ES2839083T3 - Composiciones de resina de poliuretano formulado para revestimientos por inundación de placas de circuitos electrónicos - Google Patents
Composiciones de resina de poliuretano formulado para revestimientos por inundación de placas de circuitos electrónicos Download PDFInfo
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- ES2839083T3 ES2839083T3 ES14733036T ES14733036T ES2839083T3 ES 2839083 T3 ES2839083 T3 ES 2839083T3 ES 14733036 T ES14733036 T ES 14733036T ES 14733036 T ES14733036 T ES 14733036T ES 2839083 T3 ES2839083 T3 ES 2839083T3
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- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims abstract description 35
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
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- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 2
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- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
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- RYEVPEDOQVMHIY-UHFFFAOYSA-N N=C=O.N=C=O.CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1 Chemical compound N=C=O.N=C=O.CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1 RYEVPEDOQVMHIY-UHFFFAOYSA-N 0.000 description 1
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- FGPCETMNRYMFJR-UHFFFAOYSA-L [7,7-dimethyloctanoyloxy(dimethyl)stannyl] 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCC(C)(C)C FGPCETMNRYMFJR-UHFFFAOYSA-L 0.000 description 1
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- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
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- KHLCTMQBMINUNT-UHFFFAOYSA-N octadecane-1,12-diol Chemical compound CCCCCCC(O)CCCCCCCCCCCO KHLCTMQBMINUNT-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/22—Catalysts containing metal compounds
- C08G18/24—Catalysts containing metal compounds of tin
- C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
- C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
- C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Polyurethanes Or Polyureas (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Organic Insulating Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361829681P | 2013-05-31 | 2013-05-31 | |
| PCT/US2014/040421 WO2014194303A1 (en) | 2013-05-31 | 2014-05-31 | Formulated polyurethane resin compositions for flood coating electronic circuit assemblies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2839083T3 true ES2839083T3 (es) | 2021-07-05 |
Family
ID=51014655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES14733036T Active ES2839083T3 (es) | 2013-05-31 | 2014-05-31 | Composiciones de resina de poliuretano formulado para revestimientos por inundación de placas de circuitos electrónicos |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US9699917B2 (enExample) |
| EP (1) | EP2997099B1 (enExample) |
| JP (3) | JP6574413B2 (enExample) |
| KR (1) | KR102355209B1 (enExample) |
| CN (2) | CN105358638B (enExample) |
| CA (2) | CA2913996C (enExample) |
| ES (1) | ES2839083T3 (enExample) |
| HU (1) | HUE053002T2 (enExample) |
| MX (2) | MX381812B (enExample) |
| PL (1) | PL2997099T3 (enExample) |
| PT (1) | PT2997099T (enExample) |
| SI (1) | SI2997099T1 (enExample) |
| WO (1) | WO2014194303A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9832902B2 (en) | 2013-05-31 | 2017-11-28 | Elantas Pdg, Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
| CA2913996C (en) * | 2013-05-31 | 2021-08-31 | Cytec Industries Inc. | Formulated polyurethane resin compositions for flood coating electronic circuit assemblies |
| CN106471087B (zh) | 2014-03-12 | 2020-07-07 | 艾伦塔斯Pdg有限公司 | 用于反渗透组件的聚氨酯粘合剂 |
| MX379142B (es) | 2014-11-26 | 2025-03-11 | Cytec Ind Inc | Composiciones de poliuretano de múltiples partes, artículos de las mismas y método de preparación. |
| MX2017013000A (es) | 2015-04-09 | 2018-04-20 | Elantas Pdg Inc | Adhesivos de poliuretano para modulos de osmosis inversa. |
| JP2017147388A (ja) * | 2016-02-19 | 2017-08-24 | 株式会社デンソー | 電子装置の製造方法 |
| RU2771386C1 (ru) | 2018-09-10 | 2022-05-04 | ХАНТСМЭН ИНТЕРНЭШНЛ ЭлЭлСи | Форполимер, содержащий оксазолидиндионовые концевые группы |
| WO2020053062A1 (en) * | 2018-09-10 | 2020-03-19 | Huntsman International Llc | Oxazolidinedione-terminated prepolymer |
| JP7391101B2 (ja) * | 2018-10-31 | 2023-12-04 | エイチ．ビー．フラー カンパニー | 液体塗布型制振材用の２成分ポリウレタン系 |
| JP7654095B2 (ja) * | 2021-02-10 | 2025-03-31 | キャボット コーポレイション | 熱可塑性エラストマーの製造方法及びそれにより得られるポリマー複合体 |
| GB2613561A (en) * | 2021-12-03 | 2023-06-14 | H K Wentworth Ltd | Expandable protective coating |
| KR102764618B1 (ko) | 2023-09-15 | 2025-02-11 | (주)이에스피켐 | 폴리우레탄 수지 조성물 |
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| US9832902B2 (en) * | 2013-05-31 | 2017-11-28 | Elantas Pdg, Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
| CA2913996C (en) | 2013-05-31 | 2021-08-31 | Cytec Industries Inc. | Formulated polyurethane resin compositions for flood coating electronic circuit assemblies |
| CN106471087B (zh) | 2014-03-12 | 2020-07-07 | 艾伦塔斯Pdg有限公司 | 用于反渗透组件的聚氨酯粘合剂 |
| MX379142B (es) | 2014-11-26 | 2025-03-11 | Cytec Ind Inc | Composiciones de poliuretano de múltiples partes, artículos de las mismas y método de preparación. |
| MX2017013000A (es) | 2015-04-09 | 2018-04-20 | Elantas Pdg Inc | Adhesivos de poliuretano para modulos de osmosis inversa. |
-
2014
- 2014-05-31 CA CA2913996A patent/CA2913996C/en active Active
- 2014-05-31 MX MX2015016482A patent/MX381812B/es unknown
- 2014-05-31 HU HUE14733036A patent/HUE053002T2/hu unknown
- 2014-05-31 WO PCT/US2014/040421 patent/WO2014194303A1/en not_active Ceased
- 2014-05-31 PT PT147330369T patent/PT2997099T/pt unknown
- 2014-05-31 CN CN201480038041.8A patent/CN105358638B/zh active Active
- 2014-05-31 PL PL14733036T patent/PL2997099T3/pl unknown
- 2014-05-31 US US14/292,876 patent/US9699917B2/en active Active
- 2014-05-31 KR KR1020157036488A patent/KR102355209B1/ko active Active
- 2014-05-31 EP EP14733036.9A patent/EP2997099B1/en active Active
- 2014-05-31 JP JP2016517071A patent/JP6574413B2/ja active Active
- 2014-05-31 SI SI201431747T patent/SI2997099T1/sl unknown
- 2014-05-31 ES ES14733036T patent/ES2839083T3/es active Active
- 2014-11-29 CA CA2913565A patent/CA2913565A1/en not_active Abandoned
- 2014-11-29 JP JP2017515665A patent/JP6600681B2/ja active Active
- 2014-11-29 CN CN201480037777.3A patent/CN105683316B/zh active Active
- 2014-11-29 MX MX2015016483A patent/MX2015016483A/es unknown
-
2019
- 2019-09-05 JP JP2019162154A patent/JP6811818B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SI2997099T1 (sl) | 2021-03-31 |
| CN105358638A (zh) | 2016-02-24 |
| EP2997099B1 (en) | 2020-10-14 |
| CA2913996A1 (en) | 2014-12-04 |
| PT2997099T (pt) | 2021-01-11 |
| KR102355209B1 (ko) | 2022-01-25 |
| CA2913565A1 (en) | 2015-11-30 |
| CN105358638B (zh) | 2018-08-07 |
| EP2997099A1 (en) | 2016-03-23 |
| CA2913996C (en) | 2021-08-31 |
| US9699917B2 (en) | 2017-07-04 |
| JP6600681B2 (ja) | 2019-11-06 |
| JP6574413B2 (ja) | 2019-09-11 |
| MX2015016482A (es) | 2016-06-21 |
| JP2016529333A (ja) | 2016-09-23 |
| WO2014194303A1 (en) | 2014-12-04 |
| CN105683316A (zh) | 2016-06-15 |
| CN105683316B (zh) | 2019-12-31 |
| JP2017524794A (ja) | 2017-08-31 |
| HUE053002T2 (hu) | 2021-06-28 |
| JP6811818B2 (ja) | 2021-01-13 |
| JP2020077847A (ja) | 2020-05-21 |
| PL2997099T3 (pl) | 2021-04-19 |
| US20140355225A1 (en) | 2014-12-04 |
| MX381812B (es) | 2025-03-13 |
| KR20160014677A (ko) | 2016-02-11 |
| MX2015016483A (es) | 2016-07-07 |
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