CN215499762U - Multilayer circuit boards with impedance-sensitive electronics - Google Patents

Abstract

The utility model has described a multilayer circuit board with sensitive electronic component of impedance, it includes lower mother board, inner circuit board layer and upper mother board; the top surface of the lower main board is provided with an inductor; an inner circuit board layer located between the upper and lower main boards and having at least one inner circuit board surrounding the inductor, a top surface of the inner circuit board layer being higher than or equal to a top surface of the inductor; the upper main board is provided with at least one impedance sensitive electronic element and an electroplating through hole structure; electrodes of the inductor are inserted into the electroplating through hole structure and electrically connected with the electroplating through hole structure; through the design of the multilayer circuit board, the distance between the impedance sensitive electronic element and the inductor can be effectively shortened, and the impedance of circuit layout is effectively reduced.

Description

Multilayer circuit boards with impedance-sensitive electronics

technical field

The utility model relates to a multi-layer circuit board, in particular to a multi-layer circuit board provided with impedance sensitive electronic components.

Background technique

Some circuit boards are equipped with impedance-sensitive electronic components (such as power modules) due to functional requirements. Impedance-sensitive electronic components refer to electronic components whose characteristics or performance are seriously affected by the impedance of the circuit layout. Take the power module as an example. In the circuit layout of the circuit board, it is desirable that the circuit between the power module and the capacitor or inductor to which it is electrically coupled can be shortened as much as possible, thereby reducing the overall impedance of the circuit layout and improving the power output efficiency. However, in the conventional circuit board design, the above impedance-sensitive electronic components are simply arranged on one layer of the circuit board in the multilayer circuit board, and the circuit layout and the configuration of the electronic components cannot effectively reduce the overall impedance. It can be seen that Conventional circuit board designs are imperfect and leave room for improvement.

Utility model content

One of the objectives of the present invention is to improve the deficiencies of the prior art, and further propose a multilayer circuit board with impedance-sensitive electronic components, the circuit layout distance between the impedance-sensitive electronic components and the inductor is short , which can effectively reduce the overall impedance of the circuit layout.

Therefore, according to the structure of a multilayer circuit board provided with impedance-sensitive electronic components provided by the present invention, the structure includes a lower main board, an inner circuit board layer and an upper main board. Wherein, the top surface of the lower main board is provided with an inductor, and the top surface of the inductor is provided with electrodes. The inner circuit board layer is arranged above the lower main board and has at least one inner circuit board, the at least one inner circuit board surrounds the inductor and is electrically connected to the lower main board, and the top surface of the inner circuit board layer is higher than or equal to the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer and is provided with at least one impedance sensitive electronic element and a first plated through hole structure on the top surface. The first plated through hole structure penetrates the top and bottom surfaces of the upper motherboard and is electrically connected to the at least one impedance-sensitive electronic element. The electrodes of the inductor are inserted into the first plated through hole structure and are electrically connected to the first plated through hole structure.

Through the design of the above-mentioned multilayer circuit board, since the inductor is inserted into the first plated through hole structure through its electrodes and electrically coupled with it, the circuit between the impedance-sensitive electronic component and the inductor can be effectively shortened. The distance of the layout can effectively reduce the overall impedance on the circuit layout.

In one aspect, in order to effectively adjust the height difference between the upper mainboard and the lower mainboard, the at least one inner circuit board may be a plurality of inner circuit boards, and the inner circuit boards are stacked and electrically connected to each other.

In another aspect, each inner circuit board includes a second plated through hole structure, the second plated through hole structure includes a through hole and two solder pads, the through hole penetrates through the top and bottom surfaces of each inner circuit board, and the through hole penetrates through the inner circuit board. The hole wall of the hole is covered with a metal layer, two soldering pads are respectively arranged on the top and bottom sides of each inner circuit board and cover the through hole, the two soldering pads are electrically connected to the metal layer, and each inner circuit board is plated through the second The hole structure is electrically connected to each other.

In another aspect, the impedance-sensitive electronic component may be, but is not limited to, a Smart PowerStage chip.

The utility model also provides a structure of a multi-layer circuit board provided with impedance-sensitive electronic components, which comprises a lower main board, an inner circuit board layer and an upper main board. Wherein, the top surface of the lower motherboard is provided with an inductor. The inner circuit board layer is arranged above the lower main board and has a plurality of pairs of electrical connection components. The above-mentioned groups of electrical connection components surround the inductor and are electrically connected to the lower main board. Each group of the above-mentioned groups of electrical connection components includes a board A board-to-board connector and an inner circuit board, the board-to-board connector includes a connector body and a pin connected to the connector body. Each inner circuit board includes a plated through hole structure. The plated through hole structure includes through holes and solder pads. The through holes penetrate through the top and bottom sides of the inner circuit board. On one side of the inner circuit board and covering the through hole on the side, the plug is inserted into the through hole, and the top surface of each group of the above-mentioned multiple sets of electrical connection components is coplanar with the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer, and at least one impedance-sensitive electronic element is provided on the top surface, and the at least one impedance-sensitive electronic element is electrically connected to the inductor.

In one aspect, the inner circuit board is positioned over the board-to-board connector, and in some cases both the inner circuit board and the board-to-board connector may be reversed.

Description of drawings

The detailed structure, features, and manufacturing methods of the above-mentioned multilayer circuit board provided with impedance-sensitive electronic components will be described in the following embodiments. However, it should be understood that the following embodiments and the accompanying drawings are only for As an exemplary illustration, it should not be used to limit the scope of the claims of the present invention, wherein:

1 is a schematic cross-sectional view of a multilayer circuit board according to a first embodiment;

2 is a perspective view of the inductor of the first embodiment;

3 is a schematic cross-sectional view of the inner circuit board according to the first embodiment, for illustrating the second plated through hole structure;

FIG. 4 is a flow chart of the steps of the manufacturing method of the multilayer circuit board of the first embodiment;

5A to 5P are schematic cross-sectional views corresponding to each step of FIG. 4;

6 is a schematic cross-sectional view of a multilayer circuit board according to a second embodiment;

7 is a schematic view of the appearance of the board-to-board connector of the second embodiment;

8 is a schematic cross-sectional view of the inner circuit board of the second embodiment, for illustrating the plated through hole structure;

9 is a flow chart of steps of a method of manufacturing a multilayer circuit board according to a second embodiment; and FIGS. 10A to 10K are schematic cross-sectional views corresponding to the steps of FIG. 9 .

(Symbol Description)

1. 1’…Multilayer circuit board 10…Lower motherboard

10B…Lower motherboard connection piece 11…Solder pads

12, 12’…Inductor 13…Body

14…Electrodes 20…Inner circuit board layers

21…Inner circuit board 22…Board-to-board connector

221…Connector body 222…Plunger

23…Through hole 24…Solder pad

25…Metal layer 26…Resin

30…On the main board 30B…On the main board

31…Solder pads 32…Impedance-sensitive electronic components

33…Through hole 34…Metal layer

36…Thermal interface material 21B…Inner circuit board connection piece

27B...the first inner circuit board connecting piece 21a...the first inner circuit board

28B...Second inner circuit board connecting piece 21b...Second inner circuit board

29B...the third inner circuit board connecting piece 21c...the third inner circuit board

G1, G2...Inner circuit board group G3...Electrical connection components

P1, P2, P3…plated through hole structure

Detailed ways

The following describes the technical content and features of the present utility model in detail through the enumerated embodiments in conjunction with the accompanying drawings. Directional descriptive terms such as "bottom" are merely illustrative terms based on the normal use direction, and are not intended to limit the scope of claims.

In order to illustrate the technical features of the present invention in detail, the following two embodiments are given and described below in conjunction with the accompanying drawings.

As shown in FIG. 1 , the first embodiment provides a multilayer circuit board 1 provided with impedance-sensitive electronic components, which includes a lower main board 10 , an inner circuit board layer 20 and an upper main board 30 .

A plurality of soldering pads 11 are laid on the top surface of the lower main board 10 , and an inductor 12 is provided in the center of the top surface of the lower main board 10 . As shown in FIG. 2 , the inductor 12 structurally includes a body 13 and two electrodes 14 . The bottom of the body 13 is electrically connected to the lower motherboard 10 , and the two electrodes 14 are disposed on the top surface of the body 13 and extend upward.

The inner circuit board layer 20 is disposed above the lower main board 10 and includes a plurality of inner circuit boards 21 . These inner circuit boards 21 are arranged in groups, and each group of inner circuit boards 21 is composed of a plurality of inner circuit boards 21 stacked on top of each other. However, in this embodiment, the number of circuit boards 21 in each group is three. These inner circuit boards 21 surround the inductor 12 , and each set of inner circuit boards 21 is electrically connected to the lower main board 10 . Referring to FIG. 3 , each inner circuit board 21 includes a plated through hole structure P2 (Plating Through Hole). The plated through hole structure P2 includes a through hole 23 and two solder pads 24 in structure, and the through hole 23 penetrates through each inner On the top and bottom sides of the circuit board 21 , the hole wall of the through hole 23 is covered with a metal layer 25 and the through hole 23 is also provided with a resin 26 , and two soldering pads 24 are respectively provided on the top and bottom sides of each inner circuit board 21 and Covering the through hole 23 , the two bonding pads 24 are electrically connected to the metal layer 25 . Through the plated through hole structure P2, the stacked inner circuit boards 21 can be electrically connected to each other effectively, and the height of the top surface of the inner circuit board layer 20 can be controlled so that the top surface of the inner circuit board layer 20 is higher than or equal to The top surface of the inductor 12 .

Please return to FIG. 1 , the upper main board 30 is disposed above the inner circuit board layer 20 , and a plurality of soldering pads 31 are laid on the top surface and the bottom surface, so that the upper mainboard 30 can be electrically connected to the inner circuit board layer 20 through the soldering pads 31 . . The top surface of the upper motherboard 30 is provided with two impedance sensitive electronic components 32 arranged at intervals and two plated through hole structures P1 (only one of which is shown in FIG. 1 ) disposed between the two impedance sensitive electronic components 32 . In this embodiment, the impedance sensitive electronic component 32 is a smart power stage (Smart Power Stage) chip. In some cases, the number of impedance sensitive electronic components 32 may also be only one. The plated through hole structure P1 of the upper main board 30 is different from the plated through hole structure P2 of the inner circuit board 21. Specifically, the plated through hole structure P1 of the upper main board 30 penetrates through the top and bottom surfaces of the upper main board 30 and passes through wires. The two impedance-sensitive electronic components 32 are electrically connected, the wall of the through hole 33 is covered with a metal layer 34, and the electrode 14 of the inductor 12 is inserted into the through hole 33 of the plated through hole structure P1 and electrically connected to the plated through hole structure P1 , so that the two impedance-sensitive electronic components 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper motherboard 30 .

Through the design of the above-mentioned multilayer circuit board 1 , since the inductor 12 is inserted into the plated through hole structure P1 through its electrodes 14 and electrically coupled with the plated through hole structure P1 of the upper main board 30 , the impedance-sensitive electronic component is 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper motherboard 30 with a short circuit layout distance, so that the circuit layout distance between the impedance sensitive electronic component 32 and the inductor 12 can be effectively shortened, And can effectively reduce the overall impedance on the circuit layout, and improve the output efficiency of the impedance-sensitive electronic component 32 .

The manufacturing method of the multilayer circuit board 1 of the first embodiment will be described below. Please refer to FIG. 4 and FIG. 5A to FIG. 5P. The manufacturing method includes the following steps.

Step S1.1: Prepare a plurality of inner circuit boards that are stacked and electrically connected to each other. Specifically, a first inner circuit board connecting piece 27B (as shown in FIG. 5A ) is prepared. The first inner circuit board connecting piece 27B includes a plurality of laterally connected first inner circuit boards 21a, and each first inner circuit board 21a are provided with plated through hole structures P2. A dicing process (routing) is performed to separate out each of the first inner circuit boards 21a (as shown in FIG. 5B ). Next, a second inner circuit board connecting piece 28B is prepared. The second inner circuit board connecting piece 28B also has a plurality of laterally connected second inner circuit boards 21b, and the second inner circuit board 21b is also provided with a plated through hole structure P2 (as shown in FIG. 5C ), each of the separated first inner circuit boards 21 a is placed on the soldering pads 24 of the second inner circuit board connecting piece 28B, and these first inner circuit boards are assembled by surface mount process (SMT). The board 21a and the second inner circuit board connecting piece 28B are mechanically and electrically coupled as a whole (as shown in FIG. 5D ), and then a cutting process (routing) is performed to cut the second inner circuit board connecting piece 28B, so that multiple The group is an inner circuit board group G1 in which the first inner circuit board 21a and the second inner circuit board 21b are superimposed on top of each other (as shown in FIG. 5E ). After that, a third inner circuit board connecting piece 29B is prepared. The third inner circuit board connecting piece 29B also has a plurality of horizontally connected third inner circuit boards 21c, and the third inner circuit board 21c also has a plated through hole structure. P2 (as shown in FIG. 5F ), the above-cut inner circuit board groups G1 are placed on the solder pads 24 of the third inner circuit board connecting piece 29B, and these inner circuit board groups are assembled by surface mount process (SMT). The group G1 is mechanically and electrically coupled to the third inner circuit board connecting piece 29B (as shown in FIG. 5G ), and finally a cutting process (routing) is performed to cut the third inner circuit board connecting piece 29B, thus forming a plurality of groups from the first connecting piece 29B. The first to third inner circuit boards 21a-21c are stacked on top of each other in the inner circuit board group G2 (as shown in FIG. 5H).

Next, prepare a lower main board connecting piece 10B. The lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally. Several soldering pads 11 are laid on the top surface of the lower main board connecting piece 10B (as shown in FIG. 5I ), and a plurality of top plates are prepared. The inductor 12 with the electrode 14 on the surface is glued to the solder pad 11 on the top surface of the lower motherboard connecting piece 10B by performing a glue dispensing process, and the above-mentioned multiple groups are placed up and down from the first to third inner circuit boards 21a-21c. The stacked inner circuit board group G2 is disposed on the solder pads 11 on the top surface of the lower motherboard connecting piece 10B and is located at the periphery of the inductor 12 , thereby surrounding the inductor 12 . The inductor 12 and the above-mentioned inner circuit board group G2 (ie, the inner circuit boards 21 a - 21 c ) are mechanically and electrically coupled to the top surface of the lower motherboard 10 by a surface mount process (SMT) (as shown in FIG. 5J ). A laser cutting process is performed to separate a plurality of lower main boards 10 provided with the inductors 12 and the inner circuit boards 21 a - 21 c (as shown in FIG. 5K ).

Step S1.2: prepare an upper main board connection piece 30B, the upper main board connection piece 30B includes a plurality of upper main boards 30 connected horizontally, each upper main board 30 has a plated through hole structure P1 and a number of solder joints are arranged on the top surface pad 31 (see Figure 5L). A plurality of impedance sensitive electronic components 32 are arranged on both sides of each plated through hole structure P1, and the impedance sensitive electronic components 32 are mechanically and electrically coupled to the top surface ( As shown in FIG. 5M ), a layer of thermal interface material 36 (Thermal Interface Material; TIM; FIG. 5N ) is laid on each impedance sensitive electronic component 32 .

Step S1.3: Invert the lower main board 10 provided with the inner circuit boards 21a-21c and the inductor 12 and the upper main board connecting piece 30B provided with the impedance sensitive electronic element 32, so that the electrodes 14 of the inductor 12 are inserted into the upper main board 30 The plated through hole structure P1 is mechanically and electrically coupled to the inductor 12 and the plated through hole structure P1 by a surface mount process (SMT), and electrically coupled to the inner circuit boards 21a-21c and the upper motherboard 30 (Figure 5O). Finally, a laser cutting process is performed to cut each of the upper main board connecting pieces 30B provided with the inductors 12 , the impedance sensitive electronic components 32 , and the inner circuit boards 21 a - 21 c to produce the first embodiment of the present invention. For example, a plurality of multilayer circuit boards 1 provided with impedance-sensitive electronic components 32 (as shown in FIG. 5P ).

It should be noted that step S1.2 may be executed before step S1.1, and step S1.2 may even be executed simultaneously with step S1.1.

The present invention further provides a second embodiment, please refer to FIG. 6 . The second embodiment also provides a multilayer circuit board 1' provided with impedance-sensitive electronic components, which can be applied to a surface mount type (SMD) inductor 12'. The multilayer circuit board 1' of the second embodiment includes a lower main board 10, an inner circuit board layer 20 and an upper main board 30 in structure.

A number of soldering pads 11 are laid on the top surface of the lower main board 10, and an inductor 12' is provided in the center of the top surface of the lower main board 10. Electrodes 14 are provided on the top and bottom surfaces of the inductor 12', and the inductor 12' is electrically connected to the lower main board 10 through the electrodes 14 on the bottom surface.

The inner circuit board layer 20 is disposed above the lower main board 10 and has a plurality of pairs of electrical connection components G3 . The plurality of electrical connection components G3 surround the inductor 12 ′ and are electrically connected to the lower main board 10 . Each set of electrical connection components G3 includes a board-to-board connector 22 (as shown in FIG. 7 ) and an inner circuit board 21 (as shown in FIG. 8 ) disposed above the board-to-board connector 22 . The board-to-board connector 22 includes a connector body 221 and a plug 222 connected to the connector body 221 . The inner circuit board 21 includes a plated through hole structure P3. The plated through hole structure P3 includes a through hole 23 and a solder pad 24. The through hole 23 penetrates through the top and bottom surfaces of the inner circuit board 21. The hole wall of the through hole 23 is covered with metal. Layer 25 and solder pads 24 are provided on the top surface of the inner circuit board 21 and cover the through holes 23 . The pin 222 of the board-to-board connector 22 is inserted upwardly into the through hole 23 of the plated through hole structure P3 of the inner circuit board 21 , and the board-to-board connector 22 is electrically coupled to the inner circuit board 21 through the pin 222 . In addition, by means of press-fit insertion, the top surface of each set of electrical connection components G3 is coplanar with the top surface of the inductor 12 ′, so as to facilitate the inner circuit board layer 20 and the inductor 12 'Subsequently, the electrical coupling can be smoothly formed with the upper motherboard 30 .

The upper main board 30 is disposed above the inner circuit board layer 20 , and a number of soldering pads 31 are also laid on the top surface and the bottom surface of the upper main board 30 . The top surface of the upper motherboard 30 is provided with two impedance-sensitive electronic components 32 (in this embodiment, the impedance-sensitive electronic components 32 are Smart Power Stage) chips arranged at intervals. There may also be only one impedance sensitive electronic component 32 on the upper motherboard 30). The upper main board 30 is electrically connected to the inner circuit board layer 20, and the two impedance sensitive electronic components 32 are electrically connected to the inductor 12' through the upper main board 30, thereby shortening the line between the two impedance sensitive electronic components 32 and the inductor 12' Layout distance.

Through the design of the multilayer circuit board 1 ′ of the second embodiment, the distance of the circuit layout between the impedance sensitive electronic component 32 and the inductor 12 ′ can also be shortened, and the overall impedance on the circuit layout can be effectively reduced, improving the Output efficiency of impedance sensitive electronics 32.

The manufacturing method of the multilayer circuit board 1' of the second embodiment will be described below. Please refer to FIG. 9 and FIG. 10A to FIG. 10K. The manufacturing method includes the following steps.

Step S2.1: Prepare multiple inner circuit boards. Specifically, an inner circuit board connecting piece 21B is prepared (as shown in FIG. 10A ). The inner circuit board connecting piece 21B includes a plurality of laterally connected inner circuit boards 21 , and each inner circuit board 21 includes a plated through hole structure P3 ( Please refer to FIG. 8 ), the plated through hole structure P3 includes through holes 23 and solder pads 24 , the through holes 23 penetrate through the top and bottom surfaces of the inner circuit board 21 , the hole walls of the through holes 23 are covered with a metal layer 25 , and the solder pads 24 It is arranged on the top surface of the inner circuit board 21 and covers the through hole 23 . After that, a routing process is performed to separate each inner circuit board 21 from the inner circuit board connecting piece 21B (as shown in FIG. 10B ).

Step S2.2: Prepare a lower main board connecting piece 10B. The lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally. Several soldering pads 11 are laid on the top surface of the lower main board connecting piece 10B (as shown in FIG. 10C ). A plurality of surface mount type (SMD) inductors 12' and a plurality of board-to-board connectors 22 are prepared. The inductor 12 ′ and the above-mentioned board-to-board connector 22 are mechanically and electrically coupled to the top surface of the lower motherboard connecting piece 10B (as shown in FIG. 10D ) by a surface mount process (SMT), and these board-to-board connections are made The inductor 22 is disposed around the inductor 12' and surrounds the inductor 12'. Wherein, each board-to-board connector 22 includes a connector body 221 and a plug 222 (please refer to FIG. 7 ) connected with the connector body 221 , and the plug 222 extends upward. A laser cutting process is performed to separate the lower main boards 10 each provided with the inductors 12' and the board-to-board connectors 22 (Fig. 10E). The inner circuit boards 21 are placed on the board-to-board connectors 22, and the plated through hole structures P3 of each inner circuit board 21 are correspondingly facing the pins 222 of the respective board-to-board connectors 22, and a press-fit insertion machine is used (Press-fitinsertion machine), press the inner circuit boards 21 in a press-fit insertion manner until the top surfaces of the inner circuit boards 21 are coplanar with the top surface of the inductor 12' (as shown in FIG. 10F ). ).

Step S2.3: prepare an upper main board connection piece 30B, the upper main board connection piece 30B includes a plurality of upper main board 30 connected horizontally, prepare a plurality of impedance-sensitive electronic components 32, and arrange them at positions corresponding to each upper main board 30 At least one of the impedance-sensitive electronic components 32 is mechanically and electrically coupled to the top surface of the upper motherboard connecting plate 30B by surface mount process (SMT) (as shown in FIG. 10H ).

Step S2.4: Invert the lower main board 10 provided with the board-to-board connector 22, the inner circuit board 21 and the inductor 12', and the upper main board connecting piece 30B provided with a plurality of impedance sensitive electronic components 32, and invert the above-mentioned inverted main board 10. The lower motherboard 10 is disposed above the inverted upper motherboard connecting piece 30B, and the inner circuit boards 21 are mechanically and electrically coupled to the bottom surface of the upper motherboard connecting piece 30B by a surface mount process (SMT) (as shown in FIG. 10I ). ), and the impedance-sensitive electronic components 32 are electrically coupled to the inductor 12' through the upper motherboard connecting piece 30B. After that, a layer of thermal interface material 36 (Thermal Interface Material; TIM; as shown in FIG. 10J ) is laid on each impedance sensitive electronic element 32 . Finally, a laser cutting process is performed to cut the main board connecting piece 30B, and a plurality of multilayer circuit boards 1 ′ provided with impedance sensitive electronic components 32 according to the second embodiment of the present invention can be produced (as shown in FIG. 10K).

It should be noted that step S2.3 may be performed before step S2.1, and step S2.3 may even be performed simultaneously with step S2.1.

Finally, it must be reiterated that the methods and constituent elements disclosed in the foregoing embodiments of the present invention are only for illustration, and are not intended to limit the patent scope of the present invention. All simple structures made without departing from the spirit of the present invention Modifications or changes, or replacements with other equivalent elements, should still fall within the scope covered by the claims of the present invention.

Claims (7)

1. A multilayer circuit board having impedance sensitive electronic components, comprising:

a lower main board, a top surface of which is provided with an inductor, a top surface of the inductor having an electrode;

an inner circuit board layer disposed above the lower main board and having at least one inner circuit board surrounding the inductor and electrically connected to the lower main board, a top surface of the inner circuit board layer being higher than or equal to a top surface of the inductor; and

the upper main board is electrically connected with the inner circuit board layer, the top surface of the upper main board is provided with at least one impedance sensitive electronic element and a first electroplating through hole structure, the first electroplating through hole structure penetrates through the top surface and the bottom surface of the upper main board and is electrically connected with the at least one impedance sensitive electronic element, and the electrode of the inductor is inserted into the first electroplating through hole structure and is electrically connected with the first electroplating through hole structure.

2. Multilayer circuit board provided with impedance sensitive electronic components according to claim 1,

the at least one internal circuit board is a plurality of internal circuit boards stacked on each other and electrically connected.

3. Multilayer circuit board provided with impedance sensitive electronic components according to claim 2,

each of the inner circuit boards includes a second plated through hole structure including a through hole and two pads, the through hole penetrates through the top and bottom surfaces of each of the inner circuit boards, a metal layer is laid on a wall of the through hole, the two pads are respectively disposed on the top and bottom surfaces of each of the inner circuit boards and cover the through hole, the two pads are electrically connected to the metal layer, and the inner circuit boards are electrically connected to each other through the second plated through hole structure.

4. Multilayer circuit board provided with impedance sensitive electronic components according to one of claims 1 to 3,

the at least one impedance sensitive electronic component is an intelligent power level module chip.

5. A multilayer circuit board having impedance sensitive electronic components, comprising:

the top surface of the lower main board is provided with an inductor;

an inner circuit board layer disposed above the lower main board and having a plurality of sets of paired electrical connection components, the multiple sets of electrical connection components surround the inductor and are electrically connected with the lower main board, each set of the multiple sets of electrical connection components comprises a board-to-board connector and an inner circuit board, the board-to-board connector comprises a connector body and a pin connected with the connector body, the inner circuit board comprises a plated through hole structure, the electroplating through hole structure comprises a through hole and a welding pad, the through hole penetrates through the top surface and the bottom surface of the inner circuit board, the wall of the through hole is laid with a metal layer, the welding pad is arranged at one side of the inner circuit board and covers the through hole, the plug pins are inserted into the through holes, and the top surface of each group of the plurality of groups of the electric connection assemblies is coplanar with the top surface of the inductor; and

an upper motherboard electrically connected to the inner circuit board layer and having a top surface provided with at least one impedance-sensitive electronic component electrically connected to the inductor.

6. Multilayer circuit board provided with impedance sensitive electronic components according to claim 5,

the inner circuit board is positioned above the board-to-board connector.

7. Multilayer circuit board provided with impedance sensitive electronic components according to claim 5 or 6,

the at least one impedance sensitive electronic component is an intelligent power level module chip.

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