CN215499762U - Multilayer circuit boards with impedance-sensitive electronics - Google Patents

Multilayer circuit boards with impedance-sensitive electronics Download PDF

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CN215499762U
CN215499762U CN202121984164.4U CN202121984164U CN215499762U CN 215499762 U CN215499762 U CN 215499762U CN 202121984164 U CN202121984164 U CN 202121984164U CN 215499762 U CN215499762 U CN 215499762U
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circuit board
inner circuit
board
inductor
sensitive electronic
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黄世昌
邱俊吉
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Huanxu Shenzhen Electronic Technology Innovation Co ltd
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Huanxu Shenzhen Electronic Technology Innovation Co ltd
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Abstract

The utility model has described a multilayer circuit board with sensitive electronic component of impedance, it includes lower mother board, inner circuit board layer and upper mother board; the top surface of the lower main board is provided with an inductor; an inner circuit board layer located between the upper and lower main boards and having at least one inner circuit board surrounding the inductor, a top surface of the inner circuit board layer being higher than or equal to a top surface of the inductor; the upper main board is provided with at least one impedance sensitive electronic element and an electroplating through hole structure; electrodes of the inductor are inserted into the electroplating through hole structure and electrically connected with the electroplating through hole structure; through the design of the multilayer circuit board, the distance between the impedance sensitive electronic element and the inductor can be effectively shortened, and the impedance of circuit layout is effectively reduced.

Description

设有阻抗敏感电子元件的多层电路板Multilayer circuit boards with impedance-sensitive electronics

技术领域technical field

本实用新型涉及一种多层电路板,尤其涉及一种设有阻抗敏感电子元件的多层电路板。The utility model relates to a multi-layer circuit board, in particular to a multi-layer circuit board provided with impedance sensitive electronic components.

背景技术Background technique

部分电路板因为功能上的需求而设有阻抗敏感电子元件(例如电源模块),阻抗敏感电子元件是指其特性或表现会受到线路布局的阻抗严重影响的电子元件,其中就以电源模块为例,在电路板的线路布局上,会希望电源模块与其所电耦接的电容器或电感器之间的线路能尽可能地缩短,由此降低线路布局的整体阻抗并提升电源输出效率。然而,惯用的电路板的设计,只是单纯将上述阻抗敏感电子元件设置在多层电路板中的其中一层电路板上,其线路布局与电子元件的配置方式并无法有效地降低整体阻抗,可见惯用的电路板的设计未臻完善而尚有可改善的空间。Some circuit boards are equipped with impedance-sensitive electronic components (such as power modules) due to functional requirements. Impedance-sensitive electronic components refer to electronic components whose characteristics or performance are seriously affected by the impedance of the circuit layout. Take the power module as an example. In the circuit layout of the circuit board, it is desirable that the circuit between the power module and the capacitor or inductor to which it is electrically coupled can be shortened as much as possible, thereby reducing the overall impedance of the circuit layout and improving the power output efficiency. However, in the conventional circuit board design, the above impedance-sensitive electronic components are simply arranged on one layer of the circuit board in the multilayer circuit board, and the circuit layout and the configuration of the electronic components cannot effectively reduce the overall impedance. It can be seen that Conventional circuit board designs are imperfect and leave room for improvement.

实用新型内容Utility model content

本实用新型的其中一个目的在于针对现有技术的缺失进行改良,进而提出一种设有阻抗敏感电子元件的多层电路板,其阻抗敏感电子元件与电感器之间的线路布局的距离较短,从而能有效地降低线路布局的整体阻抗。One of the objectives of the present invention is to improve the deficiencies of the prior art, and further propose a multilayer circuit board with impedance-sensitive electronic components, the circuit layout distance between the impedance-sensitive electronic components and the inductor is short , which can effectively reduce the overall impedance of the circuit layout.

于是,根据本实用新型所提供的一种设有阻抗敏感电子元件的多层电路板的结构,其包含有下主板、内电路板层以及上主板。其中,下主板的顶面设有电感器,并且电感器的顶面具有电极。内电路板层设于下主板上方并具有至少一个内电路板,上述至少一个内电路板围绕电感器并且电连接下主板,上述内电路板层的顶面高于或等于电感器的顶面。上主板电连接内电路板层并且顶面设有至少一个阻抗敏感电子元件、以及第一电镀通孔结构。上述第一电镀通孔结构贯穿上主板的顶、底两面并且电连接上述至少一个阻抗敏感电子元件。电感器的电极插接于上述第一电镀通孔结构并且电连接第一电镀通孔结构。Therefore, according to the structure of a multilayer circuit board provided with impedance-sensitive electronic components provided by the present invention, the structure includes a lower main board, an inner circuit board layer and an upper main board. Wherein, the top surface of the lower main board is provided with an inductor, and the top surface of the inductor is provided with electrodes. The inner circuit board layer is arranged above the lower main board and has at least one inner circuit board, the at least one inner circuit board surrounds the inductor and is electrically connected to the lower main board, and the top surface of the inner circuit board layer is higher than or equal to the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer and is provided with at least one impedance sensitive electronic element and a first plated through hole structure on the top surface. The first plated through hole structure penetrates the top and bottom surfaces of the upper motherboard and is electrically connected to the at least one impedance-sensitive electronic element. The electrodes of the inductor are inserted into the first plated through hole structure and are electrically connected to the first plated through hole structure.

通过上述多层电路板的设计,由于电感器是通过其电极而插接于上述第一电镀通孔结构并与其形成电耦接,如此可有效地缩短阻抗敏感电子元件到电感器之间的线路布局的距离,遂能有效地降低线路布局上的整体阻抗。Through the design of the above-mentioned multilayer circuit board, since the inductor is inserted into the first plated through hole structure through its electrodes and electrically coupled with it, the circuit between the impedance-sensitive electronic component and the inductor can be effectively shortened. The distance of the layout can effectively reduce the overall impedance on the circuit layout.

在其中一个方面,为了有效调整上主板与下主板之间的高度差,上述至少一个内电路板可为多个内电路板,并且这些内电路板彼此相互堆叠且电连接。In one aspect, in order to effectively adjust the height difference between the upper mainboard and the lower mainboard, the at least one inner circuit board may be a plurality of inner circuit boards, and the inner circuit boards are stacked and electrically connected to each other.

在另一个方面,各个内电路板都包含有第二电镀通孔结构,第二电镀通孔结构包含有一个贯孔和两个焊接垫,贯孔贯穿各个内电路板的顶、底两面,贯孔的孔壁铺设有金属层,两个焊接垫分别设于各个内电路板的顶、底两面并且覆盖贯孔,两个焊接垫电连接金属层,并且各个内电路板都通过第二电镀通孔结构而彼此电连接。In another aspect, each inner circuit board includes a second plated through hole structure, the second plated through hole structure includes a through hole and two solder pads, the through hole penetrates through the top and bottom surfaces of each inner circuit board, and the through hole penetrates through the inner circuit board. The hole wall of the hole is covered with a metal layer, two soldering pads are respectively arranged on the top and bottom sides of each inner circuit board and cover the through hole, the two soldering pads are electrically connected to the metal layer, and each inner circuit board is plated through the second The hole structure is electrically connected to each other.

在另一个方面,阻抗敏感电子元件可为但不限于智能功率级模块(Smart PowerStage)芯片。In another aspect, the impedance-sensitive electronic component may be, but is not limited to, a Smart PowerStage chip.

本实用新型还提供一种设有阻抗敏感电子元件的多层电路板的结构,其包含有下主板、内电路板层以及上主板。其中,下主板的顶面设有电感器。内电路板层设于下主板的上方并具有多组成对的电连接组件,上述多组电连接组件围绕电感器并且电连接下主板,上述多组电连接组件中的每一组都包含有板对板连接器以及内电路板,板对板连接器包含有连接器本体和连接了连接器本体的插销。每一个内电路板都包含有电镀通孔结构,电镀通孔结构包含有贯孔和焊接垫,贯孔贯穿内电路板的顶、底两面,贯孔的孔壁铺设有金属层,焊接垫设于内电路板的一侧并且覆盖该侧的贯孔,插销插接于贯孔内,上述多组电连接组件中的每一组的顶面均与电感器的顶面共平面。上主板电连接内电路板层并且顶面设有至少一个阻抗敏感电子元件,上述至少一个阻抗敏感电子元件电连接电感器。The utility model also provides a structure of a multi-layer circuit board provided with impedance-sensitive electronic components, which comprises a lower main board, an inner circuit board layer and an upper main board. Wherein, the top surface of the lower motherboard is provided with an inductor. The inner circuit board layer is arranged above the lower main board and has a plurality of pairs of electrical connection components. The above-mentioned groups of electrical connection components surround the inductor and are electrically connected to the lower main board. Each group of the above-mentioned groups of electrical connection components includes a board A board-to-board connector and an inner circuit board, the board-to-board connector includes a connector body and a pin connected to the connector body. Each inner circuit board includes a plated through hole structure. The plated through hole structure includes through holes and solder pads. The through holes penetrate through the top and bottom sides of the inner circuit board. On one side of the inner circuit board and covering the through hole on the side, the plug is inserted into the through hole, and the top surface of each group of the above-mentioned multiple sets of electrical connection components is coplanar with the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer, and at least one impedance-sensitive electronic element is provided on the top surface, and the at least one impedance-sensitive electronic element is electrically connected to the inductor.

在其中一个方面,内电路板位于板对板连接器的上方,在某些情况下,内电路板与板对板连接器二者也可颠倒设置。In one aspect, the inner circuit board is positioned over the board-to-board connector, and in some cases both the inner circuit board and the board-to-board connector may be reversed.

附图说明Description of drawings

有关上述设有阻抗敏感电子元件的多层电路板的详细构造、特点、及其制造方法将于以下的实施例予以说明,然而,应能理解的是,以下将说明的实施例以及附图仅作为示例性的说明,其不应用来限制本实用新型的权利要求范围,其中:The detailed structure, features, and manufacturing methods of the above-mentioned multilayer circuit board provided with impedance-sensitive electronic components will be described in the following embodiments. However, it should be understood that the following embodiments and the accompanying drawings are only for As an exemplary illustration, it should not be used to limit the scope of the claims of the present invention, wherein:

图1是第一实施例的多层电路板的剖面示意图;1 is a schematic cross-sectional view of a multilayer circuit board according to a first embodiment;

图2是第一实施例的电感器的立体图;2 is a perspective view of the inductor of the first embodiment;

图3是第一实施例的内电路板的剖面示意图,用于说明第二电镀通孔结构;3 is a schematic cross-sectional view of the inner circuit board according to the first embodiment, for illustrating the second plated through hole structure;

图4是第一实施例的多层电路板的制造方法的步骤流程图;FIG. 4 is a flow chart of the steps of the manufacturing method of the multilayer circuit board of the first embodiment;

图5A至图5P是对应于图4的各步骤的剖面示意图;5A to 5P are schematic cross-sectional views corresponding to each step of FIG. 4;

图6是第二实施例的多层电路板的剖面示意图;6 is a schematic cross-sectional view of a multilayer circuit board according to a second embodiment;

图7是第二实施例的板对板连接件的外观示意图;7 is a schematic view of the appearance of the board-to-board connector of the second embodiment;

图8是第二实施例的内电路板的剖面示意图,用于说明电镀通孔结构;8 is a schematic cross-sectional view of the inner circuit board of the second embodiment, for illustrating the plated through hole structure;

图9是第二实施例的多层电路板的制造方法的步骤流程图;以及图10A至图10K是对应于图9的各步骤的剖面示意图。9 is a flow chart of steps of a method of manufacturing a multilayer circuit board according to a second embodiment; and FIGS. 10A to 10K are schematic cross-sectional views corresponding to the steps of FIG. 9 .

(符号说明)(Symbol Description)

1、1’…多层电路板 10…下主板1. 1’…Multilayer circuit board 10…Lower motherboard

10B…下主板连片 11…焊接垫10B…Lower motherboard connection piece 11…Solder pads

12、12’…电感器 13…本体12, 12’…Inductor 13…Body

14…电极 20…内电路板层14…Electrodes 20…Inner circuit board layers

21…内电路板 22…板对板连接器21…Inner circuit board 22…Board-to-board connector

221…连接器本体 222…插销221…Connector body 222…Plunger

23…贯孔 24…焊接垫23…Through hole 24…Solder pad

25…金属层 26…树脂25…Metal layer 26…Resin

30…上主板 30B…上主板连片30…On the main board 30B…On the main board

31…焊接垫 32…阻抗敏感电子元件31…Solder pads 32…Impedance-sensitive electronic components

33…贯孔 34…金属层33…Through hole 34…Metal layer

36…热界面材料 21B…内电路板连片36…Thermal interface material 21B…Inner circuit board connection piece

27B…第一内电路板连片 21a…第一内电路板27B...the first inner circuit board connecting piece 21a...the first inner circuit board

28B…第二内电路板连片 21b…第二内电路板28B...Second inner circuit board connecting piece 21b...Second inner circuit board

29B…第三内电路板连片 21c…第三内电路板29B...the third inner circuit board connecting piece 21c...the third inner circuit board

G1、G2…内电路板群组 G3…电连接组件G1, G2...Inner circuit board group G3...Electrical connection components

P1、P2、P3…电镀通孔结构P1, P2, P3…plated through hole structure

具体实施方式Detailed ways

以下通过所列举的若干实施例结合附图,详细说明本实用新型的技术内容及特征,本说明书内容所提及的“上”、“下”、“内”、“外”、“顶”、“底”等方向性形容用语,只是以正常使用方向为基准的例示描述用语,并非作为限制主张范围的用意。The following describes the technical content and features of the present utility model in detail through the enumerated embodiments in conjunction with the accompanying drawings. Directional descriptive terms such as "bottom" are merely illustrative terms based on the normal use direction, and are not intended to limit the scope of claims.

为了详细说明本实用新型的技术特点所在,兹举以下的两个实施例并结合附图说明如后。In order to illustrate the technical features of the present invention in detail, the following two embodiments are given and described below in conjunction with the accompanying drawings.

如图1所示,第一实施例提供了一种设有阻抗敏感电子元件的多层电路板1,其包含有下主板10、内电路板层20以及上主板30。As shown in FIG. 1 , the first embodiment provides a multilayer circuit board 1 provided with impedance-sensitive electronic components, which includes a lower main board 10 , an inner circuit board layer 20 and an upper main board 30 .

下主板10的顶面铺设有若干个焊接垫11,下主板10的顶面的中央设有电感器12。如图2所示,电感器12在结构上包含有一个本体13和两个电极14,本体13的底部电连接下主板10,两个电极14设于本体13的顶面并且向上地延伸。A plurality of soldering pads 11 are laid on the top surface of the lower main board 10 , and an inductor 12 is provided in the center of the top surface of the lower main board 10 . As shown in FIG. 2 , the inductor 12 structurally includes a body 13 and two electrodes 14 . The bottom of the body 13 is electrically connected to the lower motherboard 10 , and the two electrodes 14 are disposed on the top surface of the body 13 and extend upward.

内电路板层20设于下主板10的上方并包含有多个内电路板21,这些内电路板21成组地配置,每一组内电路板21都是由多个内电路板21上下堆叠而构成,在本实施例中,每一组内电路板21的数量为三。这些内电路板21围绕着电感器12,并且每一组内电路板21都是电连接至下主板10。请参考图3,各个内电路板21都包含有电镀通孔结构P2(PlatingThrough Hole),电镀通孔结构P2在结构上包含有一个贯孔23和两个焊接垫24,贯孔23贯穿各个内电路板21的顶、底两面,贯孔23的孔壁铺设有金属层25并且贯孔23内还设有树脂26,两个焊接垫24分别设于各个内电路板21的顶、底两面并且覆盖贯孔23,两个焊接垫24电连接金属层25。通过电镀通孔结构P2,可有效地使堆叠的各个内电路板21能彼此电性连接,并控制内电路板层20的顶面的高度,使内电路板层20的顶面高于或等于电感器12的顶面。The inner circuit board layer 20 is disposed above the lower main board 10 and includes a plurality of inner circuit boards 21 . These inner circuit boards 21 are arranged in groups, and each group of inner circuit boards 21 is composed of a plurality of inner circuit boards 21 stacked on top of each other. However, in this embodiment, the number of circuit boards 21 in each group is three. These inner circuit boards 21 surround the inductor 12 , and each set of inner circuit boards 21 is electrically connected to the lower main board 10 . Referring to FIG. 3 , each inner circuit board 21 includes a plated through hole structure P2 (Plating Through Hole). The plated through hole structure P2 includes a through hole 23 and two solder pads 24 in structure, and the through hole 23 penetrates through each inner On the top and bottom sides of the circuit board 21 , the hole wall of the through hole 23 is covered with a metal layer 25 and the through hole 23 is also provided with a resin 26 , and two soldering pads 24 are respectively provided on the top and bottom sides of each inner circuit board 21 and Covering the through hole 23 , the two bonding pads 24 are electrically connected to the metal layer 25 . Through the plated through hole structure P2, the stacked inner circuit boards 21 can be electrically connected to each other effectively, and the height of the top surface of the inner circuit board layer 20 can be controlled so that the top surface of the inner circuit board layer 20 is higher than or equal to The top surface of the inductor 12 .

请回到图1,上主板30设于内电路板层20的上方,并且顶面与底面都铺设有若干个焊接垫31,使得上主板30能够通过焊接垫31而电连接内电路板层20。上主板30的顶面设有呈间隔设置的两个阻抗敏感电子元件32以及设于该两个阻抗敏感电子元件32之间的两个电镀通孔结构P1(图1仅绘示其中一个)。在本实施例中,阻抗敏感电子元件32为智能功率级模块(Smart Power Stage)芯片。在某些情况下,阻抗敏感电子元件32的数量也可能只有一个。上主板30的电镀通孔结构P1的结构是不同于内电路板21的电镀通孔结构P2,具体而言,上主板30的电镀通孔结构P1贯穿上主板30的顶、底两面并且通过导线而电连接该两个阻抗敏感电子元件32,贯孔33的孔壁铺设有金属层34,电感器12的电极14插接于电镀通孔结构P1的贯孔33内并且电连接电镀通孔结构P1,使得该两个阻抗敏感电子元件32能够通过上主板30的电镀通孔结构P1而电连接至电感器12。Please return to FIG. 1 , the upper main board 30 is disposed above the inner circuit board layer 20 , and a plurality of soldering pads 31 are laid on the top surface and the bottom surface, so that the upper mainboard 30 can be electrically connected to the inner circuit board layer 20 through the soldering pads 31 . . The top surface of the upper motherboard 30 is provided with two impedance sensitive electronic components 32 arranged at intervals and two plated through hole structures P1 (only one of which is shown in FIG. 1 ) disposed between the two impedance sensitive electronic components 32 . In this embodiment, the impedance sensitive electronic component 32 is a smart power stage (Smart Power Stage) chip. In some cases, the number of impedance sensitive electronic components 32 may also be only one. The plated through hole structure P1 of the upper main board 30 is different from the plated through hole structure P2 of the inner circuit board 21. Specifically, the plated through hole structure P1 of the upper main board 30 penetrates through the top and bottom surfaces of the upper main board 30 and passes through wires. The two impedance-sensitive electronic components 32 are electrically connected, the wall of the through hole 33 is covered with a metal layer 34, and the electrode 14 of the inductor 12 is inserted into the through hole 33 of the plated through hole structure P1 and electrically connected to the plated through hole structure P1 , so that the two impedance-sensitive electronic components 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper motherboard 30 .

通过上述多层电路板1的设计,由于电感器12是通过其电极14而插接于上述电镀通孔结构P1并与上主板30的电镀通孔结构P1形成电耦接,使得阻抗敏感电子元件32能够通过上主板30的电镀通孔结构P1而以较短的线路布局的距离电连接至电感器12,如此可有效地缩短阻抗敏感电子元件32到电感器12之间的线路布局的距离,并能有效地降低线路布局上的整体阻抗,提升阻抗敏感电子元件32的输出效率。Through the design of the above-mentioned multilayer circuit board 1 , since the inductor 12 is inserted into the plated through hole structure P1 through its electrodes 14 and electrically coupled with the plated through hole structure P1 of the upper main board 30 , the impedance-sensitive electronic component is 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper motherboard 30 with a short circuit layout distance, so that the circuit layout distance between the impedance sensitive electronic component 32 and the inductor 12 can be effectively shortened, And can effectively reduce the overall impedance on the circuit layout, and improve the output efficiency of the impedance-sensitive electronic component 32 .

以下将说明第一实施例的多层电路板1的制造方法,请参考图4、图5A至图5P,上述制造方法包含有以下步骤。The manufacturing method of the multilayer circuit board 1 of the first embodiment will be described below. Please refer to FIG. 4 and FIG. 5A to FIG. 5P. The manufacturing method includes the following steps.

步骤S1.1:准备多个彼此相互堆叠且电连接的内电路板。具体而言,准备一个第一内电路板连片27B(如图5A),第一内电路板连片27B包含有多个横向连接的第一内电路板21a,并且每一个第一内电路板21a都设有电镀通孔结构P2。执行切割制程(routing)而分离出各个第一内电路板21a(如图5B)。接着,准备一个第二内电路板连片28B,第二内电路板连片28B同样具有多个横向连接的第二内电路板21b,并且第二内电路板21b同样设有电镀通孔结构P2(如图5C),将上述分离出的各个第一内电路板21a置放于第二内电路板连片28B的焊接垫24上,并以表面黏着制程(SMT)而将这些第一内电路板21a与第二内电路板连片28B机械地且电性地耦接为一体(如图5D),接着再执行切割制程(routing)以切割第二内电路板连片28B,如此将形成多组由第一内电路板21a与第二内电路板21b上下叠合的内电路板群组G1(如图5E)。之后,再准备一个第三内电路板连片29B,第三内电路板连片29B也具有多个横向连接的第三内电路板21c,并且第三内电路板21c同样设有电镀通孔结构P2(如图5F),将上述切割出的内电路板群组G1置放于第三内电路板连片29B的焊接垫24上,并以表面黏着制程(SMT)而将这些内电路板群组G1机械地且电性地耦接于第三内电路板连片29B(如图5G),最后执行切割制程(routing)以切割第三内电路板连片29B,如此将形成多组由第一至第三内电路板21a~21c上下叠合的内电路板群组G2(如图5H)。Step S1.1: Prepare a plurality of inner circuit boards that are stacked and electrically connected to each other. Specifically, a first inner circuit board connecting piece 27B (as shown in FIG. 5A ) is prepared. The first inner circuit board connecting piece 27B includes a plurality of laterally connected first inner circuit boards 21a, and each first inner circuit board 21a are provided with plated through hole structures P2. A dicing process (routing) is performed to separate out each of the first inner circuit boards 21a (as shown in FIG. 5B ). Next, a second inner circuit board connecting piece 28B is prepared. The second inner circuit board connecting piece 28B also has a plurality of laterally connected second inner circuit boards 21b, and the second inner circuit board 21b is also provided with a plated through hole structure P2 (as shown in FIG. 5C ), each of the separated first inner circuit boards 21 a is placed on the soldering pads 24 of the second inner circuit board connecting piece 28B, and these first inner circuit boards are assembled by surface mount process (SMT). The board 21a and the second inner circuit board connecting piece 28B are mechanically and electrically coupled as a whole (as shown in FIG. 5D ), and then a cutting process (routing) is performed to cut the second inner circuit board connecting piece 28B, so that multiple The group is an inner circuit board group G1 in which the first inner circuit board 21a and the second inner circuit board 21b are superimposed on top of each other (as shown in FIG. 5E ). After that, a third inner circuit board connecting piece 29B is prepared. The third inner circuit board connecting piece 29B also has a plurality of horizontally connected third inner circuit boards 21c, and the third inner circuit board 21c also has a plated through hole structure. P2 (as shown in FIG. 5F ), the above-cut inner circuit board groups G1 are placed on the solder pads 24 of the third inner circuit board connecting piece 29B, and these inner circuit board groups are assembled by surface mount process (SMT). The group G1 is mechanically and electrically coupled to the third inner circuit board connecting piece 29B (as shown in FIG. 5G ), and finally a cutting process (routing) is performed to cut the third inner circuit board connecting piece 29B, thus forming a plurality of groups from the first connecting piece 29B. The first to third inner circuit boards 21a-21c are stacked on top of each other in the inner circuit board group G2 (as shown in FIG. 5H).

接着,准备一个下主板连片10B,下主板连片10B包含有多个横向连接的下主板10,在下主板连片10B的顶面铺设若干个焊接垫11(如图5I),准备多个顶面具有电极14的电感器12,执行点胶制程而将电感器12粘在下主板连片10B的顶面的焊接垫11上,将上述多组由第一至第三内电路板21a~21c上下叠合的内电路板群组G2配置于下主板连片10B的顶面的焊接垫11上且位于电感器12的外围,由此围绕电感器12。以表面黏着制程(SMT)将电感器12与上述内电路板群组G2(即这些内电路板21a~21c)机械地且电性地耦接于下主板10的顶面(如图5J)。执行激光切割制程(laser Cutting)而分离出多个设有电感器12和这些内电路板21a~21c的下主板10(如图5K)。Next, prepare a lower main board connecting piece 10B. The lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally. Several soldering pads 11 are laid on the top surface of the lower main board connecting piece 10B (as shown in FIG. 5I ), and a plurality of top plates are prepared. The inductor 12 with the electrode 14 on the surface is glued to the solder pad 11 on the top surface of the lower motherboard connecting piece 10B by performing a glue dispensing process, and the above-mentioned multiple groups are placed up and down from the first to third inner circuit boards 21a-21c. The stacked inner circuit board group G2 is disposed on the solder pads 11 on the top surface of the lower motherboard connecting piece 10B and is located at the periphery of the inductor 12 , thereby surrounding the inductor 12 . The inductor 12 and the above-mentioned inner circuit board group G2 (ie, the inner circuit boards 21 a - 21 c ) are mechanically and electrically coupled to the top surface of the lower motherboard 10 by a surface mount process (SMT) (as shown in FIG. 5J ). A laser cutting process is performed to separate a plurality of lower main boards 10 provided with the inductors 12 and the inner circuit boards 21 a - 21 c (as shown in FIG. 5K ).

步骤S1.2:准备一个上主板连片30B,上主板连片30B包含有多个横向连接的上主板30,每个上主板30都具有一个电镀通孔结构P1并且顶面设有若干个焊接垫31(如图5L)。将多个阻抗敏感电子元件32配置于每个电镀通孔结构P1的两侧,以表面黏着制程(SMT)将阻抗敏感电子元件32机械地且电性地耦接于上主板30的顶面(如图5M),并在各个阻抗敏感电子元件32上铺设一层热界面材料36(Thermal Interface Material;TIM;如图5N)。Step S1.2: prepare an upper main board connection piece 30B, the upper main board connection piece 30B includes a plurality of upper main boards 30 connected horizontally, each upper main board 30 has a plated through hole structure P1 and a number of solder joints are arranged on the top surface pad 31 (see Figure 5L). A plurality of impedance sensitive electronic components 32 are arranged on both sides of each plated through hole structure P1, and the impedance sensitive electronic components 32 are mechanically and electrically coupled to the top surface ( As shown in FIG. 5M ), a layer of thermal interface material 36 (Thermal Interface Material; TIM; FIG. 5N ) is laid on each impedance sensitive electronic component 32 .

步骤S1.3:倒置设有这些内电路板21a~21c和电感器12的下主板10以及设有阻抗敏感电子元件32的上主板连片30B,以使电感器12的电极14插入上主板30的电镀通孔结构P1,以表面黏着制程(SMT)将电感器12与电镀通孔结构P1机械地且电性地耦接为一体,并且电耦接这些内电路板21a~21c与上主板30(如图5O)。最后,再执行激光切割制程(laserCutting)而切割各个设有电感器12、阻抗敏感电子元件32以及这些内电路板21a~21c的上主板连片30B,即可制出本实用新型的第一实施例的多个设有阻抗敏感电子元件32的多层电路板1(如图5P)。Step S1.3: Invert the lower main board 10 provided with the inner circuit boards 21a-21c and the inductor 12 and the upper main board connecting piece 30B provided with the impedance sensitive electronic element 32, so that the electrodes 14 of the inductor 12 are inserted into the upper main board 30 The plated through hole structure P1 is mechanically and electrically coupled to the inductor 12 and the plated through hole structure P1 by a surface mount process (SMT), and electrically coupled to the inner circuit boards 21a-21c and the upper motherboard 30 (Figure 5O). Finally, a laser cutting process is performed to cut each of the upper main board connecting pieces 30B provided with the inductors 12 , the impedance sensitive electronic components 32 , and the inner circuit boards 21 a - 21 c to produce the first embodiment of the present invention. For example, a plurality of multilayer circuit boards 1 provided with impedance-sensitive electronic components 32 (as shown in FIG. 5P ).

需说明的是,步骤S1.2可以在步骤S1.1之前执行,步骤S1.2甚至可能和步骤S1.1同时执行。It should be noted that step S1.2 may be executed before step S1.1, and step S1.2 may even be executed simultaneously with step S1.1.

本实用新型另提供一第二实施例,请参考图6。第二实施例同样提供了一种设有阻抗敏感电子元件的多层电路板1’,其可应用于表面贴装型(SMD)的电感器12’。第二实施例的多层电路板1’在结构上包含有下主板10、内电路板层20以及上主板30。The present invention further provides a second embodiment, please refer to FIG. 6 . The second embodiment also provides a multilayer circuit board 1' provided with impedance-sensitive electronic components, which can be applied to a surface mount type (SMD) inductor 12'. The multilayer circuit board 1' of the second embodiment includes a lower main board 10, an inner circuit board layer 20 and an upper main board 30 in structure.

下主板10的顶面铺设有若干个焊接垫11,下主板10的顶面的中央设有电感器12’。电感器12’的顶面和底面都设有电极14,电感器12’通过底面的电极14与下主板10电连接。A number of soldering pads 11 are laid on the top surface of the lower main board 10, and an inductor 12' is provided in the center of the top surface of the lower main board 10. Electrodes 14 are provided on the top and bottom surfaces of the inductor 12', and the inductor 12' is electrically connected to the lower main board 10 through the electrodes 14 on the bottom surface.

内电路板层20设于下主板10上方并具有多组成对的电连接组件G3,多组电连接组件G3围绕电感器12’并且电连接下主板10。每一组电连接组件G3都包含有板对板连接器22(board-to-board connector;如图7)以及设置于板对板连接器22上方的内电路板21(如图8)。其中,板对板连接器22包含有连接器本体221和连接了连接器本体221的插销222。内电路板21包含有电镀通孔结构P3,电镀通孔结构P3包含有贯孔23和焊接垫24,贯孔23贯穿内电路板21的顶、底两面,贯孔23的孔壁铺设有金属层25,焊接垫24设于内电路板21的顶面并且覆盖贯孔23。板对板连接器22的插销222向上地插接于内电路板21的电镀通孔结构P3的贯孔23内,并且板对板连接器22通过插销222与内电路板21形成电耦接。另外,通过压配插入(press-fit insertion)的方式,每一组的电连接组件G3的顶面均与该电感器12’的顶面共平面,以利于内电路板层20以及电感器12’后续能与上主板30顺利地形成电耦接。The inner circuit board layer 20 is disposed above the lower main board 10 and has a plurality of pairs of electrical connection components G3 . The plurality of electrical connection components G3 surround the inductor 12 ′ and are electrically connected to the lower main board 10 . Each set of electrical connection components G3 includes a board-to-board connector 22 (as shown in FIG. 7 ) and an inner circuit board 21 (as shown in FIG. 8 ) disposed above the board-to-board connector 22 . The board-to-board connector 22 includes a connector body 221 and a plug 222 connected to the connector body 221 . The inner circuit board 21 includes a plated through hole structure P3. The plated through hole structure P3 includes a through hole 23 and a solder pad 24. The through hole 23 penetrates through the top and bottom surfaces of the inner circuit board 21. The hole wall of the through hole 23 is covered with metal. Layer 25 and solder pads 24 are provided on the top surface of the inner circuit board 21 and cover the through holes 23 . The pin 222 of the board-to-board connector 22 is inserted upwardly into the through hole 23 of the plated through hole structure P3 of the inner circuit board 21 , and the board-to-board connector 22 is electrically coupled to the inner circuit board 21 through the pin 222 . In addition, by means of press-fit insertion, the top surface of each set of electrical connection components G3 is coplanar with the top surface of the inductor 12 ′, so as to facilitate the inner circuit board layer 20 and the inductor 12 'Subsequently, the electrical coupling can be smoothly formed with the upper motherboard 30 .

上主板30设置于内电路板层20的上方,并且上主板30的顶面与底面也都铺设有若干的焊接垫31。上主板30的顶面设有呈间隔设置的两个阻抗敏感电子元件32(在本实施例中阻抗敏感电子元件32为智能功率级模块(Smart Power Stage)芯片。并且,在某些情况下,上主板30的阻抗敏感电子元件32也可能只有一个)。上主板30电连接内电路板层20,并且两个阻抗敏感电子元件32通过上主板30而电连接电感器12’,由此缩短两个阻抗敏感电子元件32与电感器12’之间的线路布局的距离。The upper main board 30 is disposed above the inner circuit board layer 20 , and a number of soldering pads 31 are also laid on the top surface and the bottom surface of the upper main board 30 . The top surface of the upper motherboard 30 is provided with two impedance-sensitive electronic components 32 (in this embodiment, the impedance-sensitive electronic components 32 are Smart Power Stage) chips arranged at intervals. There may also be only one impedance sensitive electronic component 32 on the upper motherboard 30). The upper main board 30 is electrically connected to the inner circuit board layer 20, and the two impedance sensitive electronic components 32 are electrically connected to the inductor 12' through the upper main board 30, thereby shortening the line between the two impedance sensitive electronic components 32 and the inductor 12' Layout distance.

通过第二实施例的多层电路板1’的设计,同样也能缩短阻抗敏感电子元件32到电感器12’之间的线路布局的距离,并能有效地降低线路布局上的整体阻抗,提升阻抗敏感电子元件32的输出效率。Through the design of the multilayer circuit board 1 ′ of the second embodiment, the distance of the circuit layout between the impedance sensitive electronic component 32 and the inductor 12 ′ can also be shortened, and the overall impedance on the circuit layout can be effectively reduced, improving the Output efficiency of impedance sensitive electronics 32.

以下将说明第二实施例的多层电路板1’的制造方法,请参考图9、图10A至图10K,上述制造方法包含有以下步骤。The manufacturing method of the multilayer circuit board 1' of the second embodiment will be described below. Please refer to FIG. 9 and FIG. 10A to FIG. 10K. The manufacturing method includes the following steps.

步骤S2.1:准备多个内电路板。具体而言,准备一个内电路板连片21B(如图10A),内电路板连片21B包含有多个横向连接的内电路板21,各个内电路板21都包含有电镀通孔结构P3(请参考图8),电镀通孔结构P3包含有贯孔23和焊接垫24,贯孔23贯穿内电路板21的顶、底两面,贯孔23的孔壁铺设有金属层25,焊接垫24设于内电路板21的顶面并且覆盖贯孔23。之后,执行切割制程(routing),以从内电路板连片21B中分离出每一个内电路板21(如图10B)。Step S2.1: Prepare multiple inner circuit boards. Specifically, an inner circuit board connecting piece 21B is prepared (as shown in FIG. 10A ). The inner circuit board connecting piece 21B includes a plurality of laterally connected inner circuit boards 21 , and each inner circuit board 21 includes a plated through hole structure P3 ( Please refer to FIG. 8 ), the plated through hole structure P3 includes through holes 23 and solder pads 24 , the through holes 23 penetrate through the top and bottom surfaces of the inner circuit board 21 , the hole walls of the through holes 23 are covered with a metal layer 25 , and the solder pads 24 It is arranged on the top surface of the inner circuit board 21 and covers the through hole 23 . After that, a routing process is performed to separate each inner circuit board 21 from the inner circuit board connecting piece 21B (as shown in FIG. 10B ).

步骤S2.2:准备一个下主板连片10B,下主板连片10B包含有多个横向连接的下主板10,在下主板连片10B的顶面铺设若干个焊接垫11(如图10C)。准备多个表面贴装型(SMD)的电感器12’以及多个板对板连接器22。以表面黏着制程(SMT)将电感器12’与上述板对板连接器22机械地且电性地耦接于下主板连片10B的顶面(如图10D),并且将这些板对板连接器22配置于电感器12’外围并且围绕电感器12’。其中,各个板对板连接器22都包含有连接器本体221和连接了连接器本体221的插销222(请参考图7),插销222呈向上地延伸。执行激光切割制程(laser Cutting)而分离出各个设有电感器12’和板对板连接器22的下主板10(如图10E)。将这些内电路板21置放于这些板对板连接器22上,并使各个内电路板21的电镀通孔结构P3对应地面向各个板对板连接器22的插销222,使用压配插入机器(Press-fitinsertion machine),以压配插入(press-fit insertion)的方式下压这些内电路板21直到这些内电路板21的顶面均与电感器12’的顶面共平面(如图10F)。Step S2.2: Prepare a lower main board connecting piece 10B. The lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally. Several soldering pads 11 are laid on the top surface of the lower main board connecting piece 10B (as shown in FIG. 10C ). A plurality of surface mount type (SMD) inductors 12' and a plurality of board-to-board connectors 22 are prepared. The inductor 12 ′ and the above-mentioned board-to-board connector 22 are mechanically and electrically coupled to the top surface of the lower motherboard connecting piece 10B (as shown in FIG. 10D ) by a surface mount process (SMT), and these board-to-board connections are made The inductor 22 is disposed around the inductor 12' and surrounds the inductor 12'. Wherein, each board-to-board connector 22 includes a connector body 221 and a plug 222 (please refer to FIG. 7 ) connected with the connector body 221 , and the plug 222 extends upward. A laser cutting process is performed to separate the lower main boards 10 each provided with the inductors 12' and the board-to-board connectors 22 (Fig. 10E). The inner circuit boards 21 are placed on the board-to-board connectors 22, and the plated through hole structures P3 of each inner circuit board 21 are correspondingly facing the pins 222 of the respective board-to-board connectors 22, and a press-fit insertion machine is used (Press-fitinsertion machine), press the inner circuit boards 21 in a press-fit insertion manner until the top surfaces of the inner circuit boards 21 are coplanar with the top surface of the inductor 12' (as shown in FIG. 10F ). ).

步骤S2.3:准备一个上主板连片30B,上主板连片30B包含有多个横向连接的上主板30,准备多个阻抗敏感电子元件32,在对应每一个上主板30的位置上都配置至少一个上述阻抗敏感电子元件32,以表面黏着制程(SMT)将这些阻抗敏感电子元件32机械地且电性地耦接于上主板连片30B的顶面(如图10H)。Step S2.3: prepare an upper main board connection piece 30B, the upper main board connection piece 30B includes a plurality of upper main board 30 connected horizontally, prepare a plurality of impedance-sensitive electronic components 32, and arrange them at positions corresponding to each upper main board 30 At least one of the impedance-sensitive electronic components 32 is mechanically and electrically coupled to the top surface of the upper motherboard connecting plate 30B by surface mount process (SMT) (as shown in FIG. 10H ).

步骤S2.4:倒置设有板对板连接器22、内电路板21及电感器12’的下主板10和设有多个阻抗敏感电子元件32的上主板连片30B,将上述倒置后的下主板10配置于上述倒置后的上主板连片30B的上方,以表面黏着制程(SMT)将这些内电路板21机械地且电性地耦接于上主板连片30B的底面(如图10I),并且使这些阻抗敏感电子元件32通过上主板连片30B而电耦接电感器12’。之后,在各个阻抗敏感电子元件32上铺设一层热界面材料36(ThermalInterface Material;TIM;如图10J)。最后再执行激光切割制程(laser Cutting)而切割上主板连片30B,即可制出本实用新型的第二实施例的多个设有阻抗敏感电子元件32的多层电路板1’(如图10K)。Step S2.4: Invert the lower main board 10 provided with the board-to-board connector 22, the inner circuit board 21 and the inductor 12', and the upper main board connecting piece 30B provided with a plurality of impedance sensitive electronic components 32, and invert the above-mentioned inverted main board 10. The lower motherboard 10 is disposed above the inverted upper motherboard connecting piece 30B, and the inner circuit boards 21 are mechanically and electrically coupled to the bottom surface of the upper motherboard connecting piece 30B by a surface mount process (SMT) (as shown in FIG. 10I ). ), and the impedance-sensitive electronic components 32 are electrically coupled to the inductor 12' through the upper motherboard connecting piece 30B. After that, a layer of thermal interface material 36 (Thermal Interface Material; TIM; as shown in FIG. 10J ) is laid on each impedance sensitive electronic element 32 . Finally, a laser cutting process is performed to cut the main board connecting piece 30B, and a plurality of multilayer circuit boards 1 ′ provided with impedance sensitive electronic components 32 according to the second embodiment of the present invention can be produced (as shown in FIG. 10K).

需说明的是,步骤S2.3可以在步骤S2.1之前执行,步骤S2.3甚至可能和步骤S2.1同时执行。It should be noted that step S2.3 may be performed before step S2.1, and step S2.3 may even be performed simultaneously with step S2.1.

最后,必须再次说明的是,本实用新型于前述实施例中所公开的方法及构成元件仅为举例说明,并非用来限制本实用新型的专利范围,凡是未脱离本实用新型精神所作的简易结构润饰或变化,或与其他等效元件的更替,仍应属于本实用新型权利要求涵盖的范畴。Finally, it must be reiterated that the methods and constituent elements disclosed in the foregoing embodiments of the present invention are only for illustration, and are not intended to limit the patent scope of the present invention. All simple structures made without departing from the spirit of the present invention Modifications or changes, or replacements with other equivalent elements, should still fall within the scope covered by the claims of the present invention.

Claims (7)

1. A multilayer circuit board having impedance sensitive electronic components, comprising:
a lower main board, a top surface of which is provided with an inductor, a top surface of the inductor having an electrode;
an inner circuit board layer disposed above the lower main board and having at least one inner circuit board surrounding the inductor and electrically connected to the lower main board, a top surface of the inner circuit board layer being higher than or equal to a top surface of the inductor; and
the upper main board is electrically connected with the inner circuit board layer, the top surface of the upper main board is provided with at least one impedance sensitive electronic element and a first electroplating through hole structure, the first electroplating through hole structure penetrates through the top surface and the bottom surface of the upper main board and is electrically connected with the at least one impedance sensitive electronic element, and the electrode of the inductor is inserted into the first electroplating through hole structure and is electrically connected with the first electroplating through hole structure.
2. Multilayer circuit board provided with impedance sensitive electronic components according to claim 1,
the at least one internal circuit board is a plurality of internal circuit boards stacked on each other and electrically connected.
3. Multilayer circuit board provided with impedance sensitive electronic components according to claim 2,
each of the inner circuit boards includes a second plated through hole structure including a through hole and two pads, the through hole penetrates through the top and bottom surfaces of each of the inner circuit boards, a metal layer is laid on a wall of the through hole, the two pads are respectively disposed on the top and bottom surfaces of each of the inner circuit boards and cover the through hole, the two pads are electrically connected to the metal layer, and the inner circuit boards are electrically connected to each other through the second plated through hole structure.
4. Multilayer circuit board provided with impedance sensitive electronic components according to one of claims 1 to 3,
the at least one impedance sensitive electronic component is an intelligent power level module chip.
5. A multilayer circuit board having impedance sensitive electronic components, comprising:
the top surface of the lower main board is provided with an inductor;
an inner circuit board layer disposed above the lower main board and having a plurality of sets of paired electrical connection components, the multiple sets of electrical connection components surround the inductor and are electrically connected with the lower main board, each set of the multiple sets of electrical connection components comprises a board-to-board connector and an inner circuit board, the board-to-board connector comprises a connector body and a pin connected with the connector body, the inner circuit board comprises a plated through hole structure, the electroplating through hole structure comprises a through hole and a welding pad, the through hole penetrates through the top surface and the bottom surface of the inner circuit board, the wall of the through hole is laid with a metal layer, the welding pad is arranged at one side of the inner circuit board and covers the through hole, the plug pins are inserted into the through holes, and the top surface of each group of the plurality of groups of the electric connection assemblies is coplanar with the top surface of the inductor; and
an upper motherboard electrically connected to the inner circuit board layer and having a top surface provided with at least one impedance-sensitive electronic component electrically connected to the inductor.
6. Multilayer circuit board provided with impedance sensitive electronic components according to claim 5,
the inner circuit board is positioned above the board-to-board connector.
7. Multilayer circuit board provided with impedance sensitive electronic components according to claim 5 or 6,
the at least one impedance sensitive electronic component is an intelligent power level module chip.
CN202121984164.4U 2021-08-23 2021-08-23 Multilayer circuit boards with impedance-sensitive electronics Withdrawn - After Issue CN215499762U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113556872A (en) * 2021-08-23 2021-10-26 环旭(深圳)电子科创有限公司 Multilayer circuit board with impedance-sensitive electronic components and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113556872A (en) * 2021-08-23 2021-10-26 环旭(深圳)电子科创有限公司 Multilayer circuit board with impedance-sensitive electronic components and method of making the same
CN113556872B (en) * 2021-08-23 2025-04-04 环旭(深圳)电子科创有限公司 Multilayer circuit board with impedance sensitive electronic components and method for manufacturing the same

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