PL2997099T3 - Formułowane kompozycje żywic poliuretanowych do powlekania zalewowego zespołów obwodu elektronicznego - Google Patents

Formułowane kompozycje żywic poliuretanowych do powlekania zalewowego zespołów obwodu elektronicznego

Info

Publication number
PL2997099T3
PL2997099T3 PL14733036T PL14733036T PL2997099T3 PL 2997099 T3 PL2997099 T3 PL 2997099T3 PL 14733036 T PL14733036 T PL 14733036T PL 14733036 T PL14733036 T PL 14733036T PL 2997099 T3 PL2997099 T3 PL 2997099T3
Authority
PL
Poland
Prior art keywords
electronic circuit
polyurethane resin
resin compositions
circuit assemblies
flood coating
Prior art date
Application number
PL14733036T
Other languages
English (en)
Polish (pl)
Inventor
Richard David JORDAN Jr.
Thomas C. SCANLON IV
Original Assignee
Elantas Pdg Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elantas Pdg Inc. filed Critical Elantas Pdg Inc.
Publication of PL2997099T3 publication Critical patent/PL2997099T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PL14733036T 2013-05-31 2014-05-31 Formułowane kompozycje żywic poliuretanowych do powlekania zalewowego zespołów obwodu elektronicznego PL2997099T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
EP14733036.9A EP2997099B1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (1)

Publication Number Publication Date
PL2997099T3 true PL2997099T3 (pl) 2021-04-19

Family

ID=51014655

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14733036T PL2997099T3 (pl) 2013-05-31 2014-05-31 Formułowane kompozycje żywic poliuretanowych do powlekania zalewowego zespołów obwodu elektronicznego

Country Status (13)

Country Link
US (1) US9699917B2 (enExample)
EP (1) EP2997099B1 (enExample)
JP (3) JP6574413B2 (enExample)
KR (1) KR102355209B1 (enExample)
CN (2) CN105358638B (enExample)
CA (2) CA2913996C (enExample)
ES (1) ES2839083T3 (enExample)
HU (1) HUE053002T2 (enExample)
MX (2) MX381812B (enExample)
PL (1) PL2997099T3 (enExample)
PT (1) PT2997099T (enExample)
SI (1) SI2997099T1 (enExample)
WO (1) WO2014194303A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT2997099T (pt) * 2013-05-31 2021-01-11 Elantas Pdg Inc Composições de resina de poliuretano formuladas para revestimento de superfície de unidades de circuito eletrónico
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
CA2968849C (en) 2014-11-26 2023-02-28 Cytec Industries Inc. Multi-part polyurethane compositions, articles thereof, and method of making
DK3280516T3 (da) 2015-04-09 2020-03-23 Elantas Pdg Inc Polyurethan-klæbemidler til omvendt osmosemoduler
JP2017147388A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電子装置の製造方法
EP3850025A1 (en) * 2018-09-10 2021-07-21 Huntsman International LLC Oxazolidinedione-terminated prepolymer
BR112021003432A2 (pt) 2018-09-10 2021-05-18 Huntsman International Llc composto, composto de poli(uretano-amida), e, produto
KR102926165B1 (ko) * 2018-10-31 2026-02-10 에이치. 비. 풀러, 컴퍼니 액체-적용된 제진재용 2-성분 폴리우레탄 시스템
WO2022173641A1 (en) * 2021-02-10 2022-08-18 Cabot Corporation Method of producing thermoplastic elastomers and polymer composite obtained thereby
GB2613561A (en) * 2021-12-03 2023-06-14 H K Wentworth Ltd Expandable protective coating
KR102764618B1 (ko) 2023-09-15 2025-02-11 (주)이에스피켐 폴리우레탄 수지 조성물

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PT2997099T (pt) * 2013-05-31 2021-01-11 Elantas Pdg Inc Composições de resina de poliuretano formuladas para revestimento de superfície de unidades de circuito eletrónico
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
CA2968849C (en) 2014-11-26 2023-02-28 Cytec Industries Inc. Multi-part polyurethane compositions, articles thereof, and method of making
DK3280516T3 (da) 2015-04-09 2020-03-23 Elantas Pdg Inc Polyurethan-klæbemidler til omvendt osmosemoduler

Also Published As

Publication number Publication date
JP2016529333A (ja) 2016-09-23
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
CA2913565A1 (en) 2015-11-30
PT2997099T (pt) 2021-01-11
SI2997099T1 (sl) 2021-03-31
US20140355225A1 (en) 2014-12-04
KR20160014677A (ko) 2016-02-11
EP2997099B1 (en) 2020-10-14
JP6811818B2 (ja) 2021-01-13
CN105358638B (zh) 2018-08-07
MX381812B (es) 2025-03-13
MX2015016482A (es) 2016-06-21
MX2015016483A (es) 2016-07-07
JP2017524794A (ja) 2017-08-31
HUE053002T2 (hu) 2021-06-28
ES2839083T3 (es) 2021-07-05
KR102355209B1 (ko) 2022-01-25
US9699917B2 (en) 2017-07-04
JP6574413B2 (ja) 2019-09-11
JP6600681B2 (ja) 2019-11-06
JP2020077847A (ja) 2020-05-21
WO2014194303A1 (en) 2014-12-04
CN105358638A (zh) 2016-02-24
EP2997099A1 (en) 2016-03-23
CA2913996C (en) 2021-08-31
CA2913996A1 (en) 2014-12-04

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