20012052A0 (fi) 2001-10-23 2001-10-23 Mika Matti Sippola Menetelmä monikerrosrakenteen valmistamiseksi
US6765469B2 (en) 2002-02-21 2004-07-20 Eni Technology, Inc. Printed circuit board transformer
US6691420B2 (en) 2002-06-03 2004-02-17 Kabushiki Kaisha Audio-Technica Laser line beam emitting apparatus having a mechanism for automatic location of a tilted laser unit holder to a desired position
DE10342611A1 (de) * 2003-09-12 2005-04-14 Hüttinger Elektronik Gmbh + Co. Kg 90° Hybrid zum Splitten oder Zusammenführen von Hochfrequenzleistung
DE102004047188B4 (de) * 2004-09-29 2022-10-27 Robert Bosch Gmbh Vorrichtung zur Ortung metallischer Objekte
FI119265B (fi) * 2006-07-03 2008-09-15 Zelteq Oy Käämi ja sen valmistusmenetelmä
KR100780915B1 (ko) 2006-08-10 2007-11-30 한국표준과학연구원 다층 피씨비 제작 공법을 이용한 회전 가진기용 회전 코일제조 방법
KR100859072B1 (ko) 2007-01-10 2008-09-17 주식회사 대우일렉트로닉스 프린티드 써키트코일을 가지는 ｂｌｄｃ 모터
US7872560B2 (en) * 2007-03-19 2011-01-18 Abc Taiwan Electronics Corp. Independent planar transformer
ATE554487T1 (de) 2007-03-19 2012-05-15 Abc Taiwan Electronics Corp Unabhängiger planarer transformator
US7332993B1 (en) * 2007-04-10 2008-02-19 Bose Corporation Planar transformer having fractional windings
DE102007019110A1 (de) * 2007-04-23 2008-10-30 Osram Gesellschaft mit beschränkter Haftung Elektronisches Bauelement
US9018561B2 (en) * 2007-05-23 2015-04-28 Cymer, Llc High power seed/amplifier laser system with beam shaping intermediate the seed and amplifier
WO2009131059A1 (ja) * 2008-04-24 2009-10-29 パナソニック電工株式会社 トランスならびにそれを用いた電力変換装置、点灯装置、車両用灯具および車両
US8031042B2 (en) * 2008-05-28 2011-10-04 Flextronics Ap, Llc Power converter magnetic devices
US8054154B2 (en) * 2008-09-26 2011-11-08 Linclon Global, Inc. Planar transformer and method of manufacturing
US7859382B2 (en) * 2008-09-26 2010-12-28 Lincoln Global, Inc. Planar transformer
TWM357691U (en) * 2008-11-07 2009-05-21 Delta Electronics Inc Transformer
WO2011010491A1 (ja) * 2009-07-23 2011-01-27 株式会社村田製作所 コイル一体型スイッチング電源モジュール
US8258789B2 (en) * 2009-12-21 2012-09-04 General Electric Company Apparatus and method for decoupling MR coils
JP4699570B1 (ja) * 2009-12-22 2011-06-15 株式会社コスモメカニクス ディスク型コイル
DE102011003754A1 (de) * 2011-02-08 2012-08-09 Bolzenschweißtechnik Heinz Soyer GmbH Transformator und Wicklungselement zum Bilden eines Wicklungspakets hierfür
CN103035394A (zh) * 2011-10-09 2013-04-10 弘邺科技有限公司 电感元件及其成型方法
US9786587B2 (en) 2011-12-14 2017-10-10 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
JP5887901B2 (ja) * 2011-12-14 2016-03-16 富士電機株式会社 半導体装置及び半導体装置の製造方法
CN103248131B (zh) * 2012-02-09 2018-07-06 深圳光启创新技术有限公司 一种无线充电装置
US8988890B2 (en) * 2012-08-29 2015-03-24 Apple Inc. Component mounting structures with breakaway support tabs
US9508485B1 (en) 2012-10-04 2016-11-29 Vlt, Inc. Isolator with integral transformer
JP2014075535A (ja) * 2012-10-05 2014-04-24 Toyota Industries Corp 誘導機器
JP6168556B2 (ja) 2013-10-24 2017-07-26 オムロンオートモーティブエレクトロニクス株式会社 コイル一体型プリント基板、磁気デバイス
WO2015079941A1 (ja) * 2013-11-28 2015-06-04 株式会社村田製作所 多層基板の製造方法、多層基板および電磁石
US20150221429A1 (en) * 2014-02-05 2015-08-06 Wen-Hsiang Wu Li Planar Coil Module and Planar Transformer Using the Same
CN103928219B (zh) * 2014-03-21 2016-08-24 长兴柏成电子有限公司 一种制作在pcb上的多绕组平面变压器
CN103928220B (zh) * 2014-03-21 2016-08-24 长兴柏成电子有限公司 一种制作在pcb上的平面变压器绕组结构
US9901265B2 (en) 2014-11-07 2018-02-27 Welch Allyn, Inc. Medical device
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
JP6485235B2 (ja) * 2015-06-10 2019-03-20 富士電機株式会社 半導体装置
CN208589315U (zh) 2015-12-14 2019-03-08 株式会社村田制作所 层叠型线圈
KR101798420B1 (ko) 2016-03-08 2017-11-17 (주)코러싱 우수한 변압효율과 방열성을 겸비하는 박막형 변압기
JP6548817B2 (ja) 2016-04-21 2019-07-24 三菱電機株式会社 絶縁型昇圧コンバータ
US10770225B2 (en) * 2016-08-08 2020-09-08 Hamilton Sundstrand Corporation Multilayered coils
FR3073662B1 (fr) * 2017-11-14 2022-01-21 Arjo Wiggins Fine Papers Ltd Inducteur multicouches
CN113169672B (zh) 2018-12-21 2024-04-30 住友电气工业株式会社 电力变换装置、多层基板及搭载有电力变换装置的车辆
KR102126822B1 (ko) 2019-01-03 2020-06-26 왕 에릭 변압기 회로 기판의 제조 방법 및 변압기
CN112750618B (zh) * 2020-12-28 2021-10-26 天津大学 一种奇数匝比的平面变压器制备方法
WO2023020957A1 (en) * 2021-08-20 2023-02-23 Biotronik Se & Co. Kg Pcb transformer with integrated internal and external electrical contacting for automated manufacturing
WO2023232437A1 (fr) * 2022-05-30 2023-12-07 Valeo Eautomotive France Sas Ensemble et transformateur électrique planaire
CN115662754A (zh) * 2022-12-06 2023-01-31 眉山博雅新材料股份有限公司 一种高频电源及应用于高频电源的变压器

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS396921B1 (fi) 1962-05-12 1964-05-09
JPS4110524B1 (fi) 1963-09-16 1966-06-10
JPS4851250A (fi) 1971-11-04 1973-07-18
US3939450A (en) * 1974-10-04 1976-02-17 Emerson Electric Co. Electrical coil assembly with means for securing external leads
GB2163603A (en) * 1984-08-25 1986-02-26 Stc Plc Miniature transformer or choke
JPS6174311A (ja) 1984-09-20 1986-04-16 Kangiyou Denki Kiki Kk 積層配線体から成るコイルを有するトランス
JPS6175510A (ja) 1984-09-21 1986-04-17 Kangiyou Denki Kiki Kk 小形トランス
EP0267108A1 (en) * 1986-10-31 1988-05-11 Digital Equipment Corporation Miniaturized transformer
US5184103A (en) * 1987-05-15 1993-02-02 Bull, S.A. High coupling transformer adapted to a chopping supply circuit
US4873757A (en) * 1987-07-08 1989-10-17 The Foxboro Company Method of making a multilayer electrical coil
JPH02146409A (ja) * 1988-11-28 1990-06-05 Kubota Ltd スラグ溶融装置
JPH0318106A (ja) * 1989-06-14 1991-01-25 Fujitsu Ltd 発振回路
JPH07111932B2 (ja) * 1989-08-22 1995-11-29 富士通電装株式会社 高周波薄型トランス
EP0413848A1 (de) * 1989-08-25 1991-02-27 Siemens Aktiengesellschaft Adapterplatte für elektrische Spulen
IL96551A0 (en) * 1989-12-18 1991-09-16 Rohm & Haas Preparation of high glass transition temperature novolak resins useful in high resolution photoresist compositions
US5179365A (en) * 1989-12-29 1993-01-12 At&T Bell Laboratories Multiple turn low profile magnetic component using sheet windings
JPH03283404A (ja) * 1990-03-29 1991-12-13 Tabuchi Denki Kk シートコイル接続用端子台を備えた積層コイル装置
US5010314A (en) * 1990-03-30 1991-04-23 Multisource Technology Corp. Low-profile planar transformer for use in off-line switching power supplies
JPH0415512A (ja) * 1990-05-10 1992-01-20 Kobe Steel Ltd 帯材の平坦度測定方法
JPH0488614A (ja) * 1990-07-31 1992-03-23 Satosen Co Ltd 変圧器
JPH04103612U (ja) 1991-02-14 1992-09-07 富士電気化学株式会社 プリント配線板におけるインダクタの実装構造
JPH04105512U (ja) 1991-02-22 1992-09-10 田淵電機株式会社 積層シートコイル装置
JP3074316B2 (ja) * 1991-03-25 2000-08-07 株式会社サトーセン シートコイル積層或いは積装品
US5402098A (en) * 1991-03-25 1995-03-28 Satosen Co., Ltd. Coil
JPH0559818A (ja) * 1991-04-15 1993-03-09 Natl House Ind Co Ltd 壁パネル仮固定装置
JP2971220B2 (ja) * 1991-11-13 1999-11-02 富士電気化学株式会社 トランス用コイル素子、並びにそのコイル素子を用いたトランス、及びそのトランスの結線方法
JP2530797B2 (ja) 1992-04-15 1996-09-04 日立金属株式会社 薄型トランス
JPH06163266A (ja) 1992-11-26 1994-06-10 Hitachi Ferrite Ltd 薄型トランス
EP0698896B1 (en) * 1994-08-24 1998-05-13 Yokogawa Electric Corporation Printed coil

Also Published As

Publication number Publication date
EP0689214A1 (en) 1995-12-27
CN1367501A (zh) 2002-09-04
KR100373410B1 (ko) 2003-05-09
FI116100B (fi) 2005-09-15
CN1126878A (zh) 1996-07-17
FI953085A0 (fi) 1995-06-21
EP0689214B1 (en) 1999-09-22
DE69512324T2 (de) 2000-04-13
CN1204572C (zh) 2005-06-01
DE69512324D1 (de) 1999-10-28
US5952909A (en) 1999-09-14

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