FI98899B - Menetelmä elektroniikan komponenttien liittämiseksi juottamalla - Google Patents
Menetelmä elektroniikan komponenttien liittämiseksi juottamallaInfo
- Publication number
- FI98899B FI98899B FI945101A FI945101A FI98899B FI 98899 B FI98899 B FI 98899B FI 945101 A FI945101 A FI 945101A FI 945101 A FI945101 A FI 945101A FI 98899 B FI98899 B FI 98899B
- Authority
- FI
- Finland
- Prior art keywords
- soldering
- electronic components
- connecting electronic
- components
- electronic
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/29109—Indium [In] as principal constituent
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/29111—Tin [Sn] as principal constituent
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2924/01049—Indium [In]
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI945101A FI98899C (fi) | 1994-10-28 | 1994-10-28 | Menetelmä elektroniikan komponenttien liittämiseksi juottamalla |
PCT/FI1995/000599 WO1996013353A1 (en) | 1994-10-28 | 1995-10-30 | A method for joining metals by soldering |
EP95935480A EP0751847A1 (en) | 1994-10-28 | 1995-10-30 | A method for joining metals by soldering |
US08/733,665 US6015082A (en) | 1994-10-28 | 1996-10-17 | Method for joining metals by soldering |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI945101A FI98899C (fi) | 1994-10-28 | 1994-10-28 | Menetelmä elektroniikan komponenttien liittämiseksi juottamalla |
FI945101 | 1994-10-28 | ||
US08/733,665 US6015082A (en) | 1994-10-28 | 1996-10-17 | Method for joining metals by soldering |
US73366596 | 1996-10-17 |
Publications (4)
Publication Number | Publication Date |
---|---|
FI945101A0 FI945101A0 (fi) | 1994-10-28 |
FI945101A FI945101A (fi) | 1996-04-29 |
FI98899B true FI98899B (fi) | 1997-05-30 |
FI98899C FI98899C (fi) | 1997-09-10 |
Family
ID=26159829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI945101A FI98899C (fi) | 1994-10-28 | 1994-10-28 | Menetelmä elektroniikan komponenttien liittämiseksi juottamalla |
Country Status (4)
Country | Link |
---|---|
US (1) | US6015082A (fi) |
EP (1) | EP0751847A1 (fi) |
FI (1) | FI98899C (fi) |
WO (1) | WO1996013353A1 (fi) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1080616C (zh) * | 1995-06-20 | 2002-03-13 | 松下电器产业株式会社 | 焊料、用焊接法贴装的电子元件及电路板 |
US6635514B1 (en) * | 1996-12-12 | 2003-10-21 | Tessera, Inc. | Compliant package with conductive elastomeric posts |
FI970822A (fi) * | 1997-02-27 | 1998-08-28 | Nokia Mobile Phones Ltd | Menetelmä ja järjestely komponentin liittämiseksi |
FI972982A (fi) * | 1997-07-14 | 1999-01-15 | Jorma Kalevi Kivilahti | Elektroniikan komponenttien valmistuksessa ja kokoonpanossa käytettäväpinnoite |
WO2000037715A1 (en) * | 1998-11-18 | 2000-06-29 | The Johns Hopkins University | Bismuth thin film structure and method of construction |
US6123252A (en) * | 1999-03-19 | 2000-09-26 | Deutsche Carbone Ag | Process for fixing a graphite-rich material onto a metallic body |
JP2001269772A (ja) * | 2000-03-27 | 2001-10-02 | Showa Denko Kk | 金属と金属との接合方法および接合物 |
US6609651B1 (en) * | 2000-11-20 | 2003-08-26 | Delphi Technologies, Inc | Method of soldering a leaded circuit component |
US6740544B2 (en) * | 2002-05-14 | 2004-05-25 | Freescale Semiconductor, Inc. | Solder compositions for attaching a die to a substrate |
DE10251658B4 (de) * | 2002-11-01 | 2005-08-25 | Atotech Deutschland Gmbh | Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil |
JP4844393B2 (ja) * | 2004-06-01 | 2011-12-28 | 千住金属工業株式会社 | ダイボンディング接合方法と電子部品 |
KR100568496B1 (ko) * | 2004-10-21 | 2006-04-07 | 삼성전자주식회사 | 주석-인듐 합금층을 갖는 필름 회로 기판 |
TW201029059A (en) * | 2009-01-22 | 2010-08-01 | Univ Nat Central | Tin/silver bonding structure and its method |
US8471296B2 (en) | 2011-01-21 | 2013-06-25 | International Business Machines Corporation | FinFET fuse with enhanced current crowding |
JP6061276B2 (ja) | 2014-08-29 | 2017-01-18 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 金属層間のはんだ接合の形成方法 |
KR20170086886A (ko) * | 2016-01-19 | 2017-07-27 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조 방법 |
CA3014085A1 (en) * | 2016-02-11 | 2017-08-17 | Celestica International Inc. | Thermal treatment for preconditioning or restoration of a solder joint |
Family Cites Families (17)
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DE148193C (fi) * | ||||
US1248506A (en) * | 1916-08-05 | 1917-12-04 | Jacob Lavine | Solder for soldering metals. |
DE1005346B (de) * | 1955-07-30 | 1957-03-28 | Heraeus Gmbh W C | Zum Loeten von Metallteilen, insbesondere elektrischen Kontaktteilen, geeignete Flaeche |
DE1239178B (de) * | 1957-06-28 | 1967-04-20 | Siemens Ag | Verfahren zum Vorbehandeln eines mit einem Korrosionsschutzlackueberzug versehenen Koerpers fuer einen anschliessenden Loetvorgang und Flussmittel zur Durchfuehrung des Verfahrens |
US4098452A (en) * | 1975-03-31 | 1978-07-04 | General Electric Company | Lead bonding method |
US4020987A (en) * | 1975-09-22 | 1977-05-03 | Norman Hascoe | Solder preform for use in hermetically sealing a container |
DD148193A1 (de) * | 1979-12-19 | 1981-05-13 | Eberhard Kasper | Verfahren zur herstellung korrosionsverhindernder ueberzuege mit flussmitteleigenschaften |
FR2479055A1 (fr) * | 1980-03-28 | 1981-10-02 | Soudure Autogene Francaise | Procede de revetement de pieces a braser au moyen d'un flux pulverulent |
JPS5839047A (ja) * | 1981-09-02 | 1983-03-07 | Hitachi Ltd | 半導体装置およびその製法 |
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
US4727633A (en) * | 1985-08-08 | 1988-03-01 | Tektronix, Inc. | Method of securing metallic members together |
EP0265077A3 (en) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
US4875617A (en) * | 1987-01-20 | 1989-10-24 | Citowsky Elya L | Gold-tin eutectic lead bonding method and structure |
DE68911649T2 (de) * | 1988-10-12 | 1994-06-23 | Ibm | Verbinden von metallischen Oberflächen. |
CA2077161A1 (en) * | 1991-09-13 | 1993-03-14 | Thomas W. Fitzgerald | Method of establishing soldered connections |
US5439164A (en) * | 1992-06-05 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Methods for joining copper or its alloys |
US5391514A (en) * | 1994-04-19 | 1995-02-21 | International Business Machines Corporation | Low temperature ternary C4 flip chip bonding method |
-
1994
- 1994-10-28 FI FI945101A patent/FI98899C/fi not_active IP Right Cessation
-
1995
- 1995-10-30 EP EP95935480A patent/EP0751847A1/en not_active Withdrawn
- 1995-10-30 WO PCT/FI1995/000599 patent/WO1996013353A1/en not_active Application Discontinuation
-
1996
- 1996-10-17 US US08/733,665 patent/US6015082A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1996013353A1 (en) | 1996-05-09 |
US6015082A (en) | 2000-01-18 |
FI945101A0 (fi) | 1994-10-28 |
FI945101A (fi) | 1996-04-29 |
EP0751847A1 (en) | 1997-01-08 |
FI98899C (fi) | 1997-09-10 |
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Legal Events
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FG | Patent granted |
Owner name: KIVILAHTI, JORMA KALEVI |
|
BB | Publication of examined application | ||
MA | Patent expired |