EP3687799A1 - Interconnexions scellées - Google Patents
Interconnexions scelléesInfo
- Publication number
- EP3687799A1 EP3687799A1 EP19745957.1A EP19745957A EP3687799A1 EP 3687799 A1 EP3687799 A1 EP 3687799A1 EP 19745957 A EP19745957 A EP 19745957A EP 3687799 A1 EP3687799 A1 EP 3687799A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- print liquid
- supply unit
- joint
- liquid supply
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 193
- 238000003466 welding Methods 0.000 claims description 68
- 239000011241 protective layer Substances 0.000 claims description 67
- 239000000463 material Substances 0.000 claims description 58
- 239000004020 conductor Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000012815 thermoplastic material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 22
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 6
- 229920001169 thermoplastic Polymers 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000012354 overpressurization Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17513—Inner structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
- B41J2/17523—Ink connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17543—Cartridge presence detection or type identification
- B41J2/17546—Cartridge presence detection or type identification electronically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17553—Outer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17556—Means for regulating the pressure in the cartridge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17559—Cartridge manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/195—Ink jet characterised by ink handling for monitoring ink quality
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
- B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
- G01F23/246—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices
- G01F23/247—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices for discrete levels
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/80—Arrangements for signal processing
- G01F23/802—Particular electronic circuits for digital processing equipment
- G01F23/804—Particular electronic circuits for digital processing equipment containing circuits handling parameters other than liquid level
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/20—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of apparatus for measuring liquid level
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
- G01L23/08—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0848—Arrangements for testing or measuring developer properties or quality, e.g. charge, size, flowability
- G03G15/0856—Detection or control means for the developer level
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/44—Program or device authentication
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
- G06F21/606—Protecting data by securing the transmission between two devices or processes
- G06F21/608—Secure printing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
- G06F21/62—Protecting access to data via a platform, e.g. using keys or access control rules
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/30—Arrangements for executing machine instructions, e.g. instruction decode
- G06F9/30098—Register arrangements
- G06F9/30105—Register structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
- G06K15/10—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by matrix printers
- G06K15/102—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by matrix printers using ink jet print heads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/40—Details not directly involved in printing, e.g. machine management, management of the arrangement as a whole or of its constitutive parts
- G06K15/407—Managing marking material, e.g. checking available colours
- G06K15/4075—Determining remaining quantities of ink or toner
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/08—Key distribution or management, e.g. generation, sharing or updating, of cryptographic keys or passwords
- H04L9/0816—Key establishment, i.e. cryptographic processes or cryptographic protocols whereby a shared secret becomes available to two or more parties, for subsequent use
- H04L9/0819—Key transport or distribution, i.e. key establishment techniques where one party creates or otherwise obtains a secret value, and securely transfers it to the other(s)
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/08—Key distribution or management, e.g. generation, sharing or updating, of cryptographic keys or passwords
- H04L9/0891—Revocation or update of secret information, e.g. encryption key update or rekeying
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/12—Transmitting and receiving encryption devices synchronised or initially set up in a particular manner
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
- H04L9/3236—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using cryptographic hash functions
- H04L9/3242—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using cryptographic hash functions involving keyed hash functions, e.g. message authentication codes [MACs], CBC-MAC or HMAC
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
- H04L9/3271—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using challenge-response
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
- H04L9/3297—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials involving time stamps, e.g. generation of time stamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17513—Inner structure
- B41J2002/17516—Inner structure comprising a collapsible ink holder, e.g. a flexible bag
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
- B41J2002/17569—Ink level or ink residue control based on the amount printed or to be printed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
- B41J2002/17579—Measuring electrical impedance for ink level indication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
- B41J2002/17586—Ink level or ink residue control using ink bag deformation for ink level indication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49023—3-D printing, layer of powder, add drops of binder in layer, new powder
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0016—Inter-integrated circuit (I2C)
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/40—Bus coupling
Definitions
- Some types of printing utilize liquid.
- some types of printing extrude liquid onto media or material to produce a printed product (e.g., two-dimensional (2D) printed content, three-dimensional (3D) printed objects).
- a print head may be utilized to extrude ink onto paper to print text and/or images.
- a print head may be utilized to extrude fusing agent onto material in order to form a 3D printed object.
- Figure 1 is a diagram illustrating a perspective view of an example of a print liquid supply unit
- Figure 2A is a diagram illustrating an example of a body
- Figure 2B illustrates an enlarged view of an example of a portion of the body
- Figure 2C illustrates an example of a lid
- Figure 2D illustrates an enlarged view of an example of a portion of the lid
- Figure 3A is a diagram illustrating an example of a print liquid supply unit
- Figure 3B illustrates an example of a cross section of the print liquid supply unit before welding
- Figure 3C illustrates an example of the cross section of the print liquid supply unit after welding
- Figure 4A is a diagram illustrating an enlarged view of an example of a passage region
- Figure 4B is a diagram illustrating an enlarged view of an example of a passage region
- Figure 5A is a diagram illustrating a side view of an example of an electrical interconnect or electrical interconnects and protective layers
- Figure 5B is a diagram illustrating a side view of an example of an electrical interconnect or electrical interconnects and protective layers
- Figure 5C is a diagram illustrating a front view of an example of flexible electrical connection including electrical interconnects and protective layers;
- Figure 5D is a diagram illustrating an example of an electrical connector
- Figure 5E is a diagram illustrating an example of an electrical connector
- Figure 6 is a flow diagram illustrating one example of a method for manufacturing a print liquid container
- Figure 7 shows an example print liquid supply cartridge
- Figure 8 is a cross-sectional view through the line C-C of the example print liquid supply cartridge of Figure 7;
- Figure 9 shows another example print liquid supply cartridge
- Figures 10A and 10B are perspective views of another example print liquid supply cartridge
- Figure 11 is a magnified view of part of the example cartridge.
- Print liquid is a fluid for printing.
- Examples of print liquid include ink and fusing agent.
- accurately sensing an amount of print liquid remaining in a reservoir may be difficult due to issues like liquid bridging, environmental conditions, and water vapor transmission rates. An inaccurately sensed liquid level may lead to changing the reservoir more often, wasting print liquid, and/or increasing printing expense. Accordingly, it may be beneficial to provide more delivered print liquid, a more reliable sensed print liquid level, and/or less ink supply changes.
- a sensor or sensors may be utilized to increase print liquid level sensing accuracy.
- the sensor(s) may be housed in a print liquid supply unit.
- a print liquid supply unit is a container that holds print liquid.
- a print liquid supply unit may be referred to as a print liquid container, a cartridge, a supply, print liquid supply cartridge, etc.
- the print liquid may be supplied to a printer.
- four print liquid supplies may be utilized for a printer, which may include black, cyan, magenta, and yellow print liquid supplies. This may allow print liquid supplies with colors to be replaced individually. For example, a print liquid color that is used more often may be replaced individually without replacing remaining print liquid of another color or colors.
- print liquid supply units may be constructed of thermoplastics.
- Thermoplastics may be injection molded and may be compatible with high volume manufacturing and/or assembly methods. It may be beneficial for the construction materials (e.g., materials to construct components of the print liquid supply) to be compatible with the print liquid, to be robust to environmental conditions during shipping/handling, and/or to provide target water vapor transmission rates such that print quality is maintained over the life of the print liquid supply unit.
- print liquid supply units may be constructed from thermoplastics such as polypropylene (PP), low-density polyethylene (LDPE), high-density polyethylene (HDPE), polyethylene terephthalate (PET), polycarbonate (PC), and/or blends thereof.
- thermoplastics may be compatible with high volume assembly methods such as ultrasonic welding, vibration welding, and/or laser welding.
- welding e.g., laser welding
- welding may be capable of creating waterproof joint seals to contain the print liquid.
- “welding,”“weld,” and variations thereof may denote laser welding, ultrasonic welding, and/or vibration welding.
- Other approaches for joining components may be excluded from the term“welding” (and variations thereof) in some examples.
- Welding may be beneficial because plastic parts may be joined via high speed melting.
- welding may not include utilizing another bonding agent or additional parts. Issues may arise when attempting to pass an electrical connection through a welded joint.
- a sensor may be housed in a print liquid supply unit and may utilize a conductor that passes through a welded joint.
- Some examples of the techniques described herein may include providing an electrical connection through a joint that is welded.
- the electrical connection may be sealed through a joint of thermoplastic material without other materials.
- Some examples may not utilize double-sided pressure sensitive adhesive (PSA) gaskets, elastomeric gaskets, and/or various glue joints, which may increase a number of constraints such as compatibility with print liquid, ability to seal different joint materials and the electrical connection, robustness, and/or setting/curing time.
- PSA pressure sensitive adhesive
- Some examples may provide a flexible electrical connection that can be placed in the supply joint and sealed via local compression by laser welding the supply joint.
- Figure 1 is a diagram illustrating a perspective view of an example of a print liquid supply unit 100.
- the print liquid supply unit 100 include print liquid containers, cartridges, supplies, print liquid supply cartridges, etc.
- the print liquid supply unit 100 may contain and/or transfer print liquid (e.g., ink, agent, etc.).
- the print liquid supply unit 100 may be designed to interface with a host device.
- a host device is a device that uses and/or applies print liquid. Examples of a host device include printers, ink jet printers, 3D printers, etc. For example, it may be beneficial to replenish or replace the print liquid supply unit 100 when some or all of the print liquid has been utilized.
- the print liquid supply unit 100 includes a first housing component 102 and a second housing component 104.
- the first housing component 102 and the second housing component 104 are structures for containing print liquid.
- the first housing component 102 may be joined to the second housing component 104 to form a volume to contain print liquid.
- the first housing component 102 and the second housing component 104 may be made of a thermoplastic or a combination of thermoplastics.
- the first housing component 102 may be a lid of the print liquid supply unit 100 and the second housing component may be body of the print liquid supply unit 100.
- the first housing component 102 may be welded to the second housing component 104 along a supply joint 106.
- the supply joint 106 is an interface between the first housing component 102 and the second housing component 104.
- the supply joint 106 is welded to join housing components of the print liquid supply unit 100.
- the first housing component 102 may be welded to the second housing component 104 along the supply joint 106 using laser welding, ultrasonic welding, and/or vibration welding.
- welding may be applied along the entire supply joint 106.
- welding may be applied along a portion (e.g., not the entire path) of the supply joint 106.
- the first housing component 102 may include first joint geometry and the second housing component 104 may include second joint geometry. Joint geometry is a form or shape of a surface along which the supply joint 106 may be formed.
- Welding may cause a phase change in the material of the first housing component 102 and/or the second housing component 104.
- the second housing component 104 may have an opening on one side of the second housing component to be closed with the first housing component to make a waterproof seal for the print liquid.
- the first housing component 102 and the second housing component 104 may be made of polypropylene material and may be joined using laser welding.
- the first housing component 102 may be press-fit to the second housing component 104 via a post or posts that serve to align the first housing component 102 and keep it on the second housing component 104 as the print liquid supply unit 100 enters a welder. Pressure may be applied to the print liquid supply unit 100.
- a clamp may be applied to the first housing component 102 while the second housing component 104 is supported.
- a laser beam may be passed through the first housing component 102 to the underlying joint geometry or geometries below.
- the second housing component 104 may absorb a portion (e.g., a majority) of the energy, which may cause the material of the second housing component 104 (along the supply joint 106, for example) to melt.
- the pressure and phase change of the material may cause the first housing component 102 to join to the second housing component.
- the print liquid supply unit 100 may collapse slightly, which may cause the material along the supply joint 106 to widen.
- An electrical interconnect 108 may be situated through the supply joint 106.
- the electrical interconnect 108 may be sealed in the supply joint 106 from an outside of the print liquid supply unit 100 to an inside of the print liquid supply unit 100.
- the inside of the print liquid supply unit 100 may contain print liquid.
- the electrical interconnect 108 may be coupled to a sensor for the interior of the print liquid supply unit 100.
- the electrical interconnect 108 may be coupled to an electrical interface (e.g., electrical connection pad(s)) for the exterior of the print liquid supply unit 100. The electrical interface may be utilized to communicate with a printer in some examples.
- the electrical interconnect 108 may be a material that is able to conduct electricity or electrical signals.
- the electrical interconnect 108 may be a metal wire or ribbon.
- multiple interconnects 108 e.g., conductors
- the electrical interconnect 108 may be covered by a protective layer or layers.
- a protective layer is a layer of material that protects an electrical interconnect or interconnects.
- the protective layer(s) may be polyimide (PI), polyethylene naphthalate (PEN), and/or polyethylene terephthalate (PET), etc.
- the protective layer(s) may isolate and/or protect the electrical interconnect 108 from the print liquid.
- an overmolded protective layer or layers may be utilized to house the electrical interconnect(s).
- an electrical interconnect 108 or electrical interconnects 108 may be embedded within (e.g., sandwiched between) protective layers.
- the protective layer(s) may be transmissive.
- a transmissive protective layer(s) may allow welding (e.g., laser welding, ultrasonic welding, vibration welding) to be performed through the protective layer(s).
- a transmissive protective layer may allow the transmission of a welding laser beam through the protective layer(s).
- the supply joint 106 e.g., welded joint
- the protective layer(s) may have a melting temperature that is greater than a melting temperature of material along the supply joint 106 (e.g., joint material). Using a protective layer(s) with a greater melting temperature may allow welding techniques to be performed while reducing or eliminating damage to the electrical interconnect 108.
- the protective layer(s) may be compatible with the print liquid.
- the protective layer(s) may not significantly degrade in the presence of print liquid and/or may not negatively impact the quality of the print liquid.
- the electrical interconnect 108 may be sealed in the supply joint 106.
- the seal may be a compression seal and/or a welded seal.
- the seal may be a waterproof seal (e.g., a seal to contain liquid such as print liquid).
- the sealing may prevent the print liquid from leaking from the inside of the print liquid supply unit 100 to the outside of the print liquid supply unit 100, while allowing the electrical interconnect 108 (or electrical interconnects 108) to pass through the supply joint 106.
- the seal may prevent air from leaking into the print liquid supply unit 100.
- the seal may be formed from the material(s) of the first housing component 102 and/or the second housing component 104.
- the electrical interconnect 108 with the protective layer(s) may be sealed through the supply joint 106 without additional sealing material(s) such as additional plastic, rubber, elastomer, thermoplastic elastomer, adhesive (e.g., pressure sensitive adhesive), component(s), and/or gasket(s).
- the protective layer(s) may not bond with the joint material (e.g., the first housing component 102 and/or the second housing component 104).
- the electrical interconnect 108 may be sealed in a passage region.
- a passage region is a portion of the supply joint 106 and/or joint geometry where the electrical interconnect 108 passes between the inside of the print liquid supply unit 100 and the outside of the print liquid supply unit 100.
- the supply joint 106 may include a stepped structure in the passage region.
- the stepped structure is a geometrical structure that includes a step or ramp.
- the supply joint 106 may not include a stepped structure in the passage region.
- the first housing component 102 and/or the second housing component 104 may include a flow structure or flow structures.
- a flow structure is a structure to control a flow of joint material (e.g., material in the supply joint 106) during welding.
- a flow structure may direct the flow of joint material and/or may help to ensure that the joint material fills a potential gap or gaps.
- the flow structure may include a protruding rib or ribs along edges of the supply joint 106. The protruding rib or ribs may maintain joint material in the supply joint 106 during welding.
- the protruding ribs may form a lengthwise channel along the supply joint or along joint geometry.
- the channel may hold joint material (e.g., molten joint material) along the supply joint 106 during welding.
- joint material e.g., molten joint material
- the protruding rib or ribs may compress during welding.
- An example of protruding ribs is given in connection with Figure 4A.
- the joint geometry may include an extended structure or structures that extend the side(s) of the joint geometry in a passage region.
- the extended structure(s) may provide additional joint material.
- the additional joint material may help to fill potential gaps in the passage region.
- welding may be performed with a weld (e.g., ultrasonic weld, laser weld) that is not applied along a portion of the supply joint in a passage region.
- a weld e.g., ultrasonic weld, laser weld
- a protective layer may be non-transmissive and the weld may not be applied over the protective layer to avoid damaging the protective layer and/or electrical interconnect(s) 108.
- Figure 2A is a diagram illustrating an example of a body 212.
- Figure 2B illustrates an enlarged view of an example of a portion of the body 212.
- Figure 2C illustrates an example of a lid 214.
- Figure 2D illustrates an enlarged view of an example of a portion of the lid 214.
- Figures 2A-D will be described together.
- the lid 214 may be an example of the first housing component described in connection with Figure 1.
- the body 212 may be an example of the second housing component 104 described in connection with Figure 1.
- the body 212 may be joined with the lid 214 to form a print liquid supply unit 100 (e.g., a print liquid container).
- the body 212 includes body joint geometry 216.
- joint geometry may be a kind of energy director that directs welding energy.
- the body joint geometry 216 may direct laser welding energy to melt (e.g., partially or completely melt) the body joint geometry 216 in order to join the body 212 and the lid 214.
- the body joint geometry 216 includes a raised rectangular structure with a chamfer on an edge or edges (e.g., on the exterior perimeter and/or interior perimeter).
- the body joint geometry 216 may provide joint material (e.g., a majority of plastic material) that melts in the supply joint to create a seal.
- the body joint geometry 216 may include a passage region 218.
- body joint geometry 216 (e.g., supply joint) includes a stepped structure in the passage region 218.
- the stepped structure is stepped inward with two angled sections (e.g., sections at 45-degree angles) and a flat section where electrical interconnects 208 pass through the supply joint.
- the body 212 may include a separate welding section 234 corresponding to a counterpart recess 236 on the lid 214 for structural support.
- a sensor assembly is illustrated with the lid 214.
- the sensor assembly includes electrical interconnects 208, protective layers 220, electrical pads 224, sensor(s) 222, and a sensor support 226.
- the electrical interconnects 208 and protective layers 220 may form a flexible connector.
- the electrical interconnects 208 and the sensor support 226 are mounted to the lid 214 before welding the lid 214 and body 212.
- press-fit posts 228a-b may be inserted into counterpart sockets to align the lid 214 to the body 212 before welding (e.g., laser welding).
- Other approaches and/or structures may be utilized to align the body 212 and lid 214.
- the two ends of the electrical interconnects 208 may be loose on both ends and alignment (and/or holding) of the body 212, lid 214, and electrical interconnects 208 may be accomplished with other procedures.
- lid joint geometry 230 includes a recessed track.
- the lid joint geometry 230 may be recessed to form a flash trap.
- the lid joint geometry 230 may include a raised structure 232 corresponding to the step structure of the body 212.
- the raised structure 232 may support the electrical interconnects 208 and the protective layers 220 (e.g., flexible connector) during welding.
- the electrical interconnects 208 and protective layers 220 may be sealed in the supply joint by performing welding.
- the body 212 and lid 214 may be container shells of a print liquid container.
- the sensor 222 may be a container property sensor that includes a strain sensor or pressure sensor connector to a container wall.
- the sensor support 226 and/or the sensor 222 may be connected to the container wall using posts (e.g., pressure-fit posts, posts that are swaged), adhesive, and/or another technique for attachment.
- a container wall is a barrier or partition of a container.
- the body 212 and/or lid 214 may include a container wall or container walls.
- the electrical interconnect 208 may be a conductor that is coupled to the property sensor 222 and that is sealed through a welded joint of container shells.
- the property sensor 222 may include a digital liquid level sensor.
- Figure 3A is a diagram illustrating an example of a print liquid supply unit 300.
- Figure 3B illustrates an example of a cross section of the print liquid supply unit 300 before welding.
- Figure 3C illustrates an example of the cross section of the print liquid supply unit 300 after welding.
- the print liquid supply unit 300 may be an example of the print liquid supply unit 100 described in connection with Figure 1 or the print liquid supply unit described in connection with Figure 2.
- the print liquid supply unit 300 includes a lid 314 and a body 312.
- the cross section illustrated in Figure 3B is aligned with a middle of the passage region where an electrical connector 338 is located.
- Figure 3B illustrates a cross-section prior to welding.
- the lid 314 is placed on the body 312.
- a gap 340a exists between the lid 314 and the body 312 to accommodate a collapse during welding.
- the electrical connector 338 may be positioned through the passage region 318a.
- the lid 314 is in a collapsed position after welding (e.g., the gap 340b between the body 312 and lid 314 is reduced). Joint material in the passage region 318b may melt to seal the supply joint.
- the lid 314 may collapse in a 0.3-0.5 millimeter (mm) range during welding.
- a welding laser e.g., a near infrared (IR) laser
- nm 980 nanometers
- the lid 314 has a transmissivity in a 30-60% range and the body 312 may be doped such that the body 312 (e.g., joint geometry) absorbs a large proportion of laser energy (e.g., 80%, 90%, 100%, etc.).
- the lid 314 may accordingly heat up when exposed to the welding laser, though a majority of the molten material used to form the weld may come from the body 312.
- body joint geometry in the passage region 318b may melt to seal the electrical connector 338 in the supply joint. While some examples for collapse distance, laser wavelength, transmissivity rate, and absorption rate are given, other values may be utilized in other examples.
- Figure 4A is a diagram illustrating an enlarged view of an example of a passage region 418a.
- the passage region 418a may be implemented in some of the print liquid supply units described herein.
- the passage region 418a may include a portion of body joint geometry where an electrical interconnect or interconnects (e.g., an electrical connector with a protective layer or layers) may be situated (e.g., sealed).
- Figure 4A includes an example of a flow structure to control a flow of joint material during welding.
- the flow structure includes protruding ribs 442a-b.
- the protruding ribs 442a-b are located along edges of the supply joint.
- protruding ribs may be located differently (e.g., may be in-set from the edge(s) of the supply joint.
- the protruding ribs 442a-b may maintain joint material in the supply joint during welding.
- the protruding ribs 442a-b have a wedge shape and are located above and below the energy director in the passage region 418a. The wedge shape may reduce the amount of energy absorbed by the protruding ribs 442a-b during welding. Wedges or other shapes may be utilized.
- the protruding ribs 442a-b compress during welding.
- the protruding ribs 442a-b may act as crush ribs to trap joint material (e.g., keep joint material in the supply joint) and conform around the electrical interconnect(s) (e.g., protective layer(s) and/or electrical connector).
- a flow structure e.g., protruding ribs
- supporting material 446a may be utilized near a corner or corners to strengthen the supply joint at a corner or corners.
- the supporting material 446a may be located at a socket to add structural robustness to the inside corner of the weld. This may improve strength when the print liquid supply unit is pressurized.
- the supporting material 446a may be utilized to add strength and/or may not be utilized for sealing.
- Figure 4B is a diagram illustrating an enlarged view of an example of a passage region 418b.
- the passage region 418b may be implemented in the some of the print liquid supply units described herein.
- the passage region 418b may include a portion of body joint geometry where an electrical interconnect or interconnects (e.g., an electrical connector with a protective layer or layers) may be situated (e.g., sealed).
- Figure 4B includes an example of extended structures 444a-d that extend the sides of a joint geometry in a passage region 418b.
- the extended structures 444a-d form an “H” shape. Other shapes may be utilized in other examples.
- the flow structure includes extended structures 444a- d.
- the extended structures 444a-d are rectangular energy directors to provide more joint material to form a seal along the edges of the electrical interconnect(s) (e.g., electrical connector).
- extended structure(s) may provide more joint material in a width dimension of the joint geometry (in addition to along a length dimension of the joint geometry.
- the extended structures may extend in a transverse direction across the joint geometry and/or weld path.
- supporting material 446b may be utilized near a corner or corners to strengthen the supply joint at a corner or corners.
- the supporting material 446b may be located at a socket to add structural robustness to the inside corner of the weld.
- Figure 5A is a diagram illustrating a side view of an example of an electrical interconnect or electrical interconnects 508a and protective layers 520a.
- the thickness of the protective layers 520a and the electrical interconnect(s) 508a may range between 0.05 millimeters (mm) and 1 mm.
- a combination of electrical interconnect(s) and protective layer(s) may be referred to as an electrical connector.
- Figure 5A illustrates an example of an electrical connector 548a that includes electrical interconnect(s) 508a and protective layers 520a.
- the electrical connector 548a may include 1 to n number of electrical interconnects 508a sandwiched between protective layers 520a.
- the electrical interconnect(s) 508a may be sandwiched between two protective layers 520a that are bonded or cast together to creating a seal between the protective layers 520a without adhesive.
- the protective layers 520a may be transmissive and welding (e.g., a welding laser) may pass over and/or through the electrical connector 548a (e.g., through the protective layers 520a).
- the protective layer(s) may have a transmissivity in a range between 5% and 95%. The transmissivity may allow body joint geometry material behind the electrical connector 548a to melt. During welding, the transmissivity may allow the lid to heat up and the body material to melt and flow in multiple (e.g., five) directions around the electrical connector, making a compression seal around the flex protective material that is watertight.
- the seal may be a compression seal because the plastic may conform around the electrical connector, but may not bond to the protective layer(s).
- materials used to encapsulate the electrical interconnect(s) 508a may have a melting temperature that is greater than a melting temperature of body and/or lid material to avoid damaging the materials.
- the materials used to encapsulate may be robust enough to withstand liquid attack and may be inert to the print liquid.
- the electrical connector 548a may be flexible.
- Figure 5B is a diagram illustrating a side view of an example of an electrical interconnect or electrical interconnects 508b and protective layers 520b.
- the thickness of the protective layers 520b and the electrical interconnect(s) 508b may range between 0.05 mm and 1 mm.
- Figure 5B illustrates an example of an electrical connector 548b that includes electrical interconnect(s) 508b and protective layers 520b.
- the electrical connector 548b may include 1 to n number of electrical interconnects 508b sandwiched between protective layers 520b that are bonded and sealed together using adhesive 550.
- the electrical connector 548b may be flexible.
- the protective layers 520b and/or the adhesive 550 layers may be transmissive. In some examples, the protective layers 520b may not bond with joint material.
- FIG. 5C is a diagram illustrating a front view of an example of flexible electrical connector 548c including electrical interconnects 508c and protective layers 520c.
- the electrical connector 548c is situated in a weld path 550c.
- the weld path 550c is a path along which welding is performed.
- a weld path 550c may be located in a supply joint.
- the electrical connector 548c may include 1 to n number of electrical interconnects 508c.
- Joint material in the weld path 550c may melt and flow in several directions (e.g., 5 directions) to create a compression joint around the protective layers 520c that creates a seal.
- FIG. 5D is a diagram illustrating an example of an electrical connector 548b.
- the electrical connector 548d includes protective layers 520d, electrical interconnects 508d, and slots 552d.
- the electrical interconnects 508d are metal conductors included in a flexible electrical connector 548d.
- a slot is an opening in material.
- sealing material may include a slot or slots.
- a slot may be located in sealing material or at an edge of sealing material.
- the protective layers 520d illustrated in Figure 5D includes four slots 552d. When welded, joint material may be situated in a slot. In some examples, a slot may be located between electrical interconnects.
- the slots 552d may be created in the electrical connector 548d between electrical interconnects 508d.
- the electrical connector 548d is situated in a weld path 550d.
- the slots 552d may allow joint material to flow through the slots 552d to create a mechanically locked compression joint with improved robustness.
- FIG. 5E is a diagram illustrating an example of an electrical connector 548e.
- the electrical connector 548e includes protective layers 520e, electrical interconnects 508e, and slots 552e.
- the electrical interconnects 508e are metal conductors included in a flexible electrical connector 548e.
- the slots 552e are at edges of the protective layers 520e.
- the electrical interconnects 508e are in the middle of the electrical connector 548e.
- the slots 552e form a neck geometry that is narrower in the center of the weld path 550e. This neck geometry may beneficially reduce a distance across the electrical connector 548e for sealing.
- a slot located at an edge may be referred to as an edge feature.
- the protective layers 520e illustrated in Figure 5E includes two slots 552e.
- the electrical connector 548e is situated in a weld path 550e.
- the slots 552e on the outer edges may allow joint material to flow through the slots 552e to create a mechanically locked compression joint with improved robustness.
- a combination of various geometries e.g., squares, rectangles, triangles, trapezoids, circles, ovals, and/or combinations thereof may be utilized.
- FIG. 6 is a flow diagram illustrating one example of a method 600 for manufacturing a print liquid container.
- the method 600 may be performed by an assembly machine or machines.
- the method 600 may include installing 602 an electrical conductor in a print liquid container lid.
- the electrical conductor may be coupled to a digital liquid level sensor and/or a strain sensor or pressure sensor.
- the digital liquid level sensor and/or the strain sensor may be placed on a lid.
- the digital liquid level sensor and/or strain sensor may be placed on a post or posts of the lid.
- the digital liquid level sensor may include an array of heaters and temperature sensors. Measurements from the digital liquid level sensor may but utilized to determine a print liquid level.
- the digital print liquid level sensor may activate the array of heaters and measure the temperature at different levels. Lesser temperatures may correspond to heaters and temperature sensors that are below the print liquid level. Greater temperatures may correspond to heaters and temperature sensors that are above the print liquid level. The measured temperatures may indicate the level of the print liquid due to the different specific heats of print liquid and air.
- a strain sensor or a pressure sensor may be utilized to detect a condition (e.g., pressure and/or structural condition) in the print liquid container.
- the print liquid container may include a pressure chamber in some examples.
- the pressure chamber is a device that changes structure based on pressure.
- the pressure chamber may be expandable and collapsible.
- An example of a pressure chamber is a bag.
- the pressure chamber may be utilized to regulate pressure (e.g., to avoid over-pressurization and/or under-pressurization due to altitude and/or temperature variations) inside of the print liquid container.
- the pressure chamber may be expanded (e.g., inflated) in order to purge print liquid from a print head for servicing.
- the strain sensor may be utilized to detect structural deflection of the print liquid container due to expansion of the pressure chamber.
- the pressure sensor may be utilized to detect a pressure change in the print liquid container due to the expansion of the pressure chamber.
- the electrical conductor is covered with a flexible protective layer.
- the method 600 may also include welding 604 the print liquid container lid to a print liquid container body.
- the electrical conductor may be situated in a joint between the print liquid container lid and the print liquid container body.
- the print liquid container lid and the print liquid container body include a thermoplastic material.
- FIG. 7 shows an example print liquid supply cartridge 700.
- the print liquid supply cartridge 700 may be an example of the print liquid supply unit 100 described in connection with Figure 1 , an example of the print liquid container described herein, and/or an example of the print liquid container described in connection with Figure 6.
- the print liquid supply unit housing components 102, 104 may be implemented with the print liquid supply cartridge 700. More particularly, Figure 7 shows an elevation view of the example cartridge 700.
- the cartridge 700 has a housing 780 which encloses an internal volume in which the print liquid, such as ink or agent, can be stored.
- the internal volume of the example cartridges described herein may be between approximately 10 milliliters to approximately 50 or approximately 100 milliliters.
- the housing 780 has a front end 781 , a rear end 782 and first and second sides 783, 784 extending from the front end to the rear end.
- the front end 781 and the rear end 782 can be seen also in Figure 8, which is a cross- sectional view through the line C-C of the example print liquid supply cartridge of Figure 7.
- the housing 780 may comprise two relatively hard plastic shells which directly contain the print liquid therebetween.
- the height of the housing is greater than the width of the housing.
- the height of the internal volume is greater than the width of the internal volume.
- the height of the internal volume may be defined by the height of the first and second sides and the width of the internal volume may be defined by the distance between the first and second sides.
- the front end 781 may have a print liquid outlet 785 through which the print liquid can be supplied to a printer, for example by insertion of a fluid pen of the printer therein.
- the print liquid outlet 785 may be provided closer to the bottom than to the top of the front end 781.
- a gas inlet 786 may be provided on the front end 781 also, to enable gas such as air to be supplied to the cartridge, for example, by insertion of a fluid pen of the printer therein.
- the gas inlet 786 may be positioned above the print liquid outlet 785.
- a first wall 788 having an internal side 789 and an external side 790 may be provided to delimit a recess 791.
- the recess 791 extends from the first wall 788 across the entire width of the front end 781.
- the first wall 788 thus overhangs a notched corner of the housing.
- connection pads 790 of the first wall 788 may be part of the first side 783 of the housing 780. Electrical connection pads 792 are exposed on the internal side of the first wall, as shown also in Figure 8. The electrical connection pads 792 are indicated by a single block in Figures 7 and 8. In one example, there are three electrical connection pads, although fewer or more connection pads may be provided. The electrical connection pads may be arranged in a top to bottom direction. The electrical connection pads enable electrical signals to be communicated between electrical circuitry of the cartridge and electrical circuitry of the printer, for example in accordance with an inter-integrated circuit (I2C) data communication protocol. Flence, the connection pads may form an I2C data interface. Providing the electrical connection pads 792 to the first wall 788 allows for easy mounting of the electrical connection pads 792 on the cartridge. Being positioned on the internal side 789, the electrical connection pads 792 are protected from damage when shipping and handling the cartridge. The recess
- Figure 9 shows another example print liquid supply cartridge 900.
- Figure 9 shows an elevation view of the cartridge 900.
- the example cartridge of Figure 9 is similar to that of Figure 7.
- the recess 791 does not extend across the entire width of the front end 781.
- the recess 791 is delimited by a second wall 794.
- the recess 791 between the first wall 788 and the second wall 794 may receive an electrical connector of a printer therein to contact the electrical connection pads 792.
- FIGs 10A and 10B are perspective views of another example print liquid supply cartridge 1000.
- Figure 11 is a magnified view of part of the example cartridge 1000.
- the same reference numerals are used for like parts.
- the cartridge 1000 has a housing 780 which encloses an internal volume in which the print liquid, such as ink or agent, can be stored.
- the housing 780 has a front end 781 , a rear end 782, and first and second sides 783, 784 extending from the front end to the rear end.
- a print liquid outlet 785 and a gas inlet 786 may be provided on the front end.
- the print liquid outlet 785 may be provided closer to the bottom than to the top of the front end 781.
- the gas inlet 786 may be positioned above the print liquid outlet 785.
- the front end may also have a print liquid inlet 787 to enable the cartridge to be filled or re-filled with print liquid.
- a datum surface 793 across the recess from the internal side 789 of the first wall 788.
- a rib 798 may support the first wall 788.
- the datum surface is a side of a second wall 794 facing towards the recess 791. The datum surface 793 helps ensure smooth installation and removal of the print liquid supply cartridge to and from a printer.
- the print liquid supply cartridge 1000 may include a conductor or conductors that are situated through a joint of the print liquid supply cartridge 1000.
- a first conductor may be a serial data line and/or a second conductor may be a clock line.
- a third conductor may be a power line and/or a fourth conductor may be a ground line.
- the conductor or conductors may be coupled to the electrical connection pad or pads 792.
- the electrical connection pad(s) 792 may be situated in the recess 791.
- the electrical connection pad(s) 792 and the conductor(s) may be supported by a housing component.
- the electrical connection pad(s) and the conductor(s) may be supported by the first housing component 102 (e.g., lid) described herein.
- the electrical connection pad(s) and the conductor(s) may be supported by the first wall 788, which may be a first wall 788 of a first housing component.
- the print liquid supply cartridge 1000 includes a sensor or sensors. In some examples, the sensor(s) may be supported by the first housing component and/or the first wall 788.
- the print liquid supply cartridge 1000 may include a print liquid interface or interfaces.
- a print liquid interface is an interface for the passage of print liquid. Examples of a print liquid interface may include the print liquid outlet 785 and the print liquid inlet 787, which may be included in the front end 781 of the print liquid supply cartridge.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Software Systems (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Bioethics (AREA)
- General Health & Medical Sciences (AREA)
- Combustion & Propulsion (AREA)
- Fluid Mechanics (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Quality & Reliability (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Ink Jet (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Image Input (AREA)
- Facsimile Heads (AREA)
Abstract
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2018/063638 WO2020117197A1 (fr) | 2018-12-03 | 2018-12-03 | Circuits logiques |
PCT/US2018/063630 WO2020117194A1 (fr) | 2018-12-03 | 2018-12-03 | Circuit logique |
PCT/US2018/063624 WO2020117193A1 (fr) | 2018-12-03 | 2018-12-03 | Circuits logiques |
PCT/US2018/063643 WO2020117198A1 (fr) | 2018-12-03 | 2018-12-03 | Circuit logique |
PCT/US2018/063631 WO2020117195A1 (fr) | 2018-12-03 | 2018-12-03 | Circuiterie logique |
PCT/US2019/026145 WO2020117305A1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
PCT/US2019/042466 WO2020117323A1 (fr) | 2018-12-03 | 2019-07-18 | Interconnexions scellées |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3687799A1 true EP3687799A1 (fr) | 2020-08-05 |
EP3687799B1 EP3687799B1 (fr) | 2022-08-31 |
Family
ID=70973655
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19719000.2A Withdrawn EP3687797A1 (fr) | 2018-12-03 | 2019-04-05 | Circuiterie logique |
EP19723908.0A Pending EP3688667A1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP22159551.5A Pending EP4027255A1 (fr) | 2018-12-03 | 2019-04-05 | Circuits logiques |
EP19718559.8A Pending EP3717262A1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP19720730.1A Active EP3718038B1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP19720731.9A Active EP3718039B1 (fr) | 2018-12-03 | 2019-04-05 | Circuits logiques |
EP19719004.4A Withdrawn EP3687817A1 (fr) | 2018-12-03 | 2019-04-05 | Circuiterie logique |
EP19745956.3A Active EP3687798B1 (fr) | 2018-12-03 | 2019-07-18 | Unités d'alimentation en liquide d'impression |
EP19745958.9A Active EP3688637B1 (fr) | 2018-12-03 | 2019-07-18 | Circuit de capteur |
EP19745957.1A Active EP3687799B1 (fr) | 2018-12-03 | 2019-07-18 | Interconnexions scellées |
Family Applications Before (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19719000.2A Withdrawn EP3687797A1 (fr) | 2018-12-03 | 2019-04-05 | Circuiterie logique |
EP19723908.0A Pending EP3688667A1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP22159551.5A Pending EP4027255A1 (fr) | 2018-12-03 | 2019-04-05 | Circuits logiques |
EP19718559.8A Pending EP3717262A1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP19720730.1A Active EP3718038B1 (fr) | 2018-12-03 | 2019-04-05 | Ensemble de circuits logiques |
EP19720731.9A Active EP3718039B1 (fr) | 2018-12-03 | 2019-04-05 | Circuits logiques |
EP19719004.4A Withdrawn EP3687817A1 (fr) | 2018-12-03 | 2019-04-05 | Circuiterie logique |
EP19745956.3A Active EP3687798B1 (fr) | 2018-12-03 | 2019-07-18 | Unités d'alimentation en liquide d'impression |
EP19745958.9A Active EP3688637B1 (fr) | 2018-12-03 | 2019-07-18 | Circuit de capteur |
Country Status (12)
Country | Link |
---|---|
US (11) | US20210046760A1 (fr) |
EP (10) | EP3687797A1 (fr) |
KR (6) | KR20210087981A (fr) |
CN (9) | CN113165398B (fr) |
AR (2) | AR123809A1 (fr) |
AU (6) | AU2019394682A1 (fr) |
BR (6) | BR112021010754A2 (fr) |
CA (6) | CA3120981A1 (fr) |
CL (1) | CL2021001437A1 (fr) |
IL (1) | IL282903A (fr) |
MX (6) | MX2021006471A (fr) |
WO (6) | WO2020117307A1 (fr) |
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