FI20012052A0 - Menetelmä monikerrosrakenteen valmistamiseksi - Google Patents

Menetelmä monikerrosrakenteen valmistamiseksi

Info

Publication number
FI20012052A0
FI20012052A0 FI20012052A FI20012052A FI20012052A0 FI 20012052 A0 FI20012052 A0 FI 20012052A0 FI 20012052 A FI20012052 A FI 20012052A FI 20012052 A FI20012052 A FI 20012052A FI 20012052 A0 FI20012052 A0 FI 20012052A0
Authority
FI
Finland
Prior art keywords
manufacturing
multilayer structure
multilayer
Prior art date
Application number
FI20012052A
Other languages
English (en)
Swedish (sv)
Inventor
Mika Matti Sippola
Original Assignee
Mika Matti Sippola
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mika Matti Sippola filed Critical Mika Matti Sippola
Priority to FI20012052A priority Critical patent/FI20012052A0/fi
Publication of FI20012052A0 publication Critical patent/FI20012052A0/fi
Priority to CNB028211731A priority patent/CN1266715C/zh
Priority to EP02772390A priority patent/EP1442463A1/en
Priority to PCT/EP2002/011839 priority patent/WO2003036664A1/en
Priority to JP2003539061A priority patent/JP2005506713A/ja
Priority to US10/806,269 priority patent/US7205655B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2861—Coil formed by folding a blank
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
FI20012052A 2001-10-23 2001-10-23 Menetelmä monikerrosrakenteen valmistamiseksi FI20012052A0 (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20012052A FI20012052A0 (fi) 2001-10-23 2001-10-23 Menetelmä monikerrosrakenteen valmistamiseksi
CNB028211731A CN1266715C (zh) 2001-10-23 2002-10-23 多层电路及其制造方法
EP02772390A EP1442463A1 (en) 2001-10-23 2002-10-23 Multilayer circuit and method of manufacturing
PCT/EP2002/011839 WO2003036664A1 (en) 2001-10-23 2002-10-23 Multilayer circuit and method of manufacturing
JP2003539061A JP2005506713A (ja) 2001-10-23 2002-10-23 多層回路とその製造方法
US10/806,269 US7205655B2 (en) 2001-10-23 2004-03-23 Multilayer circuit including stacked layers of insulating material and conductive sections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20012052A FI20012052A0 (fi) 2001-10-23 2001-10-23 Menetelmä monikerrosrakenteen valmistamiseksi

Publications (1)

Publication Number Publication Date
FI20012052A0 true FI20012052A0 (fi) 2001-10-23

Family

ID=8562107

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20012052A FI20012052A0 (fi) 2001-10-23 2001-10-23 Menetelmä monikerrosrakenteen valmistamiseksi

Country Status (6)

Country Link
US (1) US7205655B2 (fi)
EP (1) EP1442463A1 (fi)
JP (1) JP2005506713A (fi)
CN (1) CN1266715C (fi)
FI (1) FI20012052A0 (fi)
WO (1) WO2003036664A1 (fi)

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US9306358B2 (en) * 2009-03-09 2016-04-05 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9444213B2 (en) 2009-03-09 2016-09-13 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9232893B2 (en) 2009-03-09 2016-01-12 Nucurrent, Inc. Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication
US9208942B2 (en) 2009-03-09 2015-12-08 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9439287B2 (en) 2009-03-09 2016-09-06 Nucurrent, Inc. Multi-layer wire structure for high efficiency wireless communication
EP4234001A3 (en) 2009-03-09 2023-10-18 NuCurrent, Inc. System and method for wireless power transfer in implantable medical devices
US9300046B2 (en) 2009-03-09 2016-03-29 Nucurrent, Inc. Method for manufacture of multi-layer-multi-turn high efficiency inductors
US11476566B2 (en) 2009-03-09 2022-10-18 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
CN101945540B (zh) * 2009-07-09 2012-04-25 厦门达尔电子有限公司 挠性电路板手指折叠粘合方法及专用工具
CN102378501B (zh) * 2010-07-13 2013-06-26 富葵精密组件(深圳)有限公司 电路板制作方法
US20130068499A1 (en) * 2011-09-15 2013-03-21 Nucurrent Inc. Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication
CN103311161A (zh) * 2013-06-17 2013-09-18 华进半导体封装先导技术研发中心有限公司 一种改进的柔性基板封装装置
CN103311189B (zh) * 2013-06-17 2017-02-08 华进半导体封装先导技术研发中心有限公司 一种柔性基板多层封装装置
US9941743B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US9948129B2 (en) 2015-08-07 2018-04-17 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit
US11205848B2 (en) 2015-08-07 2021-12-21 Nucurrent, Inc. Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US10636563B2 (en) 2015-08-07 2020-04-28 Nucurrent, Inc. Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9941590B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding
US10063100B2 (en) 2015-08-07 2018-08-28 Nucurrent, Inc. Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling
US10658847B2 (en) 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9941729B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single layer multi mode antenna for wireless power transmission using magnetic field coupling
US9960629B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9960628B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling
WO2017031348A1 (en) 2015-08-19 2017-02-23 Nucurrent, Inc. Multi-mode wireless antenna configurations
KR20190038587A (ko) 2016-08-26 2019-04-08 누커런트, 인코포레이티드 무선 커넥터 시스템
US10892646B2 (en) 2016-12-09 2021-01-12 Nucurrent, Inc. Method of fabricating an antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
JPWO2018123961A1 (ja) * 2016-12-27 2019-10-31 学校法人関東学院 多層配線板及び多層配線板製造方法
US11177695B2 (en) 2017-02-13 2021-11-16 Nucurrent, Inc. Transmitting base with magnetic shielding and flexible transmitting antenna
US11283296B2 (en) 2017-05-26 2022-03-22 Nucurrent, Inc. Crossover inductor coil and assembly for wireless transmission
JP2019004266A (ja) * 2017-06-13 2019-01-10 富士通株式会社 アンテナ装置および電子機器
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US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
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Also Published As

Publication number Publication date
US20040178489A1 (en) 2004-09-16
CN1266715C (zh) 2006-07-26
WO2003036664A1 (en) 2003-05-01
JP2005506713A (ja) 2005-03-03
CN1575500A (zh) 2005-02-02
EP1442463A1 (en) 2004-08-04
US7205655B2 (en) 2007-04-17

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