CN113168449A - 打印液体供应单元 - Google Patents

打印液体供应单元 Download PDF

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Publication number
CN113168449A
CN113168449A CN201980079506.7A CN201980079506A CN113168449A CN 113168449 A CN113168449 A CN 113168449A CN 201980079506 A CN201980079506 A CN 201980079506A CN 113168449 A CN113168449 A CN 113168449A
Authority
CN
China
Prior art keywords
printing liquid
supply unit
conductor
sealing material
liquid supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980079506.7A
Other languages
English (en)
Inventor
A·D·斯图德
D·奥尔森
Q·B·韦弗
B·A·尼古拉斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2018/063624 external-priority patent/WO2020117193A1/en
Priority claimed from PCT/US2018/063643 external-priority patent/WO2020117198A1/en
Priority claimed from PCT/US2018/063630 external-priority patent/WO2020117194A1/en
Priority claimed from PCT/US2018/063638 external-priority patent/WO2020117197A1/en
Priority claimed from PCT/US2018/063631 external-priority patent/WO2020117195A1/en
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority claimed from PCT/US2019/042465 external-priority patent/WO2020117322A1/en
Publication of CN113168449A publication Critical patent/CN113168449A/zh
Pending legal-status Critical Current

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    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
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    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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Abstract

本申请描述了打印液体供应单元的示例。在一些示例中，所述打印液体供应单元包括第一外壳部件，其沿着供应接合部焊接到第二外壳部件。在一些示例中，所述打印液体供应单元还包括导体，其通过所述供应接合部从所述供应单元的外部定位到所述供应单元的内部。在一些示例中，所述导体用密封材料密封在所述供应接合部中。

Description

打印液体供应单元
相关申请
本申请与2018年12月3日提交的关于“逻辑电路”的第PCT/US2018/063643号PCT国际申请以及2019年4月5日提交的关于“逻辑电路”的第PCT/US2019/026145号PCT国际申请相关并要求其优先权，所述第PCT/US2019/026145号PCT国际申请要求2018年12月3日提交的第PCT/US2018/063631号PCT国际申请、2018年12月3日提交的第PCT/US2018/063624号国际申请、2018年12月3日提交的第PCT/US2018/063630号国际申请、2018年12月3日提交的第PCT/US2018/063638号国际申请以及2018年12月3日提交的第PCT/US2018/063643号国际申请的优先权。
背景技术
一些类型的打印使用液体。例如，一些类型的打印将液体挤出到介质或材料上以产生打印产品(例如，二维(2D)打印内容、三维(3D)打印物体)。在一些示例中，打印头可以用于将墨水挤出到纸上以打印文本和/或图像。在一些示例中，打印头可以用于将熔剂挤压到材料上以形成3D打印物体。
附图说明
图1示出打印液体供应单元的示例的透视图；
图2A示出一个或多个导体和密封材料的示例的侧视图；
图2B是示出电连接器的示例的图；
图2C是示出电连接器的示例的图；
图3是示出用于制造打印液体容器的方法的一个示例的流程图；
图4是示出用于制造打印液体容器的技术的示例的图；
图5是示出用于制造打印液体容器的技术的示例的图；
图6是示出打印液体容器部件的示例的图；
图7显示了示例打印液体供应盒；
图8是示例打印液体供应盒的通过图7的线C-C观察的横截面图；
图9显示了另一示例打印液体供应盒；
图10A和图10B是另一示例打印液体供应盒的透视图；以及
图11是示例盒的部分的放大视图。
具体实施方式
在使用打印液体的情况下会出现一些问题。打印液体是用于打印的液体。打印液体的示例包括墨水和熔剂。在一些示例中，由于如液体桥接、环境条件和水蒸气透过率等问题，准确感测贮存器中剩余的打印液体的量可能是困难的。不准确感测的液位可能导致相对于所需更频繁地更换贮存器、浪费打印液体和/或增加打印费用。因此，提供更多的输送打印液体、更可靠的感测打印液位和/或更少的墨水供应变化可能是有益的。
可以使用一个或多个传感器来提高打印液位感测准确度。传感器可以容纳在打印液体供应单元中。打印液体供应单元是容纳打印液体的容器。在一些示例中，打印液体供应单元可以被称为打印液体容器、盒、供应器、打印液体供应盒等。打印液体可以被供应到打印机。例如，四个打印液体供应器可以用于打印机，其可以包括黑色、青色、品红色和黄色打印液体供应器。这可以允许单独更换具有颜色的打印液体供应器。例如，可以在不更换另外一种或多种颜色的剩余打印液体的情况下单独更换较常使用的打印液体颜色。
在一些示例中，打印液体供应单元可以由热塑性塑料构成。热塑性塑料可以是注塑成型的，并且可以与大批量制造和/或组装方法兼容。构造材料(例如，构成打印液体供应器的部件的材料)与打印液体兼容、在运输/处理期间对环境条件稳定和/或提供目标水蒸气透过率，使得打印质量在打印液体供应单元的寿命期间得以保持可以是有益的。在一些示例中，打印液体供应单元可以由热塑性塑料构成，诸如聚丙烯(PP)、低密度聚乙烯(LDPE)、高密度聚乙烯(HDPE)、聚对苯二甲酸乙二醇酯(PET)、聚碳酸酯(PC)和/或其混合物。一些热塑性塑料可以与大批量组装方法兼容，诸如超声波焊接、振动焊接和/或激光焊接。在一些示例中，焊接(例如，激光焊接)可以能够产生防水接缝密封以容纳打印液体。如本文所用，“焊接(welding)”、“焊接(weld)”及其变型可以表示激光焊接、超声波焊接和/或振动焊接。在一些示例中，可以从术语“焊接”(及其变型)排除用于接合部件的其他方法。
焊接可以是有益的，因为塑料零件可以经由高速熔化来接合。例如，焊接可能不包括利用另一种粘合剂或额外零件。当试图使电连接穿过焊接接合部时可能会出现问题。例如，传感器可以容纳在打印液体供应单元中，并且可能利用穿过焊接接合部的导体。本文描述的技术的一些示例可以包括通过使用双面压敏粘合剂(PSA)垫圈、弹性垫圈和/或各种胶接接合部的接合部(例如，至少部分焊接的接合部)提供电连接。在一些示例中，电连接可以穿过单独的密封，该单独的密封不穿过焊接接合部。
在所有附图中，相同的附图标记可以表示相似但不一定相同的元件。相似的标号可以指示相似的元件。当在没有附图标记的情况下提及元件时，这通常可以指代该元件而不一定限于任何特定附图。附图不一定按比例绘制，并且一些部分的尺寸可以被放大以更清楚地说明所示的示例。此外，附图提供了与描述一致的示例和/或实现方式；然而，描述不限于附图中提供的示例和/或实现方式。
图1示出打印液体供应单元100的示例的透视图。打印液体供应单元100的示例包括打印液体容器、盒、供应器、打印液体供应盒等。打印液体供应单元100可以容纳和/或传送打印液体(例如，墨水、试剂等)。在一些示例中，打印液体供应单元100可以被设计成与主机装置对接。主机装置是使用和/或施加打印液体的装置。主机装置的示例包括打印机、喷墨打印机、3D打印机等。例如，当已经使用了一些或全部打印液体时补充或更换打印液体供应单元100可以是有益的。
在图1所示的示例中，打印液体供应单元100包括第一外壳部件102和第二外壳部件104。第一外壳部件102和第二外壳部件104是用于容纳打印液体的结构。例如，第一外壳部件102可以接合到第二外壳部件104以形成容纳打印液体的容积。在一些示例中，第一外壳部件102和第二外壳部件104可以由热塑性塑料或热塑性塑料的组合制成。在一些示例中，第一外壳部件102可以是打印液体供应单元的盖，并且第二外壳部件104可以是打印液体供应单元的主体。
第一外壳部件102可以沿着供应接合部106焊接到第二外壳部件104。供应接合部106是第一外壳部件102与第二外壳部件104之间的接口。在一些示例中，第一外壳部件102可以使用激光焊接、超声波焊接和/或振动焊接沿着供应接合部106焊接到第二外壳部件104。在一些示例中，可以沿着整个供应接合部106施加焊接。在其他示例中，可以沿着供应接合部106的一部分(例如，不是整个路径)施加焊接。
焊接可能导致第一外壳部件102和/或第二外壳部件104的材料发生相变。例如，第二外壳部件104可以在第二外壳部件104的一侧上具有开口，所述开口用第一外壳部件102封闭以对打印液体进行防水密封。在一些示例中，第一外壳部件102和第二外壳部件104可以由聚丙烯材料制成，并且可以使用激光焊接来接合。
在一些示例中，第一外壳部件102可以经由一个或多个柱压接到第二外壳部件104，所述一个或多个柱用于在打印液体供应单元100进入焊接机时对准第一外壳部件102并将其保持在第二外壳部件104上。可以向打印液体供应单元100施加压力。例如，在支撑第二外壳部件104的同时，可以将夹具应用于第一外壳部件102。激光束可以穿过第一外壳部件102到达下面的供应接合部106的几何结构。第二外壳部件104可以吸收一部分(例如，大部分)的能量，这可以导致第二外壳部件104的材料(例如，沿着供应接合部106)熔化。压力和材料的相变可以导致第一外壳部件102接合到第二外壳部件104。在一些示例中，因为打印液体供应单元100处于压力下，所以打印液体供应单元100可能会轻微塌陷，这可能导致沿着供应接合部106的材料变宽。
导体108可以通过供应接合部106来定位。例如，导体108可以通过供应接合部106从打印液体供应单元100的外部定位到打印液体供应单元100的内部。在一些示例中，打印液体供应单元100的内部可以容纳打印液体。在一些示例中，导体108可以耦接到用于打印液体供应单元100内部的传感器。在一些示例中，导体108可以耦接到用于打印液体供应单元100外部的电接口(例如，电连接焊盘)。在一些示例中，电接口可以用于与打印机通信。
导体108可以是能够传导电或电信号的材料。例如，导体108可以是金属线或金属带。在一些示例中，多个导体108可以通过供应接合部106来定位。
导体108可以用密封材料110密封在供应接合部106中。密封材料110是提供防水密封的材料。例如，密封材料110可以防止打印液体从打印液体供应单元100的内部泄漏到打印液体供应单元100的外部，同时允许导体108(或多个导体108)穿过供应接合部106。在一些示例中，密封材料110可以隔离和/或保护导体108免受打印液体的影响。在一些示例中，一个或多个保护层可以与一种或多种密封材料组合使用。例如，一个或多个二次注塑的保护层可以用于容纳一个或多个导体108，并且密封材料110可以用于在导体108处密封供应接合部106。在一些示例中，一个或多个保护层可以不是密封材料。例如，一个或多个保护层可以容纳一个或多个导体，并且密封材料可以施加在一个或多个保护层外部(例如，上面或周围)以在保护材料和导体周围密封供应接合部。在一些示例中，保护层可以是塑料、橡胶、弹性材料、粘合剂、薄膜等。在一些示例中，所述一个或多个保护层可以是密封材料。
密封材料110的一些示例可以包括塑料、橡胶、弹性材料、热塑性弹性体(TPE)和/或压敏粘合剂(PSA)。例如，密封材料110的示例包括压敏粘合剂垫圈、弹性垫圈、粘合剂、层、薄膜等。在一些示例中，密封材料110可以是柔性的或刚性的。在一些示例中，密封材料110可以是透射性的或非透射性的。透射性密封材料110可以允许穿过密封材料110执行焊接(例如，激光焊接、超声波焊接、振动焊接)。例如，透射性塑料、透射性橡胶或透射性热塑性弹性体可以允许焊接激光束透射穿过密封材料110。在一些示例中，密封材料110可以具有高于沿着供应接合部106的材料的熔化温度的熔化温度。使用具有较高熔化温度的密封材料110可以允许执行焊接技术，同时减少或消除对密封件和/或导体108的损坏。在一些示例中，密封材料110可以与打印液体兼容。例如，密封材料110在打印液体存在的情况下可能不会明显劣化和/或可能不会对打印液体的质量产生负面影响。
在一些示例中，焊接可以通过不在沿着供应接合部106的具有密封材料110的一部分上施加的焊接(例如，超声波焊接、激光焊接)来执行。例如，密封材料110可以是非透射性的，并且焊接可以不施加在密封材料110上方以避免损坏密封材料110和/或导体108。
在一些示例中，密封材料110可以是一个或多个导体108上的一个或多个二次注塑的保护层。例如，一个或多个导体108可以嵌入在密封材料110内(例如，夹在其之间)。
图2A是示出一个或多个导体208a和密封材料210a的示例的侧视图的图。在该示例中，密封材料210a可以包括透射性或非透射性塑料、橡胶或热塑性弹性体的一个或多个二次注塑的保护层。在一些示例中，密封材料210a和导体208a的厚度可以在0.2毫米(mm)与1mm之间的范围内。在一些示例中，导体和密封材料的组合可以被称为电连接器。例如，图2A示出了包括导体208a和密封材料210a的电连接器216a的示例。在一些示例中，密封材料210a可以是透射性的，并且焊接(例如，焊接激光)可以越过和/或穿过电连接器216a(例如，穿过密封材料210a)。在一些示例中，电连接器216a可以是刚性的或压缩性的。术语“压缩性的”可以表示压缩性材料。
图2B是示出电连接器216b的示例的图。电连接器216b包括密封材料210b、导体208b和槽212b。在图2B所示的示例中，导体208b是柔性电连接器216b中所包括的金属导体。槽是材料中的开口。在一些示例中，密封材料可以包括一个或多个槽。槽可以位于密封材料中或密封材料的边缘处。例如，图2B所示的密封材料210b包括四个槽212b。在焊接时，接合部材料可以位于槽中。在一些示例中，槽可以位于导体之间。例如，槽212b可以在导体208b之间的电连接器216b中形成。在图2B的示例中，电连接器216b位于焊接路径214b中。焊接路径214b是沿着其进行焊接的路径。例如，焊接路径214b可以位于供应接合部中。在焊接期间，槽212b可以允许接合部材料流过槽212b以产生具有改进稳固性的机械锁定压缩接合部。在一些示例中，刚性或压缩性电连接器可以在供应接合部或焊接路径中实现。
图2C是示出电连接器216c的示例的图。电连接器216c包括密封材料210c、导体208c和槽212c。在图2C所示的示例中，导体208c是柔性电连接器216c中所包括的金属导体。在图2C所示的示例中，槽212c位于密封材料210c的边缘处。槽212c形成在焊接路径214c的中心较窄的颈部几何形状。这种颈部几何形状可以有利地减小电连接器216c上的用于密封的距离。在一些示例中，颈部几何形状可以用于刚性或压缩性电连接。可以利用在焊接路径内变窄的其他几何形状。位于边缘处的槽可以被称为边缘特征。例如，图2C所示的密封材料210c包括两个槽212c。在图2C的示例中，电连接器216c位于焊接路径214c中。在焊接期间，外边缘上的槽212c可以允许接合部材料流过槽212c以产生具有改进稳固性的机械锁定压缩接合部。在一些示例中，可以使用各种几何形状(例如，正方形、矩形、三角形、梯形、圆形、椭圆形和/或其组合)的组合。在一些示例中，一个或多个保护层可以包括一个或多个槽。在一些示例中，密封材料和/或保护层可以不包括一个或多个槽。
图3是示出用于制造打印液体容器的方法300的一个示例的流程图。在一些示例中，方法300可以由一个或多个组装机来执行。方法300可以包括在打印液体容器盖中安装302电导体。电导体可以耦接到数字液位传感器和/或应变传感器或压力传感器。例如，数字液位传感器和/或应变传感器可以放置在盖上。在一些示例中，数字液位传感器和/或应变传感器的载体可以放置在盖的一个或多个柱上。在一些方法中，数字液位传感器可以包括加热器和温度传感器的阵列。来自数字液位传感器的测量可以用于确定打印液位。例如，数字打印液位传感器可以激活加热器的阵列并测量不同液位处的温度。较低的温度可以对应于在打印液位下方的加热器和温度传感器。较高的温度可以对应于在打印液位上方的加热器和温度传感器。由于打印液体和空气的比热不同，测量的温度可以指示打印液体的液位。
在一些示例中，应变传感器或压力传感器可以用于检测打印液体容器中的状况(例如，压力和/或结构状况)。例如，在一些示例中，打印液体容器可以包括压力室。压力室是基于压力改变结构的装置。压力室可以是可膨胀和可收缩的。压力室的一个示例是袋。在一些示例中，压力室可以用于调节打印液体容器内部的压力(例如，以避免由于海拔和/或温度变化引起的过压和/或欠压)。在一些示例中，压力室可以膨胀(例如，充气)以便从打印头中清除打印液体以进行维修。在一些示例中，应变传感器可以用于检测由于压力室膨胀引起的打印液体容器的结构变形。在一些示例中，压力传感器可以用于检测由于压力室膨胀引起的打印液体容器中的压力变化。
方法300还可以包括将打印液体容器盖焊接304到打印液体容器主体。电导体可以位于打印液体容器盖与打印液体容器主体之间的接合部中。电导体可以用密封材料密封在接合部中。在一些示例中，密封材料可以包括压敏粘合剂、垫圈、弹性材料或其他密封剂(例如，非弹性密封剂)。密封剂的一些示例可以包括1或2份环氧树脂型密封剂。一些环氧树脂型密封剂在液态形式或固化后可能不是弹性体的。
在一些示例中，方法300可以包括通过在将打印液体容器盖焊接到打印液体容器主体之前将密封材料安装在打印液体容器盖和/或打印液体容器主体中来施加密封材料。例如，可以将垫圈或双面压敏粘合剂施加到打印液体容器盖上。可以将另一个垫圈或双面压敏粘合剂施加到打印液体容器主体上。在将密封材料安装在打印液体容器盖和/或打印液体容器主体中之后，可以将打印液体容器盖焊接到打印液体容器主体。在一些示例中，将打印液体容器盖焊接到打印液体容器主体可以包括在打印液体容器盖与打印液体容器主体之间执行超声波焊接或激光焊接，同时避免在接合部中焊接电导体的区域。
在一些示例中，方法300可以包括通过经由一个或多个端口将密封材料注射到接合部中来施加密封材料。例如，可以在施加密封材料之前将打印液体容器盖焊接到打印液体容器主体。例如，可以将电导体、数字液位传感器和/或应变传感器或压力传感器安装在打印液体容器盖中，并且可以使用激光焊接或超声波焊接将打印液体容器盖焊接到打印液体容器主体。在焊接之后，可以将密封材料(例如，粘合剂或密封剂)注射到打印液体容器盖和/或打印液体容器主体中的一个或多个端口中。
在一些示例中，电连接器保护材料可以是可压缩的(例如，弹性体的)非透射性密封材料。例如，电连接器保护材料可以是可压缩的橡胶和/或热塑性弹性体，其是非透射性的和/或具有太低而不能经受焊接(例如，激光和/或超声波焊接)的熔化温度。在一些示例中，可以使用弹性体材料在电连接器周围执行密封以产生密封(例如，代替添加垫圈和/或压敏粘合剂片)。在一些示例中，电连接器和/或传感器可以安装有接合部中的电连接器。打印液体容器盖可以焊接到打印液体容器主体。可以执行激光和/或超声波焊接，同时在电连接器保护材料上方的区域中省略焊接以避免损坏保护材料。当打印液体容器盖在焊接期间塌陷时，压缩可以将电连接器周围的材料密封到打印液体容器盖、打印液体容器主体和/或与电连接器对接的接合部两侧的材料。
图4是示出用于制造打印液体容器的技术的示例的图。在第一程序430中，将第一密封材料422施加到打印液体容器盖418a。第一密封材料422的示例可以包括垫圈或双面压敏粘合剂。第一密封材料422可以施加在接合部路径420上。
在第二程序432中，将电导体428安装在打印液体容器盖418b上(例如，在第一密封材料422上方)。将电导体428耦接到传感器426。传感器426可以包括数字液位传感器和/或应变传感器或压力传感器。传感器426也可以安装在打印液体容器盖418b上。例如，支撑传感器426的载体可以安装在盖418b的柱424上。
在第三程序434中，将第二密封材料440施加到打印液体容器主体438a。第二密封材料440可以施加在接合部区域中。第二密封材料440的示例可以包括垫圈或双面压敏粘合剂。
在第四程序436中，可以将打印液体容器盖418c焊接到(例如，与之组装)打印液体容器主体438b。例如，将打印液体容器盖418c焊接到打印液体容器主体438b可以包括在打印液体容器盖418c与打印液体容器主体438b之间执行超声波焊接或激光焊接，同时避免在接合部中焊接电导体的区域442。在一些示例中，焊接(例如，激光或超声波焊接)可以使用来自接合部塌陷的压缩来执行以使用密封材料422、440(例如，垫圈和/或双面压敏粘合剂)来密封接合部，同时省略焊接密封材料422、440上方的区域442以避免损坏密封材料422、440和/或电导体428。压缩可以将电导体428周围的密封材料422、440密封到打印液体容器盖418c、打印液体容器主体438b和/或与密封材料422、440对接的接合部两侧的材料。
在一些示例中，结合图4描述的程序430、432、434、436可以按不同次序执行。例如，在一些方法中，第三程序434可以在第一程序430之前和/或在第二程序432之前执行。
图5是示出用于制造打印液体容器的技术的示例的图。在第一程序544中，将电导体546安装在打印液体容器盖548a上(例如，电导体546放置在接合部545上方)。电导体546耦接到传感器550。传感器550可以包括数字液位传感器和/或应变传感器或压力传感器。传感器550也可以安装在打印液体容器盖548a上。例如，支撑传感器550的载体可以安装在盖548a的柱552上。
在第二程序554中，可以将打印液体容器盖548b焊接到打印液体容器主体556。例如，将打印液体容器盖548b焊接到打印液体容器主体556可以包括在打印液体容器盖548b与打印液体容器主体556之间执行超声波焊接或激光焊接。在一些示例中，焊接可以在电导体546上方执行。在一些示例中，可以执行焊接(例如，激光或超声波焊接)，同时省略焊接电导体546上方的区域以避免损坏电导体546。是否在电导体546上方执行焊接可以取决于连接器透射率。
在一些示例中，可以通过经由一个或多个端口将密封材料注射到接合部545中来施加密封材料。在图5所示的图中，示出了打印液体容器部分的示例上的端口558、560、562的示例。程序可以包括将密封材料注射到所示的端口558、560、562中的一个、一些或全部中。例如，可以注射密封材料(例如，粘合剂和/或密封剂)以便密封电导体546周围的区域。例如，可以将密封材料注射到前部端口558、顶部端口562和/或侧部端口560中。
图6是示出打印液体容器部件664、666的示例的图。在一些示例中，电导体670a可以不穿过接合部668a。在一些示例中，打印液体容器可以包括容器属性传感器672a。容器属性传感器672a可以包括液位传感器(例如，数字液位传感器)、温度传感器、应变传感器和/或压力传感器。在一些示例中，容器属性传感器672a可以设置在衬底(例如，硅衬底)上，衬底可以由载体673a支撑。容器属性传感器672a可以连接到容器壁676a。在一些示例中，容器属性传感器672a可以间接连接到容器壁。例如，容器属性传感器672a可以设置在衬底上，衬底由载体673a支撑，所述载体673a可以粘附或焊接(例如，密封)到壁上。因此，容器属性传感器672a可以连接到打印液体容器部件664的容器壁676a。容器属性传感器672a可以包括连接到容器壁676a的应变传感器或压力传感器。在一些示例中，容器属性传感器672a可以包括数字液位传感器。电导体670a可以耦接到属性传感器672a。电导体670a可以穿过容器壁676a中的槽674a。槽674a可以与容器壳体的接合部668a分隔设置。例如，所示的液体容器部件664可以是容器壳体的一部分(例如，打印液体容器盖)。接合部668a可以接合到对应的容器壳体(例如，打印液体容器主体)。在一些示例中，电导体670a可以绕过接合部668a并且利用电导体670a(例如，柔性导体)和/或容器属性传感器672a周围的次级密封。
在一些示例中，供应接合部668a可以使用激光焊接、超声波焊接、振动焊接和/或粘合剂等来密封。在一些示例中，电导体670a和/或容器属性传感器672a载体673a可以用粘合剂、垫圈和/或压敏粘合剂等密封到打印液体容器部件664(例如，打印液体容器盖)。
在一些示例中，在接合部668a下方的容器壁676a中的槽674a可以用于将容器属性传感器672a密封到打印液体容器部件664。例如，可以使电导体670a(例如，电连接器)穿过容器壁676a中的槽674a。在一些示例中，这可以通过在电连接器的顶部边缘穿过槽674a的情况下旋转电导体670a并且接着旋转电导体670a，使得容器属性传感器672a载体673a的背面可以密封到打印液体容器部件664的内部来实现。在一些示例中，可以朝向盖的底部向上转动电导体670a(例如，电连接)以避免干扰接合部668a的密封程序。在接合部668a被密封之后，可以使电导体670a(例如，电连接器)穿过接合部上方的开口678a以将电导体670a路由到打印液体容器部件664(例如，打印液体容器盖)上的位置。如可以观察到的，容器壁676a可以包括用于安装容器属性传感器672a(例如，从内部)的内部凹陷。
在一些示例中，可以首先使导体670a(例如，连接器)穿过槽674a。接着，可以将容器属性传感器672a载体673a的背面密封到打印液体容器部件664的内部凹陷。接着，可以密封接合部668a(例如，可以将打印液体容器盖密封到打印液体容器主体)。接着，可以使导体670a(例如，连接器)穿过开口678a。
在一些示例中，可以从打印液体容器部件的外部将容器属性传感器安装在容器壁的凹陷中。这种方法可以简化组装，因为可以首先密封接合部，并且接着可以在外部将容器属性传感器载体密封到打印液体容器部件(例如，打印液体容器盖)。接着，可以使电导体(例如，电连接器)穿过接合部上方的开口。
在一些示例中，电导体670b可以不穿过接合部668b。在一些示例中，打印液体容器可以包括容器属性传感器672b。容器属性传感器672b可以包括液位传感器(例如，数字液位传感器)、温度传感器、应变传感器和/或压力传感器。在一些示例中，容器属性传感器672b可以设置在衬底(例如，硅衬底)上，所述衬底可以由载体673b支撑。容器属性传感器672b可以连接到容器壁676b。在一些示例中，容器属性传感器672b可以间接连接到容器壁。例如，容器属性传感器672b可以设置在衬底上，所述衬底由载体673b支撑，所述载体673b可以粘附或焊接(例如，密封)到壁上。因此，容器属性传感器672b可以连接到打印液体容器部件666的容器壁676b。容器属性传感器672b可以包括连接到容器壁676b的应变传感器或压力传感器。在一些示例中，容器属性传感器672b可以包括数字液位传感器。电导体670b可以耦接到属性传感器672b。电导体670b可以穿过容器壁676b中的槽674b。槽674b可以和容器壳体的接合部668b分隔设置。例如，所示的液体容器部件666可以是容器壳体的一部分(例如，打印液体容器盖)。接合部668b可以接合到对应的容器壳体(例如，打印液体容器主体)。在一些示例中，电导体670b可以绕过接合部668b并利用电导体670b(例如，柔性导体)和/或容器属性传感器672b周围的次级密封。
在一些示例中，供应接合部668b可以使用激光焊接、超声波焊接、振动焊接和/或粘合剂等来密封。在一些示例中，电导体670b和/或容器属性传感器672b载体673b可以用粘合剂、垫圈和/或压敏粘合剂等密封到打印液体容器部件666(例如，打印液体容器盖)。
在一些示例中，在接合部668b下方的容器壁676b中的槽674b可以用于将容器属性传感器672b载体673a密封到打印液体容器部件666。例如，可以使电导体670b(例如，电连接器)穿过容器壁676b中的槽674b。在该示例中，可以利用较小的槽674b以穿过容器壁672b。在一些示例中，可以使电导体670a(例如，电连接器)穿过接合部668b下方的槽674b。可以密封接合部668b。接着，可以使电导体670a(例如，电连接器)穿过接合部668b上方的开口678b。可以密封槽674b。例如，可以将接合部668b下方的槽674b密封到打印液体容器部件(例如，打印液体容器盖)。
在一些示例中，可以首先使导体670b(例如，连接器)穿过槽674b。接着，可以密封接合部668b(例如，可以将打印液体容器盖密封到打印液体容器主体)。接着，可以使导体670a(例如，连接器)穿过开口678b。接着，可以将槽674b密封到导体670b(例如，连接器)。
在一些示例中，可以为电导体670a-b实现外部凹陷或缺口，使得电导体670a-b可以与打印液体容器部件664、666的外表面齐平。在一些示例中，覆盖物(例如，装饰标签、贴纸等)可以放置在外部的电导体670a-b(例如，电连接器)和/或容器属性传感器672a-b载体673a-b上方。
尽管本文中根据通过透射性薄柔性、弹性体(例如，压缩性)或刚性电导体的激光焊接描述了一些示例，但是根据本公开可以使用其他技术。例如，可以使用超声波或振动焊接来代替激光焊接将一些可能不具有透射性的电导体密封件密封在接合部中。
本文描述的技术的一些示例可以是有益的。例如，用于使导体或连接器穿过接合部或穿过容器壁的一些方法和/或结构可以与大规模生产方法兼容。使用不同材料来密封导体或连接器的能力可以使得能够使用与不同打印液体兼容的材料。
图7显示了示例打印液体供应盒700。在一些示例中，打印液体供应盒700可以是结合图1描述的打印液体供应单元100的示例、结合图4描述的打印液体容器的示例和/或结合图5描述的打印液体容器的示例。在一些示例中，打印液体容器部件664、666可以用打印液体供应盒700来实现。更具体地说，图7展示了示例盒700的平面图。盒700具有外壳780，其包围可以在其中储存诸如墨水或试剂等打印液体的内部容积。本文描述的示例盒的内部容积可以在大约10毫升至大约50或大约100毫升之间。外壳780具有前端781、后端782以及从前端延伸到后端的第一侧和第二侧783、784。前端781和后端782还可以在图8中看到，图8是图7的示例打印液体供应盒的在线C-C处的横截面图。外壳780可以包括两个相对较硬的塑料壳体，它们之间直接容纳打印液体。在所述示例中，外壳的高度大于外壳的宽度。类似地，内部容积的高度大于内部容积的宽度。内部容积的高度由第一侧和第二侧的高度界定，并且内部容积的宽度由第一侧与第二侧之间的距离界定。
前端781可以具有打印液体出口785，可以通过所述打印液体出口785将打印液体供应到打印机，例如通过将打印机的流体笔插入打印液体出口785。打印液体出口785可以设置成比前端781的顶部更靠近底部。
气体入口786也可以设置在前端781上，以使得诸如空气等气体能够供应到盒，例如通过将打印机的流体笔插入气体入口786中。气体入口786可以位于打印液体出口785上方。
可以提供具有内侧789和外侧790的第一壁788来限定凹陷791。在所示的示例中，凹陷791从第一壁788延伸跨越前端781的整个宽度。因此，第一壁788悬在外壳的凹口拐角上方。第一壁788的外侧790可以是外壳780的第一侧783的一部分。电连接焊盘792暴露在第一壁的内侧上，也如图8所示。在图7和图8中，电连接焊盘792由单个框指示。虽然可以提供更少或更多的连接焊盘，在一个示例中，存在三个电连接焊盘。电连接焊盘可以在从上到下的方向上排列。电连接焊盘使得电信号能够在盒的电路与打印机的电路之间传递，例如根据集成电路间(I2C)数据通信协议。因此，连接焊盘可以形成I2C数据接口。向第一壁788提供电连接焊盘792允许将电连接焊盘792容易地安装在盒上。电连接焊盘792位于内侧789上，在运输和处理盒时保护电连接焊盘792免受损坏。凹陷791可以接纳打印机的电连接器以在电连接焊盘792与电连接器之间建立电连接。
图9显示了另一示例打印液体供应盒900。具体地，图9显示了盒900的平面图。图9的示例盒类似于图7的示例盒。在图9的示例中，凹陷791没有延伸跨越前端781的整个宽度。凹陷791由第二壁794限定。第一壁788与第二壁794之间的凹陷791可以接纳打印机的电连接器以接触电连接焊盘792。
图10A和图10B是另一示例打印液体供应盒1000的透视图。图11是示例盒1000的一部分的放大视图。相同的附图标记用于相同的部件。盒1000具有外壳780，其包围在其中可以储存诸如墨水或试剂等打印液体的内部容积。外壳780具有前端781、后端782以及从前端延伸到后端的第一侧和第二侧783、784。打印液体出口785和气体入口786可以设置在前端上。打印液体出口785可以设置成比前端781的顶部更靠近底部。气体入口786可以位于打印液体出口785上方。前端还可以具有打印液体入口787以使得盒能够填充或重新填充打印液体。
在图10A、图10B和图11的示例中，可以从第一壁788的内侧789跨越凹陷提供基准面793。肋状物798可以支撑第一壁788。在所示的示例中，基准面是第二壁794的面向凹陷791的一侧。基准面793有助于确保将打印液体供应盒顺利安装到打印机和从打印机拆卸打印液体供应盒。
在一些示例中，打印液体供应盒1000可以包括通过打印液体供应盒1000的接合部来定位的一个或多个导体。例如，第一导体可以是串行数据线和/或第二导体可以是时钟线。在一些示例中，第三导体可以是电力线和/或第四导体可以是接地线。在一些示例中，一个或多个导体可以耦接到一个或多个电连接焊盘792。电连接焊盘792可以位于凹陷791中。
在一些示例中，电连接焊盘792和导体可以由外壳部件支撑。例如，电连接焊盘和导体可以由本文描述的第一外壳部件102(例如，盖)支撑。例如，电连接焊盘和导体可以由第一壁788支撑，所述第一壁788可以是第一外壳部件的第一壁788。在一些示例中，打印液体供应盒1000包括一个或多个传感器。在一些示例中，传感器可以由第一外壳部件和/或第一壁788支撑。
在一些示例中，打印液体供应盒1000可以包括一个或多个打印液体接口。打印液体接口是用于使打印液体通过的接口。打印液体接口的示例可以包括打印液体出口785和打印液体入口787，它们可以包括在打印液体供应盒的前端781中。

Claims (27)

1.一种打印液体供应单元，包括：
第一外壳部件，沿着供应接合部焊接到第二外壳部件；和
导体，从所述供应单元的外部到所述供应单元的内部通过所述供应接合部定位，其中所述导体用密封材料密封在所述供应接合部中。
2.根据权利要求1所述的打印液体供应单元，还包括通过所述供应接合部定位的第二导体，其中所述导体是串行数据线并且所述第二导体是时钟线。
3.根据权利要求2所述的打印液体供应单元，还包括通过所述供应接合部定位的第三导体和第四导体，其中所述第三导体是电力线并且所述第四导体是接地线。
4.根据前述权利要求中任一项所述的打印液体供应单元，其中所述密封材料包括透射性塑料或弹性材料。
5.根据前述权利要求中任一项所述的打印液体供应单元，其中所述密封材料包括槽。
6.根据权利要求5所述的打印液体供应单元，其中接合部材料位于所述槽中。
7.根据权利要求5或6所述的打印液体供应单元，其中所述槽位于所述供应接合部的焊接路径中。
8.根据权利要求5、6或7所述的打印液体供应单元，其中所述槽位于所述导体与第二导体之间的所述密封材料中。
9.根据权利要求5、6或7所述的打印液体供应单元，其中所述槽位于所述密封材料的边缘处。
10.根据前述权利要求中任一项所述的打印液体供应单元，其中所述供应接合部用穿过所述密封材料的激光进行焊接。
11.根据前述权利要求中任一项所述的打印液体供应单元，其中所述密封材料具有比接合部材料的第二熔化温度高的第一熔化温度。
12.根据权利要求1、2或3所述的打印液体供应单元，其中利用超声波焊接或利用激光焊接执行焊接，在沿着具有所述密封材料的所述供应接合部的一部分上不施加超声波焊接或激光焊接。
13.根据权利要求1、2、3或12所述的打印液体供应单元，其中所述密封材料是非透射性密封材料。
14.根据前述权利要求中任一项所述的打印液体供应单元，其中所述导体耦接到所述打印液体供应单元内部的传感器和所述打印液体供应单元外部的电连接焊盘。
15.根据权利要求14所述的打印液体供应单元，还包括底部、顶部和具有至少一个打印液体接口的前端，其中所述打印液体供应单元包括在所述前端和所述顶部中以及在所述前端和所述顶部之间的凹陷，其中所述电连接焊盘位于所述凹陷中。
16.根据权利要求15所述的打印液体供应单元，其中所述电连接焊盘和所述导体由所述第一外壳部件支撑。
17.根据权利要求15或16所述的打印液体供应单元，其中所述电连接焊盘和所述导体由所述第一外壳部件的同一壁支撑。
18.根据权利要求16或17所述的打印液体供应单元，包括连接到所述导体的至少一个传感器，其中所述至少一个传感器由所述同一壁或所述第一外壳部件支撑。
19.根据前述权利要求中任一项所述的打印液体供应单元，还包括在所述打印液体供应单元的前端上的打印液体出口和气体入口。
20.一种打印液体容器，包括：
容器属性传感器，包括连接到容器壁的数字液位传感器、温度传感器、应变传感器或压力传感器中的至少一者；以及
导体，耦接到所述容器属性传感器，所述导体穿过所述容器壁中的槽，其中所述槽与容器壳体的接合部分隔设置。
21.根据权利要求20所述的打印液体容器，其中所述容器属性传感器包括所述数字液位传感器。
22.根据权利要求20或21所述的打印液体容器，其中支撑所述容器属性传感器的载体密封到所述容器壁。
23.一种方法，包括：
在打印液体容器盖中安装电导体，其中所述电导体耦接到数字液位传感器和应变传感器或压力传感器；以及
将所述打印液体容器盖焊接到打印液体容器主体，其中所述电导体位于所述打印液体容器盖与所述打印液体容器主体之间的接合部中，其中所述电导体用密封材料密封在所述接合部中。
24.根据权利要求23所述的方法，其中所述密封材料包括压敏粘合剂、垫圈、弹性体材料或环氧树脂型密封剂。
25.根据权利要求23或24所述的方法，还包括在将所述打印液体容器盖焊接到所述打印液体容器主体之前通过将所述密封材料安装在所述打印液体容器盖和所述打印液体容器主体中来施加所述密封材料。
26.根据权利要求23、24或25所述的方法，其中将所述打印液体容器盖焊接到所述打印液体容器主体包括在所述打印液体容器盖与所述打印液体容器主体之间执行超声波焊接或激光焊接，同时避免焊接在所述接合部中的所述电导体的区域。
27.根据权利要求23或24所述的方法，还包括通过经由端口将所述密封材料注射到所述接合部中来施加所述密封材料。
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