KR970004992A - 땜납 접착 방법 - Google Patents
땜납 접착 방법 Download PDFInfo
- Publication number
- KR970004992A KR970004992A KR1019960021469A KR19960021469A KR970004992A KR 970004992 A KR970004992 A KR 970004992A KR 1019960021469 A KR1019960021469 A KR 1019960021469A KR 19960021469 A KR19960021469 A KR 19960021469A KR 970004992 A KR970004992 A KR 970004992A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesion method
- solder adhesion
- solder
- adhesion
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05166—Titanium [Ti] as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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- H01L2224/11—Manufacturing methods
- H01L2224/11011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/11013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bump connector, e.g. solder flow barrier
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2224/13001—Core members of the bump connector
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/490,878 US5620131A (en) | 1995-06-15 | 1995-06-15 | Method of solder bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970004992A true KR970004992A (ko) | 1997-01-29 |
Family
ID=23949877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960021469A KR970004992A (ko) | 1995-06-15 | 1996-06-14 | 땜납 접착 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5620131A (ko) |
EP (1) | EP0749157A3 (ko) |
JP (1) | JPH098082A (ko) |
KR (1) | KR970004992A (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19730118B4 (de) | 1997-07-14 | 2006-01-12 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Herstellung einer Chip-Substrat-Verbindung |
US5962151A (en) * | 1997-12-05 | 1999-10-05 | Delco Electronics Corp. | Method for controlling solderability of a conductor and conductor formed thereby |
JP2000012607A (ja) * | 1998-05-28 | 2000-01-14 | Xerox Corp | 集積回路装置、及びフリップチップボンディングされたコンビネ―ションを作成する方法 |
US6316736B1 (en) | 1998-06-08 | 2001-11-13 | Visteon Global Technologies, Inc. | Anti-bridging solder ball collection zones |
US6378758B1 (en) * | 1999-01-19 | 2002-04-30 | Tessera, Inc. | Conductive leads with non-wettable surfaces |
US6047637A (en) * | 1999-06-17 | 2000-04-11 | Fujitsu Limited | Method of paste printing using stencil and masking layer |
US6427901B2 (en) * | 1999-06-30 | 2002-08-06 | Lucent Technologies Inc. | System and method for forming stable solder bonds |
US6251732B1 (en) * | 1999-08-10 | 2001-06-26 | Macronix International Co., Ltd. | Method and apparatus for forming self-aligned code structures for semi conductor devices |
US8802556B2 (en) * | 2012-11-14 | 2014-08-12 | Qualcomm Incorporated | Barrier layer on bump and non-wettable coating on trace |
DE102015120647B4 (de) * | 2015-11-27 | 2017-12-28 | Snaptrack, Inc. | Elektrisches Bauelement mit dünner Lot-Stopp-Schicht und Verfahren zur Herstellung |
KR20210157787A (ko) | 2020-06-22 | 2021-12-29 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
KR20220008088A (ko) | 2020-07-13 | 2022-01-20 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5850021B2 (ja) * | 1982-07-16 | 1983-11-08 | 富士通株式会社 | 半導体装置の製法 |
DE3824008A1 (de) * | 1988-07-15 | 1990-01-25 | Contraves Ag | Elektronische schaltung sowie verfahren zu deren herstellung |
JPH0252436A (ja) * | 1988-08-17 | 1990-02-22 | Shimadzu Corp | ハンダバンプ製造方法 |
US5162257A (en) * | 1991-09-13 | 1992-11-10 | Mcnc | Solder bump fabrication method |
JPH05144815A (ja) * | 1991-11-25 | 1993-06-11 | Ibiden Co Ltd | バンプを有する電子部品搭載用基板 |
KR960016007B1 (ko) * | 1993-02-08 | 1996-11-25 | 삼성전자 주식회사 | 반도체 칩 범프의 제조방법 |
US5536677A (en) * | 1994-12-01 | 1996-07-16 | Motorola, Inc. | Method of forming conductive bumps on a semiconductor device using a double mask structure |
-
1995
- 1995-06-15 US US08/490,878 patent/US5620131A/en not_active Expired - Lifetime
-
1996
- 1996-06-04 EP EP96304039A patent/EP0749157A3/en not_active Withdrawn
- 1996-06-14 JP JP8153654A patent/JPH098082A/ja active Pending
- 1996-06-14 KR KR1019960021469A patent/KR970004992A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0749157A3 (en) | 1997-05-07 |
JPH098082A (ja) | 1997-01-10 |
US5620131A (en) | 1997-04-15 |
EP0749157A2 (en) | 1996-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |