FI98899B - Menetelmä elektroniikan komponenttien liittämiseksi juottamalla - Google Patents

Menetelmä elektroniikan komponenttien liittämiseksi juottamalla

Info

Publication number
FI98899B
FI98899B FI945101A FI945101A FI98899B FI 98899 B FI98899 B FI 98899B FI 945101 A FI945101 A FI 945101A FI 945101 A FI945101 A FI 945101A FI 98899 B FI98899 B FI 98899B
Authority
FI
Finland
Prior art keywords
soldering
electronic components
connecting electronic
components
electronic
Prior art date
Application number
FI945101A
Other languages
English (en)
Swedish (sv)
Other versions
FI945101A0 (fi
FI945101A (fi
FI98899C (fi
Inventor
Jorma Kalevi Kivilahti
Original Assignee
Jorma Kalevi Kivilahti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jorma Kalevi Kivilahti filed Critical Jorma Kalevi Kivilahti
Priority to FI945101A priority Critical patent/FI98899C/fi
Publication of FI945101A0 publication Critical patent/FI945101A0/fi
Priority to PCT/FI1995/000599 priority patent/WO1996013353A1/en
Priority to EP95935480A priority patent/EP0751847A1/en
Publication of FI945101A publication Critical patent/FI945101A/fi
Priority to US08/733,665 priority patent/US6015082A/en
Publication of FI98899B publication Critical patent/FI98899B/fi
Application granted granted Critical
Publication of FI98899C publication Critical patent/FI98899C/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
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    • H01L2224/29109—Indium [In] as principal constituent
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    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/01005—Boron [B]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
FI945101A 1994-10-28 1994-10-28 Menetelmä elektroniikan komponenttien liittämiseksi juottamalla FI98899C (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI945101A FI98899C (fi) 1994-10-28 1994-10-28 Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
PCT/FI1995/000599 WO1996013353A1 (en) 1994-10-28 1995-10-30 A method for joining metals by soldering
EP95935480A EP0751847A1 (en) 1994-10-28 1995-10-30 A method for joining metals by soldering
US08/733,665 US6015082A (en) 1994-10-28 1996-10-17 Method for joining metals by soldering

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FI945101A FI98899C (fi) 1994-10-28 1994-10-28 Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
FI945101 1994-10-28
US73366596 1996-10-17
US08/733,665 US6015082A (en) 1994-10-28 1996-10-17 Method for joining metals by soldering

Publications (4)

Publication Number Publication Date
FI945101A0 FI945101A0 (fi) 1994-10-28
FI945101A FI945101A (fi) 1996-04-29
FI98899B true FI98899B (fi) 1997-05-30
FI98899C FI98899C (fi) 1997-09-10

Family

ID=26159829

Family Applications (1)

Application Number Title Priority Date Filing Date
FI945101A FI98899C (fi) 1994-10-28 1994-10-28 Menetelmä elektroniikan komponenttien liittämiseksi juottamalla

Country Status (4)

Country Link
US (1) US6015082A (fi)
EP (1) EP0751847A1 (fi)
FI (1) FI98899C (fi)
WO (1) WO1996013353A1 (fi)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997000753A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Metal d'apport de brasage, composant electronique soude et plaque de circuit electronique
US6635514B1 (en) * 1996-12-12 2003-10-21 Tessera, Inc. Compliant package with conductive elastomeric posts
FI970822A (fi) * 1997-02-27 1998-08-28 Nokia Mobile Phones Ltd Menetelmä ja järjestely komponentin liittämiseksi
FI972982A (fi) * 1997-07-14 1999-01-15 Jorma Kalevi Kivilahti Elektroniikan komponenttien valmistuksessa ja kokoonpanossa käytettäväpinnoite
US6358392B1 (en) * 1998-11-18 2002-03-19 The Johns Hopkins University Bismuth thin films structure and method of construction
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WO1996013353A1 (en) 1996-05-09
FI945101A0 (fi) 1994-10-28
FI945101A (fi) 1996-04-29
EP0751847A1 (en) 1997-01-08
FI98899C (fi) 1997-09-10
US6015082A (en) 2000-01-18

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