CN102378501B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN102378501B CN102378501B CN201010224861XA CN201010224861A CN102378501B CN 102378501 B CN102378501 B CN 102378501B CN 201010224861X A CN201010224861X A CN 201010224861XA CN 201010224861 A CN201010224861 A CN 201010224861A CN 102378501 B CN102378501 B CN 102378501B
- Authority
- CN
- China
- Prior art keywords
- unit
- circuit board
- line
- line unit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010224861XA CN102378501B (zh) | 2010-07-13 | 2010-07-13 | 电路板制作方法 |
US13/181,453 US9095082B2 (en) | 2010-07-13 | 2011-07-12 | Method for manufacturing multilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010224861XA CN102378501B (zh) | 2010-07-13 | 2010-07-13 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102378501A CN102378501A (zh) | 2012-03-14 |
CN102378501B true CN102378501B (zh) | 2013-06-26 |
Family
ID=45465763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010224861XA Active CN102378501B (zh) | 2010-07-13 | 2010-07-13 | 电路板制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9095082B2 (zh) |
CN (1) | CN102378501B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103517558B (zh) * | 2012-06-20 | 2017-03-22 | 碁鼎科技秦皇岛有限公司 | 封装基板制作方法 |
CN103269564B (zh) * | 2013-03-28 | 2015-11-18 | 淳华科技(昆山)有限公司 | 多层板局部单层区域内层切割工艺 |
JPWO2018123961A1 (ja) * | 2016-12-27 | 2019-10-31 | 学校法人関東学院 | 多層配線板及び多層配線板製造方法 |
WO2019055438A1 (en) | 2017-09-12 | 2019-03-21 | Knowles Cazenovia, Inc. | VERTICAL SWITCHING FILTER BENCH |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4772353A (en) * | 1985-09-02 | 1988-09-20 | Basf Aktiengesellschaft | Apparatus for cutting photoresist webs into photoresist sheets of defined size and exact, fold-free lamination of these with flexible and rigid bases |
JP2001313105A (ja) * | 2000-04-28 | 2001-11-09 | Sumitomo Wiring Syst Ltd | 配線板の接続クリップ及び配線板の接続構造 |
CN1575500A (zh) * | 2001-10-23 | 2005-02-02 | 沙夫纳Emv股份公司 | 多层电路及其制造方法 |
JP2006256366A (ja) * | 2005-03-15 | 2006-09-28 | Fujikura Ltd | フレキシブルプリント配線板の排水レイアウト構造 |
JP2006303333A (ja) * | 2005-04-22 | 2006-11-02 | Fujikura Ltd | フレキシブル配線基板製造装置 |
JP4186694B2 (ja) * | 2003-05-09 | 2008-11-26 | 株式会社ジェイテクト | 超音波伝播速度測定方法およびそれを用いた固体表層部状態測定方法 |
CN101521990A (zh) * | 2009-03-19 | 2009-09-02 | 淳华科技(昆山)有限公司 | 加长型软性电路板的制作方法及加长型光条 |
WO2009142496A1 (en) * | 2008-05-22 | 2009-11-26 | Polymer Vision Limited | A stacked display with a bended substrate, an electronic apparatus and a method for manufacturing the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5262594A (en) * | 1990-10-12 | 1993-11-16 | Compaq Computer Corporation | Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
US5105055A (en) * | 1990-10-17 | 1992-04-14 | Digital Equipment Corporation | Tunnelled multiconductor system and method |
JPH04186694A (ja) * | 1990-11-16 | 1992-07-03 | Sanyo Electric Co Ltd | 混成集積回路およびその製造方法 |
US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
NL9400165A (nl) * | 1994-02-03 | 1995-09-01 | Hollandse Signaalapparaten Bv | Transmissielijnnetwerk. |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
US5612570A (en) * | 1995-04-13 | 1997-03-18 | Dense-Pac Microsystems, Inc. | Chip stack and method of making same |
US5795162A (en) * | 1996-03-28 | 1998-08-18 | Lucent Technologies, Inc. | RF flex circuit transmission line and interconnection method |
US5712607A (en) * | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
JP3241019B2 (ja) * | 1999-03-15 | 2001-12-25 | 日本電気株式会社 | コプレーナ線路 |
US6351029B1 (en) * | 1999-05-05 | 2002-02-26 | Harlan R. Isaak | Stackable flex circuit chip package and method of making same |
US6323060B1 (en) * | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
JP4105020B2 (ja) | 2003-04-09 | 2008-06-18 | シャープ株式会社 | フレキシブル多層プリント配線板用基材、フレキシブル多層プリント配線板、電装基板および電子機器 |
US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
JP2007180421A (ja) | 2005-12-28 | 2007-07-12 | Sumitomo Bakelite Co Ltd | 多層回路板の製造方法および多層回路板 |
EP2547183A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
CN103906374B (zh) * | 2012-12-28 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | 刚挠结合板及其制作方法 |
-
2010
- 2010-07-13 CN CN201010224861XA patent/CN102378501B/zh active Active
-
2011
- 2011-07-12 US US13/181,453 patent/US9095082B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4772353A (en) * | 1985-09-02 | 1988-09-20 | Basf Aktiengesellschaft | Apparatus for cutting photoresist webs into photoresist sheets of defined size and exact, fold-free lamination of these with flexible and rigid bases |
JP2001313105A (ja) * | 2000-04-28 | 2001-11-09 | Sumitomo Wiring Syst Ltd | 配線板の接続クリップ及び配線板の接続構造 |
CN1575500A (zh) * | 2001-10-23 | 2005-02-02 | 沙夫纳Emv股份公司 | 多层电路及其制造方法 |
JP4186694B2 (ja) * | 2003-05-09 | 2008-11-26 | 株式会社ジェイテクト | 超音波伝播速度測定方法およびそれを用いた固体表層部状態測定方法 |
JP2006256366A (ja) * | 2005-03-15 | 2006-09-28 | Fujikura Ltd | フレキシブルプリント配線板の排水レイアウト構造 |
JP2006303333A (ja) * | 2005-04-22 | 2006-11-02 | Fujikura Ltd | フレキシブル配線基板製造装置 |
WO2009142496A1 (en) * | 2008-05-22 | 2009-11-26 | Polymer Vision Limited | A stacked display with a bended substrate, an electronic apparatus and a method for manufacturing the same |
CN101521990A (zh) * | 2009-03-19 | 2009-09-02 | 淳华科技(昆山)有限公司 | 加长型软性电路板的制作方法及加长型光条 |
Also Published As
Publication number | Publication date |
---|---|
US20120011713A1 (en) | 2012-01-19 |
US9095082B2 (en) | 2015-07-28 |
CN102378501A (zh) | 2012-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7698811B2 (en) | Method for manufacturing multilayer printed circuit boards using inner substrate | |
US8052881B2 (en) | Method of manufacturing multilayer printed circuit board having buried holes | |
CN102387672B (zh) | 多层电路板的制作方法 | |
US20080141527A1 (en) | Method for manufacturing multilayer flexible printed circuit board | |
TW201410097A (zh) | 柔性多層電路板及其製作方法 | |
TW201913835A (zh) | 軟硬結合板及其製作方法 | |
CN102340938B (zh) | 电路板制作方法 | |
US20140085833A1 (en) | Chip packaging substrate, method for manufacturing same, and chip packaging structure having same | |
CN102340937B (zh) | 柔性多层电路板的制作方法 | |
CN102378501B (zh) | 电路板制作方法 | |
CN103635005A (zh) | 软硬结合电路基板、软硬结合电路板及制作方法 | |
JP2011040607A (ja) | 多層フレキシブルプリント配線板およびその製造方法 | |
KR100765022B1 (ko) | 플렉시블 기판 및 그 제조방법 | |
TWI398206B (zh) | 電路板製作方法 | |
TWI407872B (zh) | 電路板製作方法 | |
JPH05315758A (ja) | 多層フレキシブル回路基板およびその製法 | |
TWI437943B (zh) | 柔性多層電路板之製作方法 | |
TWI388262B (zh) | 軟硬結合板的製作方法 | |
CN216860887U (zh) | 增厚型金属箔积层板制造设备 | |
CN216860888U (zh) | 金属箔积层板制造设备 | |
JP5027535B2 (ja) | 多層プリント配線板及びその製造方法 | |
CN113365412B (zh) | 复合电路板及其制作方法 | |
CN102958293A (zh) | 具有断差结构的电路板的制作方法 | |
CN115460805A (zh) | 一种超薄多层挠性板的制作方法 | |
JP3101047U (ja) | 多層フレキシブルプリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |