WO2023020957A1 - Pcb transformer with integrated internal and external electrical contacting for automated manufacturing - Google Patents

Pcb transformer with integrated internal and external electrical contacting for automated manufacturing Download PDF

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Publication number
WO2023020957A1
WO2023020957A1 PCT/EP2022/072651 EP2022072651W WO2023020957A1 WO 2023020957 A1 WO2023020957 A1 WO 2023020957A1 EP 2022072651 W EP2022072651 W EP 2022072651W WO 2023020957 A1 WO2023020957 A1 WO 2023020957A1
Authority
WO
WIPO (PCT)
Prior art keywords
transformer
circuit board
contacts
circuit
smd
Prior art date
Application number
PCT/EP2022/072651
Other languages
French (fr)
Inventor
Colby Whitaker
Delancy Rose ALBERS
Bangnguyen VO
Original Assignee
Biotronik Se & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE202021105981.8U external-priority patent/DE202021105981U1/en
Application filed by Biotronik Se & Co. Kg filed Critical Biotronik Se & Co. Kg
Publication of WO2023020957A1 publication Critical patent/WO2023020957A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/378—Electrical supply
    • A61N1/3782—Electrical supply producing a voltage above the power source level
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Definitions

  • the present invention relates to a transformer for a medical device, in particular for a medical implant.
  • Virtually all electrical and electronic medical devices contain one or more components consisting of electrical conductors wound into a coil to form transformers and other similar components.
  • transformer components are known whose windings are formed on a single printed circuit board or on multiple stacked printed circuit boards using printed circuit board fabrication technology to obtain the number of turns required for the electrical design.
  • connection of the printed circuit board(s) both within the transformer and to the external circuitry that uses the transformer is currently made by either a pin or tab soldered to the printed circuit board of the transformer.
  • the problem to be solved by the present invention is to provide a transformer that permits manufacturing of the transformer by a process that is readily available and suitable for automated manufacturing methods.
  • This problem is solved by a transformer having the features of claim 1.
  • a transformer is disclosed, in particular for a medical device, in particular for a medical implant, wherein the transformer comprises at least one circuit board or several circuit boards stacked on top of each other, which form(s) windings of the transformer, wherein the respective circuit board has integrated SMD contacts for internal electrical contacting of the transformer, in particular to another circuit board of the transformer, and/or SMD contacts for external electrical contacting to a circuit carrier (e.g. in the form of a circuit board with etched conductor tracks, also referred to as PCB for Printed Circuit Board).
  • the circuit carrier is also denoted as circuit substrate.
  • the solution according to the invention presents an integrated SMD interconnection strategy, in particular with planar structures, so that the transformer can be surface mounted directly.
  • the PCB transformer with SMD contacts, external pins or other tabs/foils are unnecessary and automated assembly can be performed with commercially available surface mount equipment or other suitable equipment.
  • the SMD contacts are located on a top side and/or on bottom side of the respective circuit board.
  • the SMD contacts are vertically connected to each other by an electrically conductive connection.
  • the respective electrically conductive connection is a via.
  • the respective via is a half-hole edge contact or a drilled via.
  • the SMD contacts for internal electrical contacting are flat SMD contacts connected by solder joints to make internal electrical connections between circuit boards.
  • SMD contacts for external contacting are arranged on a bottom side of a lowermost circuit board, so that they can be placed on and soldered to corresponding contacts of a circuit substrate.
  • connection between the circuit boards can be done using standard manufacturing techniques, such as solder printing, solder preforming, etc.
  • the transformer is configured to be electrically connected to a circuit substrate via a lowermost circuit board in the form of one or more PCB interposers comprising SMD contacts that provide a connection between the transformer windings and a corresponding contact on the circuit substrate.
  • the circuit boards of the transformer are arranged between transformer core components.
  • the transformer core components form a magnetic core of the transformer.
  • the magnetic core consists of or comprises ferrite, iron, particularly powdered iron or a powdered mu metal.
  • a further aspect of the present invention relates to a method for manufacturing a transformer according to the present invention, the method comprising the steps of:
  • the step of arranging the at least one circuit board or said plurality of circuit boards in a stack further comprises arranging the stack between the transformer core components.
  • the SMD contacts for internal electrical contacting are connected in an electrically conducting fashion via one of: solder joints, electrically conductive connections, vias, half-hole edge contacts or drilled vias.
  • Fig. 1 shows a perspective view of an embodiment of a transformer according to the present invention
  • Fig. 2 shows a perspective view of a further embodiment of a transformer according to the present invention
  • Fig. 3 shows an exploded view of an embodiment of a transformer according to the present invention
  • Fig. 4 shows a representation of a detail of the transformer according to Figs. 2 and 3
  • Fig. 5 shows an illustration of a production flow for manufacturing a transformer according to the present invention.
  • Fig. 1 shows an embodiment of a transformer 1 according to the present invention, comprising a single circuit board (e.g. PCB) 10 or a plurality of circuit boards 10 stacked on top of each other to form the required number of windings and turns for these windings.
  • the design of each transformer sub-board 10 includes integrated SMD contacts 10a, 10b that are used for both internal and external connections to the transformer 1.
  • the SMD contacts 10a are located on the top, bottom or both sides of the respective circuit board 10. In the case of pads 10a located on both sides of the circuit board 10, they may be vertically connected to each other by a via 13 or another electrically conductive connection 13.
  • the pads 10a do not need to be at the same X and Y position when viewed from the top or bottom side, but may be arranged offset to allow for greater design flexibility.
  • contacts 10b are provided for external contacting, in particular on a bottom side of a lowermost circuit board 10, so that they can be placed on and soldered to corresponding contacts of a circuit carrier (e g. PCB).
  • a circuit carrier e g. PCB
  • connection between the circuit boards 10 can be done using standard manufacturing techniques, such as solder printing, solder preforming, etc. This allows a single PCB transformer or a multi-up array to be fabricated using standard SMT equipment.
  • the connection of the PCB transformer 1 to the circuit substrate i.e., the module substrate
  • Fig. 1 shows a corresponding embodiment of a transformer 1 according to the present invention with several circuit boards 10, in which vias in the form of half-hole edge contacts 13 are used as connections between contacts 10a.
  • Fig. 2 shows an embodiment of a PCB transformer 1 according to the invention, in which flat SMD contacts 10a and solder joints 12 are used to make internal electrical connections between subcomponents or circuit boards 10.
  • Fig. 3 shows internal SMD connections 10a between PCB transformer subassemblies 10.
  • Fig. 4 shows a detail of one of the solder joints 12 between internal SMD contacts 10a that form the internal connections between subassemblies 10.
  • the SMD contacts 10b for external contacting can be arranged on PCB interposers 10c, each of which forms a lowermost circuit board of the transformer 1 and is connected to the other circuit boards 10 of the transformer 1 via upper (internal) SMD contacts 10a.
  • Figs. 2 and 3 the circuit boards 10 (apart from the interposers 10c) may be arranged between transformer core components 1 la, 1 lb, which form, for example, an iron or ferrite core of the transformer 1.
  • Fig. 5 shows a sequence of a possible manufacturing process for producing a transformer 1 according to the invention.
  • the first SMT build A creates the stack of three sub-boards with SMT processing, which together form the turns of the transformer. These stacks of sub-boards are then separated from the board format in the first excision step B. The separated stacks are repackaged in a format suitable for SMT processing (e.g., tape and reel, JEDEC tray, waffle pack, etc.) C. The singulated stacks of sub-boards are then assembled together with the magnetic core on an interposer board using SMT processing to form an array of PCB transformers D. The PCB transformers are then singulated from the array format into individual complete PCB transformers E.
  • SMT processing e.g., tape and reel, JEDEC tray, waffle pack, etc.
  • the assembly process can be automated with standard equipment.
  • Known solutions use pins or other external means to make the connections between the PCB transformer boards and to the circuit substrate. This further complicates processing and pushes manufacturing away from SMD manufacturing to a more manual or custom manufacturing method.
  • the invention enables a fully automated manufacturing process for transformers while allowing labor costs for transformers to be significantly reduced.
  • the transformer manufactured in this manner exhibits higher reliability due to the more mechanically robust windings.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The present invention relates to a transformer (1), in particular for a medical device, having at least one circuit board (10) or a plurality of circuit boards (10) stacked on top of one another, which form(s) windings of the transformer (1), the respective circuit board (10) having integrated SMD contacts (10a) for internal electrical contacting of the transformer, in particular to another circuit board (10) of the transformer, and/or SMD contacts (10b) for external electrical contacting to a circuit carrier.

Description

PCB transformer with integrated internal and external electrical contacting for automated manufacturing
The present invention relates to a transformer for a medical device, in particular for a medical implant.
Virtually all electrical and electronic medical devices contain one or more components consisting of electrical conductors wound into a coil to form transformers and other similar components.
In the prior art, transformer components are known whose windings are formed on a single printed circuit board or on multiple stacked printed circuit boards using printed circuit board fabrication technology to obtain the number of turns required for the electrical design. In both cases, the connection of the printed circuit board(s) both within the transformer and to the external circuitry that uses the transformer is currently made by either a pin or tab soldered to the printed circuit board of the transformer.
The disadvantage of this is that additional components are required for the internal connections and that the use of pins and tabs is not suitable for automated SMT production of the transformer. This results in high assembly costs due to the additional labor involved and reduced design flexibility.
Therefore, the problem to be solved by the present invention is to provide a transformer that permits manufacturing of the transformer by a process that is readily available and suitable for automated manufacturing methods. This problem is solved by a transformer having the features of claim 1. Advantageous embodiments of the invention are stated in the corresponding sub claims and are described below.
According to claim 1, a transformer is disclosed, in particular for a medical device, in particular for a medical implant, wherein the transformer comprises at least one circuit board or several circuit boards stacked on top of each other, which form(s) windings of the transformer, wherein the respective circuit board has integrated SMD contacts for internal electrical contacting of the transformer, in particular to another circuit board of the transformer, and/or SMD contacts for external electrical contacting to a circuit carrier (e.g. in the form of a circuit board with etched conductor tracks, also referred to as PCB for Printed Circuit Board). The circuit carrier is also denoted as circuit substrate.
The solution according to the invention presents an integrated SMD interconnection strategy, in particular with planar structures, so that the transformer can be surface mounted directly. By designing the PCB transformer with SMD contacts, external pins or other tabs/foils are unnecessary and automated assembly can be performed with commercially available surface mount equipment or other suitable equipment.
According to a preferred embodiment of the present invention, the SMD contacts are located on a top side and/or on bottom side of the respective circuit board.
Further, according to a preferred embodiment of the present invention, the SMD contacts are vertically connected to each other by an electrically conductive connection. In a preferred embodiment, the respective electrically conductive connection is a via. According to yet another preferred embodiment, the respective via is a half-hole edge contact or a drilled via.
Further, according to a preferred embodiment of the present invention, the SMD contacts for internal electrical contacting are flat SMD contacts connected by solder joints to make internal electrical connections between circuit boards. Further, according to a preferred embodiment of the present invention, SMD contacts for external contacting are arranged on a bottom side of a lowermost circuit board, so that they can be placed on and soldered to corresponding contacts of a circuit substrate.
Particularly, the connection between the circuit boards can be done using standard manufacturing techniques, such as solder printing, solder preforming, etc.
Furthermore, according to a preferred embodiment of the present invention, the transformer is configured to be electrically connected to a circuit substrate via a lowermost circuit board in the form of one or more PCB interposers comprising SMD contacts that provide a connection between the transformer windings and a corresponding contact on the circuit substrate.
In a preferred embodiment of the present invention, the circuit boards of the transformer (particularly apart from interposers) are arranged between transformer core components.
According to yet another preferred embodiment, the transformer core components form a magnetic core of the transformer. Preferably, the magnetic core consists of or comprises ferrite, iron, particularly powdered iron or a powdered mu metal.
A further aspect of the present invention relates to a method for manufacturing a transformer according to the present invention, the method comprising the steps of:
- Arranging the at least one circuit board or said plurality of circuit boards in a stack, and
- Connecting the at least one circuit board or said plurality of circuit boards in an electrically conducting fashion via said integrated SMD contacts for internal electrical contacting of the transformer to said SMD contacts for external electrical contacting.
According to a preferred embodiment of the method, the step of arranging the at least one circuit board or said plurality of circuit boards in a stack further comprises arranging the stack between the transformer core components. According to a further preferred embodiment, the SMD contacts for internal electrical contacting are connected in an electrically conducting fashion via one of: solder joints, electrically conductive connections, vias, half-hole edge contacts or drilled vias.
In the following, embodiments of the invention and further features and advantages of the invention will be explained with reference to the Figures, wherein:
Fig. 1 shows a perspective view of an embodiment of a transformer according to the present invention,
Fig. 2 shows a perspective view of a further embodiment of a transformer according to the present invention,
Fig. 3 shows an exploded view of an embodiment of a transformer according to the present invention,
Fig. 4 shows a representation of a detail of the transformer according to Figs. 2 and 3, and
Fig. 5 shows an illustration of a production flow for manufacturing a transformer according to the present invention.
Fig. 1 shows an embodiment of a transformer 1 according to the present invention, comprising a single circuit board (e.g. PCB) 10 or a plurality of circuit boards 10 stacked on top of each other to form the required number of windings and turns for these windings. The design of each transformer sub-board 10 includes integrated SMD contacts 10a, 10b that are used for both internal and external connections to the transformer 1. The SMD contacts 10a are located on the top, bottom or both sides of the respective circuit board 10. In the case of pads 10a located on both sides of the circuit board 10, they may be vertically connected to each other by a via 13 or another electrically conductive connection 13. The pads 10a do not need to be at the same X and Y position when viewed from the top or bottom side, but may be arranged offset to allow for greater design flexibility. Furthermore, contacts 10b are provided for external contacting, in particular on a bottom side of a lowermost circuit board 10, so that they can be placed on and soldered to corresponding contacts of a circuit carrier (e g. PCB).
Making the connection between the circuit boards 10 can be done using standard manufacturing techniques, such as solder printing, solder preforming, etc. This allows a single PCB transformer or a multi-up array to be fabricated using standard SMT equipment. The connection of the PCB transformer 1 to the circuit substrate (i.e., the module substrate) can be made, for example, via a lowermost circuit board in the form of one or more PCB interposers 10c with SMD contacts 10a, 10b that provide the connection between the PCB transformer windings and the corresponding contact on the circuit substrate. Fig. 1 shows a corresponding embodiment of a transformer 1 according to the present invention with several circuit boards 10, in which vias in the form of half-hole edge contacts 13 are used as connections between contacts 10a.
In conjunction with Fig. 3, Fig. 2 shows an embodiment of a PCB transformer 1 according to the invention, in which flat SMD contacts 10a and solder joints 12 are used to make internal electrical connections between subcomponents or circuit boards 10.
The exploded view according to Fig. 3 shows internal SMD connections 10a between PCB transformer subassemblies 10. Fig. 4 shows a detail of one of the solder joints 12 between internal SMD contacts 10a that form the internal connections between subassemblies 10.
As shown in Fig. 3, also here, the SMD contacts 10b for external contacting can be arranged on PCB interposers 10c, each of which forms a lowermost circuit board of the transformer 1 and is connected to the other circuit boards 10 of the transformer 1 via upper (internal) SMD contacts 10a.
According to Figs. 2 and 3, the circuit boards 10 (apart from the interposers 10c) may be arranged between transformer core components 1 la, 1 lb, which form, for example, an iron or ferrite core of the transformer 1. Finally, Fig. 5 shows a sequence of a possible manufacturing process for producing a transformer 1 according to the invention.
The first SMT build A creates the stack of three sub-boards with SMT processing, which together form the turns of the transformer. These stacks of sub-boards are then separated from the board format in the first excision step B. The separated stacks are repackaged in a format suitable for SMT processing (e.g., tape and reel, JEDEC tray, waffle pack, etc.) C. The singulated stacks of sub-boards are then assembled together with the magnetic core on an interposer board using SMT processing to form an array of PCB transformers D. The PCB transformers are then singulated from the array format into individual complete PCB transformers E.
By integrating SMD-compatible connections, the assembly process can be automated with standard equipment. Known solutions use pins or other external means to make the connections between the PCB transformer boards and to the circuit substrate. This further complicates processing and pushes manufacturing away from SMD manufacturing to a more manual or custom manufacturing method. In contrast, the invention enables a fully automated manufacturing process for transformers while allowing labor costs for transformers to be significantly reduced. In addition, the transformer manufactured in this manner exhibits higher reliability due to the more mechanically robust windings.
It will be apparent to those skilled in the art that numerous modifications and variations of the examples and embodiments described are possible in light of the above teachings. The disclosed examples and embodiments are presented for illustrative purposes only. Other alternative embodiments may incorporate some or all of the features disclosed herein. Therefore, it is the intent to cover all such modifications and alternative embodiments that may come within the true scope of this invention.

Claims

- 7 - Claims
1. A transformer (1), in particular for a medical device, having at least one circuit board (10) or a plurality of circuit boards (10) stacked on top of one another, which forms or form windings of the transformer (1), the respective circuit board (10) having integrated SMD contacts (10a) for internal electrical contacting of the transformer, in particular to another circuit board (10) of the transformer, and/or SMD contacts (10b) for external electrical contacting to a circuit substrate.
2. The transformer according to claim 1, wherein the SMD contacts (10a) are located on a top side and/or on bottom side of the respective circuit board (10).
3. The transformer according to claim 1 or 2, wherein the SMD contacts (10a) are vertically connected to each other by an electrically conductive connection (13).
4. The transformer according to claim 3, wherein said electrically conductive connection (13) is a via (13).
5. The transformer according to claim 4, wherein said via (13) is a half-hole edge contact or a drilled via.
6. The transformer according to one of the claims 1 to 3, wherein the SMD contacts (10a) for internal electrical contacting are flat SMD contacts (10a) connected by solder joints (12) to make internal electrical connections between circuit boards (10).
7. The transformer according to one of the preceding claims, wherein SMD contacts (10b) for external contacting are arranged on a bottom side of a lowermost circuit board (10), so that they can be placed on and soldered to corresponding contacts of a circuit substrate.
8. The transformer according to one of the preceding claims, wherein the transformer (1) is configured to be electrically connected to a circuit substrate via a lowermost circuit - 8 - board in the form of one or more PCB interposers (10c) comprising SMD contacts (10a, 10b) that provide a connection between the transformer windings and a corresponding contact on the circuit substrate. The transformer according to one of the preceding claims, wherein circuit boards (10) of the transformer are arranged between transformer core components (I la, 1 lb). The transformer according to claim 9, wherein the transformer core components (I la, 11b) form a magnetic core of the transformer (1), wherein particularly the magnetic core may consists of or comprises iron, particularly powdered iron, ferrite or powdered mu metal.. A method for manufacturing a transformer (1) according to one of the preceding claims, the method comprising the steps of:
Arranging the at least one circuit board (10) or said plurality of circuit boards (10) in a stack, and
Connecting the at least one circuit board (10) or said plurality of circuit boards (10) in an electrically conducting fashion via said integrated SMD contacts (10a) for internal electrical contacting of the transformer (1) to said SMD contacts (10b) for external electrical contacting of the transformer (1). The method according to claim 11, wherein the step of arranging the at least one circuit board (10) or said plurality of circuit boards (10) in a stack further comprises arranging the stack between the transformer core components (I la, 1 lb). The method according to claim 11 or 12, wherein SMD contacts (10a) for internal electrical contacting are connected in an electrically conducting fashion via one of: solder joints (12), electrically conductive connections (13), vias (13), half-hole edge contacts (13), or drilled vias (13).
PCT/EP2022/072651 2021-08-20 2022-08-12 Pcb transformer with integrated internal and external electrical contacting for automated manufacturing WO2023020957A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163235318P 2021-08-20 2021-08-20
US63/235,318 2021-08-20
DE202021105981.8 2021-11-02
DE202021105981.8U DE202021105981U1 (en) 2021-11-02 2021-11-02 PCB transformer with integrated internal and external electrical contact for automated production

Publications (1)

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WO2023020957A1 true WO2023020957A1 (en) 2023-02-23

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PCT/EP2022/072651 WO2023020957A1 (en) 2021-08-20 2022-08-12 Pcb transformer with integrated internal and external electrical contacting for automated manufacturing

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181191A (en) * 1989-12-11 1991-08-07 Sanken Electric Co Ltd Printed wiring board
GB2272109A (en) * 1992-11-02 1994-05-04 Murata Manufacturing Co Laminated coiled conductive pattern and terminal arrangement
EP0689214A1 (en) * 1994-06-21 1995-12-27 Sumitomo Special Metals Co., Ltd. Process of producing a multi-layered printed-coil substrate, printed-coil substrates and printed-coil components
US5724016A (en) * 1995-05-04 1998-03-03 Lucent Technologies Inc. Power magnetic device employing a compression-mounted lead to a printed circuit board
US20020070834A1 (en) * 2000-12-11 2002-06-13 Majid Dadafshar Multi-layer and user-configurable micro-printed circuit board
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20130335927A1 (en) * 2012-06-15 2013-12-19 Medtronic, Inc. Planar transformer assemblies for implantable cardioverter defibrillators
DE102018005043A1 (en) * 2018-06-25 2019-01-24 Daimler Ag Planar

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181191A (en) * 1989-12-11 1991-08-07 Sanken Electric Co Ltd Printed wiring board
GB2272109A (en) * 1992-11-02 1994-05-04 Murata Manufacturing Co Laminated coiled conductive pattern and terminal arrangement
EP0689214A1 (en) * 1994-06-21 1995-12-27 Sumitomo Special Metals Co., Ltd. Process of producing a multi-layered printed-coil substrate, printed-coil substrates and printed-coil components
US5724016A (en) * 1995-05-04 1998-03-03 Lucent Technologies Inc. Power magnetic device employing a compression-mounted lead to a printed circuit board
US20020070834A1 (en) * 2000-12-11 2002-06-13 Majid Dadafshar Multi-layer and user-configurable micro-printed circuit board
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20130335927A1 (en) * 2012-06-15 2013-12-19 Medtronic, Inc. Planar transformer assemblies for implantable cardioverter defibrillators
DE102018005043A1 (en) * 2018-06-25 2019-01-24 Daimler Ag Planar

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