FI112121B - Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa - Google Patents

Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa Download PDF

Info

Publication number
FI112121B
FI112121B FI20002707A FI20002707A FI112121B FI 112121 B FI112121 B FI 112121B FI 20002707 A FI20002707 A FI 20002707A FI 20002707 A FI20002707 A FI 20002707A FI 112121 B FI112121 B FI 112121B
Authority
FI
Finland
Prior art keywords
web
smart
smart label
component
film
Prior art date
Application number
FI20002707A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20002707A (fi
FI20002707A0 (fi
Inventor
Samuli Stroemberg
Marko Hanhikorpi
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Priority to FI20002707A priority Critical patent/FI112121B/fi
Publication of FI20002707A0 publication Critical patent/FI20002707A0/fi
Priority to PCT/FI2001/001038 priority patent/WO2002049093A1/en
Priority to JP2002550306A priority patent/JP4071626B2/ja
Priority to GB0314166A priority patent/GB2388250B/en
Priority to AU2002220764A priority patent/AU2002220764A1/en
Priority to DE10197008T priority patent/DE10197008B4/de
Publication of FI20002707A publication Critical patent/FI20002707A/fi
Priority to US10/444,692 priority patent/US7244332B2/en
Application granted granted Critical
Publication of FI112121B publication Critical patent/FI112121B/fi

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y10T156/1095—Opposed laminae are running length webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y10T156/1098—Feeding of discrete laminae from separate sources

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
  • Detection And Correction Of Errors (AREA)
  • Error Detection And Correction (AREA)
FI20002707A 2000-12-11 2000-12-11 Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa FI112121B (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20002707A FI112121B (fi) 2000-12-11 2000-12-11 Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
PCT/FI2001/001038 WO2002049093A1 (en) 2000-12-11 2001-11-29 A smart label web and a method for its manufacture
JP2002550306A JP4071626B2 (ja) 2000-12-11 2001-11-29 スマートラベルウェブおよびその製造方法
GB0314166A GB2388250B (en) 2000-12-11 2001-11-29 A smart label web and a method for its manufacture
AU2002220764A AU2002220764A1 (en) 2000-12-11 2001-11-29 A smart label web and a method for its manufacture
DE10197008T DE10197008B4 (de) 2000-12-11 2001-11-29 Verfahren zur Herstellung einer Materialbahn, Materialbahn mit intelligenten Etiketten, Verfahren zur Herstellung einer Trägerbahn und Bauteil für ein intelligentes Etikett
US10/444,692 US7244332B2 (en) 2000-12-11 2003-05-23 Smart label web and a method for its manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20002707 2000-12-11
FI20002707A FI112121B (fi) 2000-12-11 2000-12-11 Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa

Publications (3)

Publication Number Publication Date
FI20002707A0 FI20002707A0 (fi) 2000-12-11
FI20002707A FI20002707A (fi) 2002-06-12
FI112121B true FI112121B (fi) 2003-10-31

Family

ID=8559686

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20002707A FI112121B (fi) 2000-12-11 2000-12-11 Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa

Country Status (7)

Country Link
US (1) US7244332B2 (ja)
JP (1) JP4071626B2 (ja)
AU (1) AU2002220764A1 (ja)
DE (1) DE10197008B4 (ja)
FI (1) FI112121B (ja)
GB (1) GB2388250B (ja)
WO (1) WO2002049093A1 (ja)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
US7218527B1 (en) 2001-08-17 2007-05-15 Alien Technology Corporation Apparatuses and methods for forming smart labels
JP3770237B2 (ja) * 2002-03-22 2006-04-26 セイコーエプソン株式会社 電子デバイス製造装置および電子デバイスの製造方法
US7117581B2 (en) 2002-08-02 2006-10-10 Symbol Technologies, Inc. Method for high volume assembly of radio frequency identification tags
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US20050205202A1 (en) * 2003-03-24 2005-09-22 Precision Dynamics Corporation Continuous lamination of RFID tags and inlets
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7694883B2 (en) * 2003-05-01 2010-04-13 Brother Kogyo Kabushiki Kaisha RFID label, method for producing the RFID label, device for producing the RFID label, sheet member (tag sheet) used for the RFID label, and cartridge attached to the device for producing the RFID label
FI20030833A0 (fi) 2003-06-04 2003-06-04 Rafsec Oy Älytarra ja menetelmä älytarran valmistamiseksi
US20050005434A1 (en) 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
AU2005206800A1 (en) 2004-01-12 2005-08-04 Symbol Technologies, Inc. Radio frequency identification tag inlay sortation and assembly
ES2322456T3 (es) 2004-01-31 2009-06-22 Atlantic Zeiser Gmbh Procedimiento para fabricar tarjetas inteligentes sin contacto.
TWI288885B (en) * 2004-06-24 2007-10-21 Checkpoint Systems Inc Die attach area cut-on-fly method and apparatus
US7187293B2 (en) 2004-08-17 2007-03-06 Symbol Technologies, Inc. Singulation of radio frequency identification (RFID) tags for testing and/or programming
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
JP4091096B2 (ja) 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
US7506813B2 (en) * 2005-01-06 2009-03-24 Quad/Graphics, Inc. Resonator use in the print field
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
ATE487993T1 (de) 2006-05-12 2010-11-15 Confidex Oy Verfahren zur herstellung von transponder umfassenden produkten
DE102006028760B3 (de) * 2006-06-23 2007-11-29 Mühlbauer Ag Sortiereinrichtung sowie Verfahren zum Sortieren von RFID-Etiketten
DE102007001411A1 (de) 2007-01-09 2008-07-10 Mühlbauer Ag Verfahren zur Herstellung eines elektronischen Datenträgers mit textilem Substrat sowie elektronischer Datenträger mit textilem Substrat
EP1978791A3 (de) * 2007-04-04 2009-12-30 Hirschmann Car Communication GmbH Antenneneinrichtung für Fahrzeuge
US7546676B2 (en) * 2007-05-31 2009-06-16 Symbol Technologies, Inc. Method for manufacturing micro-strip antenna element
DE102009022299B4 (de) * 2008-05-26 2014-07-17 Technische Universität Chemnitz Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat
WO2009147546A1 (en) 2008-06-02 2009-12-10 Nxp B.V. Method for manufacturing an electronic device
DE102008046338B4 (de) * 2008-07-10 2012-10-31 Gera-Ident Gmbh Identifikationsmittel für eine kontaktlose Datenübertragung und Herstellungsverfahren hierfür

Family Cites Families (128)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628977A (en) 1969-10-02 1971-12-21 Addressograph Multigraph Multilayer tape for coating intaglio depressions and process for using same
BE792488A (fr) * 1971-12-08 1973-03-30 Dainippon Printing Co Ltd Cartes d'identification et procede de fabrication de ces cartes
US4021705A (en) * 1975-03-24 1977-05-03 Lichtblau G J Resonant tag circuits having one or more fusible links
FR2435778A1 (fr) 1978-08-01 1980-04-04 Pyral Soc Support d'enregistrement magnetique securitaire
US4253899A (en) * 1979-03-08 1981-03-03 Avery International Corporation Method of making matrix free thin labels
US4288499A (en) * 1979-05-08 1981-09-08 Rohm And Haas Company Polymers adherent to polyolefins
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
JPS57142798A (en) 1981-02-26 1982-09-03 Nippon Piston Ring Co Ltd Powder molding method and molded article
DE3130032A1 (de) * 1981-07-30 1983-02-17 Agfa-Gevaert Ag, 5090 Leverkusen Faelschungssicheres dokument
US5294290A (en) * 1982-06-07 1994-03-15 Reeb Max E Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits
US4443491A (en) * 1982-06-10 1984-04-17 Acumeter Laboratories, Inc. Method of and apparatus for producing adhesive-coated sheet materials usable with radiation-cured silicone release coatings and the like
AU589144B2 (en) * 1984-11-16 1989-10-05 Toyo Seikan Kaisha Ltd. Packaging material comprising iron foil, and container and container lid composed thereof
US4866505A (en) * 1986-03-19 1989-09-12 Analog Devices, Inc. Aluminum-backed wafer and chip
US4954814A (en) * 1986-09-29 1990-09-04 Monarch Marking Systems, Inc. Tag and method of making same
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
US4841712A (en) * 1987-12-17 1989-06-27 Package Service Company, Inc. Method of producing sealed protective pouchs with premium object enclosed therein
GB8817239D0 (en) 1988-07-20 1988-08-24 Adhesive Materials Ltd Adhesive labels & methods for their manufacture
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
KR0147813B1 (ko) * 1989-05-16 1998-08-01 월터 클리웨인, 한스-피터 위트린 적층 구조물 및 그의 제조방법
JPH03239595A (ja) 1990-02-16 1991-10-25 Dainippon Printing Co Ltd カード製造方法
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
CH680823A5 (ja) 1990-08-17 1992-11-13 Kobe Properties Ltd
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
US5201976A (en) * 1991-05-06 1993-04-13 Morgan Adhesives Company Method of producing a continuous label web
GB9114793D0 (en) * 1991-07-09 1991-08-28 Scient Generics Ltd Novel rf tag
JPH05160290A (ja) * 1991-12-06 1993-06-25 Rohm Co Ltd 回路モジュール
US5244836A (en) * 1991-12-30 1993-09-14 North American Philips Corporation Method of manufacturing fusible links in semiconductor devices
US5302431A (en) * 1992-01-06 1994-04-12 National Poly Products, Inc. Deformable label
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5266355A (en) * 1992-06-18 1993-11-30 Eastman Kodak Company Chemical vapor deposition of metal oxide films
US5344808A (en) * 1992-09-09 1994-09-06 Toppan Printing Co., Ltd. Intermediate transfer medium and process for producing image-recorded article making use of the same
US5404044A (en) * 1992-09-29 1995-04-04 International Business Machines Corporation Parallel process interposer (PPI)
US5693421A (en) * 1992-12-22 1997-12-02 Dai Nippon Printing Co., Ltd. Information recording medium and information recording and reproducing method
DE4327642C2 (de) * 1993-05-17 1998-09-24 Anatoli Stobbe Lesegerät für ein Detektierplättchen
US5534372A (en) * 1993-07-28 1996-07-09 Konica Corporation IC card having image information
CA2134156A1 (en) * 1993-11-22 1995-05-23 Thomas P. Klun Coatable compositions, abrasive articles made therefrom, and methods of making and using same
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
FR2716555B1 (fr) 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
US5822194A (en) * 1994-03-31 1998-10-13 Ibiden Co., Ltd. Electronic part mounting device
US5464690A (en) * 1994-04-04 1995-11-07 Novavision, Inc. Holographic document and method for forming
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
CN1054573C (zh) 1994-09-22 2000-07-19 罗姆股份有限公司 非接触型ic卡及其制造方法
DE4446369A1 (de) * 1994-12-23 1996-06-27 Giesecke & Devrient Gmbh Datenträger mit einem elektronischen Modul
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
WO1996023277A1 (en) 1995-01-27 1996-08-01 Interprint Formularios Ltda. Memory card and method of producing same
US5976690A (en) 1995-05-18 1999-11-02 3M Innovative Properties Company Opaque adhesives and method therefor
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5714305A (en) * 1995-05-24 1998-02-03 Polaroid Corporation Overcoat-releasing laminate and method for the manufacture thereof
US6221191B1 (en) * 1996-06-07 2001-04-24 Qpf, L.L.C. Polyester-containing biaxially-oriented polypropylene films and method of making the same
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
FR2736740A1 (fr) 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
JPH09156267A (ja) * 1995-12-06 1997-06-17 Watada Insatsu Kk プラスチックカード
US5937512A (en) * 1996-01-11 1999-08-17 Micron Communications, Inc. Method of forming a circuit board
JP3842362B2 (ja) * 1996-02-28 2006-11-08 株式会社東芝 熱圧着方法および熱圧着装置
US5781110A (en) * 1996-05-01 1998-07-14 James River Paper Company, Inc. Electronic article surveillance tag product and method of manufacturing same
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
EP2253481A3 (en) * 1996-09-19 2011-11-23 Dai Nippon Printing Co., Ltd. Multilayered volume hologram structure, and label for making multilayered volume hologram structure
ATE218735T1 (de) * 1996-09-27 2002-06-15 Avery Dennison Corp Haftetikett
US6122010A (en) * 1996-12-16 2000-09-19 Vidicast Ltd. Television signal data transmission system
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
US5963134A (en) * 1997-07-24 1999-10-05 Checkpoint Systems, Inc. Inventory system using articles with RFID tags
US6025780A (en) * 1997-07-25 2000-02-15 Checkpoint Systems, Inc. RFID tags which are virtually activated and/or deactivated and apparatus and methods of using same in an electronic security system
US6180256B1 (en) * 1997-08-26 2001-01-30 Arkwright Incorporated Heat shrinkable ink jet recording medium
EP1016052B1 (en) * 1997-09-11 2015-08-19 Precision Dynamics Corporation Laminated radio frequency identification device
US5982284A (en) 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
FR2769440B1 (fr) * 1997-10-03 1999-12-03 Gemplus Card Int Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
JPH11115328A (ja) * 1997-10-16 1999-04-27 Dainippon Printing Co Ltd 熱転写受像シート及びその製造方法
US6177859B1 (en) * 1997-10-21 2001-01-23 Micron Technology, Inc. Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus
DE19751043C2 (de) * 1997-11-18 2001-11-08 David Finn Gehäuste Transponderanordnung
FR2772494B1 (fr) * 1997-12-15 2001-02-23 Gemplus Card Int Carte a puce munie d'une etiquette de garantie
DE19829617A1 (de) * 1998-02-18 1999-08-26 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte sowie nach dem Verfahren hergestellte Chipkarte
DK1060460T3 (da) * 1998-03-06 2002-10-14 Security Graphics B V Identifikationsmærke omfattende optisk og elektronisk læsbar mærkning
TW424312B (en) 1998-03-17 2001-03-01 Sanyo Electric Co Module for IC cards, method for making a module for IC cards, hybrid integrated circuit module and method for making same
US6315856B1 (en) 1998-03-19 2001-11-13 Kabushiki Kaisha Toshiba Method of mounting electronic component
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
WO2000003354A1 (fr) * 1998-07-08 2000-01-20 Dai Nippon Printing Co., Ltd. Carte a circuit integre sans contact et son procede de fabrication
US6161761A (en) 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
EP1901251B1 (en) * 1998-08-14 2010-09-29 3M Innovative Properties Company Applications for radio frequency identification systems
US6066377A (en) * 1998-08-17 2000-05-23 Furon Laminated air brake tubing
DE19845296A1 (de) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Verfahren zur Kontaktierung eines Schaltungschips
WO2000016280A1 (en) * 1998-09-11 2000-03-23 Key-Trak, Inc. Object tracking system with non-contact object detection and identification
US6358588B1 (en) * 1998-10-03 2002-03-19 Brady Worldwide, Inc. Tags having a metallic heft and appearance and process for making them
JP2000113147A (ja) * 1998-10-08 2000-04-21 Hitachi Chem Co Ltd Ｉｃカードとその製造法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6569280B1 (en) * 1998-11-06 2003-05-27 The Standard Register Company Lamination by radiation through a ply
US6501721B2 (en) * 1999-01-14 2002-12-31 Hewlett-Packard Company Spliceless editing of a read/write optical medium
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
US6412702B1 (en) * 1999-01-25 2002-07-02 Mitsumi Electric Co., Ltd. Non-contact IC card having an antenna coil formed by a plating method
KR100414402B1 (ko) * 1999-02-25 2004-01-07 피츠필드 위빙 캄파니 인코포레이티드 라벨 제조 방법 및 장치
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
US6248199B1 (en) * 1999-04-26 2001-06-19 Soundcraft, Inc. Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
IT1317426B1 (it) * 1999-05-19 2003-07-09 Bosch Gmbh Robert Procedimento e dispositivo per comandare l'unita' motrice di unveicolo.
US6694872B1 (en) * 1999-06-18 2004-02-24 Holographic Label Converting, Inc. In-line microembossing, laminating, printing, and diecutting
FR2796183B1 (fr) 1999-07-07 2001-09-28 A S K Ticket d'acces sans contact et son procede de fabrication
EP1204136B1 (en) * 1999-07-16 2009-08-19 Panasonic Corporation Method of fabricating a packaged semiconductor device
JP4588139B2 (ja) * 1999-08-31 2010-11-24 リンテック株式会社 Ｉｃカードの製造方法
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6557766B1 (en) * 1999-10-01 2003-05-06 Keith R. Leighton Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
WO2001035457A1 (en) * 1999-11-08 2001-05-17 Amerasia International Technology, Inc. Wafer level application of tack-free die-attach adhesive film
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
US6520544B1 (en) * 2000-01-10 2003-02-18 Moore North America, Inc. Radio frequency labels on reusable containers
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
US6478229B1 (en) 2000-03-14 2002-11-12 Harvey Epstein Packaging tape with radio frequency identification technology
US6249199B1 (en) * 2000-04-10 2001-06-19 George Liu Quick magnetizing and demagnetizing device for screwdrivers
JP3597754B2 (ja) * 2000-04-24 2004-12-08 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
US6555213B1 (en) * 2000-06-09 2003-04-29 3M Innovative Properties Company Polypropylene card construction
JP2002109491A (ja) * 2000-09-29 2002-04-12 Sony Corp Ｉｃカード及びその製造方法
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
US6480110B2 (en) 2000-12-01 2002-11-12 Microchip Technology Incorporated Inductively tunable antenna for a radio frequency identification tag
US6600418B2 (en) * 2000-12-12 2003-07-29 3M Innovative Properties Company Object tracking and management system and method using radio-frequency identification tags
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、ｉｄタグ、及び、ｉｄタグの共振周波数の調整方法
FI119401B (fi) * 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
EP1485867A4 (en) * 2001-12-24 2012-02-22 L 1 Secure Credentialing Inc CONTACT CHIP CARDS HAVING A DOCUMENT CORE AND CONTACTLESS CHIP CARDS COMPRISING A MULTILAYER STRUCTURE, A PET IDENTIFICATION DOCUMENT, AND METHODS OF PRODUCING THE SAME

Also Published As

Publication number Publication date
GB2388250B (en) 2005-03-09
JP2004516538A (ja) 2004-06-03
DE10197008T1 (de) 2003-10-30
WO2002049093A1 (en) 2002-06-20
US7244332B2 (en) 2007-07-17
AU2002220764A1 (en) 2002-06-24
DE10197008B4 (de) 2007-10-18
JP4071626B2 (ja) 2008-04-02
GB2388250A (en) 2003-11-05
GB0314166D0 (en) 2003-07-23
FI20002707A (fi) 2002-06-12
US20040004295A1 (en) 2004-01-08
FI20002707A0 (fi) 2000-12-11

Similar Documents

Publication Publication Date Title
FI112121B (fi) Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
FI112550B (fi) Älytarra ja älytarraraina
US6886246B2 (en) Method for making an article having an embedded electronic device
US8198135B2 (en) Method for producing flexible integrated circuits which may be provided contiguously
FI119401B (fi) Älytarraraina ja menetelmä sen valmistamiseksi
US20020020491A1 (en) High speed flip chip assembly process
AU2005234764C9 (en) Method of forming RFID circuit assembly
KR20070034502A (ko) 알에프아이디 장치 및 형성 방법
KR20070100248A (ko) 기능성 소자를 포함하는 조립체 및 그 제조 방법
JP2005111928A (ja) 電子回路装置およびその製造方法並びに電子回路装置の製造装置
EP1292455B1 (en) A method and an apparatus for manufacturing a smart label inlet web
FI111039B (fi) Älykorttiraina ja menetelmä sen valmistamiseksi
US20070163704A1 (en) Method for manufacturing a label comprising a transponder
TW200527312A (en) Electronic device
FI113851B (fi) Menetelmä piisirulle integroidun piirin kiinnittämiseksi älytarraan ja menetelmä piikiekon esikäsittelemiseksi
WO2005069205A1 (ja) 電子装置の製造方法
FI115568B (fi) Älytarra ja älytarraraina
FI111485B (fi) Menetelmä RFID-lipukkeen kiinnittämiseksi toiseen pintaan
JP2004086852A (ja) 非接触ｉｄカード類及びその製造方法

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: UPM RAFLATAC OY

Free format text: UPM RAFLATAC OY

PC Transfer of assignment of patent

Owner name: SMARTRAC IP B.V.

PC Transfer of assignment of patent

Owner name: SMARTRAC INVESTMENT B.V.

MM Patent lapsed